SKY85402_11_202120I.pdf

PRELIMINARY DATA SHEET
SKY85402-11: High-Power (+22 dBm) 802.11ac WLAN Power
Amplifier with Integrated Power Detector
Applications
Description
 IEEE 802.11ac WLAN enabled:
 Access points
 Media gateways
 Set-top boxes
 LCD TVs
Skyworks SKY85402-11 is a 5 GHz Microwave Monolithic
Integrated Circuit (MMIC) power amplifier (PA) with superior
output power, linearity, and efficiency. These features make the
SKY85402-11 ideal for wireless local area network (WLAN IEEE
802.11ac) applications.
 Other broadband triple-play multimedia applications
The device is fabricated using SiGe BiCMOS technology. The
device is internally matched and mounted in a 20-pin, 4 x 4 mm
Quad Flat No-Lead (QFN) surface-mount technology (SMT)
package, which allows for a highly manufacturable low cost
solution.
Features
 Linear output power for IEEE 802.11ac 256-QAM,
EVM < 1.8% = +22 dBm @ 5.0 V
A block diagram of the SKY85402-11 is shown in Figure 1.The
device package and pinout are shown in Figure 2. Signal pin
assignments and functional pin descriptions are described in
Table 1.
 High gain: 32 dB
 Power shutdown mode
 Superior gain flatness
 Fully matched at RF input/output ports
 Load insensitive power detector
 Small footprint QFN (20-pin, 4 x 4 mm) SMT package
(MSL3, 260 C per JEDEC J-STD-020)
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
RF_IN
Bias
Input
Match
Inter-Stage
Match
Input
Match
Inter-Stage
Match
Detector
VCC1
VCC2
RF_OUT
Y1928
PA_EN
VDET
VCC3
Figure 1. SKY85402-11 Block Diagram
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VCC1
VCC2
VCC3
GND
GND
PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
20
19
18
17
16
2
14
GND
RF_IN
3
13
RF_OUT
GND
4
12
GND
PA_EN
5
11
GND
6
7
8
9
10
VDET
GND
VCC3
GND
N/U
15
N/U
1
N/U
N/U
S2838a
Figure 2. SKY85402-11 Pinout
(Top View)
Table 1. SKY85402-11 Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
N/U
Not used; open circuit.
11
GND
Ground
2
GND
Ground
12
GND
Ground
3
RF_IN
RF input
13
RF_OUT
Power amplifier RF output
4
GND
Ground
14
GND
Ground
5
PA_EN
PA enable
15
GND
Ground
6
N/U
Not used; open circuit.
16
GND
Ground
7
N/U
Not used; open circuit.
17
GND
Ground
8
N/U
Not used; open circuit.
18
VCC3
Third stage supply voltage
9
VCC3
Third stage supply voltage
19
VCC2
Second stage supply voltage
10
VDET
Analog power detector output
20
VCC1
First stage supply voltage
Technical Description
Electrical and Mechanical Specifications
The SKY85402-11 PA contains all of the needed RF matching and
DC biasing circuits. The device also provides an output power
detector voltage.
The absolute maximum ratings of the SKY85402-11 are provided
in Table 2. Recommended operating conditions are specified in
Table 3. Electrical specifications are provided in Tables 4, 5,
and 6.
The SKY85402-11 is a three-stage, SiGe BiCMOS device
optimized for high linearity and power efficiency. These features
make the device suitable for wideband digital applications, where
PA linearity and power consumption are of critical importance
(e.g., WiFi systems or WLANs).
Typical performance characteristics of the SKY85402-11 are
illustrated in Figures 3 through 9.
The device has been characterized with the highest specified data
rates for IEEE802.11ac (256 QAM). Under these stringent test
conditions, the device exhibits excellent spectral purity and power
efficiency.
