Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
SKY77174 Power Amplifier Module for WCDMA / HSDPA
(1920–1980 MHz)
Applications
Description
• WCDMA Handsets
The SKY77174 Power Amplifier module is a fully matched 10-pad surface mount module developed
for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power
amplifier packs full coverage of the 1920–1980 MHz bandwidth into a single compact package. The
SKY77174 meets the stringent spectral linearity requirements of HSDPA (High Speed Downlink Packet
Access) data transmission with high power added efficiency for power output of up to 28 dBm.
Because of high efficiencies attained throughout the entire power range, the SKY77174 delivers
unsurpassed talk-time advantages.
• HSDPA Handsets
• Personal Communications
Services (PCS)
• Wireless local loop (WLL)
Features
• No VREF required
• Low voltage positive bias
- 3.1 V to 4.6 V
• Supports low collector
voltage operation
• Good linearity
• High efficiency at all power
levels (17.5% at 16 dBm)
• Large dynamic range
• Low Profile package
- 4 mm x 4 mm x 1.1 mm
• 10-pad configuration
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC includes on-board bias circuitry, as well as input and interstage
matching circuits. The output match is realized off-chip within the module package to optimize
efficiency and power performance into a 50 Ω load. This device is manufactured with Skyworks’
InGaP GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC
supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77174 is
supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output
in the 3.1 to 4.6 volt range. No VREF voltage is required. Power down is accomplished by setting the
voltage on VENABLE to zero volts. Digital bias control can be used to optimize efficiency at high and low
power or analog bias control can be used to optimize efficiency over the entire power range. No
external supply side switch is needed as typical “off” leakage is a few microamperes with full primary
voltage supplied from the battery.
• Power down control
• InGaP
MODULE
• Digital VENABLE
• Digital or Analog VCONTROL
MMIC
VCC2 (10)
VCC1 (1)
Skyworks offers lead
(Pb)-free, RoHS
(European Parliament
for the Restriction of
Hazardous Substances)
-compliant packaging.
RF_IN (4)
INPUT
MATCH
DA
INTERSTAGE
MATCH
PA
OUTPUT
MATCH
(8) RF_OUT
ENABLE (2)
VCONTROL (3)
BIAS and GAIN CONTROL CIRCUIT
VBIAS (5)
200444_001
GND (6, 7, 9)
Figure 1. SKY77174 Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200444A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • July 24, 2007
1
DATA SHEET
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA/HSDPA
(1920–1980 MHz)
Electrical Target Specifications
The following tables list the electrical characteristics of the
SKY77174 Power Amplifier. Table 1 lists the absolute maximum
ratings, while Table 2 shows the recommended operating
conditions to achieve the performance characteristics for WCDMA
and HSDPA listed, respectively, in Table 3 and Table 5. Standard
test configurations for WCDMA and HSDPA are shown in Table 4
and Table 6, respectively. Table 7 specifies the recommended
control and collector voltages vs. output power for low collector
voltage operation.
