Applications • Receiver protection Features • High power, midrange and clean-up designs • Low insertion loss (0.1 dB at 10 GHz) • Power handling to 70 dBm • Tight control of basewidth Limiter Diodes Skyworks’ broad product portfolio includes limiter diodes as packaged and bondable silicon chips, in addition to ceramic hermetic packaged and plastic surface mount packaged devices for receiver protection applications. Skyworks series of silicon limiter diode chips provides passive receiver protection over a wide range of frequencies from 100 MHz to beyond 30 GHz. These devices utilize Skyworks well established silicon technology for high resistivity and tightly controlled thin basewidth PIN limiter diodes. Limiter circuits employing these devices perform with strong limiting action and low loss. The CLA series consists of nine individual chip designs of different intrinsic region basewidths and capacitances designed to accommodate multistage limiter applications. The mesa constructed, thin basewidth, low capacitance CLA4601, CLA4602, CLA4604 and CLA4605 and SMP1330 are designed for low-level and cleanup applications. The CLA4603, and CLA4606 through CLA4609 are planar designs designed for mid-range and high-power applications. Receiver Receiver Protector Limiter Downconverter Mixer Low Noise AAmplifier lifi High Power Amplifier Transmitter Simplified Radar Transceiver with a Receiver Protector Limiter Skyworks Green™ products are compliant to all applicable materials legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. BUY NOW Innovation to GoTM New! Free Designer Kits Select products and sample/designer kits available for purchase online. www.skyworksinc.com Limiter Output 30 DC Block Input Output Power (dBm) DC Block Output RF Choke Limiter PIN Pin-IL Limiting Operation Low Insertion Loss Operation 20 1 dB 10 0 Threshold Level -10 -10 0 10 20 30 Input Power (dBm) Output Power vs. Input Power for a Single-Stage Limiter A Single-Stage Limiter The PIN limiter diode can be described as an incidentpower-controlled, variable resistor. In the case when no large input signal is present, the impedance of the limiter diode is at its maximum, thereby producing minimum insertion loss, typically less than 0.5 dB. The presence of a large input signal temporarily forces the impedance of the diode to a much lower value, producing an impedance mismatch which reflects the majority of the input signal power back towards its source. Electrical Specifications at 25 °C Thermal Impedance (q) Top Contact Diam. (mils/mm) Typ. Part Number Breakdown Voltage (V) Min. – Max. I Region (µm) Nominal CJ @ 0 V (pF) Typ. CJ @ 6 V (pF) Max. RS @ 10 mA (Ω) Max. TL @ 10 mA (ns) Typ. Average (°C/W) Max. 1 µs Pulse (°C/W) Typ. CLA4601 Series 15–30 1.0 0.12 0.10 2.5 5 120 15 1.2/0.03 CLA4602 Series 15–30 1.0 0.20 0.15 2.0 5 80 10 1.5/0.038 SMP1330 Series 20–50 1.5 0.20 – 1.5 4 110 25 N/A CLA4603 Series 20–45 1.5 0.20 0.15 2.0 5 100 10 1.5/0.038 CLA4604 Series 30–60 2.0 0.12 0.10 2.5 7 100 10 1.5/0.038 CLA4605 Series 30–60 2.0 0.20 0.15 2.0 7 70 7 2.5/0.064 CLA4606 Series 45–75 2.5 0.20 0.15 2.0 10 80 7 2.5/0.064 CLA4607 Series 120–180 7.0 0.20 0.15 @ 50 V 2.0 50 40 1.2 3/0.076 CLA4608 Series 120–180 7.0 0.80 0.5 @ 50 V 1.2 100 15 0.3 5/0.127 CLA4609 Series >250 28 0.26 0.14 1.5 1175 15 0.3 6.5/0.165 Capacitance, CJ, specified at 1 MHz. Resistance, RS, measured at 500 MHz. CW thermal resistance for infinite heat sink. Pulse thermal resistance for single 1 µs pulse. Typical Performance at 25 °C Part Number Insertion Loss @ -10 dBm (dB) Input Power for 1 dB Loss (dBm) Maximum Pulsed Input Power (dBm) Output at Max. Pulsed Maximum CW Input Input (dBm) Power (W) CLA4601 Series 0.10 7 47 21 2 Recovery Time (ns) 5 CLA4602 Series 0.10 7 50 24 3 5 SMP1330 Series 0.15 11 50 30 1 30 CLA4603 Series 0.10 10 50 22 2 10 CLA4604 Series 0.10 12 47 24 3 10 CLA4605 Series 0.10 12 50 27 4 10 CLA4606 Series 0.10 15 53 27 3 20 CLA4607 Series 0.10 20 60 39 6 50 CLA4608 Series 0.20 20 66 44 15 100 CLA4609 Series 0.30 38 70 50 20 1000 Insertion loss for CLA4601 through CLA4607 at 10 GHz; insertion loss for CLA4608 at 5 GHz. Limiter power results at 1 GHz for shunt connected, single limiter diode and DC return in 50 Ω line. Maximum pulsed power for 1 µs pulse and 0.1% duty factor with chip at 25 °C heat sink. Derate linearly to 0 W at 175 °C. Maximum CW input power at 25 °C heat sink. Derate linearly to 0 W at 175 °C. Recovery time to insertion loss from limiting state. How to Select Limiter Diode Packages Ceramic-Metal Packages Skyworks limiter diodes are available in several types of packages and as unpackaged dice. In most cases the requirements of the end application will determine the optimal