PRELIMINARY DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features Designed for high-performance, double-balanced mixers Schottky diodes supplied 100% tested, sawn, mounted on film frame Low cost 4 1 Three barrier heights available 4 2 3 2 Available lead (Pb)-free, RoHS-compliant, and Green 3 Description This Skyworks family of Si Schottky diodes are configured as bridge quads intended for use in double-balanced mixers. Each bridge quad die is comprised of four Schottky junctions. There are three barrier heights available: DMF4102-099 is composed of low-barrier diodes, which can be driven with low-power local oscillator signals; DME4101-099 is composed of medium-barrier diodes, for applications in which moderate-power local oscillator signals are available; and, DMJ4103-099 is composed of highbarrier diodes for applications that require very low distortion performance and have higher local oscillator power available. These bridge quads are 100% tested, sawn and supplied on film frame in wafer quantities. 1 Y1254 Electrical and Physical Specifications Absolute maximum ratings for the Schottky diodes are provided in Table 1. Electrical specifications are noted in Table 2. The chip dimensions are shown in Table 3. SPICE model parameters are defined in Table 4. Typical performance data is indicated in Figure 1. The outline drawing is shown in Figure 2. Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203306A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 19, 2014 1 PRELIMINARY DATA SHEET • SCHOTTKY DIODE QUAD MIXER CHIPS SUPPLIED ON FILM FRAME Table 1. Absolute Maximum Ratings (Note 1) Parameter Symbol Forward current Minimum Typical IF Power dissipation @ 25 C at the base of the chip Maximum Units 75 P mA 75 mW/per junction TSTG –65 +200 C Operating temperature TOP –65 +150 C Electrostatic discharge: ESD <250 V Storage temperature Human Body Model (HBM), Class 0 Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. Electrical Specifications at 25 C (Notes 1 and 2) CJ VR = 0 V, f = 1 MHz (pF) VB IR = 10 A (V) Part Number VF @ IF = 1 mA (mV) VF @ IF = 1 mA (mV) RT (Note 3) IF = 10 mA () Min Min Max Min Max Max Max DMF4102-099 2 0.15 0.30 250 310 10 14 DME4101-099 3 0.15 0.30 325 425 10 14 DMJ4103-099 4 0.15 0.30 550 650 10 14 Note 1: The above Schottky diode chips are processed on 100 mm silicon wafers, 100% DC tested, sawn and shipped on 6” film frame hoops. Electrical rejects are identified with black ink. Note 2: All parameters are based upon a single junction. Note 3: RT is the slope resistance. Table 3. Chip Dimensions Quantity of Good Diodes Per Wafer Min. Nom. Bonding Pad Nominal (In.) Chip Size Nominal (In.) Chip Height Nominal (In.) DMF4102-099 27,000 30,000 0.0035 ± 0.0005 0.0150 ± 0.001 0.006 ± 0.001 DME4101-099 23,000 28,000 0.0035 ± 0.0005 0.0150 ± 0.001 0.006 ± 0.001 DMJ4103-099 27,000 30,000 0.0035 ± 0.0005 0.0150 ± 0.001 0.006 ± 0.001 Part Number Table 4. SPICE Model Parameters (Per Junction) Part Number Prefix IS (A) RS () N tT (s) CJO (pF) M EG (eV) VJ (V) XTI FC BV (V) IBV (A) DMF4102 1.1 x 10–7 6 1.04 1 x 10–11 0.22 0.32 0.69 0.495 2 0.5 2 1 x 10–5 DME4101 2.4 x 10–9 6 1.04 1 x 10–11 0.20 0.37 0.69 0.595 2 0.5 3 1 x 10–5 DMJ4103 8.5 x 10–13 6 1.04 1 x 10–11 0.20 0.42 0.69 0.800 2 0.5 4 1 x 10–5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 August 19, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203306A PRELIMINARY DATA SHEET • SCHOTTKY DIODE QUAD MIXER CHIPS SUPPLIED ON FILM FRAME 10 Forward Current (mA) 8 6 4 DMF4101 2 DME4102 400 600 800 1000 ts092 DMJ4103 0 200 1200 Forward Voltage (mV) Figure 1. Typical DC Characteristic at 25 C Schematic 1 4 2 3 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 4 3 0.0035 in (0.089 mm) ± 0.0035 in (0.089 mm) 4 Plcs. 2 0.015 in (0.381 mm) ± 0.001 in (0.025 mm) 1 0.006 in (0.18 mm) ± 0.001 in (0.025 mm) S3548 Figure 2. Outline Drawing Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203306A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 19, 2014 3 PRELIMINARY DATA SHEET • SCHOTTKY DIODE QUAD MIXER CHIPS SUPPLIED ON FILM FRAME Wafer on Film Figure 3 illustrates the wafer on film. 0.003 (0.076 mm) Nom. Separation Between Die 5.981 (151.92 mm) Outer Ring O.D. 0.003 (0.076 mm) Separation Between Die 5.520 (140.20 mm) Inner Ring I.D. 3.940 (100.0 mm) Wafer Dia. Grip Ring 0.236 (5.99 mm) Ring Thickness ts093 Figure 3. Wafer on Film Wafer Film Frame Description Wafer on nitto tape Color: light blue Thickness: 2.2 3.0 mils Tensile strength: 6.6 (lbs. in width) Ring material: plastic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 August 19, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203306A PRELIMINARY DATA SHEET • SCHOTTKY DIODE QUAD MIXER CHIPS SUPPLIED ON FILM FRAME Copyright © 2014 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 203306A • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • August 19, 2014 5