Aerospace and Defense Solutions

| Aerospace and Defense
TM
Mission Critical Communications
| The Sky is Not the Limit
Aerospace and defense industries depend on precision systems operating faultlessly under the most extreme
conditions possible. Mission critical functions such as navigation, communication, and radar rely on solutions that
work day-in and day-out without fail.
Skyworks’ portfolio of RF/microwave products support a broad array of applications including avionics systems,
electronic defense and countermeasure platforms, global positioning devices and land mobile radios.
In addition to Skyworks’ standard consumer off-the-shelf (COTS) product offering, we offer a broad portfolio of
technical ceramics and advanced materials through Trans-Tech, and high reliability ceramic hermetic packaged
devices through Isolink, subsidiaries of Skyworks Solutions.
TM
Isolink offers high reliability hermetic packaged optocoupler and RF diode and switch products. Bare die
diode product screenings equivalent to up to JANS level of MIL-PRF-19500 and Class K of MIL-PRF-38534 are
also available.
Trans-Tech offers technical ceramics, including RF components, dielectric resonators, ferrites and magnetic
materials, as well as advanced materials in technical powder and ingot form.
| The Right Design Choice Starts Here
Skyworks is continually releasing new products. We invite you to review this brochure as well as our website for a
complete list of our solutions from our broad portfolio.
2 | www.skyworksinc.com
RF/Analog and High-reliability Solutions
| Table of Contents
Aerospace and Defense Solutions . . . . . 4
Reference Materials
Certifications . . . . . . . . . . . . . . . . . . . . . . . 5
Application Notes . . . . . . . . . . . . . . . . . . . . . . 45
Published Articles . . . . . . . . . . . . . . . . . . . . . . 46
Additional Literature . . . . . . . . . . . . . . . . . . . 46
High-reliability Screening Capabilities . 6
Product Specifications
Designer Kits . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Amplification . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Hot to Select Diode Packages . . . . . . . . . . . . 47
Attenuation . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Circulation and Isolation . . . . . . . . . . . . . . . . 20
DC Blocking and Filtering . . . . . . . . . . . . . . . . 21
Skyworks’ Sales Offices . . . . . . . . . . . . . . . 50
Demodulation . . . . . . . . . . . . . . . . . . . . . . . . . 22
Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Mixing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Optical Coupling . . . . . . . . . . . . . . . . . . . . . . . 30
Power Detection . . . . . . . . . . . . . . . . . . . . . . . 32
Power Management . . . . . . . . . . . . . . . . . . . . 35
Receiver Protection . . . . . . . . . . . . . . . . . . . . 36
Scan to join our customer
email program today!
Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Aerospace
Avionics
Countersurveillance
Systems
Homeland
Security
Instrumentation
Microwave
Subsystems
Global Positioning
Systems
Portable Radio
Communications
Radar
www.skyworksinc.com | 3
| Aerospace and Defense Solutions
Aerospace and Defense Solutions
The Right Products for Your System Applications
Skyworks and our wholly owned subsidiaries have the RF products you need to speed your design from concept to production.
Figure 1 shows Skyworks’ transceiver (simplified) block diagram.
Applications
Products
Amplifiers
Attenuators
■
Ceramic filters
■
Circulators and isolators
■
Detectors
■
Couplers
■
Demodulators
■
Diodes
■
Mixers
■
Modulators
■
Optocouplers
■
Optoisolators
■
Power splitters / combiners
■
Resonators
■
Switches
■
Avionics systems
■
■
Electronic Countermeasures (ECM) equipment
■
■
Electronic Warfare (EW)
■
Global Positioning System (GPS)
■
Improvised Explosive Device (IED)
■
Instrumentation
■
Joint Tactical Radio System (JRTS)
■
Land Mobile Radio (LMR)
■
Microwave subsystems
■
Software Defined Radio (SDR)
■
Surveillance receivers or jammers
■
Traffic Collision Avoidance System (TCAS)
“I” ADC
Downconverter
Mixer
Receiver
Limiter
Digital
Baseband Out
I/Q
Demodulator
Rx
Low Noise
Amplifier
“Q” ADC
Synthesized
Local Oscillator
Gain
Control
Synthesized
Local Oscillator
Antt
Transmitter
Upconverter
Mixer
Tx
“I” DAC
High Power
Amplifier
“Q” DAC
Level
Control
Synthesized
Local Oscillator
Figure 1. Transceiver (Simplified) Block Diagram
4 | www.skyworksinc.com
Digital
Baseband In
I/Q
Modulator
Synthesized
Local Oscillator
Certifications |
Certifications
As an industry leader, Skyworks and its wholly owned subsidiaries have demonstrated their quality leadership and
strengthened its commitment to customer satisfaction through formal, third-party registration to ISO 9001, ANSI/ESD
S.20.20, and ISO 14001. Skyworks’ Woburn and Mexicali sites are ISO/TS 16949 certified.
Company
ISO 9001
ANSI/ESD S.20.20
ISO 14001
ISO/TS 16949 1
•
•
•
Skyworks Solutions, Inc.
•
Trans-Tech, Inc. 2
•
Isolink 2
•
•
ISO 9001
ISO 9001 is an internationally recognized Quality Management System standard that promotes customer satisfaction through
continual improvement of the system’s effectiveness. ISO 9001 provides a model for a Quality Management System which
focuses on the effectiveness of the processes in a business to achieve desired results. The standard promotes the adoption
of a process approach emphasizing the requirements, added value, process performance and effectiveness, and continual
improvement through objective measurements.
ANSI/ESD S.20.20
ANSI/ESD S.20.20 is a standard for the Development of an Electrostatic Discharge Control Program for Protection of Electrical
and Electronic Parts, Assemblies and Equipment. The standard covers the requirements necessary to design, establish,
implement, and maintain an Electrostatic Discharge (ESD) Control Program.
ISO/TS 16949
One of the major challenges facing today’s manufacturers is that, even though there is a low failure probability for each
individual component, the total failure probability for all parts combined may reach unacceptable levels. The ISO/TS 16949
standard answers this challenge by defining requirements focused on continual improvement, and the understanding of process
interaction. It also creates an implementation framework for customer specific requirements, and includes clear requirements
for development processes and techniques to prevent problems in the earliest possible stage of product development.
Jointly developed by International Automotive Task Force (IATF), ISO/TS 16949 is the automotive industry’s international
quality management system standard intended to answer the need for global consistency, continual improvement, and
increased customer satisfaction. It is approved and released by the International Organization for Standardization (ISO).
ISO 14001:2004
As an industry leader, Skyworks is committed to the protection and preservation of the environment in all its business
operations. We understand that our actions today can have environmental impacts tomorrow. Improvements at our facility
will affect our customers and ultimately consumers. To this end, we have an established ISO 14001 certified Environment
Management System by which we operate. We build products in consideration of regulatory and industry requirements, such
as Restriction of Hazardous Substances Derivative (RoHS), and offer lead (Pb)-free, RoHs-compliant, and Green™ solutions to
meet the needs of our customers in today’s environmentally-conscious market.
1. Woburn, MA and Mexicali, B.C. sites
2. Wholly owned subsidiaries of Skyworks Solutions, Inc.
www.skyworksinc.com | 5
| High-reliability Screening Capabilities
High-reliability Screening Capabilities
When requested, Isolink will perform up to JANS level high-reliability testing on ceramic packaged diode
devices in accordance with MIL-PRF-19500, and Element Evaluation on unpackaged dice and beam-lead
diode devices in accordance with MIL-PRF-38534. Isolink also offers lot approval services for sensitive
circuits. The table below shows screening requirements for ceramic packaged diode devices.
Screening Requirements for Ceramic Packaged Diode Devices
Screening Requirement in Accordance with Table E-IV-MIL-PRF-19500
Step
Process
Conditions
Comments
JANS
JANTXV
•
•
JANTX
1
Pre-Cap Inspection
MIL-STD-750 – Method 2070
2
High-Temperature Bake
MIL-STD-750 – Method 1032
t = 340 Hrs.
•
•
•
3
Temperature Cycling
MIL-STD-750 – Method 1051
20 Cycles. Condition C
•
•
•
4
Thermal Impedance
MIL-STD-750 – Method 3101
•
•
•
5
Constant Acceleration
MIL-STD-750 – Method 2006
Condition A Y1 Axis Only
•
•
•
6
PIND
MIL-STD-750 – Method 2052
Condition A
•
7
Initial Electrical Test
Serialize, Read & Record
•
•
•
8
High-Temperature Reverse Bias
Condition A, t = 48 Hrs.
•
•
•
9
Interim Electricals
Read and Record
•
•
•
10
Burn-in
Condition B, (JANS t = 240 Hrs.,
JANTX & JANTXV t = 96 Hrs.)
•
•
•
11
Final Electrical Test
Group A, Subgroup 2 and 3.
Read and Record
•
•
•
12
Delta Calculation
Compare Interim Test to Final Test
•
•
•
13
PDA
Percent Defective Allowable
(JANS = 5% Max.; JANTX and
JANTXV = 10% Max.)
•
•
•
14
Fine Leak
MIL-STD-750 – Method 1071
Condition H
•
•
•
Condition C
•
•
•
•
•
MIL-STD-750 – Method 1038
MIL-STD-750 – Method 1038
15
Gross Leak
MIL-STD-750 – Method 1071
16
X-ray
MIL-STD-750 – Method 2076
•
17
External Visual Inspection
MIL-STD-750 – Method 2071
•
6 | www.skyworksinc.com
High-reliability Screening Capabilities |
Screening Requirements for Ceramic Packaged Diode Devices (Continued)
Group A Inspection in Accordance with Table E-IV-MIL-PRF-19500
Step
Process
Conditions
Comments
JANS
JANTXV
JANTX
Sample Size: JANS = 15(0),
JANTX and JANTXV = 45(0)
•
•
•
Electrical Testing
DC (static) @ TA = 25 °C,
Sample Size = 116(0)
•
•
•
Electrical Testing
DC (static) @ Min. and Max. Operating Temp.,
Sample Size = 116(0)
•
•
•
Electrical Testing
Dynamic @ TA = 25 °C,
Sample Size = 116(0)
•
•
•
JANS
JANTXV
JANTX
Subgroup 1
1
Visual and Mechanical Inspection
MIL-STD-750 – Method 2071
Subgroup 2
1
Subgroup 3
1
Subgroup 4
1
Subgroup 5 – Not Applicable
Subgroup 6 – Not Applicable
Subgroup 7 – Not Applicable
Group B Inspection for JANS Devices in Accordance with Table E-VIA-MIL-PRF-19500
Step
Process
Conditions
Comments
Subgroup 1
1
Physical Dimensions
MIL-STD-750 – Method 2066
Sample Size – Large Lot = 22(0),
Small Lot = 8(0)
•
1
Solderability
MIL-STD-750 – Method 2026
Sample Size – Large Lot = 15(0),
Small Lot = 6(0)
•
2
Resistance to Solvents
MIL-STD-750 – Method 1022
Sample Size – Large Lot = 15(0),
Small Lot = 6(0)
•
1
Temperature Cycling
MIL-STD-750 – Method 1051
100 Cycles. Condition C, Sample Size – Large
Lot= 22(0), Small Lot = 6(0)
•
2
Fine Leak
MIL-STD-750 – Method 1071
Condition H, Sample Size –
Large Lot= 22(0), Small Lot = 6(0)
•
3
Gross Leak
MIL-STD-750 – Method 1071
Condition C, Sample Size –
Large Lot= 22(0), Small Lot = 6(0)
•
4
Electrical Testing
DC @ TA = 25 °C, Sample Size –
Large Lot = 22(0), Small Lot = 6(0)
•
5
Decap Internal Visual
MIL-STD-750 – Method 2075
Sample size = 6(0)
•
6
Bond Strength
MIL-STD-750 – Method 2037
Condition D, Sample Size –
Large Lot = 22 Wires (0),
Small Lot = 12 wires (0)
•
7
Die Shear
MIL-STD-750 – Method 2017
Condition D, Sample Size = 6 Wires (0)
•
1
Intermittent Operation Life
MIL-STD-750 – Method 1037
2,000 Cycles. Condition D, Sample Size –
Large Lot = 22(0), Small Lot = 12(0)
•
2
Electrical Testing
DC @ TA = 25 °C, Sample Size –
Large Lot = 22(0), Small Lot = 12(0)
•
Subgroup 2
Subgroup 3
Subgroup 4
www.skyworksinc.com | 7
| High-reliability Screening Capabilities
Screening Requirements for Ceramic Packaged Diode Devices (Continued)
Group B Inspection for JANS Devices in Accordance with Table E-VIA-MIL-PRF-19500 (Continued)
Step
Process
Conditions
Comments
JANS
JANTXV
JANTX
JANTXV
JANTX
Subgroup 5
1
Accelerated Steady-State Operation MIL-STD-750 – Method 1027
Life
1,000 Hrs. Sample Size –
Large Lot = 22(0), Small Lot = 12(0)
•
2
Electrical Testing
DC @ TA = 25 °C, Sample Size –
Large Lot = 22(0), Small Lot = 12(0)
•
Subgroup 6
1
Thermal Resistance
MIL-STD-750 – Method 4081
Sample Size – Large Lot = 22(0),
Small Lot = 8(0)
•
1
High Temperature Life
MIL-STD-750 – Method 1032
t = 340 Hrs. @ Max. Rated Storage Temp.,
Large Lot = 32(0),
Small Lot = 12(0)
•
2
Electrical Testing
DC @ TA = 25 °C, Sample Size –
Large Lot = 22(0), Small Lot = 12(0)
•
Subgroup 7
Group B Inspection for JANTX and JANTXV in Accordance with Table E-VIB-MIL-PRF-19500
Step
Process
Conditions
Comments
JANS
Subgroup 1
1
Solderability
MIL-STD-750 – Method 2026
Sample Size = 15(0) Leads,
Small Lot = 4 (0) Leads
•
•
2
Resistance to Solvents
MIL-STD-750 – Method 1022
Sample Size = 15(0), Small Lot = 3(0)
•
•
1
Temperature Cycling
MIL-STD-750 – Method 1051
25 Cycles. Condition C,
Sample Size = 22(0), Small Lot 6(0)
•
•
2
Fine Leak
MIL-STD-750 – Method 1071
Condition H, Sample Size = 22(0),
Small Lot 6(0)
•
•
3
Gross Leak
MIL-STD-750 – Method 1071
Condition C, Sample Size = 22(0),
Small Lot = 6(0)
•
•
4
Electrical Testing
DC @ TA = 25 °C, Sample Size = 22(0), Small
Lot = 6(0)
•
•
t = 340 Hrs. Sample Size = 45(0),
Small Lot = 12(0)
•
•
DC @ TA = 25 °C, Sample Size = 45(0), Small
Lot = 12(0)
•
•
Subgroup 2
Subgroup 3
1
Steady-State Operation Life
MIL-STD-750 – Method 1027
2
Electrical Testing
3
Bond Strength
MIL-STD-750 – Method 2037
Sample Size = 11 Wires(0)
•
•
Decap Internal Visual
MIL-STD-750 – Method 2075
Sample Size = 1(0)
•
•
Thermal Resistance
MIL-STD-750 – Method 4081
Sample Size = 15(0), Small Lot = 6(0)
•
•
1
High Temperature Life
MIL-STD-750 – Method 1032
t = 340 Hrs. @ Max. Rated Storage Temp.,
Sample Size = 32(0),
Small Lot = 12(0)
•
•
2
Electrical Testing
DC @ TA = 25 °C, Sample Size = 32(0), Small
Lot = 12(0)
•
•
Subgroup 4
1
Subgroup 5
1
Subgroup 6
8 | www.skyworksinc.com
High-reliability Screening Capabilities |
Screening Requirements for Ceramic Packaged Diode Devices (Continued)
Group C Inspection in Accordance with Table E-VII-MIL-PRF-19500
Step
Process
Conditions
Comments
JANS
JANTXV
JANTX
•
•
Subgroup 1
1
Physical Dimensions
MIL-STD-750 – Method 2066
Sample Size = 15(0), Small Lot = 6(0)
Subgroup 2
1
Thermal Shock
MIL-STD-750 – Method 1056
Sample Size = 22(0), Small Lot = 6(0)
•
•
•
2
Temperature Cycling
MIL-STD-750 – Method 1051
25 Cycles. Condition C,
Sample Size = 22(0), Small Lot = 6(0)
•
•
•
3
Terminal Strength
MIL-STD-750 – Method 2036
Sample Size = 22(0), Small Lot = 6(0)
•
•
•
4
Fine Leak
MIL-STD-750 – Method 1071
Condition H, Sample Size = 22(0),
Small Lot = 6(0)
•
•
•
5
Gross Leak
MIL-STD-750 – Method 1071
Condition C, Sample Size = 22(0),
Small Lot = 6(0)
•
•
•
6
Moisture Resistance
MIL-STD-750 – Method 1021
7
Electrical Testing
Sample Size = 22(0), Small Lot = 6(0)
•
•
•
DC @ TA = 25 °C, Sample Size = 22(0), Small
Lot = 6(0)
•
•
•
Subgroup 3
1
Shock
MIL-STD-750 – Method 2016
1,500Gs, X1, Y1 & Z1.