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Table 2. SKY85402-11 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
V
Supply voltage
VCC1, VCC2, VCC3
–0.3
+5.5
Enable voltage
PA_EN
–0.3
+3.6
V
RF input power
PIN
+12
dBm
Operating temperature
TOP
–40
+85
C
Storage temperature
TST
–40
+150
C
Junction temperature
TJ
+160
C
Thermal resistance
ΘJC
14.9
C/W
1000
V
Electrostatic discharge:
Human Body Model (HBM), Class 1C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY85402-11 Recommended Operating Conditions
Parameter
Symbol
Minimum
Typical
Maximum
Units
3.0
5.00
5.25
V
3.6
V
+25
+85
C
Supply voltage
VCC1, VCC2, VCC3
Enable voltage
PA_EN
1.8
Case operating temperature
TOP
–40
Table 4. SKY85402-11 Electrical Specifications: DC Characteristics (Note 1)
(VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C as Measured on the Evaluation Board, Unless Otherwise Noted)
Parameter
Supply current
Symbol
ICC
Quiescent current
ICQ
Enable voltage:
High
Low
PAEN_H
PAEN_L
Enable current
IEN
Test Condition
Min
Typical
Max
Units
POUT = +22 dBm, MCS9, 5 V
450
495
mA
POUT = +25 dBm, MCS7, 5 V
802.11ac:
560
615
mA
PA_EN = 0 V, No RF
20
100
μA
No RF
335
1.8
0
150
mA
3.6
0.5
V
V
200
μA
Note 1: Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
Table 5. SKY85402-11 Electrical Specifications: General (Note 1)
(VCC1 = VCC2 = VCC3 = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, Unless Otherwise Noted)
Parameter
Symbol
Frequency range
f
Output power
POUT
1 dB output compression point
Test Condition
Min
Typical
5.15
OP1dB
802.11ac, MCS9, –35 dB DEVM, HT80, 5 V
+20.5
802.11n, MCS7, –30 dB DEVM, HT40, 5 V
MCS0, 5 V, HT20, mask compliant
PIN = CW
5.85
+23
+25
dBm
+26
+27.5
dBm
+28
+29
dBm
|S21|
31
32
|S11|
8
14
 S21
2fo, 3fo
Rise and fall time
tR, tF
Stability
Ruggedness
Ru
GHz
dBm
Input return loss
2nd and 3rd harmonics
Units
+22
Small signal gain
Gain variation over band
Max
36
±1.5
POUT = +23 dBm
–50
dB
dB
dB
–45
dBm/MHz
0.5
μs
POUT = +28 dBm,
VSWR = 6:1, all phases
All non-harmonically related outputs
< –50 dBc/100 kHz
–
PIN = +10 dBm,
VSWR = 6:1, all phases
No damage
–
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 6. SKY85402-11 Electrical Specifications: Power Detector Characteristics (Note 1)
(VCC = 5.0 V, PA_EN = 3.3 V, TOP = +25 C, f = 5.4 GHz, Unless Otherwise Noted)
Parameter
Symbol
Output power detector range
PDR
Detector voltage
VDET
Detector accuracy
ERRDET
Test Condition
Min
Typical
0
Max
Units
OP1dB
dBm
POUT = +28 dBm
0.85
V
POUT = +25 dBm
0.65
V
POUT = No RF
0.30
V
ΔPOUT @ constant VDET, +25 dBm:
5.15 GHz to 5.32 GHz. 0.65 V
–0.5
+0.5
dB
5.32 GHz to 5.70 GHz, 0.66 V
–0.5
+0.5
dB
5.70 GHz to 5.85 GHz, 0.88 V
–0.5
+0.5
dB
Detection variation at VSWR = 3:1
±1.5
dB
Output impedance
PDZOUT
2
kΩ
DC load impedance
PDZLOAD
26.5
kΩ
Note 1: Performance is guaranteed only under the conditions listed in this table.
