SKYWORKS SKY77181

PRELIMINARY DATA SHEET
SKY77181 Power Amplifier Module for WCDMA / HSDPA
(880–915 MHz)
Applications
Description
• WCDMA Handsets
The SKY77181 Power Amplifier module is a fully matched 8-pad surface mount module developed for
Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power
amplifier packs full coverage of the 880–915 MHz bandwidth into a single compact package. The
SKY77181 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access
(HSDPA) data transmission with high power added efficiency for power output of up to 28 dBm.
Because of high efficiencies attained throughout the entire power range, the SKY77181 delivers
unsurpassed talk-time advantages.
• HSDPA Handsets
• Personal Communications
Services (PCS)
• Wireless local loop (WLL)
Features
• No VREF required
• Low voltage positive bias
- 3.1 V to 4.6 V
• Supports low collector
voltage operation
• Good linearity
• High efficiency at all power
levels (13.5% at 15 dBm)
• Large dynamic range
• Low Profile package
- 3 x 3 x 1.1 mm
• 8-pad configuration
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC includes on-board bias circuitry, as well as input and interstage
matching circuits. The output match is realized off-chip within the module package to optimize
efficiency and power performance into a 50 Ω load. This device is manufactured with Skyworks’
InGaP GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC
supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77181 is
supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output
in the 3.1 to 4.6 volt range. No VREF voltage is required. Power down is accomplished by setting the
voltage on VENABLE to zero volts. Digital bias control can be used to optimize efficiency at high and low
power or analog bias control can be used to optimize efficiency over the entire power range. No
external supply side switch is needed as typical “off” leakage is a few microamperes with full primary
voltage supplied from the battery.
• Power down control
• InGaP
• Digital VENABLE
• Digital or Analog VCONTROL
Figure 1. SKY77181 Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200643A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • January 7, 2008
1
PRELIMINARY DATA SHEET
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
Electrical Target Specifications
The following tables list the electrical characteristics of the
SKY77181 Power Amplifier. Table 1 lists the absolute maximum
ratings, while Table 2 shows the recommended operating
conditions to achieve the performance characteristics for WCDMA
and HSDPA listed, respectively, in Table 4 and Table 6.
Table 3 lists the recommended Supply and Control voltage
conditions over Output Power. Standard test configurations for
WCDMA and HSDPA are shown in Table 5 and Table 7,
respectively,.
Table 1. Absolute Maximum Ratings 1
Parameter
Symbol
Minimum
Maximum
Unit
RF Input Power
PIN
—
9
dBm
Supply Voltage
VCC, VBIAS (no RF)
—
7
Volts
Control Voltage
VCONT
0
1.5
Volts
Enable Voltage
VEN
—
3
Volts
Operating
TCASE
–30
110
Storage
TSTG
–55
125
Ru
—
10:1
Case Temperature
Ruggedness – no damage 2
°C
VSWR
1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
2 PO_MAX, all phases, time = 10 sec, continuous modulated signal.
Table 2. Recommended Operating Conditions
Parameter
Symbol
WCDMA
RF Output Power
PO_MAX
HSDPA
Operating Frequency
FO
VBATT
Supply Voltage 1
VCC
DC/DC
Bias Voltage
VBIAS
PA On
Enable Voltage
VEN
PA Off
Minimum
Nominal
Maximum
—
—
28.5
—
—
28.0
880.0
897.5
915.0
3.1
3.4
4.6
0.5
3.4
3.4
3.4
3.6
4.6
1.3
—
2.75
0.0
—
0.4
Unit
dBm
MHz
Volts
Volts
Volts
VCONTROL Range
VCONT
0.6
—
1.2
Volts
Load Mismatch (all angles)