Sample Size = 22(0), Small Lot = 6(0)
•
•
•
2
Vibration, Variable Frequency
MIL-STD-750 – Method 2056
Sample Size = 22(0), Small Lot = 6(0)
•
•
•
3
Constant Acceleration
MIL-STD-750 – Method 2006
20,000Gs, X1, Y1 & Z1.
Sample Size = 22(0)
•
•
•
4
Electrical Testing
DC @ TA = 25 °C, Sample Size = 22(0), Small
Lot = 6(0)
•
•
•
Subgroup 4
1
Salt Atmosphere
MIL-STD-750 – Method 1041
Sample Size = 15(0), Small Lot = 6(0)
•
•
•
Thermal Resistance
MIL-STD-750 – Method 4081
Sample Size = 15(0), Small Lot = 6(0)
•
•
•
1
Steady-State Operation Life
MIL-STD-750 – Method 1026
1,000 Hrs. Sample Size = 22(0),
Small Lot = 12(0)
•
•
•
2
Electrical Testing
DC @ TA = 25 °C, Sample Size = 22(0), Small
Lot = 12(0)
•
•
•
Sample Size = 3(0)
(Hermetic Packages Only)
•
•
•
Subgroup 5
1
Subgroup 6
Subgroup 7
1
Internal Water Vapor
MIL-STD-750 – Method 1018
www.skyworksinc.com | 9
| High-reliability Screening Capabilities
Screening Requirements for Ceramic Packaged Diode Devices (Continued)
Group E Inspection in Accordance with Table E-IX-MIL-PRF-19500
Step
Process
Conditions
Comments
JANS
JANTXV
JANTX
Subgroup 1
1
Temperature Cycling
MIL-STD-750 – Method 1051
500 Cycles. Condition C,
Sample Size = 45(0)
•
•
•
2
Fine Leak
MIL-STD-750 – Method 1071
Condition H, Sample Size = 45(0)
•
•
•
3
Gross Leak
MIL-STD-750 – Method 1071
Condition C, Sample Size = 45(0)
•
•
•
4
Electrical Testing
DC @ TA = 25 °C, Sample Size = 45(0)
•
•
•
t = 1,000 Hrs. Sample Size = 45(0)
•
•
•
DC @ TA = 25 °C, Sample Size = 45(0)
•
•
•
•
•
•
Subgroup 2
1
Steady-State Operation Life
2
Electrical Testing
MIL-STD-750 – Method 1026
Subgroup 3 – Not Applicable
Subgroup 4
1
Thermal Impedance
Subgroup 5 – Not Applicable
Subgroup 6
1
ESD
MIL-STD-750 – Method 1020
Sample Size = 3(0)
•
•
•
1
Resistance to Soldering Heat
MIL-STD-750 – Method 2031
Sample Size = 3(0)
•
•
•
2
External Visual Inspection
MIL-STD-750 – Method 2071
Sample Size = 3(0)
•
•
•
3
Fine Leak
MIL-STD-750 – Method 1071
Condition H, Sample Size = 3(0)
•
•
•
4
Gross Leak
MIL-STD-750 – Method 1071
Condition C, Sample Size = 3(0)
•
•
•
5
Electrical Testing
DC @ TA = 25 °C, Sample Size = 3(0)
•
•
•
Subgroup 7
Subgroup 8 – Not Applicable
Subgroup 9 – Not Applicable
10 | www.skyworksinc.com
High-reliability Screening Capabilities |
MIL-PRF-38534
Step
Screen
Test Methods and Conditions
Class K
Class H
Optional
Optional
1
Preseal Burn-in
MIL-STD-883, Method 1030
2
"100% Nondestructive Bond
Pull"
MIL-STD-883, Method 2023, 2% PDA
100%
Optional
3
Internal Visual
MIL-STD-883, Method 2017
100%
100%
4
Temperature Cycling
"MIL-STD-883, Method 1010,
Condition C"
100%
100%
5
Constant Acceleration
"MIL-STD-883, Method 2001,
Condition 3,000 g, Y1 direction only"
100%
100%
6
"Particle Impact Noise
Detection (PIND) See Note 1"
"MIL-STD-883, Method 2020,
Condition A (Class K) or B"
100%
Optional
7
Preburn-in Electrical Test
"Table 6-3, Subgroup 1; Read and Record"
100%
Optional
8
Burn-In
"MIL-STD-883, Method 1015, at 125°C Minimum"
160 hrs
160 hrs
9
Interim Electrical
Group A ( Read and Record)
10
Burn-In
"MIL-STD-883, Method 1015, at 125°C Minimum"
11
Final Electrical Test
"Table 6-3, Subgroup 1 -3, 9-11;
Read and Record
Delta per Table 6-4."
100%
100%
12
PDA
"Calculate Delta and Percent
Defective"
100%
100%
13
Fine Leak
"MIL-STD-883, Method 1014, Conditions A or B"
100%
100%
14
Gross Leak
MIL-STD-883, Method 1014, Condition C
100%
100%
15
X-ray
MIL-STD-883, Method 2012
100%
Optional
16
External Visual
MIL-STD-883, Method 2009
100%
100%
100%
160 hrs
www.skyworksinc.com | 11
| High-reliability Screening Capabilities
MIL-PRF-38535
Step
Screening Tests
Class B
"QM plan (see H.3.2.1.4) 1/"
Class S
1
Wafer Lot Acceptance Test
"QM plan (see H.3.2.1.4)
or
TM 5007 of MIL-STD-883 (all lots)"
2
"Nondestructive bond pull (NDBP) test"
3
Internal Visual Inspection
TM 2010, Condition B
TM 2010, Condition A
4
Temperature Cycling
"TM 1010, Condition C, 10 Cycles Minimum"
"TM 1010, Condition C, 10 Cycles Minimum"
TM 2023
5
Constant Acceleration
TM 2001, Condition E (Minimum), Y1 Orientation Only TM 2001, Condition E (Minimum), Y1 Orientation Only
6
Visual Inspection
100%
7
"Particle Impact Noise Detection (PIND) test"
8
Serialization
In Accordance with Device Specification (100%)
In Accordance with Device Specification (100%)
9
Pre burn-in (Interim) Electrical Parameters Test
In Accordance with Device Specification
In Accordance with Device Specification
10
"Burn-in test"
"TM 1015 160 Hours at +125 °C Minimum"
"TM 1015 240 Hours at 125 °C, Condition D"
100%
"TM 2020, Test Condition A on Each Device"
11
Post Burn-in (Interim) Electrical Parameters Test
In Accordance with Device Specification
12
"Reverse Bias Burn-in Test
(Static Burn-in)"
"TM 1015, Condition A or C;
144 Hours at +125 °C or
72 Hours at +150 °C Minimum"
13
"Post Burn-in (Interim-reverse Bias)
Electrical Parameters Test"
In Accordance with Device Specification
Class Q (Class Level B)
Class V (Class Level S)
5 Percent PDA (All Lots)
"5 Percent PDA, 3 Percent PDA for Functional
Parameters at 25 °C (All Lots)"
14
"Percent Defective Allowable (PDA)
Calculation"
15
"Final Electrical Tests
"In Accordance with Applicable Device Specification
a. Static Test: (1) at 25 °C
(see Group A Test)"
(2) Maximum and Minimum Operating Temperature
b. Dynamic or Functional Test:
(2) Maximum and Minimum Operating Temperature
c. Switching Test: (1) at 25 °C
(2) Maximum and Minimum Operated Temperature"
“In Accordance with Applicable Device Specification
(see Group A Test)”
16
"Seal test
a. Fine leak
b. Gross leak"
TM 1014
17
"Radiographic (X-ray) and/or C-SAM test"
18
"External visual inspection"
19
Qualification or Quality Conformance Inspection/TCI
Test Sample Selection
20
Radiation Dose Rate Induced Latch-up Test
12 | www.skyworksinc.com
TM 1014
X-ray: TM 2012, Two Views; C-SAM TM 2030
TM 2009
TM 2009
TM 1020
TM 1020
High-reliability Screening Capabilities |
Isolink provides discrete “bare die” and beam-lead products with Class H and Class K element evaluation
in accordance with MIL-PRF-38534 for microcircuit and semiconductor die and for passive devices.
IE:CLA4601-000 = Commercial Product Flow
CLA4601H000 = Class H
CLA4601K000 = Class K
High-reliability Product Flow for Element Evaluation for Unpackaged Devices
Product
MIL-PRF-38534
Application
Bare Die
Class H
Class K
Military
Space
Chip Element Evaluation for Microcircuits and Semiconductors
Mil-Std-883
Test Inspection
Requirement
Method
Condition
Class H
Class K
Per Product Specification
On-wafer
100%
100%
Element Visual
2010
A = Class K
B = Class H
100%
100%
Internal Visual
2010
10/0
10/0
Stabilization Bake
1008
C
N/A
10/0
Temperature Cycling
1010
C
N/A
10/0
Mechanical Shock or Constant
Acceleration
2002
2001
B, Y1 Direction
A, Y1 Direction
N/A
10/0
10/0
Per Product Specification
25 °C, Min. and Max.
Operating Temps.
N/A
1015
240 Hrs. Min. @ 125 °C
N/A
10/0
Per Product Specification
25 °C, Min. and Max.
Operating Temps.
N/A
10/0
Element Electrical
Interim Electrical
Burn-in
Post Burn-in Electrical
Steady-State Life
1005
1,000 Hrs. Min. @ 125 °C
N/A
10/0
Per Product Specification
25 °C, Min. and Max.
Operating Temps.
10/0
10/0
Wire Bond Evaluation
2011
C
10/0
10/0
SEM
2018
N/A
4/0
Final Electrical
Chip Element Evaluation for Passive Devices
Class
MIL-STD-883
Subgroup
K
H
1
•
•
Element Electrical
2
•
•
Visual Inspection
2032
•
•
•
•
•
•
•
1010
2002
2001
•
Temperature Cycling
Mechanical Shock or
Constant Acceleration
Voltage Conditioning or
Aging (Capacitors)
Visual Inspection
Electrical
•
•
Wire Bond Evaluation
2011
4
Test
Method
2032
C
B, V1 Direction
3,000Gs Y1 Direction
Quantity
(Accept Number)
Condition
Reference
Paragraph
100%
C.3.4.1
100% 22 (0)
C.3.4.2
10 (0)
10 (0)
10 (0)
10 (0)
10 (0)
10 (0)
10 (0)
C.3.4.3
10 (0) Wires or
20 (1) Wires
C.3.4.3
C.3.4.6
C.3.4.7
C.3.4.5
C.3.4.4
www.skyworksinc.com | 13
| Amplification
Product Specifications
Specifications tables for all of our latest Aerospace and Defense products are provided on the following pages.
Amplification
The primary purpose of amplifiers is to make a small signal larger. Amplifiers may be specialized for specific applications, such
as low noise amplifiers (LNAs) for receiver front ends, or they may be designed for general purpose amplification, such as
broadband gain blocks.
LNAs are designed to produce optimum noise figure, excellent distortion performance, and outstanding gain.
Gain blocks are designed for ease of circuit design, since they require no input or output impedance matching structures, and
very broadband operation.
