DATA SHEET SE5003L1-R: High-Power (+19 dBm) 802.11ac WLAN Power Amplifier with Integrated Power Detector Applications Description IEEE802.11ac WLAN enabled: Access points Media gateways Set-top boxes LCD TVs Skyworks SE5003L1-R is a 5-GHz Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SE5003L1-R ideal for Wireless Local Area Network (WLAN IEEE 802.11ac) applications. Other broadband triple-play multimedia applications The device is fabricated using Indium Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT) technology. The device is internally matched and mounted in a 20-pin, 4 x 4 mm Quad Flat No-Lead (QFN) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low-cost solution. Features Linear output power of +19 dBm for IEEE 802.11ac 256-QAM, EVM < 1.8% @ 5.0 V High gain of 32 dB @ 5.0 V 3.3 to 5 V operation The device package and pinout for the 20-pin QFN are shown in Figure 1. A block diagram of the SE5003L1-R is shown in Figure 2. Power shutdown mode Fully matched at RF input/output ports VCC1 VCC2 VCC3 GND GND Superior gain flatness Load insensitive power detector 20 19 18 17 16 GND 2 14 GND RF_IN 3 13 RF_OUT GND 4 12 GND VREF 5 11 GND 6 7 8 9 10 DET GND N/U 15 N/U 1 SP2 N/U SP1 Small footprint QFN (20-pin, 4 x 4 mm) SMT package (MSL3, 260 C per JEDEC J-STD-020) S2838 Figure 1. SE5003L1-R Pinout – 20-Pin QFN (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 1 DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA SP1 SP2 Bias VREF Input Match RF_IN Inter-Stage Match Output Match Inter-Stage Match RF_OUT Detector VCC1 VCC2 VDET VCC3 S2823 Figure 2. SE5003L1-R Block Diagram Technical Description Electrical and Mechanical Specifications The SE5003L1-R PA contains all of the needed RF matching and DC biasing circuits. The device also provides an output power detector voltage. Signal pin assignments and functional pin descriptions are described in Table 1. The absolute maximum ratings of the SE5003L1-R are provided in Table 2. Recommended operating conditions are specified in Table 3. Electrical specifications are provided in Tables 4 through 8. The SE5003L1-R is a three-stage, HBT InGaP device optimized for high linearity and power efficiency. These features make the device suitable for wideband digital applications, where PA linearity and power consumption are of critical importance (e.g., WiFi systems or WLANs). Typical performance characteristics of the SE5003L1-R are illustrated in Figures 3 through 8. The device has been characterized with the highest specified data rates for IEEE802.11ac (256 QAM). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency. Table 1. SE5003L1-R Signal Descriptions Pin # Name Description Pin # Name Description 1 N/U Not used; open circuit. 11 GND Ground 2 GND Ground 12 GND Ground 3 RF_IN RF input 13 RF_OUT Power amplifier RF output 4 GND Ground 14 GND Ground 5 VREF Reference voltage 15 GND Ground 6 SP1 Port for optional capacitor to improve dynamic EVM 16 GND Ground 7 SP2 Port for optional capacitor to improve dynamic EVM 17 GND Ground 8 N/U Not used; open circuit. 18 VCC3 Third stage supply voltage 9 N/U Not used; open circuit. 