SE2568U - Skyworks Solutions, Inc.

DATA SHEET
SE2568U: 2.4 GHz High Efficiency Wireless LAN PA
Applications
Description
 IEEE802.11b DSSS WLAN
The SE2568U is a complete 802.11 b/g WLAN discrete power
amplifier. The device provides all the functionality of the power
amplifier, power detector, filter, associated input, inter-stage and
output matching in an ultra-compact 2 mm  2 mm  0.5 mm
form factor.
 IEEE802.11g/n OFDM WLAN
 General applications
The SE2568U is designed for ease of use, with all the critical
input and output matching integrated. The SE2568U includes a
transmitter power detector with 20 dB of dynamic range and a
digital Enable for power on/off control. Harmonic filters and an
input 3.2 GHz LO rejection filter are integrated on-chip. The power
ramp rise/fall time is 0.7 s typical.
Features
 Dual mode IEEE802.11b & IEEE802.11g
 Integrated PA, digital bias control, 50  input and output match,
3.2 GHz TX filter
 Integrated harmonic filter
The device package and pinout for the 8-pin QFN are shown in
Figure 1. A block diagram of the SE2568U is shown in
Figure 2.
 Integrated load insensitive power detector, with < 1 dB error at
2 : 1 mismatch
 20 dBm, 802.11b, 11 Mbps, ACPR < 30 dBc, 3.3 V
 18 dBm, 802.11g, @ 3.0 % EVM, 54 Mbps, 3.3 V
 20.5 dBm, 802.11g @ 3.0 % EVM, 54 Mbps, 5.0 V
 Lead free, halogen free, ROHS compliant QFN (8-pin,
2  2  0.5 mm) package (MSL1, 260 C per JEDEC J-STD020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
RF_IN
1
GND
Ground
Paddle
8
EN
2
7
DET
GND
3
6
VCC
RF_OUT
4
5
VCC2
ts001
Figure 1. SE2568U Pinout – 8-Pin QFN
(Top View)
EN
VCC2
VCC
Bias Circuitry
RF_IN
50 Ω
Match
50 Ω Match
& Harmonic
Filter
3.2 GHz
Filter
RF_OUT
Detector
DET
ts002
Figure 2. SE2568U Block Diagram
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202400B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • April 4, 2014
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DATA SHEET • SE2568U 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN PA
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are
described in Table 1. The absolute maximum ratings of the
SE2568U are provided in Table 2. Recommended operating
conditions are specified in Table 3. Electrical specifications are
provided in Tables 4 through 6, and Figure 3.
Table 1. SE2568U Signal Descriptions
Pin
Name
Description
1
RF_IN
RF input (no DC voltage on the pin, but DC short to ground)
2
GND
Ground
3
GND
Ground
4
RF_OUT
RF output (no DC voltage on the pin, DC open to ground)
5
VCC2
Final stage supply voltage (may attach directly to battery)
6
VCC
First stage supply voltage (may attach directly to battery)
7
DET
Power detector output
8
EN
Power amplifier enable
GND
Ground
Die paddle
Table 2. SE2568U Absolute Maximum Ratings (Note 1)
Minimum
Maximum
Units
Supply voltage on VCC
Parameter
VCC
Symbol
0.3
+5.5
V
DC input on EN
EN
0.3
+4.0
V
RF input power. ANT terminated in 50  match
TX
12.0
dBm
Operating temperature range
TA
40
+85
C
Storage temperature range
TSTG
40
+150
C
Electrostatic discharge:
ESD
500
V
Human Body Model (HBM), Class 1B
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SE2568U Recommended Operating Conditions
Parameter
Ambient temperature
Symbol
TA
Supply voltage, nominal operation
Supply voltage, output power reduced by 2 dB typ.
VCC
Minimum
Typical
Maximum
Units
40
25
85
C
3.0
3.3
5.0
V
2.3
3.0
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DATA SHEET • SE2568U: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN PA
Table 4. SE2568U Electrical Specifications: DC Characteristics (Note 1)
(VCC = 3.3 V (default) or VCC = 5.0 V (as noted), EN = 3.3 V, TA = +25 C as Measured on the SE2568U-EK1 Evaluation Board, All Unused
Ports Terminated with 50 , Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
54 Mbps OFDM signal, 64QAM
Total supply current
ICC_G
Total supply current
ICC_N
Total supply current
ICC_B
Total supply current
ICQ
VCC = 3.3 V
VCC = 5.0 V
Total supply current
ICC_OFF
EN = 0 V, no RF applied
18 dBm, VCC = 3.3 V
20.5 dBm, VCC = 5.0 V
135
150
mA
115
130
mA
160
175
mA
90
100
mA
802.11n, MCS7
17 dBm, VCC = 3.3 V
19 dBm, VCC = 5.0 V
11 Mbps CCK signal, BT = 0.45
20 dBm, VCC = 3.3 V
22 dBm, VCC = 5.0 V
No RF.
