PWM Control IC BM1P061FJ / BM1P062FJ / BM1P101FJ

Datasheet
Application
Note
AC/DC Drivers
PWM Control IC
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Overview
The PWM control IC for AC/DC “BM1Pxxx” provides
an optimized system for all applications that include an
electrical outlet.
A built-in 650V startup circuit contributes to lower
power consumption, and both isolated and
non-isolated configurations are supported, simplifying
the design of various types of low-power converters.
External switching MOSFET and current detection
resistors provide greater design flexibility. The
switching frequency is fixed. Since current mode
control is used, a current limit is imposed in each cycle,
ensuring superior performance in bandwidth and
transient response. Frequency is reduced at light loads,
for higher efficiency. A frequency hopping function is
also built in, contributing to low EMI.
Additional features include soft start and burst
functions, a per-cycle overcurrent limiter, VCC
overvoltage protection, overload protection, and other
protection functions.
● Key Specifications
 Operating supply voltage range:
 Operating current:
 Oscillation frequency:
 Operating temperature range:
● Features
 PWM frequency: 65 kHz, 100 kHz
 PWM current mode
 Frequency hopping function
 Light load burst operation / Frequency reduction
function
 650V startup circuit
 VCC pin undervoltage protection
 VCC pin overvoltage protection
 CS pin open protection
 CS pin Leading-Edge-Blanking function
 Per-cycle overcurrent limiter function
 Overcurrent limiter with AC voltage compensation
function
 Soft start function
 Secondary overcurrent protection circuit
● Package
SOP-J8
VCC 8.9 V to 26.0 V
VH:
to 600 V
Normal: 0.60 mA (Typ.)
Burst mode: 0.35 mA (Typ.)
BM1P061/2FJ: 65 kHz (Typ.)
BM1P101/2FJ: 100 kHz (Typ.)
-40°C to +85°C
4.90mm × 3.90mm × 1.65mm, 1.27mm pitch
● Applications
AC adapters, TVs, and household appliances
(vacuum cleaners, humidifiers, air cleaners, air
conditioners, IH cooking heaters, rice cookers, etc.)
● Lineup
● Application Circuit
BM1P101FJ
BM1P102FJ
BM1P061FJ
BM1P062FJ
Oscillation
Frequency
100 kHz
100 kHz
65 kHz
65 kHz
VCC OVP
Auto-recovery
Latch
Auto-recovery
Latch
Figure 1.Application Circuit
○ Product structure:Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
○This product is not designed for protection against radioactive rays
1/18
Oct.2013.Rev.001
Application Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Conditions
Maximum voltage 1
Vmax1
-0.3 ~ 30.0
V
VCC
Maximum voltage 2
Vmax2
-0.3 ~ 6.5
V
CS, FB, ACMONI
Maximum voltage 3
Vmax3
-0.3 ~ 15.0
V
OUT
Maximum voltage 4
Vmax4
-0.3 ~ 650
V
VH
OUT pin peak current
IOUT
±1.0
A
Allowable dissipation
Pd
674.9 (Note 1)
mW
When mounted
o
Operating temperature range
Topr
-40 ~ +85
C
o
Storage temperature range
Tstr
-55 ~ +150
C
Note 1: (SOP-J8) When mounted on a 70×70×1.6mm glass epoxy single-layer substrate. Reduce by 5.40mW/°C when
used at temperatures above Ta=25°C.
● Recommended Operating Conditions (Ta = 25°C)
Parameter
Supply voltage range 1
Supply voltage range 2
Symbol
VCC
VH
Rating
8.9 ~ 26.0
80 ~ 600
Unit
V
V
● Electrical Characteristics (Unless otherwise noted, Ta = 25°C, VCC = 15 V)
Rating
Parameter
Symbol
Min.
Typ.
Max.
Conditions
VCC pin voltage
VH pin voltage
Unit
Conditions
[Circuit current]
FB = 2.0 V
(during pulse operation)
FB = 0.0 V
(during burst operation)
Circuit current (ON) 1
ION1
-
600
1000
μA
Circuit current (ON) 2
ION2
-
350
450
μA
[VCC pin (5 pin) protection function ]
VCC UVLO voltage 1
VUVLO1
VCC UVLO voltage 2
VUVLO2
VCC UVLO hysteresis
VUVLO3
12.50
7.50
-
13.50
8.20
5.30
14.50
8.90
-
V
V
V
Low VCC charge start voltage
VCHG1
7.70
8.70
9.70
V
VCC charge stop voltage
VCC OVP voltage 1
VCHG2
VOVP1
12.00
26.00
13.00
27.50
14.00
29.00
V
V
VCC OVP voltage 2
VOVP2
-
23.50
-
V
VCC OVP hysteresis
VOVP3
-
4.00
-
V
VOUTH
VOUTL
RPDOUT
10.5
75
12.5
100
14.5
1.00
125
V
V
kΩ
IO = -20 mA
IO = +20 mA
VACMONI1
VACMONI2
VACMONI3
TACMONI1
0.92
0.63
0.20
180
1.00
0.70
0.30
256
1.08
0.77
0.40
330
V
V
V
mS
ACMONI rise
ACMONI drop
Start current 1
Start current 2
ISTART1
ISTART2
0.400
1.000
0.700
3.000
1.000
5.000
mA
mA
OFF current
ISTART3
-
10
20
uA
VSC
0.400
0.800
1.400
V
VCC rise
VCC drop
VUVLO3 = VUVLO1- VUVLO2
Start circuit operating
voltage
Stop voltage from VCHG1
VCC rise
VCC drop
BM1P061FJ/BM1P101FJ
BM1P061FJ/BM1P101FJ
[Output driver block]
OUT pin H voltage
OUT pin L voltage
OUT pin pull-down resistance
[ACMONI detection circuit]
ACMONI detection voltage 1
ACMONI detection voltage 2
ACMONI hysteresis
ACMONI timer
[Start circuit block]
Start current switching voltage
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TSZ22111・15・001
2/28
VCC = 0 V
VCC = 10 V
Inflow current from VH pin
after release of UVLO
Oct.2013.Rev.001
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Electrical Characteristics of Control IC Block (Unless otherwise noted, Ta = 25°C, VCC = 15 V)
Rating
Parameter
Symbol
Unit
Min.