19 VCC2 Second stage supply voltage 10 DET Analog power detector output 20 VCC1 First stage supply voltage Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA Table 2. SE5003L1-R Absolute Maximum Ratings (Note 1) Parameter Minimum Maximum Units VCC1, VCC2 –0.3 VCC3 V VCC3 –0.3 +6.0 V Reference voltage VREF –0.3 +3.6 V RF input power PIN +6 dBm Operating temperature TOP –40 +85 C Storage temperature TST –40 +150 C Junction temperature TJ Thermal resistance ΘJC Electrostatic Discharge Human Body Model (HBM), Class 1A ESD Supply voltage Symbol +160 C 43 C/W 250 V Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE5003L1-R Recommended Operating Conditions Parameter Supply voltage Symbol Minimum Typical Maximum Units VCC1, VCC2 3.0 VCC3 VCC3 V VCC3 3.0 5.0 5.5 V 2.9 V +25 +85 C Reference voltage VREF 2.8 Case operating temperature TOP –40 Table 4. SE5003L1-R Electrical Specifications: DC Characteristics (Note 1) (VCC1 = VCC2 = VCC3 = 5.0 V, VREF = 2.85 V, TOP = +25 C as Measured on the Evaluation Board, Unless Otherwise Noted) Parameter Supply current Symbol ICC Quiescent Current ICQ Reference voltage enabled VREF_H Reference voltage disabled VREF_L Reference voltage current IREF Test Condition Min Typical Max Units POUT = +19 dBm, 5.0 V 205 240 mA POUT = +23 dBm, 54 Mbps, 5.0 V 300 340 mA POUT = +19 dBm, 3.3 V 200 230 mA POUT = +21 dBm, 3.3 V 230 265 mA VREF = 0 V, No RF 0.5 10 No RF 120 2.80 2.85 0 VREF voltage set to 2.85 V μA mA 2.90 0.5 10 V V mA Note 1: Performance is guaranteed only under the conditions listed in this Table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 3 DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA Table 5. SE5003L1-R Electrical Specifications: General, 5.0 V Operation (Note 1) (VCC1 = VCC2 = VCC3 = 5.0 V, VREF = 2.85 V, TOP = +25 C, Unless Otherwise Noted) Parameter Symbol Frequency range f Output power POUT Test Condition Min Typical 5.15 1 dB output compression point OP1dB Small signal gain |S21| Input return loss |S11| Gain variation over band S21 2nd and 3rd harmonics 2fo, 3fo Rise and fall time tR, tF Stability Ruggedness Max Units 5.90 GHz 802.11ac, MCS9, 1.8% DEVM, HT80 +17 +18 dBm 802.11ac, MCS9, 1.8% DEVM, HT40 +18 +19 dBm 802.11n, MCS7, 3% DEVM, HT40 +22 +23 dBm 802.11n, MCS0, HT40, mask compliant +24 PIN = CW +28 +32 dBm 28 32 dBm 35 –11 POUT = +23 dBm dB dB ±1.5 dB –45 dBm/MHz 0.5 μs POUT = +23 dBm, VCC = 5 V, 54 Mbps, 64 QAM, VSWR = 6:1, all phases All non-harmonically related outputs < –50 dBc/100 kHz PIN = –10 dBm, CW, VSWR = 6:1, all phases No damage Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 6. SE5003L1-R Electrical Specifications: General, 3.3 V Operation (1 of 2) (Note 1) (VCC1 = VCC2 = VCC3 = 3.3 V, VREF = 2.85 V, TOP = +25 C, Unless Otherwise Noted) Parameter Symbol Frequency range f Output power POUT 1 dB output compression point OP1dB Small signal gain |S21| Input return loss |S11| Gain variation over band S21 2nd and 3rd harmonics 2fo, 3fo Rise and fall time tR, tF Test Condition Min Typical 5.15 Max Units 5.90 GHz 802.11ac, MCS9, 1.8% DEVM, HT80 +17 +18 dBm 802.11ac, MCS9, 1.8% DEVM, HT40 +18 +19 dBm 802.11n, MCS7, 3% DEVM, HT40 +20 +21 dBm 802.11n, MCS0, HT40, mask compliant +22 PIN = CW +24 +28 27 31 dBm dBm 34 –11 ±1.5 POUT = +23 dBm –45 dB dB –42 0.5 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 dB October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J dBm/MHz μs DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA Table 6. SE5003L1-R Electrical Specifications: General, 3.3 V Operation (2 of 2) (Note 