MIC5209 500mA Low-Noise LDO Regulator General Description Features The MIC5209 is an efficient linear voltage regulator with very low dropout voltage, typically 10mV at light loads and less than 500mV at full load, with better than 1% output voltage accuracy • Output voltage range: 1.8V − 15V ® • Meets Intel Slot 1 and Slot 2 requirements • Guaranteed 500mA output over the full operating temperature range • Low 500mV maximum dropout voltage at full load • Extremely tight load and line regulation • Thermally-efficient surface-mount package • Low temperature coefficient • Current and thermal limiting • Reversed-battery protection • No-load stability • 1% output accuracy • Ultra-low-noise capability in SO-8 and TO-263-5 • Ultra-small 3mm × 3mm DFN package Designed especially for hand-held, battery-powered devices, the MIC5209 features low ground current to help prolong battery life. An enable/shutdown pin on SO-8 and TO-263-5 versions can further improve battery life with near-zero shutdown current. Key features include reversed-battery protection, current limiting, overtemperature shutdown, ultra-low-noise capability (SO-8 and TO-263-5 versions), and availability in thermally-efficient packaging. The MIC5209 is available in adjustable or fixed output voltages. Datasheets and support documentation are available on Micrel’s web site at: www.micrel.com. Applications • • • • • • Pentium II Slot 1 and Slot 2 support circuits Laptop, notebook, and palmtop computers Cellular telephones Consumer and personal electronics SMPS post-regulator/DC-to-DC modules High-efficiency linear power supplies Typical Application 3.3V Nominal Input Slot 1 Power Supply Ultra-Low Noise 5V Regulator Intel is a registered trademark of Intel Corporation. Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com May 19, 2015 Revision 4.1 Micrel, Inc. MIC5209 Ordering Information Part Number Voltage Junction Temperature Range Package Pb-Free MIC5209-2.5YS 2.5V −40°C to +125°C SOT-223 X MIC5209-3.0YS 3.0V −40°C to +125°C SOT-223 X MIC5209-3.3YS 3.3V −40°C to +125°C SOT-223 X MIC5209-3.6YS 3.6V −40°C to +125°C SOT-223 X MIC5209-4.2YS 4.2V −40°C to +125°C SOT-223 X 5.0V −40°C to +125°C SOT-223 X MIC5209-1.8YM 1.8V 0°C to +125°C SOIC-8 X MIC5209-2.5YM 2.5V −40°C to +125°C SOIC-8 X MIC5209-3.0YM 3.0V −40°C to +125°C SOIC-8 X MIC5209-3.3YM 3.3V −40°C to +125°C SOIC-8 X MIC5209-3.6YM 3.6V −40°C to +125°C SOIC-8 X MIC5209-5.0YM 5.0V −40°C to +125°C SOIC-8 X Adjustable (2.5V − 15.0V) −40°C to +125°C Adjustable (1.8V − 2.5V) 0°C to +125°C SOIC-8 X MIC5209-1.8YU 1.8V 0°C to +125°C TO-263-5 X MIC5209-2.5YU 2.5V −40°C to +125°C TO-263-5 X MIC5209-3.0YU 3.0V −40°C to +125°C TO-263-5 X MIC5209-3.3YU 3.3V −40°C to +125°C TO-263-5 X MIC5209-3.6YU 3.6V −40°C to +125°C TO-263-5 X MIC5209-5.0YU 5.0V −40°C to +125°C TO-263-5 X Adjustable (2.5V − 15.0V) −40°C to +125°C Adjustable (1.8V − 2.5V) 0°C to +125°C TO-263-5 X Adjustable (2.5V − 15.0V) −40°C to +125°C Adjustable (1.8V − 2.5V) 0°C to +125°C 8-Pin DFN X MIC5209-5.0YS (1) MIC5209YM (1) MIC5209YU MIC5209YML Note: 1. Contact Micrel for availability. May 19, 2015 2 Revision 4.1 Micrel, Inc. MIC5209 Pin Configuration May 19, 2015 MIC5209-x.xYS SOT-223 Fixed Voltages MIC5209YML 8-Pin 3mm × 3mm DFN Adjustable Voltages MIC5209-x.xYM SO-8 Fixed Voltages MIC5209-x.xYU TO-263-5 Fixed Voltages MIC5209YM SO-8 Adjustable Voltages MIC5209YU TO-263-5 Adjustable Voltages 3 Revision 4.1 Micrel, Inc. MIC5209 Pin Description Pin Number 8-Pin DFN Pin Number SOT-223 Pin Number SO-8 Pin Number TO-263-5 Pin Name Pin Function 1, 2 1 2 2 IN Supply Input. 7 2, TAB 5−8 3, TAB GND Ground: SOT-223 Pin 2 and TAB are internally connected. SO-8 Pins 5 through 8 are internally connected. 3, 4 3 3 4 OUT Regulator Output: Pins 3 and 4 must be tied together. 5 8 6 1 1 Not Connected. EN Enable (Input): CMOS-compatible control input. Logic High = Enable; Logic Low = Shutdown. 