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Typical Performance Characteristics
(VCC1 = VCC2 = VCC3 = 5.0 V, TOP = +25 C, Unless Otherwise Noted)
5.0
4.5
3.5
4.0
3.0
2.5
3.0
DEVM (%)
DEVM (%)
3.5
2.5
2.0
1.5
0.5
0
+7
+9
+11
+13
+15
+17
+19
+21
+23
+25
1.5
1.0
5180 MHz
5500 MHz
5805 MHz
3.0%
1.8%
1.0
2.0
5150 MHz
5500 MHz
5850 MHz
802.11n Limit
802.11ac Limit
0.5
0
+7
+27
+9
+11
+13
Output Power (dBm)
35
0.80
34
0.75
33
0.70
32
0.65
31
30
29
28
+19
+21
+23
+25
+27
5150 MHz
5500 MHz
5850 MHz
0.60
0.55
0.50
0.45
5150 MHz
5500 MHz
5850 MHz
27
0.40
26
0.35
+10
+12
+14
+16
+18
+20
+22
+24
+26
0.30
+8
+28
+10
+12
+14
Output Power (dBm)
+16
+18
+20
+22
+24
+26
+28
Output Power (dBm)
Figure 5. Gain vs Output Power @ 5 V
(R8 and R11 with 0 Ω)
Figure 6. Total Current vs Output Power @ 5 V
1.0
+40
5500 MHz
5850 MHz
0.9
S11
S12
S21
S22
+20
0.8
S-Parameter (dB)
Detector Voltage (V)
+17
Figure 4. DEVM vs Output Power
(802.11ac, MCS9, HT40, 5 V)
Current (mA)
Gain (dB)
Figure 3. DEVM vs Output Power
(802.11ac, MCS9, HT80, 5 V)
25
+8
+15
Output Power (dBm)
0.7
0.6
0.5
0.4
0.3
0.2
0
–20
–40
–60
0.1
0
+3
–80
+5
+7
+9
+11
+13
+15
+17
+19
+21
+23
Output Power (dBm)
Figure 7. Detector Voltage vs Output Power
+25
+27
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
Figure 8. S-Parameters vs Frequency
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
–50
Harmonics (dBm/MHz)
–52
–54
–56
–58
–60
–62
–64
–66
2nd Harmonics
3rd Harmonics
–68
–70
5200
5300
5400
5500
5600
5700
5800
Frequency (MHz)
Figure 9. Harmonics vs Frequency
(@ +25 dBm)
Evaluation Board Description
Circuit Design Considerations
The SKY85402-11 Evaluation Board is used to test the
performance of the SKY85402-11 WLAN PA. A schematic diagram
of the SKY85402-11 Evaluation Board is shown in Figure 10. A
photograph of the Evaluation Board is shown in Figure 11.
Component values for the SKY85402-11 Evaluation Board are
listed in Table 7.
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
Evaluation Board Setup Procedure
 Paths to ground should be made as short as possible.
 The ground pad of the SKY85402-11 has special electrical and
thermal grounding requirements. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as the
heat sink, it must shunt as much heat as possible from the
device.
1. Connect system ground to pin 2 of connector J6.
2. Apply 5.0 V to pin 7 of connector J6.
3. By applying 3.3 V on PA_EN (pin 6 of the J5 header), the PA is
enabled. By placing a ground on PA_EN, the PA is disabled and
placed in a shutdown state, drawing minimal current.
4. The 5 GHz amplifier performance can be monitored by applying
an RF signal to connector J2 (RF_IN). Monitor the output power
on the RF_OUT port connector, J1.
5. Detector performance can be monitored on pin 4 of connector
J5.
CAUTION: Do not overdrive the amplifier by applying too much
RF on the device input. A suitable starting input power
setting is –20 dBm.
Therefore, design the connection to the ground pad to dissipate
the maximum wattage produced by the circuit board. Multiple
vias to the grounding layer are required. For further information,
refer to the Skyworks Application Note PCB Design Guidelines
for High Power Dissipation Packages, document number
201211.