1) (VCC1 = VCC2 = VCC3 = 3.3 V, VREF = 2.85 V, TOP = +25 C, Unless Otherwise Noted) Parameter Symbol Stability Ruggedness Test Condition Min Typical Max POUT = +23 dBm, VCC = 5 V, 54 Mbps, 64 QAM, VSWR = 6:1, all phases All non-harmonically related outputs < –50 dBc/100 kHz PIN = –10 dBm, CW, VSWR = 6:1, all phases No damage Units Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 7. SE5003L1-R Electrical Specifications: Power Detector Characteristics for 5.0 V Operation (Note 1) (VCC = 5.0 V, VREF = 2.85 V, TOP = +25 C, f = 5.4 GHz, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical 0 Max Units OP1dB dBm Output power detector range PDR Detector voltage VDET POUT = +23 dBm 1.00 V POUT = No RF 0.35 V Detector accuracy ERRDET ΔPOUT @ constant VDET: 5.15 GHz to 5.70 GHz –0.5 +0.5 dB 5.70 GHz to 5.85 GHz –0.5 +0.5 dB VSWR = 3:1 –1.5 to +1.5 dB –1.5 +1.5 dB Output impedance PDZOUT 700 Ω DC load impedance PDZLOAD 26.5 kΩ Note 1: Performance is guaranteed only under the conditions listed in this Table. Table 8. SE5003L1-R Electrical Specifications: Power Detector Characteristics for 3.3 V Operation (Note 1) (VCC = 3.3 V, VREF = 2.85 V, TOP = +25 C, f = 5.4 GHz, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical 0 Max Units OP1dB dBm Output power detector range PDR Detector voltage VDET POUT = +22 dBm 0.85 V POUT = No RF 0.35 V Detector accuracy ERRDET ΔPOUT @ constant VDET: 5.15 GHz to 5.70 GHz –0.5 +0.5 dB 5.70 GHz to 5.85 GHz –0.5 +0.5 dB VSWR = 3:1 –1.5 to +1.5 dB –1.5 +1.5 dB Output impedance PDZOUT 700 Ω DC load impedance PDZLOAD 26.5 kΩ Note 1: Performance is guaranteed only under the conditions listed in this Table. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 5 DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA Typical Performance Characteristics (VCC1 = VCC2 = VCC3 = 5.0 V, TOP = +25 C, Unless Otherwise Noted) 5 5 4 3 EVM (%) EVM (%) 4 2 5150 MHz 5500 MHz 5850 MHz 1 0 +10 +12 +14 +16 +18 +20 +22 3 2 5150 MHz 5500 MHz 5850 MHz 1 +24 0 +10 +26 +12 +14 +16 Output Power (dBm) +18 +20 +22 +24 Figure 3. EVM vs Output Power (802.11ac, MCS9, HT80) Figure 4. EVM vs Output Power (802.11ac, MCS9, HT40) 400 40 5150 MHz 5500 MHz 5850 MHz 38 300 Gain (dB) Current (mA) 350 250 200 5150 MHz 5500 MHz 5850 MHz 150 100 +10 +12 +14 +16 +18 +20 +22 +24 36 34 32 30 +10 +26 +12 +14 Output Power (dBm) +30 5150 MHz 5500 MHz 5850 MHz +9 +11 +13 +15 +17 +19 +21 +23 +25 +27 +29 Output Power (dBm) Figure 7. Detector Voltage vs Output Power S-Parameters (dB) Voltage (V) +40 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 +3 +7 +18 +20 +22 +24 +26 +28 +30 +32 Figure 6. Gain vs Output Power 1.6 +5 +16 Output Power (dBm) Figure 5. Operating Current vs Output Power (OFDM, 256 QAM, HT40, 100% Duty Cycle) S22 S21 S11 +20 +10 0 –10 –20 –30 3 4 5 6 7 Frequency (GHz) Figure 8. Small Signal Parameters vs Frequency Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 +26 Output Power (dBm) October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J 8 DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA Evaluation Board Description The SE5003L1-R Evaluation Board is used to test the performance of the SE5003L1-R WLAN PA. A schematic diagram of the SE5003L1-R Evaluation Board is shown in Figure 9. A photograph of the Evaluation Board is shown in Figure 10. Component values for the SE5003L1-R Evaluation Board are listed in Table 9. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Paths to ground should be made as short as possible. The ground pad of the SE5003L1-R has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. Refer to the schematic drawing in Figure 9 for further details. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation. NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device. Evaluation Board Setup Procedure Step 1: Connect system ground to pin 1 of connector J3. Step 2: Apply 5.0 V to pins 4, 6, and 8 of connector J3. Step 3: By applying 2.85 V on VREF (pin 2 of the J3 header), the PA is enabled. By placing a ground on VREF, the PA is disabled and placed in a shutdown state, drawing minimal current. Step 4: The 5 GHz amplifier performance can be monitored by applying an RF signal to connector J2 (RF_IN). Monitor the output power on the RF_OUT port connector, J1. Step 5: Detector performance can be monitored on pin 10 of connector J3. Care should be taken not to overdrive the amplifier by applying too much RF on the device input. A suitable starting input power setting would be –20 dBm. Package Dimensions Typical case markings for the SE5003L1-R are shown in Figure 11. The PCB layout footprint for the SE5003L1-R is provided in Figure 12. Package dimensions for the 20-pin QFN are shown in Figure 13, and tape and reel dimensions are provided in Figure 14. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE5003L1-R is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 7 DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA J3 Header 3 4 5 6 7 8 9 10 VDET 2 VREF 1 C20 10 μF C14 100 nF R5 3.3 Ω C6 100 nF C2 220 pF RF Input 4 5 VREF C11 47 nF GND GND VCC3 GND GND GND RF_OUT RF_IN GND GND VREF GND R6 (See Note) 6 7 8 9 × × × 15 14 J1 13 12 11 RF Output C18 10 pF DET 3 16 N/U N/U C19 10 pF 17 N/U 2 18 SP2 J2 1 SP1 × 19 VCC2 VCC1 20 10 DET R1 26.7 kΩ Note: Some component labels may be different than the corresponding component symbol shown here. Component values, however, are accurate as of the date of this Data Sheet. Component R6 = 2.2 kΩ for 3.3 V operation, 510 Ω for 5.0 V operation. Y0013 Figure 9. SE5003L1-R Evaluation Board Schematic Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA Figure 10. SE5003L1-R Evaluation Board Table 9. SE5003L1-R Evaluation Board Bill of Materials Component Size Value Vendor Part # Comments C2 0402 220 pF Murata GRM1555C1H221JA01 Multilayer ceramic C6, C14 0402 100 nF Murata GRM155R61A104KA01 Multilayer ceramic C11 0402 47 nF Murata GRM155R71E473KA88 Multilayer ceramic C18, C19 0402 10 pF Murata GRM1555C1H100JZ01 Multilayer ceramic C20 0805 10 μF Murata GRM21BR61A106KE19 Ceramic J1, J2 End launch SMA Johnson Components 142-0701-851 SMA end launch straight jack receptacle, tab contact J3 100 mil 10X1 Samtec TSW-110-07-G-S 100 mil header R1 0402 26/7 k Ω Panasonic ERJ2RKF2672 Thick film chip resistor R5 0402 3.3 Ω Panasonic ERJ2GEJ3R3 Thick film chip resistor R6 0402 0402 2.2 kΩ (3.3 V operation) 510 Ω (5 V operation) Panasonic Panasonic ERJ3GEYJ222 ERJ2GEJ621 Thick film chip resistor Thick film chip resistor Pin 1 Indicator Skyworks Part # Lot Code Date Code: YY = Calendar Year WW = Work Week CC = Country Code Y0221 5003L1 XXXXX YYWW CC Figure 11. Typical Case Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 