WiFi Connectivity Amplifiers
2.5 GHz Power Amplifiers for WiFi Connectivity
Part
Number
SE2623L
Frequency Range Test Frequency
(GHz)
(GHz)
2.5–2.5
2.45
Typ. Gain
(dB)
OIP3
(dBm)
P1 dB
(dBm)
Typ. Quiescent
Current (mA)
Typ. Noise
Figure
(dB)
33
–
32
–
–
Typ. Gain
(dB)
OIP3
(dBm)
P1 dB
(dBm)
Typ. Quiescent
Current (mA)
Typ. Noise
Figure
(dB)
32
–
32
120
–
Package
(mm)
16L QFN
3 x 3 x 0.9
WiFi Connectivity Amplifiers
5 GHz Power Amplifiers for WiFi Connectivity
Part
Number
SE5003L1-R
Frequency Range Test Frequency
(GHz)
(GHz)
5.15–5.85
14 | www.skyworksinc.com
5.4
Package
(mm)
20L QFN
4 x 4 x 0.9
Amplification |
Amplification
Low Noise Amplifiers 400 MHz to 6 GHz
Part Number
Frequency
Range
Test Frequency
(GHz)
(MHz)
Gain
(dB)
NF
(dB)
OIP3
(dBm)
OP1 dB (dBm)
VDD (V)
(Operating
Range)
IDD (mA)
(Operating
Range)
Package
(mm)
SKY67101-396LF
0.4–1.2
900
17.5
0.50
34.0
19.0
4
(3.3–5.0)
56
(20–90)
DFN 8L
2 x 2 x 0.75
SKY67100-396LF
1.2–2.3
1950
17.5
0.70
34.0
18.5
4
(3.3–5.0)
56
(20–90)
DFN 8L
2 x 2 x 0.75
SKY67102-396LF
2.0–3.0
2600
17.2
0.80
33.8
15.0
4
(3.3–5.0)
50
(20–90)
DFN 8L
2 x 2 x 0.75
SKY67001-396LF
0.6–1.2
900
17.5
0.60
40.5
21.0
5
(3.3–5.0)
100 (50–120)
DFN 8L
2 x 2 x 0.75
SKY67111-396LF
0.7–1.2
900
20.7
0.50
39.6
20.0
5
(3.3–5.0)
77
(50–120)
DFN 8L
2 x 2 x 0.75
SKY67002-396LF
1.6–2.1
1850
17.5
0.65
39.5
20.0
5
(3.3–5.0)
95
(50–120)
DFN 8L
2 x 2 x 0.75
SKY67003-396LF
2.0–3.0
2600
17.5
0.88
39.0
19.7
5
(3.3–5.0)
100
(50–120)
DFN 8L
2 x 2 x 0.75
SKY67105-306LF
0.6–1.1
850
37.0
0.70
41.0
26.0
5
(3.5–5.0)
138
(120–155)
QFN 16L
4 x 4 x 0.90
SKY67106-306LF
1.5–3.0
1950
35.0
0.65
37.0
24.0
5
(3.5–5.0)
100
(80–125)
QFN 16L
4 x 4 x 0.90
SKY67107-306LF
2.3–2.8
2600
32.0
0.85
37.5
18.5
5
(3.5–5.0)
125
(50–145)
QFN 16L
4 x 4 0.75
SKY67012-396LF
0.3–0.6
450
16.5
0.85
24.0
14.0
3.3
(1.8–5.0)
15
(5–30)
DFN 8L
2 x 2 x 0.75
SKY67013-396LF
0.6–1.5
900
14.0
0.85
26.0
15.5
3.3
(1.8–5.0)
15
(5–30)
DFN 8L
2 x 2 x 0.75
SKY67014-396LF
1.5–3.0
2450
12.0
0.95
18.0
6.0
3.3
(1.8–5.0)
5
(5–30)
DFN 8L
2 x 2 x 0.75
SKY67015-396LF
0.03–0.3
250
17.5
0.90
26.0
12.5
3.3
(1.8–5.0)
18
(5–30)
DFN 8L
2 x 2 x 0.75
SKY65404-31
4.9–5.9
5800
13.0
1.20
20.0
9.0
3.3
(2.8–5.0)
11
(10–15)
DFN 6L
1.5 x 1.5 x 0.45
SKY65405-21
2.4–2.5
2450
15.0
1.10
24.0
15.0
3.3
(2.8–5.0)
12
(10–16)
DFN 6L
1.5 x 1.5 x 0.45
SKY67151-396LF
0.7–3.8
1500
22.0
0.30
37.0
20.0
5
(3.3–5.0)
65
(20–90)
DFN 8L
2 x 2 x 0.75
Gain Block (General Purpose) Amplifiers
Part
Number
Frequency Range Test Frequency
(GHz)
(GHz)
Typ. Gain
(dB)
OIP3
(dBm)
P1 dB
(dBm)
Typ. Quiescent
Current (mA)
Typ. Noise
Figure
(dB)
Package
(mm)
SKY65013-70LF
0.1–7
2.0
12.5
29
12.5
40
5.5
4-pin SOT-89
4.5 x 2.5 x 1.5
SKY65014-70LF
0.1–6
2.0
16.0
36
18.0
70
4.8
4-pin SOT-89
2.4 x 4.5 x 1.5
SKY65015-70LF
0.1–6
2.0
18.0
35
17.0
70
4.2
4-pin SOT-89
4.5 x 2.5 x 1.5
SKY65016-70LF
0.1–3
2.0
20.0
27
14.0
40
4.8
4-pin SOT-89
4.5 x 2.5 x 1.5
SKY65017-70LF
0.1–6
2.0
20.0
35
20.0
100
4.5
4-pin SOT-89
4.5 x 2.5 x 1.5
SKY67130-396LF
0.7–2.7
2.6
13.0
39
16.0
22
2.6
8-pin DFN
2 x 2 x 0.75
www.skyworksinc.com | 15
| Amplification
Amplification
Variable Gain Amplifiers (VGAs)
Part
Number
Operating
Frequency
(MHz)
Architecture
SKY65172
400–2700
Single Channel
Digital/
Analog
SKY65175
1710–1950 Single Channel
SKY65185
1700–2700
SKY65186-11
330–2700
SKY65187-11
Gain
Control
Range
(dB)
Gain Step
Size
(dB)
Gain
(dB)
Min.
NF
IP3
(dBm)
P1 dB
(dBm)
Supply
Voltage
(V)
25
(Analog)
31.5
(Digital)
N/A 0.5
26.5
5
OIP3 = 38
OP1 dB = 24.5
5
48-pin MCM
7 x 7 x 1.1
Analog
18
N/A
26
2.8
OIP3 = 41.5
OP1 dB = 29
5
12-pin MCM
8 x 8 x 1.35
Dual Channel
6-bit Digital
31.5
0.5
15
4.5
OIP3 = 41
OP1 dB = 26
5
32-pin MCM
7 x 7 x 1.35
Dual Channel
Digital
31.5
0.5
13.5
5
OIP3 = 36
OP1 dB = 20
5
32-pin MCM
7 x 7 x 1.35
2000–2230 Single Channel
Analog
30
N/A
24
2.7
OIP3 = 41.5
OP1 dB = 28
5
12-pin MCM
8.385 x 8.385 x 1.35
SKY65373-11
1710–1785 Single Channel
Voltage
Controlled
35
Analog
35
1
IIP3 = 3
OP1 dB = -11
5
16-pin MCM
8 x 8 x 1.3
SKY65386-11
2620–2690 Single Channel
Analog
42
N/A
25.5
3.9
OIP3 = 41.5
OP1 dB = 28.5
5
12-pin MCM
8.385 x 8.385 x 1.35
SKY65387-11
2000–2230 Single Channel
Analog
35
N/A
30
3.5
OIP3 = 42
OP1 dB = 28
5
12-pin MCM
8.385 x 8.385 x 1.35
16 | www.skyworksinc.com
Attenuation
Type
Package
(mm)
Attenuation
Attenuation
Attenuators are used to adjust signal levels, to compensate for impedance mismatches, and to enhance isolation, among other
uses. Attenuators may be electronically variable or may offer fixed values of attenuation. Skyworks’ offering of digital and
variable attenuators, attenuator PIN diodes, and fixed attenuators are shown in the following tables.
The attenuation of variable attenuators is controlled by one or more external signals. One type of variable attenuators, digital
variable attenuators, produces discrete combinations of attenuation values, which comprise one or more bits which are typically
binary weighted values. The attenuation produced by voltage variable attenuators is continuously variable under the control of
an analog voltage.
Fixed attenuators contain fixed resistors, typically connected in tee or p networks. The attenuation values of these fixed
attenuators range from 0 to 30 dB.
Variable attenuators are available in several different surface mount plastic package styles. The fixed attenuators are available
as unpackaged dice.
Digital Attenuators
Digital Attenuators for IF/UHF/VHF and Broadband RF Applications
Frequency
Range
(GHz)
Number
of Bits
Least
Significant
Bit (dB)
Control
Interface
Maximum Attenuation
(dB)
Typical
Insertion
Loss (dB)
Typical
IIP3
(dBm)
LF–2.5
1
10
Parallel
10
0.3–0.4
41
SOT-23 5L 2.8 x 2.9 x 1.18
SKY12406-360LF
0.05–0.6
1
12
Parallel
12
0.3
46
QFN 8L 2 x 2 x 0.9
AA116-72LF
0.004–2.0
1
15
Parallel
15
0.35–0.4
41
SOT-23 5L 2.8 x 2.9 x 1.18
AA104-73LF
LF–2.5
1
32
Parallel
32
0.8–1.0
41
SOT-23 6L 2.8 x 2.9 x 1.18
SKY12407-321LF
0.05–0.6
2
12
Parallel
12
(100 W Differential I/O)
0.3
48
QFN 12L 3 x 3 x 0.75
SKY12338-337LF
0.35–4.0
2
6
Parallel
18
0.55–1.3
45
QFN 12L 3 x 3 x 0.75
SKY12325-350LF
0.5–6.0
3
1
Parallel
7
0.7–1.3
47
QFN 16L 3 x 3 x 0.75
SKY12348-350LF
0.1–3.0
4
1
Parallel
15
0.8–1.2
45
QFN 16L 3 x 3 x 0.75
SKY12340-364LF
0.3–2.0
5
0.5
SPI
15.5
1.4–1.8
45
QFN 32L 5 x 5 x 0.9
SKY12322-86LF
0.5–4.0
5
0.5
Parallel
15.5
1.4–3.0
45
MSOP 10L 4.9 x 3 x 0.96
SKY12345-362LF
0.7–4.0
5
0.5
SPI
15.5
1.2–2.0
42
QFN 24L 4 x 4 x 0.9
SKY12347-362LF
LF–3.0
6
0.5
SPI or Parallel
31.5
1.2–2.0
50
QFN 24L 4 x 4 x 0.9
SKY12343-364LF
0.01–4.0
7
0.25
SPI or Parallel
31.75
1.8–1.9
50
QFN 32L 5 x 5 x 0.9
Part Number
AA103-72LF
Package
(mm)
www.skyworksinc.com | 17
| Attenuation
Attenuation
Variable Attenuators—FET Based
3.0–3.8 GHz Plastic Packaged Voltage Variable Attenuators
Part
Number
Frequency
(GHz)
SKY12146-321LF
3.0–3.8
Description
Typ. Insertion
Loss Range (dB)
Attenuation
Range (dB)
Typ. IP3 > 0.5 GHz
(dBm)
Package
(mm)
1.5–1.6
32–20
20
QFN 12L 3 x 3 x 0.75
20 dB Single CTL
ATN3590 Fixed Attenuator Pads
Part
Number
Nominal
Attenuation
Attenuation Tolerance @ DC–12 GHz
(dB)
DC (dB)
(dB)
Attenuation Flatness
Return Loss
12–26 GHz
(dB)
26–33 GHz
(dB)
33–40 GHz
(dB)
DC–12 GHz
(dB)
12–26 GHz
(dB)
26–33 GHz
(dB)
33–40 GHz
(dB)
ATN3590-00
0
0.25
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-01
1
±0.20
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-02
2
±0.20
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-03
3
±0.20
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-04
4
±0.20
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-05
5
±0.20
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-06
6
±0.40
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-07
7
±0.40
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-08
8
±0.40
±0.15
±0.15
±0.20
±0.20
28
24
20
16
ATN3590-09
9
±0.40
±0.20
±0.20
±0.25
±0.30
28
24
20
16
ATN3590-10
10
±0.40
±0.20
±0.20
±0.25
±0.50
28
24
20
16
ATN3590-12
12
±0.40
±0.20
±0.20
±0.30
±0.50
28
24
20
16
ATN3590-15
15
±0.40
±0.20
±0.20
±0.50
±0.75
28
24
20
16
ATN3590-20
20
±1.0
±0.20
±0.20
±0.75
±1.0
28
24
20
16
ATN3590-30
30
±1.0
±0.20
±0.25
±0.75
±2.5
28
24
20
16
18 | www.skyworksinc.com
Attenuation |
Attenuation
Attenuator PIN Diodes
PIN Diode Discrete—Low Frequency to 12 GHz
Nominal Input
3rd Order Intercept
(dBm)1
Nominal I Layer
Thickness
(µm)
Nominal Largest
Series Resistance
(kW)
Minimum Series
Resistance
(W)
Maximum
Capacitance
(pF)
Nominal Carrier
Lifetime
(ns)
SMP1307 Series
>50
175
3.0
3.0 @ 100 mA
0.3 @ 30 V
1500
SMP1304 Series
>43
100
2.5
2.0 @ 100 mA
0.3 @ 30 V
1000
SMP1302 Series
>38
50
1.8
1.5 @ 100 mA
0.3 @ 30 V
700
>38
50
1.8
1.5 @ 100 mA
0.2 @ 50 V
700
Part
Number
APD2220-000
1. Input third order intercept (IIP3) is dependent on several factors, including signal frequency, bias condition and attenuator topology. Values shown here refer to hybrid coupler attenuator topology,
signal frequency equal to the center frequency of the hybrid coupler, with bias adjusted to produce minimum attenuation. IIP3 typically degrades by approximately 6 dB when attenuation is adjusted
to maximum.
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
AEC-Q101 Qualified2
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 30 V
(pF)
Typ. VF
IF = 10 mA
(V)
Max. RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Max. RS
IF = 100 mA
F = 100 MHz
(Ω)
Typ. Carrier
Lifetime
IF = 10 mA
(ns)
SMPA1302-079LF
200
0.30
0.80
20
3
1.5
700
QFN 2L
2 x 2 x 0.9
SMPA1304-011LF
200
0.30
0.80
50
7
2.0
1000
SOD 2L
2.52 x 1.25 x 1.04
SMPA1304-019LF
200
0.45
0.80
50
7
2.0
1000
SOT 3L
2.37 x 2.92 x 1.00
Part
Number
Package
(mm)
2. Not all stresses listed within AEC-Q101 have been performed. Qualification report available upon request.
Contact your sales representative for more information. For the full details of Skyworks Quality and Reliability on our products that can be designed into automotive applications, please view
the “Skyworks Quality Standards for Automotive Customers” on our website.
www.skyworksinc.com | 19
| Circulation and Isolation
Circulation and Isolation
Skyworks is now pleased to offer customers innovative and cost-competitive ferrite circulators and isolators for both military
and commercial markets. Our circulators deliver industry-leading insertion loss performance, a critical parameter in radar
design, of less than 0.25 dB. Skyworks’ MAFR-000493-000001, for example, is designed to operate in the L band. It has a
typical insertion loss of just 0.16 dB at 1030 MHz. Our MAFR-000403 S band circulator, optimized from 2.7 GHz to 3.1 GHz, has
a typical insertion loss of only 0.25 dB. Skyworks achieves best-in-class performance through a systematic approach including
Six Sigma tools and methodologies, which help ensure quality and reliability from product development through volume
production. All production facilities are certified to ISO 9001 and ISO 14001 standards and our products are compliant to the
European Union’s RoHS directive 2002/95/EC.
Circulators for Radar Applications
Part Number
Frequency
(MHz)
Insertion Loss
(dB)
Isolation
(dB)
Return Loss
(dB)
Rotation
Max. Power
(W) F/R
Case Size
(Inch/mm)
Package
MAFR-000399-000001
1450–1500
0.30
20
20
CW
1000
1.0/25.4
Drop-in
MAFR-000409-000001
960–1200
0.50
18
18
CCW
1000
1.0/25.4
Drop-in
MAFR-000428-000001
960–1200
0.50
18
18
CCW
1200
1.0/25.4
Drop-in
MAFR-000493-000001
1030–1090
0.30
18
18
CW
1200
1.0/25.4
Drop-in
MAFR-000514-000001
3100–3500
0.30
23
21
CW
1500/1500
0.752/192
Drop-in
MAFR-000578-000001
1200–1400
0.30
20
20
CW
1500
1.0/25.4
Drop-in
MAFR-000608-000001
1200–1400
0.30
20
20
CCW
1500
1.0/25.4
Drop-in
MAFR-000613-000001
1030–1090
0.30
18
18
CW
1200/1200
1.0 25.4
Drop-in
MAFR-000627-000001
1350–1850
0.50
18
18
CW
1500
1.0/25.4
Drop-in
MAFR-000645-000001
960–1215
0.50
16
16
CCW
1000/1000
1.0 25.4
Drop-in
MAFR-000668-000001
1350–1850
0.50
18
18
CCW
1500/1500
1.02/25.42
Drop-in
MAFR-000677-000001
2700–3100
0.35
20
20
CW
1300/1300
0.75 /19
Drop-in
2/
2
2/
2
2
2
Isolators for Radar Applications
Part Number
Frequency
(MHz)
Insertion Loss
(dB)
Isolation
(dB)
Return Loss
(dB)
Rotation
Max. Power
(W) F/R
Case Size
(Inch/mm)
Package
MAFR-000430-000001
2700–3100
0.30
20
20
CW
1300/75
0.75 x 1.0/19 x 25.4
Drop-in
MAFR-000628-000001
1200–1400
0.30
20
20
CCW
1500/2
1.0/25.4
Drop-in
MAFR-000629-000001
1200–1400
0.30
20
20
CW
1500/25
1.0 x 1.25/25.4 x 31.7
Drop-in
MAFR-000667-000001
1200–1400
0.30
20
20
CCW
1500/25
1.0 x 1.25/25.4 x 31.7
Drop-in
20 | www.skyworksinc.com
DC Blocking and Filtering |
DC Blocking and Filtering
Skyworks’ metal-insulator-semiconductor (MIS) chip capacitors are available in a wide range of capacitance values and die
sizes for chip-and-wire circuits requiring DC blocking, RF bypassing or as tuning elements in filters, oscillators, and matching
networks. The capacitors have a dielectric composed of thermally-grown silicon dioxide over which a layer of silicon nitride
is deposited. This two-layer dielectric produces a very a low temperature coefficient of capacitance, very high insulation
resistance, outstanding long-term stability, and excellent reliability. The temperature coefficient of capacitance is less that
50 ppm/°C, and the capacitors are suitable for operation from -65 °C to 200 °C. Skyworks’ MIS chip capacitors offer very high
Q. Wafers can be supplied on expanded film frame for automatic pick-and-place manufacturing. To reduce cost, chips can
be supplied packaged in vials with sample electrical testing. Packaging in waffle packs with 100% electrical test and visual
inspection is available if required.