Typ.
Max.
Conditions
[PWM type DC/DC driver block]
FB = 2.00 V average
frequency
BM1P061FJ/BM1P062FJ
FB = 2.00 V average
frequency
BM1P101FJ/BM1P102FJ
FB = 0.40 V average
frequency
FB = 2.00 V average
frequency
BM1P061FJ/BM1P062FJ
FB = 2.00 V average
frequency
BM1P101FJ/BM1P102FJ
Oscillation frequency 1a
FSW1a
60
65
70
kHz
Oscillation frequency 1b
FSW1b
90
100
110
kHz
Oscillation frequency 2
FSW2
-
25
-
kHz
Frequency hopping range 1
FDEL1
-
4.0
-
kHz
Frequency hopping range 2
FDEL2
-
6.0
-
kHz
Hopping fluctuation frequency
Minimum pulse width
Soft start time 1
Soft start time 2
Soft start time 3
Soft start time 4
Maximum duty
FB pin pull-up resistance
FB / CS gain
FB burst voltage 1
FB burst voltage 2
FCH
Tmin
TSS1
TSS2
TSS3
TSS4
Dmax
RFB
Gain
VBST1
VBST2
75
0.30
0.60
1.20
2.40
68.0
22
0.300
0.350
125
400
0.50
1.00
2.00
4.00
75.0
30
4.00
0.400
0.450
175
0.70
1.40
2.80
5.60
82.0
38
0.500
0.550
Hz
ns
ms
ms
ms
ms
%
kΩ
V/V
V
V
FBOLP voltage 1a
VFOLP1A
2.60
2.80
3.00
V
FBOLP voltage 1b
VFOLP1B
-
VFOLP2A-0.2
-
V
FBOLP detection timer
FBOLP start timer
FBOLP stop timer
TFOLP
TFOLP2
TOLPST
44
26
358
64
32
512
84
38
666
ms
ms
ms
Latch release voltage
VLATCH
-
VUVLO2-0.5
-
V
Latch mask time
TLATCH
50
100
200
us
VCS
0.380
0.400
0.420
V
VCS_SS1
-
0.100
-
V
VCS_SS2
-
0.150
-
V
TSS1 [ms] ~ TSS2 [ms]
VCS_SS3
-
0.200
-
V
TSS2 [ms] ~ TSS3[ms]
VCS_SS4
-
0.300
-
V
TSS3 [ms] ~ TSS4 [ms]
TLEB
-
250
-
ns
KCS
12
20
28
mV/us
FB drop
FB rise
When overload is detected
(FB rise)
When overload is detected
(FB drop)
VCC pin voltage
BM1P062FJ/BM1P102FJ
VCC OVP
BM1P062FJ/BM1P102FJ
[Overcurrent detection block]
Overcurrent detection voltage
Overcurrent detection voltage
SS1
Overcurrent detection voltage
SS2
Overcurrent detection voltage
SS3
Overcurrent detection voltage
SS4
Leading edge blanking time
Overcurrent
detection
AC
compensation factor
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TSZ22111・15・001
3/28
Ton = 0 us
0 [ms] ~ Tss1 [ms]
Oct.2013.Rev.001
Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Pin Descriptions
Table1. I/O Pin Functions
No.
Pin Name
I/O
Function
1
2
3
4
5
6
7
8
ACMONI
FB
CS
GND
OUT
VCC
N.C.
VH
I
I
I
I/O
O
I/O
I
Comparator input pin
Feedback signal input pin
Primary current sense pin
GND pin
External MOS drive pin
Power supply input pin
Non Connection
Start circuit pin
ESD Diode
VCC
○
○
○
○
○
-
GND
○
○
○
○
○
○
● I/O Equivalent Circuit Diagrams
Figure 2. I/O Equivalent Circuit Diagrams
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TSZ22111・15・001
4/28
Oct.2013.Rev.001
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
● Block Diagram
Figure 3. Block Diagram
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TSZ22111・15・001
5/28
Oct.2013.Rev.001
Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Application Description for Each Block
(1)
Startup Circuit (VH pin: Pin 8)
These ICs integrate a startup circuit (650V withstand voltage), enabling both low standby power and high-speed startup.
The startup circuit operates only at startup. Current flow during operation is shown in Figure 5.
After startup, the only power consumed is due to the idling current ISTART3 (10uA typ.).
Ex.) When Vac=100V, startup power consumption is:
PVH=100V*√2*10uA =1.41mW
Ex.) When Vac=240V, startup power consumption is:
PVH=240V*√2*10uA=3.38mW
Startup time is determined based on VH pin inrush current and VCC pin capacitance.
Startup time reference values are shown in Figure 6. For example, when Cvcc=10uF, startup takes about 0.07 seconds.
When the VCC pin has been shorted to GND, the ISTART1 current in Figure 5 flows.
When the VH pin has been shorted to GND, a large current flows to GND from the VH line. To prevent this, please insert
resistor RVH (5 kΩ ~ 60 kΩ) to limit the current between the VH line and the IC’s VH pin.
2
When the VH pin is shorted, power equal to VH /RVH is applied to the resistor. Therefore, select a resistor size that is able
to tolerate this amount of power.
