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PACKAGE INFORMATION
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PE-SON1612-6-101018
SON1612-6
Unit: mm
PACKAGE DIMENSIONS
3
6
3
0.125±0.055
0.22±0.05
1
Bottom View
0.6Max.
0.08
(0.3)
4
(0.3)
1
0.5
0.3Typ.
1.6±0.05
4
1.2±0.05
6
(0.2)
1.6±0.1
0.08 M
1.75
3.5±0.05
2.0±0.05
1.1±0.1
1.75
4.0±0.1
1.1MAX.
TR
User Direction of Feed
TAPING REEL DIMENSIONS
(1reel=4000pcs)
2±0.5
21±0.8
∅60 +1
0
∅180 0
−1.5
∅ 13±0.2
11.4±1.0
9.0±0.3
8.0±0.3
4.0±0.1
1.5 +0.1
0
0.25±0.1
1.75±0.1
TAPING SPECIFICATION
PACKAGE INFORMATION
PE-SON1612-6-101018
Power Dissipation (SON1612-6)
This specification is at mounted on board.
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm × 40mm × 1.6mm
Copper Ratio
Top side : Approx. 50%, Back side : Approx.50%
Through-hole
φ0.5mm × 24pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
Power Dissipation
500mW
θja=(125−25°C)/0.5W=200°C/W
Thermal Resistance
θjc=82°C/W
39
500
On Board
400
300
39
40
27
Power Dissipation PD(mW)
600
200
100
0
0
25
50
75 85 100
Ambient Temperature (°C)
125
27
40
150
Power Dissipation
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.5
0.45 0.45
0.28
(Unit: mm)