MIS Silicon Chip Capacitors—Low Frequency to 20 GHz
Part Number
Capacitance Value (pF) ±20%
Die Size (mils)
SC00080912
0.8
12 x 12
SC00120912
1.2
12 x 12
SC00180912
1.8
12 x 12
SC00260912
2.6
12 x 12
SC00380912
3.8
12 x 12
SC00560912
5.6
12 x 12
SC00680912
6.8
12 x 12
SC00820710
8.2
10 x 10
SC00821518
8.2
18 x 18
SC01000710
10
10 x 10
SC01000912
10
12 x 12
SC01001518
10
18 x 18
SC01500912
15
12 x 12
SC01501518
15
18 x 18
SC02201518
22
18 x 18
SC03301518
33
18 x 18
SC04701518
47
18 x 18
SC06801518
68
18 x 18
SC10002430
100
30 x 30
SC33303440
333
40 x 40
SC50004450
500
50 x 50
SC99906068
1000
68 x 68
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
www.skyworksinc.com | 21
| Demodulation
Demodulation
Demodulation is a process in which information, known as the baseband signal, is recovered from a modulated carrier signal.
Typically, the carrier signal frequency is higher than that of the baseband signal, so a frequency-down conversion is inherently
involved in demodulation. Skyworks offers a family of I/Q demodulators which produce complex baseband signals by processing
the modulated carrier signal and a high frequency local oscillator signal. Baseband signals are comprised of in-phase (I) and
quadrature (Q) baseband signals, (IQ signals), which can be produced from the demodulation of any digital or analog modulation.
Frequency conversion mixers, modulators, and demodulators all require stable, low noise local oscillator signals signals (LO
signals) in order to perform their primary functions. Skyworks offers advanced phase locked loop (PLL)/synthesizers which
produce high frequency signals which are locked to low frequency, very stable reference frequency signals through the use of
advanced frequency dividers, and phase/frequency detectors. These circuits offer exceptional phase noise performance, very
low spurious signal content, excellent frequency agility, and very fast settling without sacrificing spectral purity.
These devices are available with or without internal high-frequency voltage-controlled oscillators, with “integer-n” or
“fractional-n” frequency dividers and as single or dual PLL/synthesizers.
Demodulator
Broadband Direct Quadrature Demodulator
Part
Number
SKY73012
RF Input Frequency IF Input Frequency
Range (MHz)
Range (MHz)
400–3900
Voltage
(V)
IIP2
(dBm)
IIP3
(dBm)
Voltage Conversion
Gain (dB)
Package
(mm)
3.0
60 @ 900 MHz
29 @ 900 MHz
1 @ 900 MHz
32-pin RFLGA
5x5x1
DC–250
PLLs/Synthesizers/VCOs
High Performance VCOs/Synthesizers
Part
Number
RF Output
Frequency
Output
Range (MHz) Power (dBm)
Phase Noise
@ 200 kHz
(dBc/Hz)
Phase Noise
@ 800 kHz
(dBc/Hz)
Phase Settling
Time
(µs)
Current
Consumption
(mA)
Supply Voltage
(V)
Package
(mm)
SKY73101-11
1930–1990
-10
-112
-139
300
120
5
38-pin MCM
9 x 12 x 1.7
SKY73112-11
750–850
0
-128
-151
300
110
5
38-pin MCM
9 x 12 x 1.7
SKY73120
890–960
0
-124
-144
–
26
3
28-pin MCM
6 x 6 x 0.9
1805–1890
-10
-126
-142
227
114
5
38-pin MCM
9 x 12 x 1.7
SKY73121-11
22 | www.skyworksinc.com
Demodulation, Filtering |
Demodulation
Single Fractional-N Synthesizer
Part
Number
Main Synthesizer
Frequency (MHz)
Main Synthesizer Phase Noise
(dBc/Hz)
Supply Voltage
(V)
Package
(mm)
100–2100
-91 @ 1800 MHz
2.7–3.3
24-pin QFN 4 x 4 x 0.9
SKY72310-362LF
Mixer Modules with Built-in Voltage Controlled Oscillators (VCOs)
Operating
Frequency
(MHz)
IF Frequency
(MHz)
Architecture
Power
Down
Built-In
LO Drivers
Built-In
PLL/VCO
Conversion
Gain
IIP3
(dBm)
VCC
(V)
NF
(dB)
Package
(mm)
SKY73212-11
1700–2000
40–300
Diversity
Yes
Yes
Integer-N
9
24
5
11
44-pin MCM
10 x 6 x 1.05
SKY73208-11
350–5000
50–500
Single
Yes
Yes
Integer-N
6
26
5
14
36-pin MCM
6 x 6 x 1.35
Part Number
Dual Fractional-N Synthesizers
Part
Number
Main Synthesizer
Frequency (MHz)
Auxiliary Synthesizer
Frequency (MHz)
Main Synthesizer Phase
Noise (dBc/Hz)
Supply Voltage
(V)
Package
(mm)
SKY72300-21
100–2100
100–500
-91 @ 1800 MHz
2.7–3.3
28-pin EP-TSSOP 9.7 x 6.4 x 1.1
SKY72300-362
100–2100
100–500
-91 @ 1800 MHz
2.7–3.3
24-pin QFN 4 x 4 x 0.9
SKY72301-22
100–1000
100–500
-96 @ 950 MHz
2.7–3.3
28-pin EP-TSSOP 9.7 x 6.4 x 1.1
SKY74038-21
100–2600
1–800
-85 @ 2500 MHz
2.6–3.6
20-pin TSSOP 6.5 x 4.4 x 1.1
Filtering
In most radio systems it is necessary to select a certain range of frequencies which the radio processes. Band pass filter
structures are utilized to select the appropriate frequency band, to reject all signals whose frequencies are lower than the
lower frequency bound of the filter, and to reject all signals whose frequencies are higher than the higher frequency bound
of the filter.
Band pass, notch, and diplex filters, in both SMT and connectorized versions, comprising ceramic resonators have very high
quality factor (Q), low in-band insertion loss, high out-of-band rejection, and excellent ruggedness. Several band pass filters
are available, as shown in Table 21, with center frequencies from 225 MHz up to 7.1 GHz. Skyworks, through its subsidiary
Trans-Tech, can design and manufacture ceramic resonators from 1.85 mm up to 20 mm and produce high-power filters
exceeding 100 CW in SMT and connectorized versions, as well as high frequency options.
When size is an issue, Trans-Tech Inc. can design and manufacture ceramic filter element solutions for your higher power filter
requirements. Our designs provide optimized physical volume and minimized weight to meet your demanding requirements.
www.skyworksinc.com | 23
| Filtering
Filtering
Ceramic Filters
Part
Number
Market Segment
Filter Type
Size/ poles
FO
Bandwidth
(MHz)
Insertion Loss
(dB)
Package
TT3P4-1255P2-8025
Radio Communications
Band Pass
3 mm/4 pole
1225
80
2.5
SMT
TT3P4-1265.2P2-1040
Radio Communications
Band Pass
3 mm/4 pole
1265
10
4.0
SMT
TT1.85P7-1400P0-20040
Radio Communications
Band Pass
1.85 mm/7 pole
1400
200
4.0
SMT
TT1.85P6-1888P0-22540
Radio Communications
Band Pass
1.85 mm/6 pole
1888
225
4.0
SMT
TT1.85P6-1638P0-27540
Radio Communications
Band Pass
1.85 mm/6 pole
1638
275
4.0
SMT
TT1.85P6-1650P0-30030
Radio Communications
Band Pass
1.85 mm/6 pole
1650
300
3.0
SMT
TT12P8-T310-R370
Radio Communications
Diplexer
12 mm/8 pole
310/370
20
0.7
SMT
TT3P5-1000P3-1030
Ground Radar
Band Pass
3 mm/5 pole
1000
10
3.0
SMT
TT6P4-1575P3-1540
GPS
Band Pass
6 mm/4 pole
1575
15
4.0
SMT
TT4P2-1227P3-2010
GPS
Band Pass
4 mm/2 pole
1227
20
1.0
SMT
TT4P2-1575P3-1014
GPS
Band Pass
4 mm/2 pole
1575
10
1.4
SMT
TT6P4-0373P0-0240
Homeland Security
Band Pass
6 mm/4 pole
373
2
4.0
SMT
TT4P5-1300P2-20010E
Homeland Security
Band Pass
4 mm/5 pole
1300
200
1.0
SMT
TT4P5-2300P2-20010
Homeland Security
Band Pass
4 mm/5 pole
2300
200
1.0
SMT
TT2P4-4700P2-60010
Homeland Security
Band Pass
2 mm/4 pole
4700
600
1.0
SMT
TT3P4-0915P2-10020
IED
Band Pass
3 mm/4 pole
915
100
2.0
SMT
TT3P4-2240P2-0545
IED
Band Pass
3 mm/4 pole
2240
5
4.5
SMT
TT4P45-2700P2-5045
IED
Band Pass
4 mm/4 pole
2700
50
4.5
SMT
TT4P6-0925P2-15020
IED
Band Pass
4 mm/6 pole
925
150
2.0
SMT
TT2P4-2650P0-8035
IED
Band Pass
2 mm/4 pole
2650
80
3.5
SMT
TT8P10-R1950-T2140
LPA
Diplexer
8 mm/10 pole
1950/2140
60
2.0
SMT
TT6P4-0480P0-3019
LPA
Band Pass
6 mm/4 pole
480
30
1.9
SMT
TT8P5-1090P0-1050
LPA
Band Pass
8 mm/5 pole
1090
10
5.0
SMT
TT4P4-0255P0-3015
LPA
Band Pass
4 mm/4 pole
255
30
1.5
SMT
Notes:
LPA = Linear Power Amps
IED = Improvised Explosive Device
TCAS = Traffic Collision Avoidance System
RC = Radio Communications
GPS = Global Positioning System
TT4P5-1000P0-10020
4P5 = 4 mm/5 pole
1000 = Center Frequency
10020 = Bandwidth/Insertion Loss
24 | www.skyworksinc.com
Filtering |
Filtering
Ceramic Filters (Continued)
Part
Number
Market Segment
Filter Type
Size/ poles
FO
Bandwidth
(MHz)
Insertion Loss
(dB)
Package
TT4P4-0364P0-3015
LPA
Band Pass
4 mm/4 pole
364
30
1.5
SMT
TT4P4-1960P3-6039
LPA
Band Pass
4 mm/4 pole
1960
60
3.9
SMT
TT4P4-0881.5P3-2537
LPA
Band Pass
4 mm/4 pole
881.5
25
3.7
SMT
TT6P6-1060P2-7020
TCAS
Band Pass
6 mm/6 pole
1060
90
2.5
SMT
TT6P6-1060P2-9020
TCAS
Band Pass
6 mm/6 pole
1060
90
2.0
SMT
TT4P4-1090P2-3044
TCAS
Band Pass
4 mm/4 pole
1090
30
4.4
SMT
TT8P8-0310P0-20xx
Mobile Radio
Ceramic
4
300–320
20
1.5
SMT or
Connectorized
TT8P8-0370P0-20xx
Mobile Radio
Ceramic
4
360–380
20
1.5
SMT or
Connectorized
TT12P5-0465P0-0750
Portable Radio
Ceramic
5
461.4–468.6
7
5
SMT or
Connectorized
TT8P8-T0311P0-R0371
Portable Radio
Ceramic
8
311/371
20/20
1.5
SMT or
Connectorized
TT2P4-1575.4-1227.6
GPS
Ceramic
4
1227/1575
16
2.5
SMT
Airborne Radio
Ceramic
7
1385–1585
200
4.4
SMT
IED
Ceramic
7
2610–2690
80
4.2
SMT
TT1.85P7-1395P0-20044
TT2P5-2650P1-8042
High Frequency Ceramic Filters
Trans-Tech, Inc. offers a series of high frequency band pass notch filters that are available in surface mount technology (SMT)
designs. This series of filters has excellent matching for 50 Ω communication systems where space and weight are critical
design criteria.
Notes:
LPA = Linear Power Amps
IED = Improvised Explosive Device
TCAS = Traffic Collision Avoidance System
RC = Radio Communications
GPS = Global Positioning System
TT4P5-1000P0-10020
4P5 = 4 mm/5 pole
1000 = Center Frequency
10020 = Bandwidth/Insertion Loss
www.skyworksinc.com | 25
| Mixing
Mixing
Frequency conversion circuits are present in many receiver and transmitter architectures. The frequency mixer comprises one
or more nonlinear impedance elements which are used to mix a signal of interest by a reference signal, commonly known as the
local oscillator (LO) signal, to produce signals at new frequencies. These frequencies include the sum of the signal of interest
and the LO signal to produce an upconverted signal, and the difference of the LO signal and the signal of interest, producing
a down-converted signal. Upconversion is generally used in transmit architectures while downconversion is generally found in
receivers.
The SKY73208-11 is a fully integrated wideband device which consists of three main blocks required in a receive RF subsystem.
It contains a wide band mixer for down conversion, a complete voltage controlled oscillator (VCO) synthesizer, and local
oscillator (LO). The integrated VCO synthesizer is a wideband integer-N synthesizer which covers frequencies from 2.8–6.0 GHz
with competitively low phase noise and very low spurious content.
Schottky diodes produce a nonlinear relationship between current and voltage, that is, they present a nonlinear impedance.
They can be used in several different circuit topologies as frequency up- or downconverters.
There are several types of Schottky mixer diodes available. Silicon (Si) Schottky mixer diodes are available with low, medium,
and high barrier heights. Lower barrier heights are sensitive to lower power signals and typically require smaller LO power,
while higher barrier heights can handle larger signals and typically produce less harmonic and intermodulation distortion.
Consequently, downconverter mixers in receivers generally contain low or medium barrier Schottky diodes, while upconverters
in transmitters contain medium- or high-barrier Schottky diodes.