If one resistor is not enough to withstand the amount of power dissipation, two or more resistors can be connected in
series.
Figure 4. Startup Circuit Block Diagram
1.0 0.9 0.8 起動時間[sec]
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0
5
10
15
20
25
30
35
40
45
50
Cvcc [uF]
Figure 5. Startup Current vs VCC Voltage
(*Startup current flows from the VH pin.)
The operating waveforms during startup are as follows.
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TSZ22111・15・001
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Figure 6. Startup Time (Reference)
(CVCC is capacitance at the VCC pin.)
Oct.2013.Rev.001
Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
The operating waveforms at startup are shown in Figure 7.
VH
Voltage
ISTART2
VH input
current
ISTART1
ISTART3
VUVLO1
VCC(5pin)
VSC
Switing
Set voltage
Secondary
output
A
B
C
D
Figure 7. Operating Waveforms at Startup
A: VH voltage is supplied when plugged into an outlet. Charging starts from the VH pin the VCC pin via the startup circuit.
At that time, VCC < VSC (0.8V typ.), so the VH input current is limited to ISTART1 by the VCC pin short protection
function.
B: Since VCC voltage > VSC (0.8V typ.), VCC short protection is cancelled and current flows from the VH input.
C: Since VCC voltage > VUVLO1 (13.5V typ.), the startup circuit is stopped and VH input current flow is only ISTART3
(10uA typ.). In addition, when switching starts, secondary output begins to increase, but since the secondary output is
low, VCC pin voltage is reduced. The drop rate of VCC is determined by the capacitance of the VCC pin capacitor and
the IC current consumption as well as the load current connected to the VCC pin. (V/t = Cvcc/Icc)
D: Since the secondary output has risen to a constant voltage, voltage is applied from the auxiliary winding to the VCC pin,
stabilizing the VCC voltage.
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Oct.2013.Rev.001
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
(2) Startup Sequence (Soft Start Operation, Light Load Operation, Auto-Recovery Operation During Overload Protection)
The startup sequence is shown in Figure 8.
See below for detailed descriptions.
Figure 8. Startup Sequence Time Chart
A: Voltage is applied to the input voltage (VH) pin (Pin 8). At that time, the ACMONI pin (Pin 1) rises to VACMONI1 >1.0V.
B: The VCC pin (Pin 6) voltage rises, and when VCC > VUVLO1 (13.5V typ.) the IC begins to operate.
When the protection functions (ACMONI,VCC, CS, FB pin, temperature) are determined to be normal, switching
operation begins.
At this time, the VCC pin (Pin 6) current consumption causes the VCC pin voltage to drop. When VCC < VCHG1 (8.7V typ.),
the startuo circuit operates to prevent startup errors, and VCC is charged. After startup, charging continues until VCC >
VCHG1 (13.0V typ.). Refer to item (1) regarding startup circuit operation.
C: With the soft start function, excessive rises in voltage and current are prevented by adjusting the voltage level of the CS
pin (Pin 3). During soft start, the IC changes the overcurrent detection voltage from VCC_SS1 to VCC_SS4 to prevent output
voltage overshoot. VCC_SS1 is described in Table 2 below.
Table 2 Overcurrent Detection Voltage at Startup
Vlim1
Soft Start
0.10 V (12%)
Start ~ 0.5 ms
0.5 ms ~1 ms
0.15 V (25%)
1 ms ~2 ms
0.20 V (50%)
2 ms ~ 4 ms
0.30 V (75%)
4 ms ~
0.500 V (100%)
D: When switching operation starts, the secondary output voltage VOUT rises.
After switching has started, set the output voltage to within TFOLP2 (32ms typ.) to become the rated voltage.
E: When there is a light load, burst operation suppresses power consumption.
F: When there is an overload, the FB pin (Pin 2) voltage becomes greater than VFOLP1A in order to reduce the output voltage.
G: If the FB pin (Pin 2) voltage exceeds VFOLP1A for longer than TFOLP2 (32ms typ.), the overload protection circuit stops the
switching operation during the TOLPST period (512ms typ.).
When the FB pin (Pin 2) voltage exceeds VFOLP1B, the IC’s internal timer TFOLP2 (32ms typ.) is reset.
H: When the VCC voltage drops to VCC < VCHG1 (8.7V typ.), the startup circuit operates and VCC charging begins.
I: When the VCC voltage increases to VCC> VCHG2 (13.0V typ.), the startup circuit stops charging VCC.
J: Same as F
K: Same as G
Startup waveforms are shown as reference examples in Figures 8 and 9.
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Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
VH voltage
VH voltage
Secondary
output
Secondary
output
VCC voltage
VCC voltage
1. Parameter: Time
2. Channel: CH1
3. Cursor 1
4. Cursor 2
Figure 8. No-Load Startup Waveforms
1. Parameter: Time
2. Channel: CH1
3. Cursor 1
4. Cursor 2
Figure 9. Heavy-Load Startup Waveforms
(3) VCC Pin Protection Function
This IC includes a VCC pin undervoltage protection function (UVLO), overvoltage protection function (OVP), as well as a
VCC charge function that operates when the VCC voltage has dropped.
The VCC UVLO and OVP functions prevent damage to the switching MOSFET due to insufficient/excessive VCC voltage.
When the VCC voltage drops, the VCC charge function charges from a line with higher voltage than the start circuit and
stabilizes secondary output.
(3-1) VCC UVLO and OVP Functions
VCC UVLO is an auto-recovery type comparator with voltage hysteresis. For VCC OVP, the BM1Pxx1 Series features an
auto-recovery type comparator while the BM1Pxx2 Series utilizes a latch-type comparator.