Table 1. Absolute Maximum Ratings 1
Parameter
Symbol
Minimum
Maximum
Unit
RF Input Power
PIN
—
8.0
dBm
Supply Voltage
VCC, VBIAS
—
6.0
Volts
Control Voltage
VCONT
0
2.0
Volts
Volts
Enable Voltage
Case Temperature
VEN
—
2.0
Operating
TCASE
–30
110
Storage
TSTG
–55
125
Ru
—
10:1
Ruggedness – no damage 2
°C
VSWR
1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
2 PO_MAX, all phases, time = 10 sec, continuous modulated signal.
Table 2. Recommended Operating Conditions
Parameter
Symbol
Minimum
Nominal
Maximum
—
—
28.5
—
—
28.0
1920
1950
1980
3.1
3.4
4.6
1.5
3.4
3.4
3.1
3.4
4.6
0.8
1.1
2.0
0.0
—
0.5
VCONT
0.5
1.2
1.2
Volts
Load Mismatch (all angles)
VSWR
—
1.0
—
VSWR
Case Operating Temperature
TCASE
–20
25
85
°C
WCDMA
RF Output Power
PO_MAX
HSDPA
Operating Frequency
FO
VBATT
Supply Voltage 1
VCC
DC/DC
Bias Voltage
VBIAS
PA On
Enable Voltage
VEN
PA Off
High Power Range
VCONTROL Range
1 When VCC supply is 3.1 V, PO_MAX must be backed off 1 dB.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
2
July 24, 2007 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200444A
Unit
dBm
MHz
Volts
Volts
Volts
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA
(1920–1980 MHz)
DATA SHEET
Table 3. SKY77174 Electrical Specifications for WCDMA — Recommended Operating Conditions 1
Refer to Table 4. Standard Test Configuration — WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
Characteristics
Symbol
High Power
Condition
GHIGH
PO_MAX
GLOW
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
TCASE = 25 °C
Minimum
Typical
Maximum
26.0
28.5
32.0
Unit
dB
Gain Conditions
Low Power
Gain Variation Over Frequency
Total Gain Reduction
20.0
24.5
27.0
—
—
—
1
dB
—
dB
High Power
PAEHIGH
PO_MAX
TCASE = 25 °C
Low Power
PAELOW
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
Power Added Efficiency
@ VCC = 3.4 V
Error Vector Magnitude
EVM
—
36.0
38.0
—
14.0
17.5
—
—
2
3
%
PO_MAX
—
–42.0
–36.0
ACPR1_L
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
—
–48.0
–38.0
ACLR2_H
PO_MAX
—
–53.5
–48.0
ACLR2_L
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
—
–59.0
–53.0
—
–45
–43.5
—
–55
–53.5
10 MHz offset
Second
4
ACLR1_H
5 MHz offset
Adjacent Channel Leakage power
Ratio 2
—
—
fH2
Harmonic Suppression
dBc
VCC = 3.4 V
Third
Noise Power
fL3
%
dBc
PN_GSM_II
875 to 925 MHz
—
—
–90
PN_GPS
1570 to 1580 MHz
—
—
–90
PN_PHS
1893.5 to 1919.6 MHz
—
—
–53
PN_DCS
1805 to 1880 MHz
—
—
–83
PN_WRX
2110 to 2170 MHz
—
—
–93
PN_WRX2
RX = 2110 MHz
TX = 1980 MHz
—
—
–70
PN_BT
2400 to 2480 MHz
—
—
–80
—
—
—
5
—
—
1.5
2.0
—
VSWR = 6:1
—
—
–65
dBc
Noise Figure
NF
Input Voltage Standing Wave Ratio (VSWR)
VSWR
Stability
S
dBm/30
kHz
dB
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200444A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • July 24, 2007
3
DATA SHEET
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA/HSDPA
(1920–1980 MHz)
Table 3. [continued] SKY77174 Electrical Specifications for WCDMA — Recommended Operating Conditions 1
Refer to Table 4. Standard Test Configuration — WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
Characteristics
Symbol
Condition
Minimum
Typical
Maximum
Unit
ICQ_H
VCC = 3.4 V
VCONT = 1.2 V
—
100
—
ICQ_L
VCC = 1.6 V
VCONT = 0.8 V
—
65
—
Control Current
ICONT
—
—
—
200
μA
Enable Current
IEN
VEN ≥ 1.0 V
—
—
5
μA
Leakage Current
ILEAK
VREF = off
VEN = off
—
10
12
μA
Quiescent Current
mA
1 Per Table 2, unless otherwise specified. Data in Table 3 were verified with the WCDMA test configuration shown in Table 4.