VSWR
—
1
—
VSWR
Case Operating Temperature
TCASE
–20
+25
+85
°C
1 When VCC supply is 3.1 V, PO_MAX must be backed off 1 dB.
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January 7, 2008 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200643A
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
PRELIMINARY DATA SHEET
Table 3. Recommended Supply Voltage (VCC) and Control Voltage (VCONT) Conditions Over Output Power (PO)
PSET (dBm)
VCONT
VCC
–21
0.72
1.15
–10
–11
0.72
1.15
–5
–6
0.81
1.17
0
–1
0.92
1.20
5
4
1.05
1.25
10
9
1.05
1.45
15
14
1.10
1.63
20
19
1.10
2.00
23
22
1.10
2.35
25
24
1.10
2.70
26
25
1.10
2.85
27
26
1.10
3.10
28
27
1.10
3.40
28.5
28
1.10
3.40
WCDMA
HSDPA
–20
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200643A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • January 7, 2008
3
PRELIMINARY DATA SHEET
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
Table 4. SKY77181 Electrical Specifications for WCDMA — Recommended Operating Conditions 1
Refer to Table 5. Standard Test Configuration — WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
WCDMA (Wideband Code Division Multiple Access) 2
Characteristics
Gain Conditions
Symbol
Condition
Minimum
Typical
Maximum
High Power
GHIGH
PO_MAX
27.0
30.0
33.0
Low Power
GLOW
PO = –10 dBm
12.5
16.0
19.5
—
—
1
—
—
Gain Variation Over Frequency
Fixed VCC, Temp, PIN
High Power
PAEHIGH
PO_MAX
TCASE = +25 °C
36.0
PAELOW
PO = 15 dBm
TCASE = +25 °C
12.5
Power Added Efficiency
Low Power
Error Vector Magnitude
EVM
—
Unit
dB
dB
%
—
—
—
5
ACLR1_H
PO_MAX
—
–38.0
–35.5
ACLR1_L
PO ≤ 9 dBm
—
–45.0
–42.0
%
5 MHz
Adjacent Channel Leakage power
Ratio 3
dBc
ACLR2_H
PO_MAX
—
–50.0
–48.0
ACLR2_L
PO ≤ 9 dBm
—
–56.0
–53.0
—
–8
0
—
–46
–30
10 MHz
Second
fH2
Harmonic Suppression
VCC = 3.4 V
Third
Noise Power
Input Voltage Standing Wave Ratio (VSWR)
fL3
PN_WRX
Band VIII_RX: 925–
960 MHz, 45 MHz duplex
—
–90
–88
PN_WRX2
WCDMARX = 925 MHz
WCDMATX = 915 MHz
—
–69
–65
PN_GPS
A-GPS Band: 1570–
1580 MHz
—
–110
–100
PN_DCS
WCDMARX = 1805–
1880 MHz
—
–111
–100
PN_UMTS
2110–2170 MHZ
—
–112
–100
PN_BT1
2400–2480 MHz
—
–107
–90
—
1.5
2.0
—
VSWR
—
Stability
S
VSWR = 6:1 all phases
Total Current
ITOTAL
PO_MAX
Quiescent Current
ICQ
VCC = 1.5 V
VCONT = 1.0 V, no RF
Control Current
ICONT
Digital Enable Current
IEN
Leakage Current
ILEAK
dBm/30
kHz
—
–46
dBm
550
578
mA
—
50
75
mA
—
—
500
μA
VEN ≥ 1.0 V
—
—
5
μA
VREF = off
VEN = off
—
5
10
μA
—
—
1 Refer to conditions in Table 2 and Table 3, unless otherwise specified.
2 Data in this Table were verified with the signal configuration shown in Table 5.
3 ACLR is specified per 3GPP as the ratio of total in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets.
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4
dBm/1
MHz
January 7, 2008 • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • 200643A
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
PRELIMINARY DATA SHEET
Table 5. Standard Test Configuration — WCDMA Voice Mode (Uplink Reference Measurement Channel: 12.2 kbps)
Parameter
Level
Spread Code
Spread Factor
I/Q
βc
βd
βhs
Relative Power
Information Bit Rate
12.2 kbps
—
—
—
—
—
—
DPCCH
15.0 kbps
0
256
Q
8/15
—
—
–6.57 dB
DPDCH
60.0 kbps
16
64
I
—
15/15
—
–1.087 dB
TFCI
ON
—
—
—
—
—
—
—
Table 6. SKY77181 Electrical Specifications for HSPDA — Recommended Operating Conditions 1
Refer to Table 7: Standard Test Configuration — HSDPA Mode
HSDPA (High Speed Downlink Packet Access) 2
Characteristics
Symbol
Gain Conditions
Minimum
Typical
Maximum
High Power
GHIGH
PO_MAX
27.0
30.0
33.0
Low Power
GLOW
PO = –10 dBm
12.5
16.0
19.5
Fixed VCC, Temp.