Latch release (reset) after latch operation detection by VCC OVP is triggered when VCC < VLATCH (7.7V typ.). This operation
is shown in Figure 8.
A mask time TLATCH (100us typ.) is built into VCC OVP. Detection is performed when the VCC pin (Pin 6) voltage continues to
exceed VOVP1 (27.5V typ.) for TLATCH (100us typ.).
This function masks surges and the like. (See section 7 below)
Vovp
VCCuvlo1
VCCCHG2
VCCCHG1
VCCuvlo2
Vlatch
ON
ON
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
OFF
ON
ON
OFF
OFF
L : Normal
H : Latch
TLATCH
A
B
CD
E
F
G H
I
J K
A
Figure 8. VCC UVLO / OVP Time Chart
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Oct.2013.Rev.001
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
A: Voltage is supplied to the VH pin (Pin 8) and voltage at the VCC pin (Pin 6) starts to rise.
B: When the VCC pin (Pin 6) voltage > VUVLO1, the VCC UVLO function is canceled and DC/DC operation begins.
C: When the VCC pin (Pin 6) voltage > VOVP, VCC OVP detects overvoltage in the IC.
D: When the VCC pin (Pin 6) voltage > VOCP continues for TLATCH (100us typ.), switching is stopped by the VCC OVP function.
(Latch mode)
E: When the VCC pin (Pin 6) voltage < VCHG1, the VCC charge function operates and the VCC pin (Pin 6) voltage rises.
F: When the VCC pin (pin 6) voltage > VCHG2, the VCC charge function is stopped.
G: Same as E.
H: Same as F.
I: High voltage line VH is reduced.
J: When VCC < VUVLO2, the VCC UVLO function operates.
K: When VCC < VLATCH,, latch is cancelled.
• VCC Pin Capacitance Value
To ensure stable operation of the IC, please set the VCC pin capacitance value to 10uF or greater.
If the capacitor at the VCC pin is too large, the response of the VCC pin to the secondary output will be delayed. In cases
where the transformer has a low degree of coupling, a large surge can be generated at the VCC pin, which may damage
the IC. In this case, insert a resistance of 10Ω to 100Ω on a bus between the diode and capacitor after the auxiliary winding.
As for constants, perform a waveform evaluation of the VCC pin and determine values that will prevent any surges at the
VCC pin from exceeding the absolute maximum rating.
• VCC OVP Voltage Protection Settings for Increased Secondary Output
The VCC pin voltage is determined by the secondary output and the transformer ratio (Np:Ns).
Accordingly, when the secondary output has become large, protection is possible by VCC OVP.
The VCC OVP protection settings are as follows.
Vout
Np
Ns
Nb
Figure 9 VCC OVP Settings
This is determined by VCC voltage = Vout x Nb/Ns. (Vout: Secondary output, Nb: Auxiliary winding turns, Ns: Secondary
winding turns).
When secondary output x 1.3 occurs and protection is desired, set the number of winding turns so that 1.3 x Vout x (Nb/Ns)
> VOVP1.
For VCC OVP protection, since there is a TLATCH (100us typ.) blanking time, VCC OVP protection cannot be detected for
instantaneous surges at the VCC pin.
However, VCC OVP is detected when the VCC pin voltage has become higher than VOVP1 for over the TLATCH period, such
as due to the effects of a low degree of transformer coupling, so an evaluation of the application should be performed
before setting VCC OVP.
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TSZ22111・15・001
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Oct.2013.Rev.001
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
(3-2) VCC Charge Function
The VCC charge function operates when the VCC pin (Pin 6) voltage exceeds VUVLO1 and the IC starts up, then later drops to
less than VCHG1. At that time, the VCC pin (Pin 6) is charged from the VH pin (Pin 8) via the IC. This operation prevents VCC
startup errors.
The VCC pin is charged, and charging is stopped when VCC pin exceeds VCHG2. This operation is shown in Figure 9.
Figure 10. VCC Pin Charge Operation
A: The VH pin (Pin 8) voltage rises and the VCC charge function starts charging the VCC pin (Pin 6).
B: When the VCC pin (Pin 6) voltage > VUVLO1, the VCC UVLO function is cancelled, the VCC charge function is stopped,
and DC/DC operation starts.
C: At startup, the output voltage is low, so the VCC pin (Pin 6) voltage drops.
D: When the VCC pin (Pin 6) voltage < VCHG1, the VCC charge function operates and the VCC pin (Pin 6) voltage increases.
E: When the VCC pin (Pin 6) voltage > VCHG2, the VCC charge function is stopped.
F: When the VCC pin (Pin 6) voltage < VCHG1, the VCC charge function operates and the VCC pin (Pin 6) voltage rises.
G: When the VCC pin (Pin 6) voltage > VCHG2, the VCC charge function is stopped.
H: Output voltage startup ends, and the VCC pin (Pin 6) is charged by the auxiliary windings to stabilize the VCC pin (Pin
6).
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Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(4) ACMONI Pin Protection Function
The ACMONI (Pin 1) is a brownout protection pin. The brownout function stops switching operation when the input AC voltage
drops. An application example is shown in Figure 11. The input voltage utilizes a resistance divider. When the ACMONI pin
exceeds VACOMONI (1.0V typ.), the circuit detects normal status and switching operation starts. After switching operation, when
the ACMONI pin drops below VACMONI (0.7V typ.), the IC’s internal timer begins to operate. When the ACMONI pin stays below
VACMONI (0.7V typ.) for at least TACMONI1 (256ms typ), DC/DC operation is turned off.
Therefore, even when AC voltage is interrupted, operation continues for a time equal to TACMONI1 (256ms typ.).
RH
RL
Figure 11.