Gallium arsenide (GaAs) Schottky diodes are similar in most respects to Si high-barrier Schottky diodes, with the exception that
the higher carrier mobility of GaAs permits GaAs Schottky diodes to be used at much higher frequencies.
Schottky detector diodes are available as beam lead, flip chip, unpackaged dice, in surface-mount plastic packages and in
hermetic, ceramic packages.
Beam lead, flip chip, and unpackaged die configurations offer optimal performance since there are no package parasitic
reactances present in these configurations.
Plastic-packaged devices are readily surface mountable and present the lowest cost alternative of the available package styles.
The parasitic impedances of these packages can reduce the maximum frequency of operation to an extent determined by the
magnitude of these parasitic reactances.
Schottky diodes packaged in hermetic, ceramic packages can meet all requirements for high-reliability screening while
operating to high frequency, since their parasitic reactances are relatively small. Skyworks’ offering of Schottky diodes are
shown in the following tables.
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned
subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
26 | www.skyworksinc.com
Mixing |
Mixing
Broadband Direct Quadrature Demodulator
Part
Number
RF Input Frequency IF Input Frequency
Range (MHz)
Range (MHz)
SKY73012
400–3900
Voltage
(V)
IIP2
(dBm)
IIP3
(dBm)
Voltage Conversion
Gain (dB)
Package
(mm)
3.0
60 @ 900 MHz
29 @ 900 MHz
1 @ 900 MHz
32-pin RFLGA
5x5x1
DC–250
Mixer Modules with Built-in Voltage Controlled Oscillators (VCOs)
Part Number
SKY73208-11
Operating
Frequency
(MHz)
IF Frequency
(MHz)
Architecture
Power
Down
Built-In
LO Drivers
Built-In
PLL/VCO
Conversion
Gain
IIP3
(dBm)
VCC
(V)
NF
(dB)
Package
(mm)
350–5000
50–500
Single
Yes
Yes
Integer-N
6
26
5
14
36-pin MCM
6 x 6 x 1.35
Schottky Diodes
Surface Mount Technology (SMT) Plastic Package—Low Frequency to 10 GHz
Configuration
Typical LO Drive
Power Range (dBm)
Barrier Height
Part Number
Si Ring Quad
10–14
Low
SMS3926-022LF
13–20
Medium
–
17–23
High
–
10–14
Low
SMS3926-023LF
13–20
Medium
SMS3927-023LF
17–23
High
SMS3928-023LF
13–17
Low
–
16–23
Medium
–
13–17
Low
–
16–23
Medium
–
-3–3
Low
0–6
Medium
–
6–13
High
–
Si Crossover Ring Quad
Si Dual Ring Quad, Octoquad
Si Crossover Dual Ring Quad
Si Single
SMS7621-079LF
www.skyworksinc.com | 27
| Mixing
Mixing
Chip, Beam Lead and 0201 Chip Scale Package (CSP)—Low Frequency to 100 GHz
Configuration
Typical LO Drive Power Range
(dBm)
Barrier Height
Base Part Number1
Si Ring Quad
10–14
Low
DMF3926-000, DMF3942-000,
DMF2865-000, DMF2454-000
13–20
Medium
DME3927-000, DME3943-000,
DME2857-000, DME2459-000
17–23
High
DMJ3928-000, DMJ3944-000,
DMJ2502-000, DMJ2455-000
Low
DMF3929-000, DMF2076-000, DMF2848-000
Medium
DME3930-000, DME2029-000, DME2851-000
High
DMJ3931-000, DMJ2312-000, DMJ2852-000
Low
DMF3932-000, DMF2835-000, DMF2828-000
Medium
DME3933-000, DME2050-000, DME2831-000
High
DMJ3934-000, DMJ2092-000, DMJ2833-000
Low
DMF3935-000
Medium
DME3936-000
High
DMJ3937-000
13–17
Low
DMF3938-000
16–23
Medium
DME3939-000
20–27
High
DMJ3940-000
13–17
Low
DMF3945-000
16–23
Medium
DME3946-000
20–27
High
DMJ3947-000
-3–3
Low
SMS7621-060, DMF2820-000, DMF2822-000
0–6
Medium
DME2127-000, DME2458-000
6–13
High
DMJ2823-000, DMJ2825-000
10–16
Low
DMF2185-000, DMF2186-000, DMF2187-000
13–20
Medium
DME2282-000, DME2283-000,
DME2284-000, DME2838-000
20–27
High
DMJ2303-000, DMJ2304-000,
DMJ2246-000, DMJ2839-000
GaAs Single
6–13
N/A
DMK2790-000
GaAs Antiparallel Pair
20–27
N/A
DMK2308-000
Si Bridge Quad
Series Pair
Back-to-Back Ring Series Pairs
1
2 4
3
Si Dual Ring Quad (Octoquad)
Si Crossover Dual Ring Quad
Si Single
Si Antiparallel
1.
All part numbers in this table are Skyworks Green™.
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
28 | www.skyworksinc.com
Mixing |
Mixing
Ceramic and Hermetic—Low Frequency to 40 GHz
Configuration
Typical LO Drive Power Range
(dBm)
Barrier Height
Base Part Number1
Si Ring Quad
10–14
Low
DMF2865, DMF2011, DMF2012, DMF2454
13–20
Medium
DME2857, DME2858, DME2859, DME2459
17–23
High
DMJ2502, DMJ2990, DMJ2667, DMJ2455
Low
DMF2076, DMF2077, DMF2078, DMF2848
Medium
DME2029, DME2850, DME2031, DME2851
High
DMJ2312, DMJ2088, DMJ2768, DMJ2852
Low
DMF2835, DMF2826, DMF2827, DMJ2828
Medium
DME2050, DME2829, DME2830, DME2831
High
DMJ2092, DMJ2093, DMJ2832, DMJ2833
13–17
Low
DMF3938-257
16–23
Medium
DME3939-257
20–27
High
DMJ3940-257
-3–3
Low
DMF2820, DMF2821, DMF2344, DMF2822
0–6
Medium
DME2127, DME2957, DME2333, DME2458
6–13
High
DMJ2823, DMJ2777, DMJ2824, DMJ2825
10–16
Low
DMF2185, DMF2186, DMF2187, DMF2837
13–20
Medium
DME2282, DME2283, DME2284, DME2838
20–27
High
DMJ2303, DMJ2304, DMJ2246, DMJ2839
Si Bridge Quad
Series Pair
Si Dual Ring Quad (Octoquad)
Si Single
Si Antiparallel Pair
1.
All part numbers in this table are Skyworks Green™.
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
www.skyworksinc.com | 29
| Optical Coupling
Optical Coupling
TM
Isolink, Inc., a subsidiary of Skyworks Solutions, Inc., is the leading supplier of high performance and high quality optoelectronic
radiation tolerant components worldwide. Expanding on our specialty in manufacturing and production of high quality, highreliability products for high demand environments, Isolink’s portfolio now includes hermetic packaged RF IC diode and switch
products. Isolink’s mission is to provide products and services to the high-reliability, military, aerospace, hybrid, industrial,
medical, and telecommunications markets. The company specializes in the manufacture of high-performance miniature hybrids
and hermetically sealed RFIC and optocoupler devices. Isolink pioneered the miniaturization of some of the most advanced
optoelectronic components. Our expertise in optoelectronic components enables us to make products of high quality, achieving
high isolation voltages. A hallmark of Isolink’s products is high common mode rejection and radiation tolerance for high demand
environments.
Isolink is committed to providing excellent products and services to its customers, and to serving as an extension of the
customer’s engineering and manufacturing resources. Isolink strives for a customer/vendor relationship aimed at optimizing
product performance, quality, and cost. We meet and exceed customer expectations, and are committed to delivering
excellence.
Isolink works with customers from program inception to the final implementation of the most demanding design and
application challenges. We are proud to provide innovative products and custom solutions with uncompromising quality and
on-time delivery.
Founded by veterans in the optoelectronics industry, Isolink is headquartered in Milpitas, California.
For more information, or for customer support, please visit the Isolink website at www.isolink.com
Photo-transistor Optocouplers
Single-channel Photo-transistor Optocouplers
VF (V) @ IF = 10 mA
Part Number
OLS249 1
OLS449 1
OLS2449
CTR
Vcc Max.
(V)
Isolation
25 °C VDC @
1s
Min.
Max.
@ IF (mA)
Min. (%)
Max. (%)
BVceo
(V)
Package
Size (inch)
1.2
1.8
1
200
1200
40
–
1500
6L
0.245 x 0.17 x 0.08
1.2
1.7
1
1500
4000
65
–
1500
6L
0.17 x 0.245 x 0.08
1.2
1.7
1
1500
4000
65
–
1500
8L
0.245 x 0.170 x 0.08
Transfer
Gain
Isolation
25 °C VDC @ 1 s
Package
Size (inch)
1 ± 0.25
1000
6L
0.245 x 0.17 x 0.08
Linear Optocouplers
Single-channel
VF (V) @ IF = 10 mA
Part Number
OLS700
Coupled Characteristics
Min.
Max.
IF (mA)
–
1.6
10
1. Radiation tolerant.
30 | www.skyworksinc.com
Servo Current IP1 (µA) Forward Current IP2 (mA)
typ. 30
30
Optical Coupling |
Photovoltaic Optocouplers
Single-channel Photovoltaic Optocouplers
VF (V) @ IF = 10 mA
Part Number
OLS910
Min.
Max.
Isc @ IF
(mA)
–
3.2
10
Conditions
Min. (µA)
Max.
VR
(V)
Isolation
@ VDC 1 µs
Package
Size (inch)
-7
–
200
1500
6L
0.245 x 0.17 x 0.08
RF Switch
DC to 6 GHz Hermetic GaAs IC SPST Non-Reflective Switch
Part
Number
ISO13316
Input Power
(dBm)
Isolation
(dB)
Insertion Loss
(dB)
Up to 25
50 @ 2 GHz
38 @ 4 GHz
27 @ 6 GHz
0.08 @ 6 GHz
Typ. Return Loss (dB)
50 @ 2 GHz
38 @ 4 GHz
27 @ 6 GHz
Typ. Switching Time
(ns)
15
Packaging
(Inches)
Hermetic SMT
0.385 x 0.345 x 0.065
www.skyworksinc.com | 31
| Power Detection
Power Detection
Signal amplitudes or signal presence must be measured for proper operation of many systems. For example, the received
signal strength is typically measured in a radio receiver in order to adjust automatic gain control circuits in order to maintain
the desired output signal from the radio receiver. Many communications standards and legal regulations specify very tight
requirements for the transmitted output power from a radio transmitter. Schottky detector diodes comprise the heart of these
signal amplitude measurement systems.
The Schottky junction operates with majority carriers only—there are no minority carriers to slow the recovery time of the
Schottky diode when a driving signal applied to the diode changes polarity from that which forward biases the diode to the
opposite polarity. The Schottky diode’s impedance changes virtually instantaneously with the change in polarity of the driving
signal, thus enabling the Schottky to have very high rectification efficiency over a very wide frequency range.
Schottky detector diodes are available as beam lead, flip chip, unpackaged dice, in surface-mount plastic packages and in
hermetic, ceramic packages.
Beam lead, flip chip and unpackaged die configurations offer optimal performance since there are no package parasitic
reactances present in these configurations.
Plastic-packaged devices are readily surface mountable and present the lowest cost alternative of the available package styles.
The parasitic impedances of these packages can reduce the maximum frequency of operation to an extent determined by the
magnitude of these parasitic reactances.
Schottky diodes packaged in hermetic, ceramic packages can meet all requirements for high-reliability screening while
operating to high frequency, since their parasitic reactances are relatively small.
Schottky Diodes—Low Frequency to 100 GHz Surface Mount Technology (SMT) Plastic
and 0201 Chip Scale Package (CSP)—Low Frequency to 100 GHz
Base
Part Number
Minimum Detectable
Signal (dBm)
Barrier Height
Input Signal
Frequency Range
Maximum
Capacitance (pF)
SMS7630 Series
-60
ZBD
Up to 10 GHz
0.30
Single Junction, Common
Cathode Pair, and Series Pair
SMS7630-061
-60
ZBD
Up to 100 GHz
0.30
Single Junction
SMS7621 Series
-53
Low
Up to 10 GHz
0.30
Single Junction, Common
Cathode Pair, and Series Pair
SMS7621-060
-53
Low
Up to 100 GHz
0.18
Single Junction
32 | www.skyworksinc.com
Configuration
Power Detection |
Power Detection
Chip, Beam Lead and 0201 CSP—Low Frequency to 100 GHz
Base
Part Number
Minimum Detectable
Signal (dBm)
Barrier Height
Input Signal
Frequency Range
Maximum
Capacitance (pF)
Configuration
CDC7630-000
-52
ZBD
–
0.25
Single junction
DDC2353-000
-52
ZBD
Ku band
–
Single junction
CDC7631-000
-56
ZBD
Ku band
0.15
Single junction
DDC2354-000
-56
ZBD
Ku band
–
Single junction
SMS7630-061
-60
ZBD
Up to 100 GHz
0.30
Single junction
CDB7620-000
-50
Low
Ku band
0.15
Single junction
CDF7621-000
-53
Low
Ku band
0.10
Single junction
CDF7623-000
-53
Low
X band
0.30
Single junction
SMS7621-060
-53
Low
Up to 100 GHz
0.18
Single junction
DDB2503-000
-50
Medium
K band
0.10
Single junction
DMK2790-000
-50
GaAs
Up to 150 GHz
0.04–0.07
Single junction
DDB2504-000
-48
Medium
Ku band
0.10
Single junction
DME2127-000
-47
Medium
S band
0.30–0.50
Single junction
CDE7618-000
-45
Medium
K band
0.10
Single junction
CME7660-000
-45
Medium
Ku band
0.15
Single junction
DME2458-000
-45
Medium
K band
0.10
Single junction
DME2333-000
-45
Medium
Ku band
0.05–0.15
Single junction
DME2050-000
-45
Medium
S band
0.3–0.5
Series pair
CDP7624-000
-40
High
X band
0.15
Single junction
DDB2265-000
-40
High
X band
0.1
Single junction
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
www.skyworksinc.com | 33
| Power Detection
Power Detection
Ceramic and Hermetic—Low Frequency to 40 GHz
Base
Part Number
Minimum Detectable
Signal (dBm)
Barrier Height
Input Signal
Frequency Range
Maximum
Capacitance (pF)
Configuration
CDC7630
-52
ZBD
–
0.40
Single junction
CDC7631
-56
ZBD
Ku band
0.35
Single junction
CDB7619
-50
Low
Ku band
0.15
Single junction
CDB7620
-50
Low
Ku band
0.35
Single junction
CDF7621
-53
Low
Ku band
0.30
Single junction
CDF7623
-53
Low
X band
0.50
Single junction
DDC2353
-52
ZBD
Ku band
–
Single junction
DDC2354
-56
ZBD
Ku band
–
Single junction
DDB2503
-50
Medium
K band
0.25
Single junction
DDB2504
-48
Medium
Ku band
0.20
Single junction
DME2127
-47
Medium
S band
0.30–0.59
Single junction
CDE7618
-45
Medium
K band
0.27
Single junction
CME7660
-45
Medium
Ku band
0.4
Single junction
DME2458
-45
Medium
K band
0.16
Single junction
DME2333
-45
Medium
Ku band
0.05–0.24
Single junction
DME2050
-45
Medium
S band
0.3–0.57
Series pair
CDP7624
-40
High
X band
0.4
Single junction
DDB2265
-40
High
X band
0.18
Single junction
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
34 | www.skyworksinc.com
Power Management |
Power Management
Linear Voltage Regulator (PowerLinear™) products include MicroPower™, NanoPower™, and OmniPower™ LDO (Low Dropout)
linear regulators which provide regulated power sources in products such as smart phones, PNDs, notebook computers, set-top
boxes, digital still cameras, and other portable personal electronic devices. Skyworks’ LDO regulator products are designed to
provide a well regulated power supply while at the same time maximize the performance for a given application. NanoPower
LDO regulators typically operate with a ground current level of 1.1 µA. The MicroPower product line has LDO regulators
optimized for low output noise and high power supply ripple rejection, making them well suited for sensitive RF and wireless
circuit applications. Other MicroPower single- and dual-channel LDO regulators from Skyworks feature fast transient response
to meet the most demanding load requirements. OmniPower LDO regulators are suitable for general purpose linear regulation
requirements across a wide range of applications. All Skyworks LDO regulators are designed to be highly reliable and stable
over a wide range of operating conditions. All LDO regulator devices function with a wide variety of input and output capacitor
types. However, they are ideally suited for stability with ceramic capacitors. Low-cost ceramic capacitors are recommended to
help increase circuit performance, reduce printed circuit board area, and minimize cost. To further enhance application reliability
under adverse operating conditions, all PowerLinear LDO regulators include over-current and over-temperature protection
circuits.