physical diode configuration. Ceramic-metal packages offer several advantages over plastic packages: their parasitic inductances and capacitances are generally lower, sometimes by as much as 75%, than that of the plastic SMT packages described above. Their thermal resistances are also generally much lower than that of the large majority of plastic SMT packages. Most ceramic packages used for limiter diodes are capable of being hermetically sealed, thereby offering maximum protection to the die against environmental contaminants such as sodium (Na), water vapor, etc. Plastic Surface Mount Technology Packages Plastic surface mount technology (SMT) packages are inexpensive and are compatible with modern pick-andplace assembly techniques, so they are optimal choices for high-volume, low-cost final product assemblies. While careful attention has been paid to minimizing package parasitic reactances they are always present in such diode configurations. These parasitics, package capacitance and package inductance, inherently reduce the bandwidth over which a diode may be used and can affect insertion loss and isolation. Plastic SMT packages also add thermal resistance to that of the die, thereby reducing the amount of power a diode can dissipate without exceeding its maximum rated operating junction temperature. Ceramic-metal packages have two disadvantages compared to plastic SMT packages: they are typically more costly, and, they generally are not compatible with automated surface mount assembly. (Packageless) Dice Diode dice, sometimes known as chips, eliminate the parasitic reactances and thermal resistance of the package. This configuration produces the widest bandwidth of operation as well as maximal power dissipation capabilities. Of course, the end user of unpackaged diode dice must be capable of handling these tiny devices as well as performing die attach and wire bonding assembly techniques. The assemblies which contain dice must be protected from mechanical damage, especially to the fragile bond wires. Outline Drawings 149-815 150 Series Anode Metallized Gold Dot Schematic 0.010 (0.251 mm) Min. 0.014 (0.356 mm) Max. Sq. Anode Top Contact, Gold 0.002 (0.050 mm) Dia. Min. 0.014 ± 0.001 (0.325 ± 0.025 mm) 150-801: 0.002 (0.051 mm) Min. 150-806: 0.0011 (0.028 mm) Min. 0.014 ± 0.001 (0.325 ± 0.025 mm) 0.004 (0.010 mm) 0.006 (0.015 mm) Nom. 0.004 (0.127 mm) Min. 0.006 (0.152 mm) Max. Silicon Cathode Metallized Back Contact: Gold Metallized Back Contact, Gold -210 Hermetic Pill Schematic -203 Hermetic Pill Schematic N-Type 0.064 (1.63 mm) 0.060 (1.52 mm) 2 PLCS 0.050 (1.27 mm) 0.040 (1.02 mm) 0.055 (1.40 mm) 0.051 (1.30 mm) Dia. 0.124 (3.15 mm) 0.119 (3.02 mm) Dia. 0.025 (0.63 mm) Max. 0.225 (5.72 mm) 0.205 (5.20 mm) 0.097 (2.46 mm) 0.83 (2.11 mm) 247-001 0.083 (2.20 mm) 0.077 (1.95 mm) 0.064 (1.63 mm) 0.060 (1.52 mm) 023-000 -240 Hermetic Stripline -219 Hermetic Pill Schematic 1 Schematic 0.075 (1.91 mm) 0.065 (1.65 mm) Sq. 2 -011 (240) 50° 45° 0.175 (4.44 mm) 0.125 (3.18 mm) 2 Plcs. 0.045 (1.14 mm) 0.030 (0.76 mm) 0.020 (0.51 mm) Typ. 0.098 (2.49 mm) 0.092 (2.34 mm) Cover Dia. Colored Dot Denotes Cathode 0.104 (2.64 mm) 0.092 (2.34 mm) Sq. 0.022 (0.56 mm) 0.018 (0.46 mm) 2 Plcs. 0.010 (0.24 mm) Ref. 0.048 ± 0.005 0.012 (0.30 mm) Typ. 0.033 (0.84 mm) Min. 0.005 (1.27 mm) 0.003 (0.76 mm) 0.042 (1.06 mm) 0.028 (0.71 mm) 325-011 404-801 Outline Drawings (Continued) -085LF, -086LF SOT-23 (-005LF) Plastic 0.5 ± 0.15 2 ± 0.2 Exposed Pad 0.030 (0.8 mm) 3 Plcs. Detail B 2 ± 0.2 1.7 ± 0.15 3 0.035 (0.9 mm) 3 PLCS. 1 2 Orientation Indicator 0.90 ± 0.1 Top View Side View 3 1 Detail B 0.104 (2.64 mm) 0.083 (2.10 mm) 0.055 (1.40 mm) 1 0.047 (1.19 mm) 0.024 (0.61 mm) 0.018 (0.45 mm) 0.080 (2.03 mm) 0.070 (1.78 mm) 2 S1632 All dimensions in millimeters 0.027 (0.69 mm) Ref. -040LF 0.004 (0.10 mm) 0.0005 (0.01 mm) 0.040 (1.02 mm) 0.037 (0.94 mm) 0.045 (1.14 mm) 0.035 (0.89 mm) Application Notes 0.650 For additional information, please refer to the following Application Notes. 1.000 0.325 0.600 2X 0.50 ± 0.05 2X 0.25 ± 0.05 0.018 (0.45 mm) 0.015 (0.38 mm) 3 0.037 (0.95 mm) 0.075 (1.9 mm) 0.007 (0.18 mm) 0.003 (0.08 mm) 2 0.27 ± 0.15 0.120 (3.05 mm) 0.110 (2.79 mm) Footprint Bottom View 0.4 ± 0.1 0.070 (1.8 mm) All dimensions in millimeters Green Initiative™ Cathode Indicator PIN Diode Basics Top View PIN Limiter Diodes in Receiver Protectors Cathode Terminal Side View 0.05/0.00 0.46 +0.04/–0.06 Bottom View Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging S1892 Through our Green Initiative,™ we are committed to manufacturing products that comply with global government directives and industry requirements. 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