Application Circuit
The brownout setting can be set by connecting an external resistor to the ACMONI pin.
The setting method is as follows.
○ When the peak value of the AC line exceeds VHstart you should start operation by calculating the following:
*VACMONI1 = 1.0V
VHstart = (RH + RL) / RL x VACMONI1
Set the RH and RL values according to this equation.
At this time, the brownout end voltage VHend is determined as:
VHend = (RH+RL) /RL x VACMONI2
*VACMONI1 = 0.7V
*When not using the brownout function, set the voltage to between VACMONI (1.0V typ.) and 5.0V.
Supply the voltage either externally or using a resistance divider from the VCC pin.
Vout
Np
Ns
Nb
Figure 12. Handling of the ACMONI Pin When Not Using the Brownout Function
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TSZ22111・15・001
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Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(5) DC/DC Driver (PWM Comparator, Frequency Hopping, Slope Compensation, OSC, Burst)
(5-1) Basic PWM Operation
Figure 13 shows a basic PWM block diagram while Figure 14 illustrates basic PWM operations.
Ip
Figure 13. Block Diagram of Internal IC PWM Operation
Figure 14. Basic PWM Operation
A: A SET signal is output from the IC’s internal oscillator, and the MOSFET is turned ON.
At this time, the capacitance between the MOSFET drain and source is discharged, and noise is generated at the
CS pin.
This noise is called the Leading Edge.
This IC has a built-in filter for this noise. (See 6)
As a result of this filter and the delay time, the minimum pulse width of the IC is 400ns (typ).
Afterward, current flows to the MOSFET and a Vcs=Rs*Ip voltage is supplied to the CS pin.
B: When the CS pin voltage rises above the FB pin voltage/Gain (4 typ.) or the overcurrent detection voltage Vcs,
a RESET signal is output and OUT is turned off.
C: There is a delay time Tondelay between time point B and actual turn-off. This time is the result of differences in
maximum power that occur based on the AC voltage. This IC includes a function that suppresses these
differences. (See 5-4))
D: The energy that accumulates in the transformer during Ton is discharged to the secondary side, and the
drain voltage starts to oscillate freely based on the transformer Lp value and the MOSFET’s Cds (drain-source
capacitance).
E: Since the IC’s internal switching frequency is predetermined, a SET signal is output from the internal oscillator
occurs for a set period starting from point A, and the MOSFET is turned on.
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
(5-2) Frequency Operation
Figure 15. PWM Operation in the IC
The PWM frequency is generated by the OSC block (internal oscillator) in Figure 15.
This oscillator has a switching frequency hopping function and the switching frequency fluctuates as is shown in Figure
16.
The fluctuation cycle is 125Hz. Due to the frequency hopping function, the frequency spectrum is dispersed and the
frequency spectrum peak is reduced. This increases the margin for EMI testing.
Figure 16-1. Frequency Hopping Function (BM1P06x Series)
Figure 16-2. Frequency Hopping Function (BM1P10x Series)
In Figure 16, the duty is calculated as Ton * Switching frequency * 100. The maximum duty value is Dmax (75% typ.).
Since PWM current mode is being used, sub-harmonic oscillation may occur if the duty exceeds 50%. Therefore,
22mV/us slope compensation is built in as a countermeasure.
To reduce power consumption during light loads, burst mode and frequency reduction circuits are included.
These operations are illustrated in Figure17. As shown in this figure, the frequency fluctuates based on the FB voltage.
If the FB voltage is within the range indicated in mode 2, switching loss is reduced by reducing the number of internal
oscillations based on the FB voltage.
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Datasheet
Figure 17-1. Operation Based on the FB Pin Voltage (BM1P06x Series) Figure 17-2. Operation Based on the FB Pin Voltage
(BM1P10x Series)
・mode1:
・mode2:
・mode3:
・mode4:
Burst operation
Frequency reduction operation (reduces maximum frequency.)
Fixed frequency operation (operates at maximum frequency.)
Overload operation (overload condition is detected and pulse operation is stopped.)
(5-3) Overcurrent Detection Operation
RFB (30kΩ typ.) is used to pull up the FB pin in response to the internal power supply (4.0V).
When the load of the secondary output voltage (secondary load power) changes, the photocoupler current changes, and
the FB pin voltage also changes.
The FB voltage VFB is determined by the following equation: FB Voltage = 4V - IFB. (IFB: Photocoupler Current)
For example, when the load becomes heavier, the FB current is reduced and the FB voltage rises.
When the load becomes lighter, the FB current increases and the FB voltage drops.
In this way, secondary power is monitored by the FB pin.
As the FB pin voltage is monitored, if the load becomes lighter (FB voltage drops), burst mode operation or frequency
reduction operation is performed.
Figure 18 shows the CS detection voltage with regard to FB voltage.
⊿CS/⊿FB Gain : 1/4
Figure 18 FB Voltage - CS Voltage Characteristics
When the FB voltage is less than 2.0V or when the CS voltage exceeds the FB voltage/Gain (4 typ.), the MOSFET is
turned off.
(See time point C in Figure 14.)
When the FB voltage exceeds 2.0V, the CS voltage = Vcs + Kcs*Ton. Kcs*Ton depends on AC voltage compensation.
(See 5-4)
Therefore, the peak current Ip is determined as Ip=Vcs1/Rs.
The current value for the MOSFET should be set with sufficient margin, taking into account the Ip value obtained from this
formula.
2
Maximum power is determined as Pmax = 1/2 x Lp x Ip x Fsw. (Lp: Primary inductance value, Ip: Primary peak current,
Fsw: Switching frequency)
Vcs1 is determined as Vcs1 = Vcs (0.4V typ.) + Kcs (typ.= 20) * Ton + Vdelay.