Skyworks’ Power Half Bridges include MultiMHz power switches that can be used to provide compact voltage regulation in
high-speed power supplies. Integrating input level shifting, high-speed break-before-make (shoot-through protection) circuitry,
and low resistance, these power MOSFETs reduce board space, parts count, and stray parasitics in switching power supplies.
FastSwitch™ buffered half bridge products may be used to drive inductors directly, as high-current gate drivers for discrete
power MOSFETs. In addition, a dual buffered half-bridge may be used to drive multiple outputs or can be configured as a full
bridge to affect a DC motor or Class-D audio driver.
Skyworks can supply devices in addition to the products shown to meet your power management requirements.
Voltage Regulation
Low Drop-Out (LDO) Linear Regulators
Part Number
Max. IOUT
(mA)
AAT3215
150
Accuracy
Power
Good
Shutdown
Typ.
Dropout
(mV)
± 1.5%
No
Yes
140
VOUT
(V)
VREF
Bypass
VIN
(V)
Typ. IQ
(μA)
Package
(mm)
Fixed
2.5–3.3
Yes
VOUT-5.5
95
SOT-23 5L 2.85 x 2.8 x 1.2
Display and Lighting
Panel Power
Part Number
Min.
VIN
(V)
Max.
VIN
(V)
Max.
IOUT
(mA)
Max.
VPDS
(mA)
Regulated
Outputs
(Number)
Max.
VNEC
VREF
Switching
Frequency
(kHz)
Max. Shutdown
Current
(μA)
Typ.
IQ
(μA)
AAT2823
2.5
5.5
20
30
4
-30
N/A
1300
1
1100
Package
(mm)
TQFN 24L
4 x 4 x 0.75
www.skyworksinc.com | 35
| Receiver Protection
Receiver Protection
The receiver protector function is performed by a specially processed PIN diode, known as a limiter diode. The PIN limiter diode
can be described as an incident-power-controlled, variable resistor. In receiver protection systems, the PIN limiter diode is
placed in shunt with the main signal path. In the case when no large input signal is present, the impedance of the limiter diode
is at its maximum, thereby producing minimum insertion loss, typically less than 0.5 dB. The presence of a large input signal
temporarily forces the impedance of the diode to a much lower value, producing an impedance mismatch which reflects the
majority of the input signal power back towards its source. Skyworks’ offering of PIN diodes are shown in Tables 32–35.
The input power level at which the limiter diode’s impedance starts to decrease in response to a large input signal amplitude is
primarily determined by the diode’s I layer thickness. The diodes which “turn on” at the lowest signal levels have the thinnest I
layers.
PIN limiter diodes are available unpackaged dice, in surface-mount plastic packages and in hermetic, ceramic packages.
Unpackaged die configurations offer optimal performance since there are no package parasitic reactances present in
these configurations.
Plastic-packaged devices are readily surface mountable and present the lowest cost alternative of the available package styles.
The parasitic impedances of these packages can reduce the maximum frequency of operation to an extent determined by the
magnitude of these parasitic reactances.
PIN limiter diodes packaged in hermetic, ceramic packages can meet all requirements for high-reliability screening while
operating to high frequency, since their parasitic reactances are relatively small.
Limiter Diodes
Plastic Surface Mount (SMT) Limiter Diodes—Low Frequency to 6 GHz
Part
Number
VB
IR = 10 µA
(V)
Nominal I-Region
Thickness
(µm)
CT 0 V,
F = 1 MHz
(pF)
Typ. CT 0 V
F = 1 GHz
(pF)
RS IF = 10 mA
F = 100 MHz
(Ω)
Typ. Carrier
Lifetime TL
IF = 10 mA
(ns)
SMP1330-005LF
20–50
3
0.7 Typ., 1.0 Max.
0.7
1.25 Typ., 1.5 Max.
4
SOT-23 3L
2.37 x 2.92 x 1
SMP1330-040LF
20–50
2
0.7 Typ., 1.0 Max.
0.7
1.25 Typ., 1.5 Max.
4
SOD-882 2L (0402)
1 x 0.6 x 0.46
SMP1330-085LF
20–50
3
0.7 Typ., 1.0 Max.
0.7
1.25 Typ., 1.5 Max.
4
QFN 3L 2 x 2 x 0.9
36 | www.skyworksinc.com
Package
(mm)
Receiver Protection |
Receiver Protection
High Power Surface Mount Technology (SMT) Limiter Diodes
Part
Number
I Region
Typ.
VB IR = 10 µA Thickness (µm) CT (pF) 0 V,
(V)
Nominal
F = 1 MHz
CT (pF) 0 V,
F = 1 GHz
Max.
CT (pF) 6 V,
F = 1 MHz
Max. RS
IF = 10 mA
Typ. Carrier
CT (pF) 30 V, F F = 100 MHz Lifetime TL (ns)
= 1 MHz
(W)
IF = 10 mA
Package
(mm)
CLA4603-085LF
20–45
t
0.36
–
0.40
0.32 Typ.
2.0
10
QFN 3L
2 x 2 x 0.9
CLA4605-085LF
30–60
2
0.33
–
–
0.30 Typ.
2.0
7.0
QFN 3L
2 x 2 x 0.9
CLA4606-085LF
45–75
2.5
0.32
–
0.38
0.29 Typ.
2.0
10
QFN 3L
2 x 2 x 0.9
CLA4607-085LF
180 Min.
7
0.40
–
–
0.30 Typ.
2.0
50
QFN 3L
2 x 2 x 0.9
CLA4608-085LF
120–180
7
–
–
–
0.65 Max.
1.2
100
QFN 3L
2 x 2 x 0.9
CLA4609-086LF
250 Min.
28
–
–
–
0.60 Max.
1.5
1.1
QFN 3L
2 x 2 x 0.9
Silicon Limiter Diode Chips for High Performance—Low Frequency to 36 GHz
Limiter Performance
Threshold
Level
(dBm)
I Layer
Thickness
(µm)
Insertion Loss
at -10 dBm
& 10 GHz
(dB)
Maximum Junction
Capacitance
(pF)
Maximum
CW Input
Power
(dBm)
Maximum
Peak Input Power
(dBm)
CLA4601-000
7
1.0
0.1
0.10
33.0
47
CLA4602-000
7
1.0
0.1
0.15
34.8
50
CLA4603-000
10
1.5
0.1
0.15
33.0
50
CLA4604-000
12
2.0
0.1
0.10
34.8
47
CLA4605-000
12
2.0
0.1
0.15
36.0
50
CLA4606-000
15
2.5
0.1
0.15
34.8
53
CLA4607-000
20
7.0
0.1
0.15
37.8
60
CLA4608-000
20
7.0
0.2
0.5
41.7
66
CLA4609-000
38
28.0
0.3
0.14
43.0
70
CLA4610-000
22
4.5
0.1
0.12
40.0
57
CLA4611-000
25
12
0.3
0.20
40.0
60
Part
Number
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
www.skyworksinc.com | 37
| Receiver Protection
Receiver Protection
Silicon Limiter Diode Chips for High Performance—Low Frequency to 36 GHz (Continued)
Electrical Characteristics
Thermal Impedance
Part
Number
VB @ 10 µA
(V)
Typ.
CJ @ 0 V
(pF)
Max.
CJ @ 6 V
(pF)
Max.
RS @ 10 mA
(W)
Max.
TL @ 10 mA (ns)
Max.
Average
(C/W)
Typ.
1 µs Pulse (C/W)
CLA4601-000
15–30
0.12
0.10
2.5
5
120
15
CLA4602-000
15–30
0.20
0.15
2.0
5
80
10
CLA4603-000
20–45
0.20
0.15
2.0
5
100
10
CLA4604-000
30–60
0.12
0.10
2.5
7
100
10
CLA4605-000
30–60
0.20
0.15
2.0
7
70
7.0
CLA4606-000
45–75
0.20
0.15
2.0
10
80
7.0
CLA4607-000
120–180
0.20
0.15 @ 50 V
2.0
50
40
1.2
CLA4608-000
120–180
0.80
0.5 @ 50 V
1.2
100
15
0.3
CLA4609-000
250 (Min.)
0.26
0.14
1.5
1175
15
0.3
CLA4610-000
80–120
0.13
0.12
2.2
20
72
72
CLA4611-000
120–180
0.20
0.65 @ 50 V
1.2
450
15
2
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
Hermetic Packaged Silicon Limiter Diodes
Hermetic Stripline
240
Hermetic Pill
203
Hermetic Pill
219
Hermetic Pill
210
CLA4601-240
CLA4601-203
CLA4601-219
CLA4601-210
CLA4602-240
CLA4602-203
CLA4602-219
CLA4602-210
CLA4603-240
CLA4603-203
CLA4603-219
CLA4603-210
CLA4604-240
CLA4604-203
CLA4604-219
CLA4604-210
CLA4605-240
CLA4605-203
CLA4605-219
CLA4605-210
CLA4606-240
CLA4606-203
CLA4606-219
CLA4606-210
CLA4607-240
CLA4607-203
CLA4607-219
CLA4607-210
CLA4608-240
CLA4608-203
CLA4608-219
CLA4608-210
CLA4609-240
CLA4609-203
CLA4609-219
CLA4609-210
CLA4610-240
CLA4610-203
CLA4610-219
CLA4610-210
CLA4611-240
CLA4611-203
CLA4611-219
CLA4611-210
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
NEW N ew products (indicated in blue, bold) are continually being introduced at Skyworks. For the latest information, please visit the new products section of our website at www.skyworksinc.com.
38 | www.skyworksinc.com
Switching |
Switching
RF microwave switching with semiconductors can be accomplished with PIN diodes and with transistor structures, such as
pseudomorphic high electron mobility transistors (pHEMT). Switches comprising these types of semiconductors have relative
advantages with respect to each other. Skyworks can supply devices in addition to the products shown to meet your switching
requirements.
Switch Technology Advantages
Attribute
Silicon PIN Diode
GaAs pHEMT Switch
Power Handling
Very High (To Greater than 1 kW CW)
Moderate (Up to 10 W CW)
Switching Time
A Few Tens of Nanoseconds to Several Microseconds
Tens to a Few Hundreds of Nanoseconds
Control Current
Up to 100 Milliamps
Less than 100 Microamps
Distortion Performance
Input Third Order Intercepts in the 45 dBm
or Higher Range
Input Third Order Intercepts in the 30 to Low
40s dBm Range
“Integratability” with Other Components
Moderate
Excellent
Switching Silicon PIN Diodes
Plastic Surface Mount (SMT) PIN Diodes—Low Frequency to 6 GHz
Part
Number
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 30 V
F = 1 MHz
(pF)
Typ. VF
@ IF = 10 mA
(V)
Typ. RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Typ. TL
IF = 10 mA
(ns)
Nominal
I-Region Thickness
(µm)
SMP1320 Series
50
0.3
0.85
2
0.9
400
8
Low Capacitance Switching PIN Diodes—Low Frequency to 6 GHz
Part
Number
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 30 V
F = 1 MHz
(pF)
Typ. VF
@ IF = 10 mA
(V)
Typ. RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Typ. TL
IF = 10 mA
(ns)
Nominal
I-Region Thickness
(µm)
SMP1321 Series
100
0.25
0.85
3
2
400
15
Low Capacitance, Fast Switching PIN Diodes—Low Frequency to 6 GHz
Part
Number
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 5 V
F = 1 MHz
(pF)
Typ. VF
@ IF = 10 mA
(V)
Typ. RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Typ. TL
IF = 10 mA
(ns)
Nominal
I-Region Thickness
(µm)
SMP1340 Series
50
0.3
0.88
1.7
1.2
100
7
Lowest Capacitance Switching PIN Diodes for High Isolation—Low Frequency to 6 GHz
Part
Number
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 20 V
F = 1 MHz
(pF)
Typ. VF
@ IF = 10 mA
(V)
Typ. RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Typ. TL
IF = 10 mA
(ns)
Nominal
I-Region Thickness
(µm)
SMP1345 Series
50
0.2
0.89
3.5
2
100
10
www.skyworksinc.com | 39
| Switching
Switching Silicon PIN Diodes
AEC-Q101 Qualified2
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 30 V
(pF)
Typ. VF
IF = 10 mA
(V)
RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Max. RS
IF = 100 mA
F = 100 MHz
(Ω)
Typ. Carrier
Lifetime
IF = 10 mA
(ns)
Package
(mm)
SMPA1302-079LF
200
0.3
0.80
20 Max.
3.0
1.5
700
QFN 2L 2 x 2 x 0.9
SMPA1320-079LF
50
0.3
0.85
2 Typ.
0.9
–
400
QFN 2L 2 x 2 x 0.2
Part
Number
2. Not all stresses listed within AEC-Q101 have been performed. Qualification report available upon request.
Contact your sales representative for more information. For the full details of Skyworks Quality and Reliability on our products that can be designed into automotive applications, please view
the “Skyworks Quality Standards for Automotive Customers” on our website.