 Bypass capacitors should be used on the DC supply lines. Refer
to the schematic drawing in Figure 10 for further details.
 The RF lines should be well separated from each other with
solid ground in between traces to maximize input-to-output
isolation.
 The RF_IN and RF_OUT ports are DC short to ground. These
ports need to be DC blocked with general purpose 10 pF
capacitors if there is DC present on the traces connecting to the
ports.
 The RF_IN and RF_OUT trace losses measured from device pin
to SMA connector are 0.2 dB each.
NOTE: A poor connection between the ground pad and ground
increases junction temperature (TJ), which reduces the life
of the device.
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Package Dimensions
The PCB layout footprint for the SKY85402-11 is provided in
Figure 12. Typical part markings are shown in Figure 13. Package
dimensions are shown in Figure 14, and tape and reel dimensions
are provided in Figure 15.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY85402-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
GND
3
4
VCC3A
VCC1
2
GND
GND
1
VCC2
VCC0
J6 Header
5
6
7
R2
0Ω
R8
27 Ω
R3
0Ω
R11
13 Ω
C20
4.7 uF
C6
1 nF
C9
1 nF
VCC Bridge
C8
100 nF
17
4
GND
14
RF_OUT
13
RF_IN
GND
GND
PA_EN
GND
N/U
5
GND
6
7
×
8
×
9
J1
L1
1.0 nH
C12
0.4 pF
12
RF Output
11
VDET
RF Input
15
VCC3
3
GND
N/U
2
J2
N/U
N/U
1
16
GND
18
VCC3
GND
19
VCC1
VCC2
20
10
×
R1
26.7 kΩ
C7
100 nF
C1
180 pF
VCC Bridge
J5 Header
7
VCC3B
6
PA_EN
5
GND
4
GND
3
VDET
2
DATA
1
CLK
Note: These pins are not used
for this product application.
Notes:
1. Components designated as DNI are not shown in this schematic.
2. The 0 Ω resistors R2 and R3 are not required in the final application.
Y0571
Figure 10. SKY85402-11 Evaluation Board Schematic
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Y0572
Figure 11. SKY85402-11 Evaluation Board
Table 7. SKY85402-11 Evaluation Board Bill of Materials
Component
Size
Value
Vendor
C1
0402
180 pF
Murata
C6, C9
0402
1 nF
C7, C8
0402
100 nF
C12
0402
0.4 pF
Murata
Mfr Part Number
Comments
GRM1555C1H181JA01
Multilayer ceramic
Murata
GRM1555C1H102JA01
Multilayer ceramic
Murata
GRM155R71C104KA88D
Multilayer ceramic
GJM1555C1HR40BB01
RF, High Q, Low Loss
C20
0603
4.7 uF
Murata
GRM188R60J475KE19
Multilayer ceramic
J1, J2
End launch
SMA
Johnson Components
142-0701-851
SMA end launch straight
jack receptacle - tab
contact
J5, J6
100 mil
7X1
Samtec
TSW-107-07-G-S
100 mil header
L1
0402
1.0 nH
Murata
LQG15HN1N0S02
High frequency multilayer
Z434-B
Skyworks Solutions Inc.
Z434-B
PCB
PCB1
R1
0402
26.7 kΩ
Panasonic
ERJ2RKF2672
Thick film chip resistor
R2, R3, R5, R6
0402
0Ω
Panasonic
ERJ2GEJ0R0
Thick film chip resistor
R8
0402
27 Ω
Panasonic
ERJ2GEJ270
Thick film chip resistor
R11
0402
13 Ω
Panasonic
ERJ2GEJ13R0
Thick film chip resistor
U1
QFN 400 X 400
SKY85402-11
Skyworks Solutions Inc.