Vdelay is the amount of CS voltage increase during the delay time Rondelay between B and C in Figure 14.
This is calculated as Vdelay = Vin / Lp * Tondelay * Rs.
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Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(5-4) AC Voltage Dependent Compensation of the Overcurrent Limiter
This IC includes an AC voltage compensation function, which performs compensation for AC voltage by increasing the level
of the overcurrent limiter over time. In the equation below, (A) and (B) are assigned values similar to those for AC 100V and
AC 200V to perform compensation.
Vcs1 = Vcs (0.4V typ.) + Kcs (typ.= 20) *Ton + Vdelay
(A)
(B)
These operations are shown in Figures 19, 20, and 21.
When there is no AC voltage
compensation, the peak current
becomes offset during the
response time.
1
When there is no AC voltage compensation, the peak current
becomes offset during the response time.
Figure 19.
1
Without AC Voltage Compensation Function
The overcurrent limiter level is changed over time to match the peak current.
Figure 20.
With AC Voltage Compensation Function
Primary peak current during overload mode is defined as follows.
Primary peak current Ipeak = Vcs/Rs + Kcs * Ton/Rs + Vin/Lp * Tondelay
Vcs:
Overcurrent limiter voltage with the IC
Current detection resistor
Rs:
Vin:
Input DC voltage
Primary peak current
Lp:
Tondelay: Delay time after overcurrent limiter detection
Figure 21. Overcurrent Limiter Voltage
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Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(6) L.E.B. Blanking Time
When the drive MOSFET is turned on, a surge current is generated at time point A as shown in Figure 14.
At that time, the CS voltage (Pin 4) rises, which may cause detection errors in the overcurrent limiter circuit.
To prevent this, the OUT pin in the IC is switched from low to high and the CS voltage (Pin 4) is masked for 250ns by the
built-in L.E.B. (Leading Edge Blanking) function.
This blanking function can reduce the CS pin noise filter for noise generated when switching the OUT pin from low to
high.
However, if the CS pin noise does not stay within this 250ns period, an RC filter should be applied to this pin, as
is shown in Figure 22. At this time, a delay time occurs due to the RC filter when the CS pin is detected.
Even if there is no filter, attaching an RCS is recommended as a countermeasure against surges.
The recommended resistance for Rcs is 1 kΩ. When filtering is desired, adjust Ccs for this resistance.
Figure22. CS Pin Peripheral Circuit
(7) CS Pin Open Protection
When the CS pin (Pin 4) becomes open, transient heat (due to noise, etc.) occurs in the IC, which may become
damaged.
An open protection circuit has been built in to prevent such damage. (Auto-recovery protection)
VCCOVP
Timeout
Bottom det
OR
POUT
AND
S
Q
FBOLP_OH AND
5 OUT
PRE
Driver
NOUT
R
VREF(4V)
1MΩ
CURRENT SENSE
Leading
Edge
Blanking
(V-V Change)
Normal : ×1.0
3
CS
RS
Figure 23. CS Pin Peripheral Circuit
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
(8) Output Overload Protection Function (FB OLP Comparator)
As shown in mode4 of Figure 17, when the FB pin voltage rises to above a certain value, it is referred to as an overload
condition.
The output overload protection function stops switching operation when mode4 is in overload mode.
During an overload condition, the output voltage drops and so current no longer flows to the photocoupler while the FB
voltage (Pin 2) rises.
When the FB voltage (Pin 2) exceeds VFOLP1A (2.8V typ.) continuously for TFOLP2 (64ms typ.), an overload condition is
determined to have occurred and switching is stopped.
After the FB pin (Pin 2) exceeds VFOLP1A (2.8V typ.), if the FB pin voltage drops below VFOLP1B (2.6V typ.) during the TFOLP2
(64ms typ.) period, the overload protection timer is reset. Switching operations are performed during the TFOLP2 (32ms
typ.) period. At startup, the FB pin (Pin 2) voltage is pulled up by a resistance to the IC internal voltage, and operation
starts when the voltage reaches VFOLP1A (2.8V typ.) or above. Therefore, the startup time of secondary output voltage at
startup must be set so that the FB voltage (Pin 2) drops to VFOLP1B (2.6V typ.) or below within the TFOLP2 (64ms typ) period.
Once FBOLP is detected, recovery occurs after the TFOLP2 (512ms typ.) period.
Figure 24. Overload Protection (Auto-Recovery)
A: Since FB > VFOLP1A, the FBOLP comparator detects an overload.
B: When the condition at A continues for TFOLP2 (32ms typ.), switching is stopped by the overload protection function.
C: While switching has been stopped by the overload protection, the VCC voltage (Pin 6) drops and when the voltage at
the VCC pin (Pin 6) becomes less than VCHG, the VCC charge function operates to increase the VCC pin voltage.
D: When the VCC charge function causes the VCC pin (Pin 6) voltage to rise above VCHG2, the VCC charge function is
stopped.
E: When the TOLPST (512ms typ.) period that starts from time point B elapses, switching is started via soft start
operation.
F: While an overload condition remains, FB continues to exceed VFOLP1A and switching is stopped when the period TFOLP2
(32ms) from time point E has elapsed.
G: While switching is stopped, the VCC voltage (Pin 1) drops and when the VCC pin (Pin 6) voltage < VCHG1, the
VCC charge function operates and the VCC pin voltage increases.
H: When the VCC charge function causes the VCC pin (Pin 6) voltage to exceed VCHG2, the VCC charge function is
stopped.
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application Note
Datasheet
(9-1) OUT Pin Clamp Function
To protect the external MOSFET, the high voltage level of the OUT pin (Pin 5) is clamped to VOUTH (12.5V typ.).