1
10
A
Note 1: Performance is guaranteed only under the conditions listed in this table.
Table 5. SE2568U Electrical Specifications: AC Characteristics (802.11g/n Transmit) (Note 1)
(VCC = 3.3 V (default) or VCC = 5.0 V (as noted), EN = 3.3 V, TA = +25 C as Measured on the SE2568U-EK1 Evaluation Board, All Unused
Ports Terminated with 50 , Unless Otherwise Noted)
Parameter
Frequency range
Symbol
Test Condition
fIN
Output power, 3.3 V
POUT
Output power, 5.0 V
1 dB output compression point
P1DB
Small signal gain
|S21|
Small signal gain variation
S21
Gain @ limit at Ref-VCO spur frequency
nd
2 harmonics
Min
Typ
2400
Max
Units
2500
MHz
54 Mbps OFDM, 64 QAM, EVM = 3%
18
dBm
11 Mbps CCK, BT = 0.45, Mask
20
dBm
802.11n, HT20, all data rates, Mask
22
dBm
802.11n, HT40, all data rates, Mask
20
dBm
54 Mbps OFDM, 64 QAM, EVM = 3%
20.5
dBm
11 Mbps CCK, BT = 0.45, Mask
22
dBm
802.11n, HT20, all data rates, Mask
24
dBm
802.11n, HT40, all data rates, Mask
22
dBm
VCC = 3.3 V
25.0
25
dBm
29
dB
Gain variation over band
1.1
dB
S21,3.2
3206 to 3312 MHz
15
dB
2fO
1 Mbps, BPSK, 20 dBm, 3.3 V, 22 dBm, 5.0 V
50
45
dBm/MHz
50
48
45
43
dBm/MHz
dBm/MHz
Gain variation over single 20 MHz channel
28
0.5
dB
1 Mbps, BPSK,
3rd harmonics
3fO
20 dBm, 3.3 V,
22 dBm, 5.0 V
Delay and rise/fall time
tR, tF
50 % of VEN edge and 90/10 % of final output power level
Input return loss
|S11|
Stability
STAB
CW, POUT = 20 dBm, VCC = 3.3 V,
0.1 GHz  20 GHz, load VSWR = 10:1
All non-harmonically rel©ated outputs less
than 42 dBm/MHz
Ruggedness
Ru
PIN = 12 dBm, VCC = 3.3 V, Load VSWR = 10:1
No permanent damage
7
0.7
s
10
dB
Note 1: Performance is guaranteed only under the conditions listed in this table.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SE2568U 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN PA
Table 6. SE2568U Electrical Specifications: Power Detector Characteristics (Note 1)
(VCC = 3.3 V, EN = 3.3 V, TA = +25 C as Measured on the SE2568U-EK1 evaluation board, all unused ports terminated with 50 , Unless
Otherwise Noted)
VCC = 3.3 V
Parameter
Symbol
Min
Frequency range
VCC = 5.0 V
fOUT
Typ
2400
Power detect range, CW
PDR
DC source impedance on PD_OUT
PDZSRC
Output voltage, POUT = No RF
PDVNORF
Output voltage, POUT = 18 dBm CW
Output voltage, POUT = 20 dBm CW
Units
Test Condition
Measured at ANT
Max
Min
2500
2400
23
0
0
Typ
Max
2500
MHz
23
dBm
1
1
k
Measured into 1 M
0.12
0.12
V
PDVP18
Measured into 1 M
0.60
0.55
V
PDVP20
Measured into 1 M
0.75
0.70
V
Output voltage, POUT = 23 dBm CW
PDVP23
Measured into 1 M
NA
1.00
V
Power detect low-pass filter 3dB
corner frequency
LPF3dB
Measured into 1 M
260
290
400
270
290
400
kHz
Note 1: Performance is guaranteed only under the conditions listed in this table.
