SE5012T_202395D.pdf

DATA SHEET
SE5012T: 5 GHz Front-End Module with Power Detector
Applications
Description
 5 GHz WLAN (IEEE 802.11a/g/n)
The SE5012T is a 5 GHz front-end module offering high linear
power for wireless LAN applications. It incorporates a power
detector for control of the output power.
 Access points, PCMCIA, PC cards
The SE5012T offers a high level of integration for a simplified
design, providing quicker time to market and higher application
board production yield. The device integrates the input match,
inter-stage match, a temperature-compensated, load-insensitive
power detector with 20 dB of dynamic range, a 3.8 GHz notch
filter, a T/R switch, and LNA.
Features
 5 GHz front-end module with PA, LNA, and T/R switch
 Integrated power amplifier enable pin (VEN)
 Buffered, temperature-compensated power detector
 5 V or direct-to-battery operation
 3% EVM, 64 QAM, 54 Mbps: +17 dBm @ 3.3 V or +21 dBm
@5V
 30 dB typical gain
 Lead free, halogen-free, ROHS compliant QFN
(16-pin, 3 mm  3 mm  0.55 mm) package
(MSL1, 260 C per JEDEC J-STD-020)
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
VCC1, 2
The SE5012T integrates the reference voltage generator, allowing
for a true 1.8 V CMOS compatible digital EN (enable) function to
turn the power amplifier on and off.
A block diagram of the SE5012T is shown in
Figure 1. The device package and pinout for the 16-pin QFN are
shown in Figure 2. Signal pin assignments and functional pin
descriptions are described in Table 1.
H/L Lin
C0
C1
Bias, Enable, Detector Circuits
EN
TXIN
VDD
For wireless LAN applications, the device meets the requirements
of IEEE 802.11a and delivers approximately +17 dBm of linear
output power at VCC = 3.3 V or 21 dBm at VCC = 5.0 V.
Match
and Filter
Match
ANT
RX
Note: The TXIN has a DC short to ground.
An external blocking capacitor is recommended at the TXIN port.
ts009
Figure 1. SE5012T Block Diagram
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EN
1
GND
VCC2
VCC1
H/L Lin
DET
DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
16
15
14
13
12
GND
2
11
ANT
TXIN
3
10
GND
GND
4
9
VDD
5
6
7
8
RX
GND
C0
C1
17 GND
ts020
Figure 2. SE5012T Pinout
(Top View
Table 1. SE5012T Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
EN
PA enable
9
VDD
LNA supply voltage
2
GND
Ground
10
GND
Ground
3
TXIN
5 GHz TX RF input signal
11
ANT
5 GHz antenna output
4
GND
Ground
12
GND
Ground
5
RX
5 GHz LNA output signal
13
DET
Power detector output
6
GND
Ground
14
H/L Lin
High-low linearity control
7
C0
Switch control logic 1
15
VCC1
Power amplifier supply voltage
8
C1
Switch control logic 2
16
VCC2
Power stage supply voltage
Electrical and Mechanical Specifications
The absolute maximum ratings of the SE5012T are provided in
Table 2. Recommended operating conditions are specified in
Table 3. Electrical specifications are provided in Tables 4 through
9. Figure 3 shows the power detector characteristics.
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DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
Table 2. SE5012T Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
Supply voltage on pins VCC1, VCC2
VCC
0.3
+5.5
V
Supply voltage on pin VDD
VDD
0.3
+3.6
V
DC input on Enable
VEN
0.3
+3.6
V
12
dBm
40
+150
C
+150
C
500
V
RF input power, RFout into 50  match
TXIN
Storage temperature range
TSTG
Junction temperature
TJ
Electrostatic discharge:
ESD
Human Body Model (HBM), Class 1B
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
Note 2: These are stress ratings only. Exposure to stresses beyond these maximum ratings for a long period of time may cause permanent damage to, or affect the reliability of the device.
Avoid operating the device outside the recommended operating conditions defined below.
CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE5012T Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
Supply voltage on pins VCC1, VCC2
VCC
3.0
5.5
V
Supply voltage on pin VDD
VDD
3.0
3.6
V
Ambient temperature
TA
40
+85
C
Table 4. SE5012T Electrical Specifications: Control Logic Characteristics (Note 1)
(VCC = 5.0 V, VDD = VEN = 3.3 V, TA = +25 C as Measured on the SE5012T-EK1 Evaluation Board, Unless Otherwise Noted)
Parameter
Supply current, transmit mode
LNA supply current
Supply current
Symbol
Typical
Max
Units
POUT = 21 dBm, 54 Mbps, 64 QAM, VCC = 5.0 V,
H/L Lin = 3.3 V
270
350
mA
POUT = 17 dBm, 54 Mbps, 64 QAM, VCC = 3.3 V,
H/L Lin = 3.3 V
195
mA
IDD
VEN = C0 = 0 V, C1 = 3.3 V
13
mA
IOFF
VEN = 0 V, no RF, C0 = C1 = 0 V measured on
VCC, VDD pins
20
ICC_802.11a
Test Condition
Min
50
A
Logic high voltage
VENH
2.8
3.6
V
Logic low voltage
VENL
0.3
0.3
V
400
A
Input current logic high voltage
IENH
Input current logic low voltage
IENL
10 k on chip pull down resistor
330
<1
A
Note 1: Performance is guaranteed only under the conditions listed in this table.
