PACKAGE INFORMATION • PE-SON-10-0512 SON-10 Unit: mm PACKAGE DIMENSIONS 0.15 +0.1 −0.15 5 0.2±0.1 1 3.0±0.2 6 2.8±0.2 10 0.15 +0.1 −0.15 0.23±0.1 0.13±0.05 0.2±0.1 2.9±0.2 0.45TYP Attention: Tab suspension leads in the parts have VDD or GND level.(They are connected to the reverse side of this IC.) Refer to PIN DISCRIPTION. Do not connect to other wires or land patterns. 0.9MAX. 0.13±0.05 Bottom View 0.1 0.5 0.25±0.1 0.1 M 3.5±0.05 2.0±0.05 3.3 2.0MAX. 4.0±0.1 ∅1.1±0.1 TR User Direction of Feed TAPING REEL DIMENSIONS (1reel=3000pcs) 2±0.5 21±0.8 +1 60 0 0 180 −1.5 13±0.2 11.4±1.0 9.0±0.3 8.0±0.3 4.0±0.1 +0.1 ∅1.5 0 3.2 0.2±0.1 1.75±0.1 TAPING SPECIFICATION PACKAGE INFORMATION PE-SON-10-0512 POWER DISSIPATION (SON-10) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-hole φ0.5mm × 44pcs Measurement Result (Topt=25°C,Tjmax=125°C) Standard Land Pattern Free Air Power Dissipation 480mW 300mW Thermal Resistance θja=(125−25°C)/0.48W=208°C/W 333°C/W 600 40 400 Free Air 300 200 40 Power Dissipation PD(mW) On Board 480 500 100 0 0 25 50 75 85 100 Ambient Temperature (°C) 125 150 Power Dissipation Measurement Board Pattern IC Mount Area (Unit : mm) RECOMMENDED LAND PATTERN 0.65 0.5 1.15 0.3 (Unit: mm)