5.0 V Operation
3.3 V Operation
Power Detector Response
Power Detector Response
2450
2500
2400 MHz
1
1
0.8
0.8
VDET (V)
0.6
0.4
0.2
2450 MHz
2500 MHz
0.6
0.4
0.2
0
0
3
5
7
9
11
13
15
17
19
21
23
25
3
5
7
9
Output Power (dBm)
11
13
15
17
19
21
23
25
Output Power (dBm)
ts031
VDET (V)
2400
Figure 3. SE2568U Power Detector Characteristics
Package Dimensions
The PCB layout footprint for the SE2568U is provided in
Figure 4. Typical case markings are shown in Figure 5. Package
dimensions for the 8-pin QFN are shown in Figure 6, and carrier
tape dimensions are provided in Figure 7.
Package and Handling Information
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SE2568U is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. If the
part is manually attached, precaution should be taken to insure
that the device is not subjected to temperatures above its rated
peak temperature for an extended period of time. For details on
both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to:
 Skyworks Application Note: QFN Solder Reflow and Rework
Information Application Note, Document Number QAD-00045.
 Skyworks Application Note: Handling, Packing, Shipping and
Use of Moisture Sensitive QFN Application Note, Document
Number QAD-00044.
Production quantities of this product are shipped in a standard
tape and reel format.
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DATA SHEET • SE2568U: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN PA
0.0
2.40
0.90
1
0.75
8
0.50
2
7
2.00
0.50 TYP
3
6
4
5 0.25 TYP
2
0.25
3
0.25
0.0
0.0
0.50
0.75
0.0
3X 0.20
Board Metal
4X 0.20
7X ø0.20
0.55 TYP
Via Pattern
(Note 4)
2.50
2.40
0.70
0.50
2x2 QFN
package
outline
1.40
0.50 TYP
2.00
0.35 TYP
1
8
2
7
3
6
4
5 0.25 TYP
1.20
0.50 TYP
0.65 TYP
Solder Mask Pattern
(Note 6)
61% solder
coverage on
center Pad
0.55 TYP
Stencil Pattern
(Note 5)
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Unless specified, dimensions are symmetrical about center lines.
4. Via hole recommendations: 0.025 mm Cu via wall plating (minimum). Via holes to be filled with conductive paste and plated over.
5. Stencil recommendations: 0.125 mm stencil thickness., laser cut apertures, trapezoidal walls and rounded corners offer better paste release.
6. Solder mask recommendations: contact board fabricator for recommended solder mask offset and tolerance.
ts034
Figure 6. PCB Layout Footprint for the SE2568U
Pin 1
Indicator
Part number
Lot Code
ts033
Figure 7. Typical Case Markings
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • SE2568U 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN PA
2.00 ± 0.05
A
0.90 ± 0.05
0.45 ± 0.05
0.05 C
0.30X 45º
0.02 +0.03
–0.02
B
Pin 1
Indicator
2.00 ± 0.05
2X
8
1
7
2
6
3
5
4
8X
0.05 C
0.500
0.05 C
See Detail A
4
C
Bottom View
Seating
Plane
Top View
2X R0.050
+
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Tolerances (unless otherwise specified)
Decimal Tolerance:
Angular Tolerance:
X. X (1 plc) ± 0.1 mm
± 1/2º
X. XX (2 plc) ± 0.05 mm
X. XXX (3 plc) ± 0.025 mm
4. Coplanarity applies to the terminal as well as all other bottom surface metallization.
5. Dimension applies to metallized terminal. If terminal tip has a radius, dimension should not be measured in that radius area.
6. Plating requirements per source control drawing (SCD) 2504.
7. Unless otherwise specified, dimensions are symmetrical about center lines.
Detail A
0.35 ± 0.05
(scale 2X)
8 places
0.25 ± 0.05
0.10
0.05
5
2.00 ± 0.05
4.00 ± 0.10
+ 0.10
Ø1.50 – 0.00
1.75 ± 0.10
Pin 1
0.23 ± 0.05
A
2.25 ± 0.05
7º
3.50 ± 0.05
8.00 ± 0.20
0.70 ± 0.05
4.00 ± 0.10
B
A
B
2.25 ± 0.05
Section A-A
CA B
C
ts032
Figure 8. SE2568U 8-Pin QFN Package Dimensions
Section B-B
All measurements are in millimeters unless otherwise stated.
ts035
Figure 9. SE2568U 8-Pin QFN Carrier Tape Dimensions
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Exposed pad
1.60 ± 0.05
0.05 C
2X
Pin 1
Indicator
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DATA SHEET • SE2568U: 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN PA
Ordering Information
Model Name
SE2568U: 2.4 GHz high efficiency wireless LAN PA
Manufacturing Part Number
SE2568U
Evaluation Board Part Number
SE2568U-EK1
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