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DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
Table 5. SE5012T Electrical Specifications: Switch Logic Characteristics (Note 1)
(VCC = 3.0 V to 5.5 V, VDD = VEN = 3.3 V, TA = +25 C as Measured on the SE5012T-EK1 Evaluation Board, All Unused Ports Terminated
with 50 , Unless Otherwise Noted)
Max
Units
Low loss switch control voltage
Parameter
ON
Symbol
High state = VCTL_ON  VCTL_OFF
2.8
3.6
V
High loss switch control voltage
OFF
Low state = VCTL_OFF  VCTL_OFF
0
0.3
V
Control input capacitance
CCTL
Control line current
ICTL
Test Condition
Min
Typical
VCTL = VCTL_ON
2
100
pF
10
A
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 6. Switch Control Logic Table
C0
C1
All other states
EN
Hi/L Lin
ANT
OFF
ON
ON
Tx
OFF
OFF
OFF
D/C (Note 1)
Rx bypass
OFF
All other states
OFF
D/C (Note 1)
Rx LNA ON
All other states
All other states
Unsupported state
Note 1: D/C = don’t care
Table 7. SE5012T Electrical Specifications: AC Characteristics (Transmit Characteristics) (Note 1)
(VCC = 5.0 V, VDD = VEN = C0 = H/L Lin = 3.3 V, C1 = 0 V, TA = +25 C, as Measured on the SE5012T-EK1 Evaluation Board, Unless
Otherwise Noted)
Parameter
Frequency range
Output power
OFDM signal,
64 QAM,
Symbol
Test Condition
fL_U
VCC = 5.0 V
EVM = 3%
POUT
EVM  1.5%
Output 1 dB compression point,
no modulation
P1dB
Input return loss
S11
Small signal gain, PIN = 25 dBm
S21
Small signal gain variation
S21
Min
19
S21_3.8
Max
Units
5.85
GHz
21
dBm
VCC = 3.3 V
17
dBm
VCC = 5.0 V
12
dBm
VCC = 3.3 V
9
dBm
VCC = 5.0 V
27
dBm
VCC = 3.3 V
24
dBm
PIN = 25 dBm
12
dB
29
Gain variation over single 40 MHz channel
Gain variation over band
Out of band gain
Typical
5.15
36
dB
0.5
dB
4
dB
Gain at 3.8 GHz
15
dB
50
45.2
dBm/MHz
3f
50
45.2
dBm/MHz
Rise and fall time
tR, tF
0.5
Stability
STAB
POUT = 17 dBm, 54 Mbps, 64QAM, VSWR = 6:1,
all phases
All non-harmonically related outputs less than
50 dBc/100 kHz
Tolerance to output load
mismatching
Rugged-ness
Constant PIN equal to POUT = 21 dBm at 50 ,
54 Mbps, 64QAM, VCC = 5.5 V, VSWR = 6:1, all phases
No damage
Robustness to input power
Robust
PIN = 12 dBm, CW, VSWR = 6:1, all phases
No damage
2f
Harmonic
POUT = 17 dBm, OFDM
Note 1: Performance is guaranteed only under the conditions listed in this table.
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s
DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
Table 8. SE5012T Electrical Specifications: AC Characteristics (Receive Characteristics) (Note 1)
(VCC = 3.0 V to 5.5 V, VDD = C1 = 3.3 V, VEN = C0 = 0 V, TA = +25 C as Measured on the SE5012T-EK1 Evaluation Board, All Unused Ports
Terminated with 50 , Unless Otherwise Noted)
Parameter
Frequency range
Symbol
Test Condition
fOUT
Insertion loss
Rx gain
High gain mode
NF
Input return loss
RXRL
Output return loss
Typical
11
Units
GHz
2.5
At the antenna port
12
At RX RF output
6
dB
14
High gain mode
Measured at ANT port, high gain mode
Max
5.85
5
Bypass mode: C0 = C1 = 0 V
RX
Noise figure
Min
5.15
dB
3.5
dB
dB
8
dB
5
dBm
Input P1dB
RX_IP1dB
Max 2.4 GHz interferer power
RX_2.4int
1 dB degradation of IP1dB
Transmit power at Rx output
TXLEAK
VEN = C0 = H/L Lin = 3.3 V, C1 = 0 V,
24 dBm at the ANT port
13
dBm
T/R on/off switching speed
tON/OFF
C0, C1 (50%) to RF output (10% or 90%)
300
ns
LNA bypass mode
10
dBm
0
dBm
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 9. SE5012T Electrical Specifications: Power Detector Characteristics (Note 1)
(VCC = 3.0 V to 5.5 V, VDD = VEN = C0 = 3.3, C1 = 0 V, f = 5.4 GHz, TA = +25 C as Measured on the SE5012T-EK1 Evaluation Board, Unless
Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
0
P1dB
dBm
POUT detect range
PDR
Detector voltage
VDET22
POUT = 22 dBm
0.80
0.95
V
Detector voltage
VDET16
POUT = 16 dBm
0.60
0.65
V
Detector voltage
VDET2
POUT = 2 dBm
0.25
Output impedance
PDZOUT
0.35
5
V
k
Note 1: Performance is guaranteed only under the conditions listed in this table.