Large Signal Switching PIN Diodes—Low Frequency to 6 GHz
Part
Number
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 20 V
F = 1 MHz
(pF)
Typ. VF
@ IF = 10 mA
(V)
Max. RS
IF = 1 mA
F = 100 MHz
(Ω)
Max. RS
IF = 10 mA
F = 100 MHz
(Ω)
Typ. TL
IF = 10 mA
(ns)
Nominal
I-Region Thickness
(µm)
SMP1352 Series
200
0.35
0.8
15
2.8
1000
50
PIN Diodes—High Power (>20 W) for Large Signal Switch and Attenuator Applications
Min. VB
IR = 10 µA
(V)
Max. CT
VR = 20 V
F = 1 MHz
(pF)
Typ. CT
VR = 30 V
F = 1 MHz
(pF)
Max. VF
@ IF = 50 mA
(V)
Max. RS
F = 100 MHz
(Ω)
Min. TL
IF = 10 mA
(ns)
Nominal
I-Region
Thickness
(µm)
Package
(mm)
SMP1302-085LF
200
–
0.30
0.8 @ 10 mA
3.0 @ 10 mA
700
50
QFN 3L 2 x 2 x 1
SMP1304-085LF
200
–
0.23
1.0
7.0 @ 10 mA
1000 Typ.
100
QFN 2L 2 x 2 x 0.9
SMP1304-087LF
200
–
0.20
1.0
7.0 @ 10 mA
1000 Typ.
100
QFN 2L 2 x 2 x 0.9
SMP1324-087LF
100
–
0.90
0.90 Typ.
0.40 Typ. @ 50 mA
6 Typ.
100
QFN 2L 2 x 2 x 0.9
SMP1325-085LF
200
0.65
–
0.86 Typ.
1.3 Typ. @ 10 mA
5 Typ.
100
QFN 3L 2 x 2 x 1
SMP1325-087LF
200
0.6
–
0.80 Typ.
1.3 Typ. @ 10 mA
5 Typ.
100
QFN 2L 2 x 2 x 0.9
SMP1345-087LF
50
0.2 @ 5 V
–
0.89
2.0 @ 10 mA
100 Typ.
10
QFN 2L 2 x 2 x 0.9
SMP1371-087LF
35
1.2
–
1.0
0.5 @ 10 mA
0.2
12
QFN 2L 2 x 2 x 0.9
Part
Number
Chip PIN Diodes—Low Frequency to 36 GHz
Part
Number
VB @ 10 µA
(V)
Nominal
I-Region
(µm)
Typ.
CJ @ 0 V
(pF)
Max.
CJ @ 50 V
(pF)
Max.
RS @ 10 mA
(W)
Max.
TL @ 10 mA
(ns)
Max. Thermal
Resistance
(C/W)
APD0505-000
50
5
0.10
0.05
2.0
20
100
APD0510-000
50
5
0.20
0.10
1.5
40
80
APD0520-000
50
5
0.25
0.20
1.0
50
80
APD0805-000
100
8
0.10
0.05
2.0
100
80
APD0810-000
100
8
0.15
0.10
1.5
160
60
APD1510-000
200
15
0.20
0.10
2.0
300
60
APD1520-000
200
15
0.25
0.20
1.2
900
30
APD2220-000
100
50
0.2
0.2
4
700
80
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
NEW N ew products (indicated in blue, bold) are continually being introduced at Skyworks. For the latest information, please visit the new products section of our website at www.skyworksinc.com.
40 | www.skyworksinc.com
Switching |
Switching Silicon PIN Diodes
Beam-Lead PIN Diodes—Low Frequency to 40 GHz
Part
Number
VB @ 10 µA
(V)
Max. CJ @ 10 V
(pF)
Max. CJ @ 50 V
(pF)
Max. RS @ 10 mA
(W)
Typ. TL @ 10 mA
(ns)
DSM8100-000
60
0.025
–
3.5
25
DSG9500-000
100
–
0.025
4.0 @ 50 mA
250
Ceramic Hermetic Packaged General-Purpose PIN Diodes for Switching
and Attenuator Applications—Low Frequency to 20 GHz
Hermetic Stripline
240
Hermetic Pill
203
Hermetic Pill
210
Hermetic Pill
219
APD0505-240
APD0505-203
APD0505-210
APD0505-219
APD0510-240
APD0510-203
APD0510-210
APD0510-219
APD0520-240
APD0520-203
APD0520-210
APD0520-219
APD0805-240
APD0805-203
APD0805-210
APD0805-219
APD0810-240
APD0810-203
APD0810-210
APD0810-219
APD1510-240
APD1510-203
APD1510-210
APD1510-219
APD1520-240
APD1520-203
APD1520-210
APD1520-219
APD2220-240
APD2220-203
APD2220-210
APD2220-219
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
FET Switches
UHF/VHF Broadband Switches—Low Frequency to 6 GHz
Description
Frequency
(GHz)
Insertion Loss
(dB)
Isolation
(dB)
Input IP3
(dBm)
Input P1 dB
(dBm)
SKY13286-359LF
SPDT (A)
0.10–6.0
0.8–1.5
62–42
46
30
SKY13348-374LF
SPDT (A)
0.50–6.0
0.6–1.0
27–24
57
37
Part Number
SKY13370-374LF
SPDT (A)
0.50–6.0
0.7–1.15
31–24
55
39
AS179-92LF
SPDT (R)
0.02–3.0
0.4
23
43
30
AS193-73LF
SPDT (R)
0.10–2.5
0.55
17
55
37
SKY13270-92LF
SPDT (R)
0.02–2.5
0.3–0.55
30–17
56
38
SKY13290-313LF
SPDT (R)
0.02–2.5
0.3
44
65
39
SKY13298-360LF
SPDT (R)
3.0–8.0
0.7–0.9
25–22
47
26
SKY13299-321LF
SPDT (R)
0.02–6.0
0.3
42
65
38
SKY13351-378LF
SPDT (R)
0.02–6.0
0.35
24
50
30 (0.5 dB)
SKY13317-373LF
SP3T (R)
0.02–6.0
0.6
25
50
29
SKY13385-460LF
SP3T (R)
0.10–3.5
0.5–0.6
39–25
57
33
SKY13322-375LF
SP4T (R)
0.02–6.0
0.6
26
51
30
SKY13318-321LF
DPDT (R)
0.10–6.0
0.95
22
57
34
SKY13355-374LF
DPDT (R)
0.10–6.0
0.6
23.5
55
33
SKY13381-374LF
DPDT (R)
0.10–6.0
0.6
22
62
38
NEW N ew products (indicated in blue, bold) are continually being introduced at Skyworks. For the latest information, please visit the new products section of our website at www.skyworksinc.com.
www.skyworksinc.com | 41
| Switching
Switching
SPDT (SP2T) RF Switches
Part
Number
SKY13330-397LF
Description
(Absorptive/
Reflective)
Min.
Frequency
(GHz)
Max.
Frequency
(GHz)
Typ. IL
(dB)
Typ. Isol.
(dB)
Typ. IIP3
(dBm)
Typ. IP1 dB
(dBm)
Package (mm)
SPDT (R)
0.1
6
0.3–0.55
35–16
55
39
QFN 12L 2 x 2 x 0.55
High Power (50 W, 100 W) SPDT PIN Diode Switches
Description
(Absorptive/
Reflective)
Frequency
(GHz)
Typ. IL
(dB)
Typ. Isol.
(dB)
Typ. IIP3
(dBm)
Max. CW Power
(dBm)
Package
(mm)
SKY12207-306LF
SPDT (R)
0.9–4.0
0.3–0.6
28–41
78
50
QFN 16L 4 x 4 x 0.9
SKY12207-478LF
SPDT (R)
0.9–4.0
0.3–0.4
30–42
78
50
QFN 16L 4 x 4 x 1.5
SKY12208-306LF
SPDT (R)
0.02–2.7
0.1–0.4
33–49
76
50
QFN 16L 4 x 4 x 0.9
SKY12208-478LF
SPDT (R)
0.02–2.7
0.1–0.4
33–49
76
50
QFN 16L 4 x 4 x 1.5
SKY12209-478LF
SPDT (R)
0.9–4.0
0.4–0.65
35–42
76
40
QFN 16L 4 x 4 x 1.5
SKY12210-478LF
SPDT (R)
0.9–4.0
0.3–0.6
33–44
78
100
QFN 16L 4 x 4 x 1.5
SKY12211-478LF
SPDT (R)
0.05–2.7
0.2–0.5
33–52
76
40
QFN 16L 4 x 4 x 1.5
SKY12212-478LF
SPDT (R)
0.02–2.7
0.3–0.6
32–50
68
100
QFN 16L 4 x 4 x 1.5
Part
Number
Chip FET Switches—Low Frequency to 10 GHz
Description
(Absorptive/
Reflective)
Frequency
(GHz)
Typ. IL
(dB)
Typ. Isol.
(dB)
Typ. IIP3
(dBm)
Typ. IP1 dB
(dBm)
Package
(mm)
AS179-000
SPDT (R)
0.20–3.0
0.3–0.35
25–22
48
30
Chip
AS227-000
SP3T (R)
0.10–2.0
0.45–0.70
32–20
63
37
Chip
AS192-000
SP4T (R)
0.10–2.5
0.90–1.1
34–21
55
37
Chip
AS221-000
SP4T (R)
0.10–2.5
0.60–1.1
34–22
55
38
Chip
SKY13290-000
SP2T (R)
0.02–2.5
0.40–0.7
26–18
–
40
Chip
Part
Number
NEW New products (indicated in blue, bold) are continually being introduced at Skyworks. For the latest information, please visit the new products section of our website at www.skyworksinc.com.
42 | www.skyworksinc.com
Tuning |
Tuning
Tuning varactor (TVAR) diodes are used to electronically tune frequencies and phase of the signal generation in local oscillators,
using variable reactance. Tuning varactors may be an abrupt junction device, which can produce a capacitance ratio of
approximately 3:1 over the tuning voltage range 0 to 30 V, or a hyperabrupt junction device, which can produce capacitance
ratios of 10:1 or greater over the tuning voltage range of 0 to 10 V.
In hyperabrupt TVARs, there is an artifact of the ability to produce large capacitance ratios: larger series resistance. Some
hyperabrupt tuning varactors might produce 3 W or 4 W series resistance, compared to 0.5 W or less for an abrupt junction
device. This larger series resistance means that the wide bandwidth capability of the hyperabrupt TVAR must be weighed
against its higher resistive loss and somewhat higher phase noise production as compared to an abrupt junction TVAR.
Figures 2 and 3 show the Skyworks’ TVAR product offering sorted by capacitance as measured with V R = 3 V, along with the
maximum rated capacitance ratio for each product. Figures 4 and 5 show these same data, but sorted by maximum rated
capacitance ratio.
50
Maximum Capacitance Ratio
Capacitance @ VR = 3 V
25
45
20
35
30
15
25
20
10
15
10
Capacitance (pF)
Capacitance Ratio
40
5
5
0
0
SMV1247 SMV2201 SMV2202 SMV1233 SMV2203 SMV1245 SMV2022 SMV1249 SMV1139
SMV2019 SMV2020 SMV1232 SMV2021 SMV1248 SMV1215 SMV2204 SMV1234 SMV1214
Figure 2. Skyworks Solutions Tuning Varactors Sorted by Capacitance at V R = 3 V
50
Capacitance Ratio
Capacitance @ 3 V
25
45
20
35
30
15
25
20
10
15
10
Capacitance (pF)
Capacitance Ratio
40
5
5
0
SMV1139 SMV1142 SMV1129 SMV1145 SMV1148 SMV1233 SMV1245 SMV1237 SMV1135 SMV2205
SMV1232 SMV1143 SMV1144 SMV1146 SMV1147 SMV1236 SMV1234 SMV1235 SMV2023
0
Figure 3. Skyworks Solutions Tuning Varactors Sorted by Capacitance at V R = 3 V
www.skyworksinc.com | 43
| Tuning
Tuning
50
Maximum Capacitance Ratio
Capacitance @ VR = 3 V
25
45
20
35
30
15
25
20
10
15
10
Capacitance (pF)
Capacitance Ratio
40
5
5
0
0
SMV2023 SMV1135 SMV1142 SMV1213 SMV1143 SMV1236 SMV1129 SMV1145 SMV1237 SMV1147
SMV2205 SMV1251 SMV1235 SMV1253 SMV1255 SMV1144 SMV1212 SMV1146 SMV1211 SMV1148
Figure 4. Skyworks Solutions Tuning Varactors Sorted by Maximum Rated Capacitance Ratio
50
Capacitance Ratio
Capacitance @ 3 V
25
45
20
35
30
15
25
20
10
15
10
5
5
0
0
SMV2020 SMV1215 SMV2203 SMV2204 SMV2019 SMV1212 SMV1211 SMV1248 SMV1255 SMV1253
SMV2202 SMV2021 SMV2022 SMV1247 SMV2201 SMV1214 SMV1213 SMV1249 SMV1251
Figure 5. Skyworks Solutions Tuning Varactors Sorted by Maximum Rated Capacitance Ratio
44 | www.skyworksinc.com
Capacitance (pF)
Capacitance Ratio
40
Application Notes |
Application Notes
See the table below for a list of Application Notes. Please visit our website to access our technical documents, which include
application notes and product briefs.
Category
Description
Document Numbers
Amplifiers
Gain Block Bias Networks
200942
Amplifiers (LNA)
SKY65047-360LF Matching Circuits for Various Frequency Bands
201100
Amplifiers (LNA)
SKY65050-372LF: Low Noise Amplifier Operation
200975
Circulators and Isolators
Curie Temperature of Isolators and Circulators
201659
Circulators and Isolators
Factors That Influence the Power Handling Capability of Circulators
201543
Circulators and Isolators
How to Test Drop-In Circulators and Isolators
201539
Circulators and Isolators
Performance of Radar Circulators under Peak and Average Power Conditions
201660
Circulators and Isolators
Reliability Performance for Standard Commercial Ferrite Isolators and Circulators
201540
GaAs Flip Chips
APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices
200741
General
Circuit Models for Plastic Packaged Microwave Diodes
200311
General
Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging
200532
General
Quality/Reliability
200149
General
Solder Reflow Information
200164
General
Waffle Pack Chip Carrier Handling/Opening Procedure
200146
Limiter
PIN Limiter Diodes in Receiver Protectors
200480
Phase Shifter
A Varactor Controlled Phase Shifter for PCS Base Station Applications
200319
PIN Diodes
5–6 GHz Switch Using Low-Cost Plastic Packaged PIN Diodes
200321
PIN Diodes
A Wideband CATV Attenuator
200327
PIN Diodes
A Wideband General-Purpose PIN Diode Attenuator
200313
PIN Diodes
Design With PIN Diodes
200312
PIN Diodes
PIN Diode Basics
200823
PIN Diodes
T/R Switch for IMT-2000 Handset Applications
200318
Schottky Diodes
Handling Precautions for Schottky Barrier Mixer and Detector Diodes
200840
Schottky Diodes
Level Detector Design for Dual-Band GSM-PCS Handsets
200324
Schottky Diodes
Mixer and Detector Diodes
200826
Tuning Varactor
A Balanced Wideband VCO for Set-Top TV Tuner Applications
200314
Tuning Varactor
A Colpitts VCO for Wideband (0.95–2.15 GHz) Set-Top TV Tuner Applications
200316
Tuning Varactor
Differential VCO Design for GSM Handset Applications
200323
Tuning Varactor
Dual-Band Switchable IF VCO for GSM/PCS Handsets
200325
Tuning Varactor
Low Phase Noise VCO Design for PCS Handset Applications
200326
Tuning Varactor
Switchable Dual-Band 170/420 MHz VCO for Handset Cellular Applications
200317
Tuning Varactor
Varactor Diodes
200824
Tuning Varactor
Varactor SPICE Models for RF VCO Applications
200315
Tuning Varactor
VCO Designs for Wireless Handset and CATV Set-Top Applications
200322
Tuning Varactor
VCO Design for WLAN Applications in the 2.4–2.5 GHz ISM Band
200320
www.skyworksinc.com | 45
| Published Articles, Additional Literature, Designer Kits
Published Articles
■
PIN Diodes for High Power T/R Switches
■
A High Linearity Darlington Intermediate Frequency (IF) Amplifier for Wide Bandwidth Applications
■
Distributed Switch FET Model that Predicts Better Insertion Loss and Harmonics
■
Phase Locked Loop Systems Design for Wireless Infrastructure Applications
■
Modeling of SOI FET for RF Switch Applications
■
Make Accurate Sub-1 dB Noise Figure Measurements. Part 1: Noise Concepts
■
Make Accurate Sub-1 dB Noise Figure Measurements. Part 2: The Measurements
■
Effect of Permittivity and Permeability of a Flexible Magnetic Composite Material on the Performance and
Miniaturization Capability of Planar Antennas for RFID and Wearable Wireless Applications
■
RF/Microwave Solid State Switches: Part 1
■
Solid State RF/Microwave Switch Technology: Part 2
■
The Nuts and Bolts of Tuning Varactors
■
Schottky Diodes
Additional Literature
Learn More
Brochure
■
RF Diode Design Guide, BRO389
For a complete listing of Skyworks’ published articles, white
papers, application notes and technical documents, please visit
our website at www.skyworksinc.com.