4 (Fixed) 5 (Fixed) BYP Reference Bypass: Connect external 470pF capacitor to GND to reduce output noise. Can be left open. For 1.8V or 2.5V operation, see Application Information. 4 (Adjustable) 5 (Adjustable) ADJ Adjust (Input): Feedback input. Connect to resistive voltage-divider network. ePad Exposed Thermal Pad: Connect to GND for best thermal performance. EP May 19, 2015 NC 4 Revision 4.1 Micrel, Inc. MIC5209 Absolute Maximum Ratings(2) Operating Ratings(3) Supply Voltage (VIN) ....................................... −20V to +20V (4) Power Dissipation (PD). .......................... Internally Limited Junction Temperature (TJ) All Except 1.8V ................................... −40°C to +125°C 1.8V Only ................................................ 0°C to +125°C Lead Temperature (soldering, 5s) .............................. 260°C Storage Temperature (TS) ......................... −65°C to +150°C ESD Rating SOT-223 ........................................ 2kV HBM/300V MM DFN, SOIC-8 ................................. 5kV HBM/100V MM Supply Voltage (VIN) ...................................... +2.5V to +16V Adjustable Output Voltage (VOUT) Range ..... +1.8V to 15.0V Junction Temperature (TJ) 2.5V − 15.0V ....................................... –40°C to +125°C 1.8V ≤ VOUT < 2.5V.................................. 0°C to +125°C Package Thermal Resistance .................................... Note 4 Electrical Characteristics VIN = VOUT + 1V, COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C, except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT < 2.5V, unless noted. Symbol Parameter Condition Min. VOUT Output Voltage Accuracy Variation from nominal VOUT ∆VOUT/∆T Output Voltage Temperature Co-Efficient Note 5 Line Regulation VIN = VOUT + 1V to 16V Load Regulation IOUT = 100µA to 500mA 1 −2 2 40 0.009 Units % ppm/°C 0.05 %/V 0.1 (6) IOUT = 100µA IOUT = 50mA Dropout Voltage Max. −1 ∆VOUT/ VOUT VIN − VOUT Typ. 0.05 IOUT = 500mA % 0.7 10 60 80 115 175 250 (7) IOUT = 150mA 0.5 165 mV 300 400 350 500 600 Notes: 2. Exceeding the absolute maximum ratings may damage the device. 3. The device is not guaranteed to function outside its operating ratings. 4. The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD(MAX) = (TJ(MAX) – TA) θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. See Table 1 and the “ Thermal Considerations” sub-section in Application Information for details. 5. Output voltage temperature coefficient is the worst case voltage change divided by the total temperature range. 6. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 7. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. 8. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. 9. VEN is the voltage externally applied to devices with the EN (enable) input pin. [SO-8 (M) and TO-263-5 (U) packages only.] May 19, 2015 5 Revision 4.1 Micrel, Inc. MIC5209 Electrical Characteristics (Continued) VIN = VOUT + 1V, COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate –40°C ≤ TJ ≤ +125°C, except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT < 2.5V, unless noted. Symbol Parameter Condition Min. VEN ≥ 3.0V, IOUT = 100µA Ground Pin Current Max. 80 130 170 350 VEN ≥ 3.0V, IOUT = 50mA IGND Typ. 1.8 VEN ≥ 3.0V, IOUT = 150mA 8 VEN ≤ 0.4V (Shutdown) 0.05 3 VEN ≤ 0.18V (Shutdown) 0.10 8 Ground Pin Quiescent Current PSRR Ripple Rejection f = 120Hz ILIMIT Current Limit VOUT = 0V ∆VOUT/∆PD Thermal Regulation Note 10 0.05 VOUT = 2.5V, IOUT = 50mA COUT = 2.2µF, CBYP = 0 500 IOUT = 50mA, COUT = 2.2µF CBYP = 470pF 300 VENL Output Noise Enable Input Logic-Low Voltage 75 700 Enable Input Current 900 0.4 0.18 V 2.0 0.01 −1 VENL ≤ 0.18V 0.01 −2 5 20 25 30 VENH ≥ 16V mA %/W VENL ≤ 0.4V IENH µA nV √Hz VEN = Logic Low (Regulator Shutdown) VENH ≥ 2.0V mA dB 1000 VEN = Logic High (Regulator Enabled) IENL 20 25 IGND eNO 2.5 3.0 VEN ≥ 3.0V, IOUT = 500mA (11) µA 