2 ACLR is specified per 3GPP as the ratio of total in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets.
Table 4. Standard Test Configuration — WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
Parameter
Level
Spread Code
Spread Factor
I/Q
βc
βd
βhs
Relative Power
Information Bit Rate
12.2 kbps
—
—
—
—
—
—
—
DPCCH
15.0 kbps
0
256
Q
8/15
—
—
–6.547 dB
DPDCH
60.0 kbps
16
64
I
—
15/15
—
–1.087 dB
TFCI
On
—
—
—
—
—
—
—
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
4
July 24, 2007 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200444A
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA
(1920–1980 MHz)
DATA SHEET
Table 5. SKY77174 Electrical Specifications for HSPDA — Recommended Operating Conditions 1
Refer to Table 6. Standard Test Configuration — HSDPA Mode
Characteristics
Symbol
High Power
Condition
Minimum
Typical
Maximum
26
28
32
Unit
GHIGH
PO_MAX
GLOW
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
TCASE = 25 °C
20
24
27
Gain Variation Over Frequency
—
—
—
1
dB
Total Gain Reduction
—
—
4
—
dB
35.0
37.0
—
Gain Conditions
dB
Low Power
High Power
PAEHIGH
PO_MAX
PAELOW
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
Power Added Efficiency @ VCC = 3.4 V
%
Low Power
Error Vector Magnitude
EVM
—
14.0
17.5
—
—
2
3
ACLR1_H
PO_MAX
—
–38
–35
ACLR1_L
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
—
–48
–38
ACLR2_H
PO_MAX
—
–53
–48
ACLR2_L
VCC = 1.6 V
VCONT = 0.8 V
PO = 16 dBm
—
–60
–53
%
5 MHz offset
Adjacent Channel Leakage power Ratio 2
dBc
10 MHz offset
1 Per Table 2, unless otherwise specified. Data in Table 5 were verified with the HSDPA test configuration shown in Table 6.
2 ACLR is specified per 3GPP as the ratio of in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200444A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • July 24, 2007
5
DATA SHEET
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA/HSDPA
(1920–1980 MHz)
Table 6. Standard Test Configuration — HSDPA Mode
Level
Spread Code
Spread Factor
I/Q
βc
βd
βhs
Relative Power
DPCCH
15 kbps
0
256
Q
12/15
—
—
–8.17 dB
DPDCH
60 kbps
16
64
I
—
15/15
—
–6.23 dB
HS– DPDCH
15 kbps
64
256
Q
—
24/15
–2.15 dB
On
—
—
—
—
—
—
Parameter
TFCI
—
Table 7. Recommended Controls for Low Collector Voltage Operation
PSET WCDMA
PSET HSDPA
VCONT
VCC
VEN
–10.0
–10.0
0.50
1.5
1.1
3.4
0.0
0.0
0.50
1.5
1.1
3.6
5.0
5.0
0.50
1.5
1.1
3.6
9.0
9.0
0.60
1.5
1.1
3.6
13.0
13.0
0.70
1.5
1.1
3.6
15.0
15.0
0.75
1.5
1.1
3.6
16.0
16.0
0.80
1.6
1.1
3.6
17.0
17.0
0.80
1.7
1.1
3.6
18.0
18.0
0.85
1.8
1.1
3.6
20.0
20.0
0.90
2.0
1.1
3.6
23.0
23.0
1.00
2.3
1.1
3.6
24.0
24.0
1.05
2.6
1.1
3.6
25.0
25.0
1.10
2.8
1.1
3.6
26.0
26.0
1.15
3.0
1.1
3.6
27.5
27.0
1.20
3.1
1.1
3.6
28.5
28.0
1.20
3.4
1.1
3.6
28.5
28.0
1.20
4.6
1.1
3.6
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
6
VBIAS
July 24, 2007 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200444A
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA
(1920–1980 MHz)
DATA SHEET
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77174, the evaluation board schematic and diagrams are
included for preliminary analysis and design. Figure 2 shows the
basic schematic of the board for the 1920 MHz to 1980 MHz
range.