SKY85402
802.11ac +22dBm PA
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
4.40
2.60
0.25 Typ.
20
19
18
17
4.40
0.25 Typ.
16
20
18
17
16
0.70 Typ.
0.70 Typ.
4.40
19
1
15
2
14
3
13
0.508 Typ.
0.20
2.60
1
15
2
14
3
13
4
12
0.95 Typ.4
12
5
11
5
11
6
7
8
9
Package
Outline
10
6
7
8
9
4.40
10
4X 0.20
0.500 Typ.
0.508 Typ.
25X ø0.25
0.500 Typ.
0.95 Typ.
Board Metal & Via Pattern
Top View (Note 4)
Package
Outline
0.20
Stencil Aperture
Top View (Note 5)
63% Solder Converage
On Center Pads
4.50
0.35 Typ.
20
19
18
17
16
0.80 Typ.
4.50
1
15
2
14
3
13
4
12
5
11
6
7
8
9
10
0.500 Typ.
2.40
2.40
Package
Outline
Solder Mask Opening
Top View (Note 6)
Notes:
1. All dimensions are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hold recommendations: 30 to 35 μm Cu via wall plating, via holes
should be tented with solder mask on the backside and filled with solder.
5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures,
trapezoidal walls, and rounded corners offer better paste release.
6. Solder mask recommendations: contact board fabricator for recommended solder mask
offset and tolerance.
Figure 12. PCB Layout Footprint for the SKY85402-11
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S2701
PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Pin 1
Indicator
SKY85402
XXXXXXXXX
YYWW CC
Skyworks
Part #
Lot #
Date Code/
Country Code
Figure 13. Typical Part Markings
(Top View)
0.850 ± 0.050
2X
4.000 ± 0.050
0.15 C
A
See Note 3
B
20
4.000 ± 0.050
19
18
17
2.500 ± 0.050
0.10 M C A B
0.30 x 45°
0.203 Ref.
16
16
1
15
15
2
14
14
3
13
4
12
5
11
2.500 ± 0.050
17
18
19
20
1
R0.05
Typ.
2
13
3
12
4
11
5
0.500
0.10 M C A B
Seating
Plane
2X
0.15 C
6
7
8
9
10
0–0.05
C
Top View
10
20X 0.250 ± 0.050
0.10 M C A B
0.05 M C
Side View
9
8
7
6
20X 0.500 ± 0.050
Bottom View
NOTES:
1. All measurements are in millimeters.
2. Dimensioning and tolerancing according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance:
Angular Tolerance:
X.X (1 place) ± 0.1 mm
±1°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Terminal #1 identification mark located within marked area.
4. Unless specified, dimensions are symmetrical about center lines.
S2836
Figure 14. SKY85402-11 20-Pin QFN Package Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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PRELIMINARY DATA SHEET • SKY85402-11: HIGH-POWER (+22 dBm) 802.11ac WLAN PA
2.0 ±0.1 (Note 1)
Ø1.5
±0.05
1.75 ±0.1
B
A
Min
12.00 ±0.3
Ø1.55
5.50 ±0.1
(Note 1)
0.30 ±0.05
4.0 ±0.1 (Note 2)
4.35 ±0.1
Ref 3°
B
8.00 ±0.1
4.35 ±0.1
1.10 ±0.1
Ref R0.25
Section B
Ref R0.25
Notes:
1. Measured from center line of sprocket hole to center line of pocket.
2. Cumulative tolerance of 10 sprocket holes is ±0.20.
3. All dimensions are in millimeters, unless otherwise specified.
Detail A
Figure 15. SKY85402-11 20-Pin QFN Tape and Reel Dimensions
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June 2, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202120I
Y0502
PRELIMINARY DATA SHEET • SKY85402-11: HIGH POWER (+22 dBm) 802.11ac WLAN PA
Ordering Information
Model Name
SKY85402-11: High-Power WLAN Power Amplifier
Manufacturing Part Number
SKY85402-11
Evaluation Board Part Number
SKY85402-11-EK1
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