9 2X 1.78 5X 1.02 0 5X 0.51 2X 0.20 5X 0.51 2X 1.78 4.40 2.60 5X 1.02 DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA Via Pattern (Note 4) 2X 1.78 Board Metal 5X 1.02 5X 0.51 2.60 (0.25 Ref) Typ R0.20 Typ 0 0 2X 0.20 4.40 5X 0.51 5X 1.02 2X 0.20 2X 1.78 0 0.70 Typ 2X 0.20 0.500 Typ 0.25 Typ 4X ø0.457 4.50 2.40 25X ø0.254 4.40 0.95 Typ Solder Mask Pattern 0.20 Typ Stencil Pattern (Note 5) 0.95 Typ 2.40 4.40 0.20 Typ 63% Solder Coverage on Center Pad 4.50 0.80 Typ 0.70 Typ 0.35 Typ 0.500 Typ 4x4 QFN Package Outline 0.25 Typ 0.500 Typ NOTES: 1. 2. 3. 4. All measurements are in millimeters. Dimensioning and tolerancing according to ASME Y14.5M-1994. Unless specified, dimensions are symmetrical about center lines. Via hole recommendations: 0.025 mm Cu via wall plating (minimum), via holes to be filled with conductive paste and plated over. 5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures trapezoidal walls, and rounded corners offer better paste release. Figure 12. PCB Layout Footprint for the SE5003L1-R Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J Y0222 DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA 4.00 ± 0.05 A 0.85 ± 0.05 0.05 C 2.50 ± 0.05 0.203 Ref B 0.30 x 45° 0 – 0.005 Pin 1 Indicator Pin 1 Indicator Exposed Pad 4.00 ± 0.05 2.50 ± 0.05 R0.075 Typ. 20X 0.15 Min 0.05 C 20X 2X 0.05 C NOTES: 1. All measurements are in millimeters. 2. Dimensioning and tolerancing according to ASME Y14.5M-1994. Unless otherwise specified the following values apply: Decimal Tolerance: Angular Tolerance: X.X (1 place) ± 0.1 mm ±0.5° X.XX (2 places) ± 0.05 mm X.XXX (3 places) ± 0.025 mm 3. Coplanarity applies to the exposed center ground pad as well as the terminals. 4. Dimension applies to the metallized terminal. If the terminal has a radius, the dimension should not be measured in that radius area. 5. Unless specified, dimensions are symmetrical about center lines. See Detail A 0.500 3 C Top View 0.08 C Seating Plane 2X Bottom View 2X R0.075 0.50 ± 0.05 0.25 ± 0.05 0.10 M C A B 0.05 M C 4 Detail A Scale 2X (20 places) Y0219 Figure 13. SE5003L1-R 20-Pin QFN Package Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 11 DATA SHEET • SE5003L1-R HIGH-POWER (+19 dBm) 802.11ac WLAN PA ∅1.50 4.35 ± 0.10 (Bo) 1.75 ± 0.10 B A 10o Max 2.00 ± 0.05 ± 0.10 A B ∅1.50 12.00 +0.30/–0.10 1.13 ± 0.10 (Ko) 4.00 ± 0.10 5.50 ± 0.05 8.00 ± 0.10 Reference Pin Indicator ± 0.25 0.229 ± 0.02 (T) Detail B 10o Max Notes: 1. Carrier tape material: black conductive polycarbonate or polysterene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC tape and reel specification. 5. Tolerance: .XX = ±0.10 6. All measurements are in millimeters 4.35 ± 0.10 (Ao) Detail A Figure 14. SE5003L1-R 20-Pin QFN Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 12 October 3, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201785J S2585 DATA SHEET • SE5003L1-R HIGH- POWER (+19 dBm) 802.11ac WLAN PA Ordering Information Model Name SE5003L1-R High-Power WLAN Power Amplifier Manufacturing Part Number SE5003L1-R Evaluation Board Part Number SE5003L1-R-EK1 Copyright © 2012-2013 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. 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Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201785J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 3, 2013 13