The VCC pin (Pin 6) voltage is raised to prevent MOSFET gate damage. (Shown in Figure16.)
Figure 25. OUT Pin (Pin 5) Schematic
(9-2) OUT Pin Driver Circuit
Figure 26. OUT Pin (Pin 5) Driver Circuit
Switching noise generated when OUT is turned on or off may cause EMI-related problems.
In such cases, the MOSFET turn-on and turn-off times must be delayed.
However, delaying the turn off time will increase switching loss.
Figure 26 shows a delay circuit for the OUT pin. In Figure 26, ① is effective for both turn-on and turn-off operation.
② shows a delay in turn-on only, while turn-off is accelerated.
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(10)
Datasheet
Notes on Board Layout Pattern
Figure 27. Board Layout Pattern
· Notes
① The red lines shown in Figure 27 are large current pathways. They should be laid out as short and thick as possible to
prevent ringing and loss.
Also, any loops that occur in the red lines should be made as small as possible.
② The orange lines in the secondary side of Figure 27 should also be made as short and thick as the red lines and
should be laid out with the smallest loops possible.
③ Be sure to ground the red, brown, blue, and green lines at a single point.
④ The green lines are pathways for surges on the secondary side to escape to the primary side. Therefore, since a large
current may flow instantaneously, they should be laid out independently of the red and blue lines.
⑤ The blue lines are GND lines for IC control. Although they do not experience large current flow, they are susceptible to
the effects of noise, so they should be laid out independently of the red lines, green lines, and brown lines.
⑥ The brown lines are current pathways for the VCC pin. Current flows through these lines during switching, so they
should also be laid out independently.
⑦ Do not route any IC control lines directly under the transformer, since they may be affected by magnetic flux.
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Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Basic Characteristics (This data is for reference only and is not guaranteed.)
MAXDUTY1(TYP周波数時 )[%]
TYP FREQ[k Hz]
68.0 66.0 64.0 62.0 60.0 -40 -25 -10
5
20
35
50
65
25.0 MAXDUTY2(TYP周波数時 )[%]
85.0 70.0 83.0 81.0 79.0 77.0 75.0 73.0 71.0 69.0 67.0 65.0 -40 -25 -10
80
5
20
35
50
65
9.0 7.0 5.0 -40 -25 -10
33.0 1.30 31.0 29.0 27.0 25.0 23.0 21.0 19.0 17.0 15.0 35
50
65
1.00 0.90 0.80 0.70 0.60 -40 -25 -10
5
20
35
50
65
80
Fig-28-3 MAXDUTY2 (Soft Start)
1.10 Temp[℃ ]
20
Max Duty 2 (Typ. frequency) [%]
1.20 80
5
Temp[℃ ]
MAXDUTY SS2(VCC=15)[msec]
1.40 MAXDUTY SS1(VCC=15)[msec]
MAXDUTY3(TYP周波数時)[%]
13.0 11.0 Fig-28-2 MAXDUTY1
35.0 20
17.0 15.0 80
Max Duty 1 (Typ. frequency) [%]
Fig-28-1 Switching Frequency (Typ.)
5
21.0 19.0 Temp[℃ ]
Temp[℃ ]
-40 -25 -10
23.0 35
50
65
10.8 10.3 9.8 9.3 8.8 8.3 7.8 7.3 6.8 6.3 5.8 5.3 4.8 -40 -25 -10
80
Temp[℃ ]
5
20
35
50
65
80
Temp[℃ ]
Max Duty 3 (Typ. frequency) [%]
MAXDUTY3 (Soft Start)
11.0 10.0 9.0 8.0 7.0 6.0 5.0 25.0 22.0 19.0 16.0 3.0 35
50
65
175.0 28.0 10.0 20
200.0 31.0 13.0 5
Fig-28-7 NMOS RON (VCC = 15V)
75.0 5
20
35
50
65
80
-40 -25 -10
5
20
35
50
65
80
Temp[℃ ]
Fig-28-9
Fig-28-8 PMOS RON (VCC = 15V)
FBRES(VCC=12)[kΩ]
ICC(VCC)OFF(VCC=12)[uA]
100.0 TIMER LATCH
25.0 15.0 10.0 5.0 23.0 21.0 19.0 17.0 15.0 0.0 5
20
35
50
65
-40 -25 -10
80
5
20
35
50
65
80
Temp[℃ ]
Temp[℃ ]
Fig-28-10 ICC (VCC) OFF (VCC = 15V)
Fig-28-11 FBRES
0.53 325.0 300.0 275.0 250.0 225.0 200.0 175.0 150.0 5
20
35
50
65
80
Temp[℃ ]
Fig-28-12 FB OVP 256 ms
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TSZ22111・15・001
0.40 FB Burst Voltage(VCC=12)[V]
CURLIM VOLTAGE(VCC=12)[V]
350.0 FB OVP 256ms(VCC=12)[ms]
125.0 Temp[℃ ]
20.0 -40 -25 -10
150.0 50.0 -40 -25 -10
80
Temp[℃ ]
-40 -25 -10
Fig-28-6 Soft Start2
34.0 4.0 -40 -25 -10
Soft Start 1
37.0 PMOS RON(VCC=12)[Ω]
NMOS RON(VCC=12)[Ω]
12.0 Fig-28-5
TIMER LATCH[us]
Fig-28-4
0.52 0.51 0.50 0.49 0.48 -40 -25 -10
5
20
35
50
65
80
Temp[℃ ]
Fig-28-13 CURLIM VOLTAGE
21/28
0.35 0.30 0.25 0.20 -40 -25 -10
5
20
35
50
65
80
Temp[℃ ]
Fig-28-14 FB Burst Voltage
Oct.2013.Rev.001
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
COMP pull up RES(VCC=12)[kΩ]
0.58 COMP LATCH detect voltage error[%]
COMP LATCH detect voltage[V]
5.00 0.61 0.55 0.52 0.49 0.46 0.43 3.00 1.00 ‐1.00 ‐3.00 0.40 ‐5.00 0.37 -40 -25 -10
5
20
35
50
65
-40 -25 -10
80
5
20
35
50
65
