PACKAGE INFORMATION • PE-DFN(PLP)1010-4B-141209 DFN(PLP)1010-4B Unit: mm PACKAGE DIMENSIONS B 3 4 DETAIL : "A" ∗ 45 0.07±0.05 0.25±0.05 0.05 1.00 ×4 0.65 1.00 5 .0 ±0 48 0. A "A" 0.04 0.6Max. 0.03Min. S 1 C0.10 2 0.05 0.25±0.05 0. 48 ±0 .0 5 C0.18 INDEX 0.045 ∗）Periphery of the mounting surface patterns, serrated design. (pitch=0.045, length=0.04) Dimension criterion, with serrated top ridge. 0.05 M S AB Bottom View ∗）Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. 0.05 S 1.5 +0.1 0 1.1 3.5±0.05 4.0±0.1 8.0±0.3 2.0±0.05 0.2±0.1 1.75±0.1 TAPING SPECIFICATION 0.5±0.1 1.2Max. 1.1 2.0±0.1 TR User Direction of Feed TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc) 11.4±1.0 (1reel=10,000pcs) 21±0.8 ∅13±0.2 2±0.5 ∅ 60 +1 0 0 ∅ 180 −1.5 9.0±0.3 PACKAGE INFORMATION PE-DFN(PLP)1010-4B-141209 POWER DISSIPATION (DFN(PLP)1010-4B) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (Double sided) Board Dimensions 40mm × 40mm × 1.6mm Copper Ratio Top side : Approx. 50% , Back side : Approx. 50% Through-holes φ0.54mm × 24pcs Measurement Results (Topt=25°C, Tjmax=125°C) Standard Land Pattern Power Dissipation 400mW Thermal Resistance θja=(125−25°C)/0.4W=250°C/W Thermal Resistance θjc=67°C/W 40 500 400 On Board 300 40 Power Dissipation PD (mW) 600 200 100 0 0 25 85 50 75 100 125 Ambient Temperature (°C) 150 Measurement Board Pattern Power Dissipation IC Mount Area (Unit: mm) RECOMMENDED LAND PATTERN 3- 0.25 C 0. 0. 48 0.22 45 0.40 0.47 1.30 18 0.65 0. 48 (Unit: mm)