Figure 3. Power Detector Performance vs Frequency
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DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
Package Dimensions
Package Handling Information
The PCB layout footprint for the SE5012T is provided in
Figure 4. Typical part markings are shown in Figure 5. Package
dimensions are shown in Figure 6, and carrier tape dimensions
are provided in Figure 7.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SE5012T is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
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3X 0.65
2X 0.33
0.25 Typ
3X 0
3X 0.65
3.40
0.500 Typ
2X 0.33
DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
0.60 Typ
3X 0.65
3.40
2X 0.32
3X 0
1.80
0
2X 0.32
3X 0.65
9X Ø0.254
0
4X Ø0.203
1.80
Via Pattern
(Note 4)
Board Metal
3.40
3.50
0.25 Typ
0.500 Typ
0.35 Typ
0.500 Typ
0.60 Typ
0.70 Typ
3.50
3.40
0.20 Typ
1.70
0.65 Typ
Package Outline
1.70
0.20 Typ
Solder Mask Pattern
(Note 6)
Stencil Pattern
(Note 5)
0.65 Typ
58% Solder Coverage
on Center Pad
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hole recommendations:
0.025 mm Cu via wall plating (minimum),
solder mask on the far side should tent or plug via holes.
5. Stencil recommendations:
0.125 mm stencil thickness, laser cut apertures, trapezoidal walls and
rounded corners offer better paste release.
6. Solder mask recommendations:
Contact board fabricator for recommended solder mask offset and tolerance.
Y1642
Figure 4. PCB Layout Footprint for the SE5012T
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DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
Pin 1 indicator
Company name
Pin 1
Part number
SiGe
5012T
Lot Code
Lot code
ts010
Figure 5. Typical Part Markings
(Top View)
2X
A
3.000 ±0.050
0.15 C
See Note 3
B
16
15
14
1.700 ±0.050
0.10 M C A B
0.550 ±0.050
4X 0.250 ±0.050
0.30 X 45°
0.152 Ref.
13
13
14
15
16
Do Not Solder
(4 places)
0.10 M C A B
1
12
2
11
3
4
12
1
11
2
10
10
3
9
9
1.700 ±0.050
3.000 ±0.050
0.500
R0.075 Typ
4
Seating
Plane
2X
0.15 C
5
6
7
8
0 – 0.050
C
4X Ø0.150 ±0.050
0.10 M C A B
0.05 M C
8
7
6
5
16X 0.250 ±0.050
0.10 M C A B
0.05 M C
16X 0.350 ±0.050
Bottom View
Top View
Notes:
1. All measurements are in millimeters.
2. Dimensions and tolerances according to ASME Y14.5M-1994.
Unless otherwise specified the following values apply:
Decimal Tolerance: Angular Tolerance:
X.X (1 place) ± 0.1 mm
±1°
X.XX (2 places) ± 0.05 mm
X.XXX (3 places) ± 0.025 mm
3. Terminal #1 identification mark located within marked area.
4. Unless specified, dimensions are symmetrical about center lines.
Figure 6. SE5012T Package Dimensions
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Y0630
DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
4.0 ± 0.1 (Note 2)
2.0 ± 0.1 (Note 1)
3.30 ± 0.10
Y
1.75 + 0.10
“A”
Ø1.5 Min.
12.00 ± 0.30
Ø1.55 + 0.05
(Note 1)
5.50 ± 0.10
0.30 ± 0.05
Ref. 3º
Pin #1
Y
3.30 ± 0.10
Ref.
R0.6
R
0. ef.
35
8.00 ± 0.10
0.80 ± 0.10
Notes:
1. Measured from center line of sprocket hole to center line of pocket.
2. Cumulative tolerance of 10 sprocket holes is ±0.20 mm.
3. Other material available.
4. Typical SR of form tape from 105 to 1011 Ω/SQ.
5. All measurements are in millimeters unless otherwise stated.
R
R0 ef.
.5
0
Section Y-Y
View “A”
ts012
Figure 7. SE5012T 16-pin QFN Carrier Tape Dimensions
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DATA SHEET • SE5012T: 5 GHz FRONT-END MODULE WITH POWER DETECTOR
Ordering Information
Model Name
SE5012T: 5 GHz Front-End Module with Power Detector
Manufacturing Part Number
SE5012T
Evaluation Board Part Number
SE5012T-EK1
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