—
—
1
Gain Variation Over Frequency
Condition
High Power
PAEHIGH
PO_MAX
TCASE = +25 °C
34.0
36.0
—
Low Power
PAELOW
PO = 14 dBm
TCASE = +25 °C
11.0
12.0
—
—
—
5
Power Added Efficiency
Error Vector Magnitude
EVM
Unit
dB
dB
%
—
%
ACLR1_H
PO_MAX
—
–38.0
–35.5
ACLR1_L
VCONT = 15 V
PO = 9 dBm
—
–45.0
–42.0
ACLR2_H
PO_MAX
—
–52.0
–48.0
ACLR2_L
VCONT = 15 V
PO = 9 dBm
—
–60.0
–53.0
5 MHz offset
Adjacent Channel Leakage power Ratio 3
dBc
10 MHz offset
1 Refer to condition in Table 2 and Table 3, unless otherwise specified.
2 Data in this Table were verified with the signal configuration shown in Table 7.
3 ACLR is specified per 3GPP as the ratio of in-band power to adjacent power, both measured in 3.84 MHz bandwidth at specified offsets.
Table 7. Standard Test Configuration — HSDPA Mode
Parameter
Level
Spread Code
Spread Factor
I/Q
βc
βd
βhs
Relative Power
DPCCH
15 kbps
0
256
Q
12/15
—
—
–8.17 dB
DPDCH
60 kbps
16
64
I
—
15/15
—
–6.23 dB
HS– DPDCH
15 kbps
64
256
Q
—
24/15
–2.15 dB
On
—
—
—
—
—
—
TFCI
—
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200643A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • January 7, 2008
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PRELIMINARY DATA SHEET
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77181, the evaluation board schematic and diagrams are
included for preliminary analysis and design. Figure 2 shows the
basic schematic of the board for the 880 MHz to 915 MHz range.
Figure 2. SKY77181 Evaluation Board Schematic
Figure 3. SKY77181 Evaluation Board Assembly Diagram
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SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
PRELIMINARY DATA SHEET
Package Dimensions and Pad Descriptions
The SKY77181 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 4 is a mechanical
drawing of the pad layout for this package. Figure 5 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good grounding,
and minimum RF discontinuity for the 50-ohm terminals. Figure 6
shows the pad names and the pad numbering convention, which
starts with pad 1 at the upper left, and increments counterclockwise around the package. Figure 7 illustrates typical case
markings.
Figure 4. Dimensional Drawing for 3 x 3 x 1.1.1 mm, 8-pad Package – SKY77181 (All Views)
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PRELIMINARY DATA SHEET
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
Figure 5. Phone PCB Layout Footprint for 3 x 3 x 1.1 mm, 8-pad Package – SKY77181
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SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)PRELIMINARY DATA SHEET
than 10 seconds. For details on attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Standard J–STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
Figure 6. SKY77181 Pad Configuration
The SKY77181 is a Class 1 device. Figure 8 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pad of the
SKY77181 product. The numbers in Figure 8 specify the ESD
threshold level for each pad where the I-V curve between the pad
and ground starts to show degradation. ESD testing was
performed in compliance with MIL-STD-883E Method 3015.7
using the Human Body Model. If ESD damage threshold
magnitude is found to consistently exceed 2000 volts on a given
pad, this so is indicated. If ESD damage threshold below 2000
volts is measured for either polarity, numbers are indicated that
represent worst case values observed in product characterization.
Figure 7. Typical Case Markings – 3 mm x 3 mm Package
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77181 is capable of withstanding an MSL3/260 ° C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 3 °C per second;
maximum temperature should not exceed 260 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 260 °C for more
Figure 8. SKY77181 ESD Sensitivity Areas
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely nonfunctional”. Skyworks employs most stringent criteria, fails
devices as soon as the pad begins to show any degradation on a
curve tracer.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200643A • Skyworks Proprietary and Confidential Information. • Products and product Information are subject to change without notice. • January 7, 2008
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PRELIMINARY DATA SHEET
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
SKY77181 POWER AMPLIFIER MODULE FOR WCDMA (880–915 MHz)
handling precautions listed below.
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 109 Ω to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
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Ordering Information
Model Number
Manufacturing
Part Number
SKY77181
SKY77181
Product Revision
Package
Operating Temperature
MCM3x3LM
–20 °C to 85 °C
Revision History
Revision
Level
A
Date
January 7, 2008
Description
Initial Issue – Preliminary Information
References
Application Note: PCB Design and SMTP Assembly/Rework, Document Number 101752
Application Note: Tape and Reel Information – RF Modules, Document Number 101568
Standard SMTP Reflow Profiles: JEDEC Standard J–STD–020
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