White Papers
■
Designing Ultra Low Noise Amplifiers for Infrastructure Receiver Applications
■
Skyworks De-embedded Scattering Parameters
Product Documents
Designer Kits
Quickly Convert Your Creativity into Working Designs
Skyworks’ Designer Kits feature samples of a variety of leading-edge components, with data sheets and comprehensive
application notes supplied on CD.
■
■
■
IT601 MIS Chip Capacitors for Hybrid
K
Circuit Applications
IT603 Silicon PIN Diode Chips for Switch and
K
Attenuator Applications
KIT606 Silicon Limiter Diode Chips
46 | www.skyworksinc.com
■
■
IT607 Silicon Schottky Diode Chips for Mixer and Detector
K
Applications
IT613 RF Switches and Digital Attenuators for WLAN,
K
Infrastructure and General Purpose Applications
■
KIT614 Diodes (SMT Limiter, PIN, Schottky, Varactor)
■
KIT619 Fixed Attenuator Pads (ATN3590)
How to Select Diode Packages |
How to Select Diode Packages
Skyworks’ diodes are available in several types of packages, as unpackaged dice or as unpackaged beam leads. In most cases
the requirements of the end application will determine the optimal physical diode configuration.
Plastic Surface Mount Technology Packages
Plastic surface mount technology (SMT) packages are inexpensive and are compatible with modern
pick-and-place assembly techniques, so they are optimal choices for high-volume, low-cost final product
assemblies.
While careful attention has been paid to minimizing package parasitic reactances, they are always
present in such diode configurations. These parasitics, package capacitance and package inductance,
inherently reduce the bandwidth over which a diode may be used. Plastic SMT packages also add thermal
resistance to that of the die, thereby reducing the amount of power a diode can dissipate without
exceeding its maximum rated operating junction temperature.
Ceramic-Metal Packages
Ceramic-metal packages offer several advantages over plastic packages: their parasitic inductances
and capacitances are lower, sometimes as much as 75% lower, than that of the plastic SMT packages
described above. Their thermal resistances are also much lower than that of the large majority of plastic
SMT packages. Most ceramic packages used for diodes are capable of being hermetically sealed, thereby
offering maximum protection to the die against environmental contaminants such as sodium (Na), water
vapor, etc.
Such packages have two disadvantages compared to plastic SMT packages: they are typically more
costly, and, they generally are not compatible with automated surface mount assembly.
(Packageless) Dice
Diode dice, sometimes known as chips, eliminate the parasitic reactances and thermal resistance of
the package. This configuration produces the widest bandwidth of operation as well as maximal power
dissipation capabilities.
Of course, the end user of diode dice must be capable of handling these tiny devices as well as
performing die attach and wire bonding assembly techniques. The assemblies which contain dice must
be protected from mechanical damage, especially to the fragile bond wires. Some devices are also
available on film frame.
Beam-Lead Power Handling Diodes
Beam-lead diodes offer the highest frequency performance capability, due to the absence of a package
and its associated parasitic reactances, and the reduction of series inductance that would be presented
by a bond wire. Also, since no mechanical connection needs to be made to the terminals of the diode
junction by the user, the diode junction area can be very small, thus reducing junction capacitance.
The metal beams of beam-lead diodes must be mechanically and electrically attached to the circuit
in which they are used. This lead attach may be accomplished using thermocompression bonding or
a combination of thermocompression and ultrasonic bonding referred to as “thermalsonic bonding,”
or beam attach may be done using conductive epoxy. Such assembly techniques are most frequently
performed manually by skilled assemblers.
The only conduction paths for heat to flow out of the diode junction are through the metal beams, which
have very small cross-sectional areas, so thermal resistance of beam-lead diodes is generally greater
than 125 °C/W, sometimes substantially so. This limits the power dissipation of beam-lead diodes to
relatively low power levels.
www.skyworksinc.com | 47
| Packaging
Packaging
Skyworks’ products are available in the packages shown in the table below. Please refer to individual data sheets for the
availability of specific diode package combinations.
Package Selection Guide
Part
Number
Suffix
Package Type
Actual Size
Package
Dimensions (mm)
(Lead Inclusive)*
-040
SOD-882 2L (0402)
1.00 x 0.60 x 0.46
-378, -385
MLPD 6-Pin
1.00 x 1.00 x 0.45
-203
Hermetic Pill
1.27 x 1.40
-517, -518
MIS
1.47 x 1.23 x 0.70
-21
MCM
-373
Part
Number
Suffix
Package Type
Actual Size
Package
Dimensions (mm)
(Lead Inclusive)*
-340
QFN 20L (4 x 4)
2.1 mm Paddle
4.00 x 4.00 x 0.75
-306
QFN 16L (4 x 4)
4.00 x 4.00 x 0.90
1.50 x 1.50 x 0.45
-355, -359,
-467
QFN 16L (4 x 4)
4.00 x 4.00 x 0.90
QFN 8L
1.50 x 1.50 x 0.45
-362, -459
QFN 24L
4.00 x 4.00 x 0.90
-079
SC-79
1.60 x 0.80 x 0.60
-478
QFN 16L (4 x 4)
4.00 x 4.00 x 1.50
-219
Hermetic SMT
1.91 x 1.91 x 1.14
-517, -518
MIS
1.47 x 1.23 x 0.70
-86
MSOP 10L
4.90 x 3.00 x 0.96
-21
MCM
1.50 x 1.50 x 0.45
-302, -303
-373
QFN 8L
1.50 x 1.50 x 0.45
MSOP 8L
Exposed Pad
4.90 x 3.00 x 1.10
(Max.)
-079
SC-79
1.60 x 0.80 x 0.60
-364
QFN 32L
3.15 mm Paddle
5.00 x 5.00 x 0.90
-396
QFN 8L
2.00 x 2.00 x 0.75
-310
5.00 x 5.00 x 0.90
-085
QFN 2L (2 x 2)
1.7 mm Paddle
2.00 x 2.00 x 0.90
QFN 32L (5 x 5)
3.3 mm Paddle
N/A
32 Pin RFLGA
5.00 x 5.00 x 1.00
-086
QFN 2L (2 x 2)
1.7 mm Paddle
2.00 x 2.00 x 0.90
-207
Hermetic Ceramic Pill
5.08 x 2.18
-087
QFN 2L (2 x 2)
2.00 x 2.00 x 0.90
-210
Hermetic Pill
5.7 x 3.15
-372
SC-70 4L
2.00 x 2.00 x 1.10
-375
QFN 10L
2.00 x 3.00 x 0.45
-230
Epoxy Stripline
5.98 x 1.4 x 0.76
-232
Epoxy Stripline
5.98 x 3.69 x 0.76
-234, -235
Epoxy Stripline
5.98 x 5.98 x 0.76
-12
SOIC 8L
6.00 x 4.90 x 1.60
-80
SSOP 16L
6.00 x 4.90 x 1.60
N/A
36 Pin MCM
6.00 x 6.00 x 1.35
-87
TSSOP 16L
6.40 x 5.00 x 1.00
N/A
MCM 12L
7.00 x 7.00 x 1.10
-313
QFN 6L
2.00 x 3.00 x 1.00
-92, -081
SC-88 (SC-70 6L)
2.10 x 2.00 x 0.95
-073, -074,
-075, -076
SC-70
2.10 x 2.00 x 0.95
-377
QFN 4L
2.20 x 2.00 x 1.35
-001, -003,
SOT-23 3L
-004, -005,
-006, -007, -39
2.37 x 2.92 x 1.00
-015, -016,
-017, -019,
-020, -021,
-022, -023,
-026, -32
SOT-143
2.37 x 2.92 x 1.00
-011
SOD-323
2.52 x 1.25 x 1.04
-027, -72
SOT-23 5L
2.80 x 2.90 x 1.18
-73
SOT-23 6L
2.80 x 2.90 x 1.18
-321, -348,
-350
QFN (3 x 3)
3.00 x 3.00 x 0.75
-337
QFN 12L
3.00 x 3.00 x 0.90
48 | www.skyworksinc.com
Packaging |
Packaging
Part
Number
Suffix
Package Type
Actual Size
Package
Dimensions (mm)
(Lead Inclusive)*
-250, -251
Epoxy Stripline
8.12 x 2.54 x 1.27
-252, -253
Epoxy Stripline
8.12 x 5.33 x 1.27
-254
Epoxy Stripline
8.12 x 8.12 x 1.27
-255, -257
Epoxy Stripline
8.12 x 8.12 x 1.27
N/A
MCM 12L
8.385 x 8.385 x 1.35
-25
SOIC 16L
10.00 x 6.00 x 1.70
-220, -221
Hermetic Stripline
11.3 x 1.91 x 1.14
Part
Number
Suffix
Package Type
Package
Dimensions (mm)
(Lead Inclusive)*
Actual Size
-224
Hermetic Stripline
11.3 x 11.3 x 1.14
-225
Hermetic Stripline
11.3 x 11.3 x 1.14
-222
Hermetic Stripline
11.3 x 6.6 x 1.14
-223
Hermetic Stripline
11.3 x 6.6 x 1.14
-240
Hermetic Stripline
11.52 x 2.64 x 1.18
*Dimensions indicated: lead tip to lead tip x body width x total thickness.
Screened bare die, epoxy and ceramic hermetic packaged versions of these devices are available through Isolink (a wholly owned subsidiary of Skyworks Solutions, Inc.)
For more information, please visit the Isolink website at www.isolink.com.
www.skyworksinc.com | 49
Helsinki
Ottawa
Beijing
Seoul
Shanghai
Cedar Rapids
Tokyo
Kadoma
Santa Clara
Newbury Park
Irvine
Mexicali
Bishops
Cork
Stortford
Paris
Andover
Woburn (Headquarters)
Adamstown
Greensboro
Taipei
Shenzhen
Singapore
Sales Offices
Design Centers
Manufacturing
USA
EUROPE
ASIA • PACIFIC
Headquarters: Massachusetts
Skyworks Solutions, Inc.
20 Sylvan Road
Woburn, MA 01801
Telephone: (781) 376-3000
Fax: (781) 376-3100
[email protected]
France
Skyworks Solutions, Inc.
60 rue Saint André des Arts
Bâtiment D
75006 Paris
France
Telephone: +33 1 43548540
Fax: +33 1 43540005
[email protected]
China
Skyworks Solutions, Inc.
Room 2901-02, Chong Hing
Finance Center
No. 288 Nanjing Road (W)
Shanghai 200003 China PRC
Telephone: +86 21 23066230
ext. 60167
Fax: +86 21 33663398
[email protected]
Japan
Skyworks Solutions Co., Ltd.
Tokyo Opera City Tower 36F
3-20-2 Nishi-Shinjuku
Shinjuku-ku
Tokyo, 163-1436
Japan
Telephone: +81 3 5308 5180
Fax: +81 3 5308 5190
[email protected]
United Kingdom
Skyworks Solutions, Ltd.
South Building
Walden Court
Parsonage Lane
Bishops Stortford
Hertfordshire CM23 5DB
United Kingdom
Telephone: +44 7585 964479
Fax: +44 01279 464201
[email protected]
Skyworks Solutions, Inc.
Room 2701, 27/F Tower 3
Kerry Plaza
No. 1 Zhongxinsi Road
Futian District
Shenzhen 518048 China PRC
Telephone: +86 755 8828 8399
Fax: +86 755 8828 8358
[email protected]
Korea
Skyworks Solutions, Inc.
12th Floor West Wing Posco Center
892 Daechi 4-Dong, Kangnam-Gu
Seoul, Korea 135-777
Telephone: +82 2 3490 3800
Fax: +82 2 553 5459
[email protected]
Finland
Skyworks Solutions, Inc.
Keilaranta 16 (5th Floor)
FIN-02150 Espoo
Finland
Telephone: +358 9251 07131
Fax: +358 9 2510 7129
[email protected]
Skyworks Solutions, Inc.
Suite 1315, Tower B, COFCO Plaza,
No. 8
Jianguomennei Avenue
Dongcheng District
Beijing 100005 China PRC
Telephone: +8610 652 60859
ext. 61602
Fax: +8610 652 61358
[email protected]
California
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617
Telephone: (949) 231-3000
Fax: (949) 231-3206
[email protected]
Skyworks Solutions, Inc.
3230 Scott Boulevard
Santa Clara, CA 95054
Telephone: (408) 330-1400
Fax: (408) 737-4611
[email protected]
Maryland
Skyworks Solutions, Inc.
5520 Adamstown Road
Adamstown, MD 21710
Telephone: (301) 695-9400
Fax: (301) 695-7065
[email protected]
50 | www.skyworksinc.com
Singapore
Skyworks Global Pte Ltd.
10 Ang Mo Kio Street 65
#05-15/16 Techpoint
Singapore 569059
Telephone: +65 64031971
Fax: +65 64031931
[email protected]
Taiwan
Skyworks Solutions, Inc.
4 F, #198, Section 2
Tun Hwa S. Road
Taipei 106, Taiwan ROC
Telephone: +8862 5559 8992
Fax: +8662 2735 6508
[email protected]
Copyright © 2011, 2012, 2013, 2014, 2015 Skyworks Solutions, Inc. All Rights
Reserved.
Information in this document is provided in connection with Skyworks Solutions,
Inc. (“Skyworks”) products or services. These materials, including the information
contained herein, are provided by Skyworks as a service to its customers and may
be used for informational purposes only by the customer. Skyworks assumes no
responsibility for errors or omissions in these materials or the information contained
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product descriptions at any time, without notice. Skyworks makes no commitment to
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MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS
HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining
applications, or other equipment in which the failure of the Skyworks products
could lead to personal injury, death, physical or environmental damage. Skyworks
customers using or selling Skyworks products for use in such applications do so at
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such improper use or sale.
Customers are responsible for their products and applications using Skyworks
products, which may deviate from published specifications as a result of design
defects, errors, or operation of products outside of published parameters or
design specifications. Customers should include design and operating safeguards
to minimize these and other risks. Skyworks assumes no liability for applications
assistance, customer product design, or damage to any equipment resulting from the
use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, “Breakthrough Simplicity,” FastSwitch, Green, Green
Initiative, HIP3, Innovation to Go, Isolink, MicroPower, NanoPower, OmniPower, and
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United States and other countries. Third-party brands and names are for identification
purposes only, and are the property of their respective owners. Additional information,
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incorporated by reference.
Skyworks Solutions, Inc. | 20 Sylvan Road, Woburn, MA 01801 | www.skyworksinc.com | BRO400-15A 5/15
[email protected] | NASDAQ: SWKS | USA: 781-376-3000 | Asia: 886-2-2735 0399 | Europe: 33 (0)1 43548540 |
TM