Figure 2. Evaluation Board Schematic
Figure 3. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200444A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • July 24, 2007
7
DATA SHEET
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA/HSDPA
(1920–1980 MHz)
Package Dimensions and Pad Descriptions
The SKY77174 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 4 is a mechanical
drawing of the pad layout for this package. Figure 5 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good grounding,
and minimum RF discontinuity for the 50-ohm terminals. Figure 6
shows the pad names and the pad numbering convention, which
starts with pad 1 at the upper left, and increments counterclockwise around the package. Figure 7 illustrates typical case
markings.
Figure 4. Drawing for 4 mm x 4 mm x 1.1 mm, 10-Pad Package – SKY77174 (All Views)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
8
July 24, 2007 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200444A
SKY77174 POWER AMPLIFIER MODULE FOR WCDMA
(1920–1980 MHz)
DATA SHEET
Figure 5. Phone PCB Layout Footprint for 4 x 4 x 1.1 mm, 10-Pad Package – SKY77174
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200444A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • July 24, 2007
9
ADVANCE DATA SHEET • SKY77174
POWER AMPLIFIER MODULE FOR WCDMA (1920–1980 MHz)
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Standard J–STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
Figure 6. SKY77174 Pad Names and Configuration
The SKY77174 is a Class 1 device. Figure 8 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pad of the
SKY77174 product. The numbers in Figure 8 specify the ESD
threshold level for each pad where the I-V curve between the pad
and ground starts to show degradation. ESD testing was
performed in compliance with MIL-STD-883E Method 3015.7
using the Human Body Model. If ESD damage threshold
magnitude is found to consistently exceed 2000 volts on a given
pad, this so is indicated. If ESD damage threshold below 2000
volts is measured for either polarity, numbers are indicated that
represent worst case values observed in product characterization.
Figure 7. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77174 is capable of withstanding an MSL3/260 ° C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 3 °C per second;
maximum temperature should not exceed 260 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 260 °C for more
than 10 seconds. For details on attachment techniques,
Figure 8. SKY77174 ESD Sensitivity Areas
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely nonfunctional”. Skyworks employs most stringent criteria, fails
devices as soon as the pad begins to show any degradation on a
curve tracer.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
10
July 24, 2007 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200444A
POWER AMPLIFIER MODULE FOR WCDMA (1920–1980 MHz)
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
ADVANCE DATA SHEET • SKY77174
handling precautions listed below.
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 109 Ω to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200444A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • July 24, 2007
11
Ordering Information
Model Number
Manufacturing
Part Number
SKY77174
SKY77174
Product Revision
Package
Operating Temperature
MCM4x4LM–16
–20 °C to 85 °C
Revision History
Revision
Level
Date
Description
P1
September 30, 2005
Initial Issue – Advance Information
P2
January 5, 2006
Revise: Table 2, Figures 2, 3, 4
Add: Figure 5
P3
January 24, 2006
Revise: Tables 1, 2, 3
P4
March 14, 2006
Revise: Features list (p1); Table 3; Figures 1, 2, 3
July 24, 2007
Add: Tables 4, 6, 7
Revise: Change data sheet Revision suffix from P5 to A; remove Advance data sheet
status; Features list (p1); Figures 2–4, 6, 8; Tables 1–3, 5; Package and Handling
Information section.
A
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752
Application Note: Tape and Reel Information – RF Modules, Document Number 101568
Standard SMTP Reflow Profiles: JEDEC Standard J–STD–020
© 2005–2007, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be
used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product
descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties
arising from future changes to its products and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks’ Terms and Conditions of Sale for
such products, Skyworks assumes no liability whatsoever.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS® PRODUCTS INCLUDING
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL
PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE
MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS
THAT MAY RESULT FROM THE USE OF THESE MATERIALS.
Skyworks® products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks’ customers using or selling Skyworks® products for use in such applications do so at
their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.
The following are trademarks of Skyworks Solutions, Inc.: Skyworks®, the Skyworks symbol, and “Breakthrough Simplicity”®. Product names or services listed in this publication are for
identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners.
Additional information, posted at www.skyworksinc.com, is incorporated by reference.