900 (8, 9) (9) 650 Units µA µA 50 Notes: 10. Thermal regulation is the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500mA load pulse at VIN = 16V for t = 10ms. 11. CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin. [SO-8 (M) and TO-263-5 (U) packages only]. May 19, 2015 6 Revision 4.1 Micrel, Inc. MIC5209 Block Diagrams Low-Noise Fixed Regulator (SOT-223 Version Only) Ultra-Low-Noise Fixed Regulator Ultra-Low-Noise Adjustable Regulator May 19, 2015 7 Revision 4.1 Micrel, Inc. MIC5209 Typical Characteristics May 19, 2015 8 Revision 4.1 Micrel, Inc. MIC5209 Typical Characteristics (Continued) May 19, 2015 9 Revision 4.1 Micrel, Inc. MIC5209 Application Information Enable Shutdown Enable is not available on devices in the SOT-223 (S) package. Applications requiring a slow ramp-up of output voltage should consider larger values of CBYP. Likewise, if rapid turn-on is necessary, consider omitting CBYP. Forcing EN (enable/shutdown) high (> 2V) enables the regulator. EN is compatible with CMOS logic. If the enable/shutdown feature is not required, connect EN to IN (supply input). If output noise is not critical, omit CBYP and leave BYP open. Thermal Considerations The SOT-223 has a ground tab which allows it to dissipate more power than the SO-8 (refer to the “Slot-1 Power Supply” sub-section for details). At 25°C ambient, it will operate reliably at 2W dissipation with “worst-case” mounting (no ground plane, minimum trace widths, and FR4 printed circuit board). Input Capacitor A 1µF capacitor should be placed from IN to GND if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. Output Capacitor An output capacitor is required between OUT and GND to prevent oscillation. The minimum size of the output capacitor is dependent upon whether a reference bypass capacitor is used. 1µF minimum is recommended when CBYP is not used (see Figure 1). 2.2µF minimum is recommended when CBYP is 470pF (see Figure 2). Larger values improve the regulator’s transient response. Thermal resistance values for the SO-8 represent typical mounting on a 1”-square, copper-clad, FR4 circuit board. For greater power dissipation, SO-8 versions of the MIC5209 feature a fused internal lead frame and die bonding arrangement that reduces thermal resistance when compared to standard SO-8 packages. Table 1. MIC5209 Thermal Resistance The output capacitor should have an ESR (equivalent series resistance) of about 1Ω and a resonant frequency above 1MHz. Ultra-low-ESR and ceramic capacitors can cause a low amplitude oscillation on the output and/or underdamped transient response. Most tantalum or aluminum electrolytic capacitors are adequate; film types will work, but are more expensive. Since many aluminum electrolytics have electrolytes that freeze at about –30°C, solid tantalums are recommended for operation below −25°C. θJC SOT-223 (S) 50°C/W 8°C/W SO-8 (M) 50°C/W 20°C/W − 2°C/W 63°C/W 2°C/W TO-263-5 (U) 3mm × 3mm DFN (ML) Multilayer boards with a ground plane, wide traces near the pads, and large supply-bus lines will have better thermal conductivity and will also allow additional power dissipation. At lower values of output current, less output capacitance is needed for output stability. The capacitor can be reduced to 0.47µF for current below 10mA or 0.33µF for currents below 1mA. For additional heat sink characteristics, refer to Micrel Application Hint 17, Designing P.C. Board Heat Sinks, included in Micrel’s Databook. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the “Regulator Thermals” section of Micrel’s Designing with Low-Dropout Voltage Regulators handbook. No-Load Stability The MIC5209 will remain stable and in regulation with no load (other than the internal voltage divider) unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. Reference Bypass Capacitor BYP (reference bypass) is available only on devices in SO-8 and TO-263-5 packages. Low-Voltage Operation The MIC5209-1.8 and MIC5209-2.5 require special consideration when used in voltage-sensitive systems. They may momentarily overshoot their nominal output voltages unless appropriate output and bypass capacitor values are chosen. BYP is connected to the internal voltage reference. A 470pF capacitor (CBYP) connected from BYP to GND quiets this reference, providing a significant reduction in output noise (ultra-low-noise performance). Because CBYP reduces the phase margin, the output capacitor should be increased to at least 2.2µF to maintain stability. During regulator power up, the pass transistor is fully saturated for a short time, while the error amplifier and voltage reference are being powered up more slowly from the output (see Block Diagrams). The start-up speed of the MIC5209 is inversely proportional to the size of the reference bypass capacitor. May 19, 2015 θJA Package 10 Revision 4.1 Micrel, Inc. MIC5209 Adjustable Regulator Circuits The MIC5209YM, MIC5209YU, and MIC5209YML can be adjusted to a specific output voltage by using two external resistors (Figure 3). The resistors set the output voltage based on the equation: Selecting larger output and bypass capacitors allows additional time for the error amplifier and reference to turn on and prevent overshoot. To ensure that no overshoot is present when starting up into a light load (100µA), use a 4.7µF output capacitance and 470pF bypass capacitance. This slows the turn-on enough to allow the regulator to react and keep the output voltage from exceeding its nominal value. At heavier loads, use a 10µF output capacitance and 470pF bypass capacitance. Lower values of output and bypass capacitance can be used, depending on the sensitivity of the system. R2 VOUT = 1.242V 1 + R1 Eq. 1 This equation is correct due to the configuration of the bandgap reference. The bandgap voltage is relative to the output, as seen in the block diagram. Traditional regulators normally have the reference voltage relative to ground; therefore, their equations are different from the equation for the MIC5209Y. Applications that can withstand some overshoot on the output of the regulator can reduce the output capacitor and/or reduce or eliminate the bypass capacitor. Applications that are not sensitive to overshoot due to power-on reset delays can use normal output and bypass capacitor configurations. Although ADJ is a high-impedance input and, for best performance, R2 should not exceed 470kΩ. Please note the junction temperature range of the regulator with an output less than 2.5V (fixed and adjustable) is 0°C to +125°C. Fixed Regulator Circuits Figure 1 shows a basic MIC5209-x.xYM (SO-8) fixedvoltage regulator circuit. See Figure 5 for a similar configuration using the more thermally-efficient MIC5209x.xYS (SOT-223). A 1µF minimum output capacitor is required for basic fixed- voltage applications. Figure 3. Low-Noise Adjustable Voltage Regulator Figure 4 includes the optional 470pF bypass capacitor from ADJ to GND to reduce output noise. Figure 1. Low-Noise Fixed Voltage Regulator Figure 2 includes the optional 470pF noise bypass capacitor between BYP and GND to reduce output noise. Note that the minimum value of COUT must be increased when the bypass capacitor is used. Figure 4. Ultra-Low-Noise Adjustable Application Figure 2. Ultra-Low-Noise Fixed Voltage Regulator May 19, 2015 11 Revision 4.1 Micrel, Inc. MIC5209 Slot-1 Power Supply Intel’s Pentium II processors have a requirement for a 2.5V ±5% power supply for a clock synthesizer and its associated loads. The current requirement for the 2.5V supply is dependent upon the clock synthesizer used, the number of clock outputs, and the type of level shifter (from core logic levels to 2.5V levels). Intel estimates a “worst-case” load of 320mA. Using the maximum junction temperature of 125°C and a θJC of 8°C/W for the SOT-223, 