PACKAGES INFORMATION • PE-HSOP-8E-091126 HSOP-8E Unit: mm PACKAGE DIMENSIONS 2.90±0.05 2.70±0.05 (0.30) 5 (0.30) ∗ DETAIL A 1.50±0.1 0.40±0.1 0 S 0.12 M Bottom View 10° 5.20±0.3 0.05±0.05 1.27 0.10 S ∗) Tab is VDD or GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. DETAIL A 0.40±0.2 0.08±0.05 4 0.695Typ. +0.1 0.15 - 0.05 1 6.20±0.3 4.40±0.2 8 4.0±0.1 5.5±0.05 5.55 2.0±0.05 12±0.3 1.5 +0.1 0 0.3±0.1 1.75±0.1 TAPING SPECIFICATION 6.7 2.7Max. 2.05±0.1 8.0±0.1 E2 User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-12Bc) (1reel=1,000pcs) 2±0.5 0 ∅ 180 −1.5 ∅ 60 +1 0 21±0.8 ∅13±0.2 15.4±1.0 13±0.3 PACKAGES INFORMATION PE-HSOP-8E-091126 POWER DISSIPATION (HSOP-8E) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (4 layers) Board Dimensions 76.2mm × 114.3mm × 0.8mm Top side, Back side : 50mm square : Approx.95% 2nd, 3rd : : 50mm square : 100% φ0.4mm × 21pcs Copper Ratio Through-holes Measurement Results (Topt=25°C, Tjmax=125°C) Standard Land Pattern Power Dissipation 2900mW Thermal Resistance θja=(125−25°C)/2.9W=35°C/W Thermal Resistance θjc=10°C/W 76.2 4000 40 2900 3000 50 On Board 2000 114.3 Power Dissipation PD (mW) 50 1000 0 0 25 50 75 85 100 125 150 Ambient Temperature (°C) Measurement Board Pattern Power Dissipation IC Mount Area RECOMMENDED LAND PATTERN 1.27 0.50 1.27 5.72 2.40 2.60 (Unit: mm) (Unit: mm)