25°C/W for the SO-8, or 2°C/W for the TO-263 package, the following worst-case heat-sink thermal resistance (θSA) requirements are: θ JA = TJ(MAX ) − TA PD θSA = θ JA = θ JC The MIC5209 was designed to provide the 2.5V power requirement for Slot-1 applications. Its guaranteed performance of 2.5V ±3% at 500mA allows adequate margin for all systems, and the dropout voltage of 500mV means that it operates from a “worst-case” 3.3V supply where the voltage can be as low as 3.0V. Table 2 and Figure 6 show that the Slot-1 power supply application can be implemented with a minimum footprint layout. Table 2. Maximum Allowable Thermal Resistance TA 40°C 50°C 60°C 75°C θJA (Limit) 209°C/W 184°C/W 160°C/W 123°C/W θSA SOT-223 201°C/W 176°C/W 152°C/W 115°C/W θSA SO-8 184°C/W 159°C/W 135°C/W 98°C/W θSA TO-263-5 207°C/W 182°C/W 158°C/W 121°C/W Figure 6 shows the necessary copper pad area to obtain specific heatsink thermal resistance (θSA) values. The θSA values highlighted in Table 2 require much less than 500mm2 of copper and, per Figure 6, can be easily accomplished with the minimum footprint. Figure 5. Slot-1 Power Supply A Slot-1 power supply (Figure 5) is easy to implement. Only two capacitors are necessary, and their values are not critical. CIN bypasses the internal circuitry and should be at least 0.1µF. COUT provides output filtering, improves transient response, and compensates the internal regulator control loop. Its value should be at least 22µF. CIN and COUT can be increased as much as desired. Slot-1 Power Supply Power Dissipation Powered from a 3.3V supply, the Slot-1 power supply illustrated in Figure 5 has a nominal efficiency of 75%. At the maximum anticipated Slot-1 load (320mA), the nominal power dissipation is only 256mW. The SOT-223 package has sufficient thermal characteristics for wide design margins when mounted on a single-layer copper-clad printed circuit board. The power dissipation of the MIC5209 is calculated using the voltage drop across the device output current plus supply voltage ground current. Considering “worst-case” tolerances, dissipation could be as high as: the Figure 6. PCB Heatsink Thermal Resistance power (VIN(MAX) − VOUT(MAX)) × IOUT + VIN(MAX) × IGND [(3.6V − 2.375V) × 320mA] + (3.6V × 4mA) PD = 407mW May 19, 2015 12 Revision 4.1 Micrel, Inc. MIC5209 Package Information and Recommended Land Patterns(12) SOT-223 (S) Note: 12. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com. May 19, 2015 13 Revision 4.1 Micrel, Inc. MIC5209 Package Information and Recommended Land Patterns(12) (Continued) 8-Pin SOIC (M) May 19, 2015 14 Revision 4.1 Micrel, Inc. MIC5209 Package Information and Recommended Land Patterns(12) (Continued) TO-263-5 (U) May 19, 2015 15 Revision 4.1 Micrel, Inc. MIC5209 Package Information and Recommended Land Patterns(12) (Continued) 8-Pin 3mm × 3mm DFN (ML) May 19, 2015 16 Revision 4.1 Micrel, Inc. MIC5209 MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel, Inc. is a leading global manufacturer of IC solutions for the worldwide high-performance linear and power, LAN, and timing & communications markets. The Company’s products include advanced mixed-signal, analog & power semiconductors; high-performance communication, clock management, MEMs-based clock oscillators & crystal-less clock generators, Ethernet switches, and physical layer transceiver ICs. Company customers include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products. Corporation headquarters and state-of-the-art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and advanced technology design centers situated throughout the Americas, Europe, and Asia. Additionally, the Company maintains an extensive network of distributors and reps worldwide. Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this datasheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2014 Micrel, Incorporated. May 19, 2015 17 Revision 4.1