31.4 29.4 27.4 25.4 23.4 21.4 19.4 -40 -25 -10
80
Figure 27 COMP LATCH Detect Voltage
5
20
35
50
65
80
Temp[℃ ]
Temp[℃ ]
Temp[℃ ]
Figure 28 COMP LATCH Detect Voltage Error
Figure 29 COMP Pull Up RES
5.0 COMP pull up RES error(VCC=12)[%]
3.0 1.0 ‐1.0 ‐3.0 ‐5.0 -40 -25 -10
5
20
35
50
65
80
Temp[℃ ]
Figure 31 RCOMP
Figure 30 COMP Pull Up RES Error
0.530 TYP FREQ[kHz]
68.0 66.0 64.0 62.0 60.0 8.5
14.0
19.5
VCC[V]
Figure 33 TYP FREQ
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TSZ22111・15・001
25.0
4.02 0.525 RCOMP(VCC=12)[kΩ]
CURLIM VOLTAGE(VCC=12)[V]
70.0 Figure 32 RCOMP Error
0.520 0.515 0.510 0.505 0.500 0.495 0.490 3.92 3.82 3.72 3.62 3.52 3.42 0.485 0.480 3.32 8.5
14.0
19.5
25.0
VCC[V]
Figure 34 CURLIM VOLTAGE
22/28
8.5
14.0
19.5
25.0
VCC[V]
Figure 35 RCOMP
Oct.2013.Rev.001
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
(Application Circuit Example)
ACIN_L
F1
3.15A
AC250V
LP01
C21
2200pF/Y1
C2
0.22uF/X2
DA1
800V 10A
AC90V
-264V
ACIN_N
T1
10,11,12
1
24V
2A
D3
FRD
800V 0.5A
D4
SBD 60V
1A
D1
800V 0.1A
R8
150
R7
10
7,8,9
3
Q1
800V 5A
D2
800V 0.1A
Vout
C4
2200pF
500V
R6
47k
2W
C3
450V
100uF
C1
0.22uF/X2
D6
FRD
300V 5A
C12
35V
470uF
C11
35V
470uF
GND
R9
100k
R10
0.18
1W
R11
1k
4
R1
10k
R2
10k
C6
50V
10uF
R3
3.9M
R12
10
D5
200V 0.5A
IC1
BM1P061FJ
R15
2k
R16
1k
5
R4
short
R5
39k
R17
120k
R18
9.1k
C20
2200pF/Y1
C8
47pF
PC1
PC81
7
C7
1000pF
4
1
3
2
C10
0.1uF
U2
TL431
R20
12k
R19
15k
Figure 28. Application Circuit Example
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Application
Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Operation Modes of Protection Circuits
Table 3 lists the operation mode of each protection function.
Table 3. Protection Circuit Operation Modes
Function
Operation Mode
VCC Undervoltage Lock Out
FB Over Limit Protection
Auto-recovery
BM1Pxx1 Series: Auto-recovery (with 100us timer)
BM1Pxx2 Series: Latch (with 100us timer)
Auto-recovery (with 64us timer)
CS OPEN Protection
Auto-recovery (with 100us timer)
VCC Overvoltage Protection
● Sequence
The IC sequence is shown in Figures 29 and 30.
Transition to OFF mode occurs under all conditions when VCC exceeds 8.2V.
OFF MODE
Soft Start1
Soft Start2
Soft Start3
VCC OVP
( Pulse Stop)
Soft Start4
CS OPEN MODE
( Pulse Stop)
Normal MODE
OLP MODE
( Pulse Stop)
Burst & Low Power MODE
Figure 29. Sequence Diagram (BM1Pxx1 Series)
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
Figure 30. Sequence Diagram (BM1Pxx2 Series)
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Note
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Thermal Loss
In thermal design, set operation to within for the following conditions.
(The temperature shown below is guaranteed, so be sure to take margin into account.)
1. The ambient temperature Ta must be less than 85°C.
2. IC loss must be less than the power dissipation.
The thermal derating characteristics are follows. (PCB: 70mm x 70mm x 1.6mm glass epoxy substrate)
1000
900
800
700
Pd[mW]
600
500
400
300
200
100
0
0
25
図-19
50
75
SOP8 熱軽減特性
Ta[℃]
100
125
150
Figure 31. Thermal Derating Characteristics
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BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
Application
Note
Datasheet
● Usage Precautions
(1) Absolute maximum ratings
Damage may occur if the absolute maximum ratings are exceeded, such as for applied voltage or operating temperature
range. Since the type of damage (short/open circuit, etc.) cannot be determined, in cases where a special mode may
conceivably exceed the absolute maximum ratings, please consider implementing physical safety measures such as fuses.
(2) Power supply and ground lines
In the board pattern design, route the power supply and ground lines to achieve low impedance. If there are multiple
power supply and ground lines, be careful about interference due to common impedance in the wiring pattern. With regard
to ground lines in particular, make sure to isolate large current and small signal routes, including the external circuits. Also,
for all of the power supply pins in this IC, in addition to inserting capacitors between the power supply and ground pins,
please thoroughly verify any problems associated with capacitor characteristics, such as capacitance loss at low
temperatures, before determining constants.
(3) Ground potential
Please set the ground pin potential to the minimum potential for all operating modes.
(4) Pin shorts and mounting errors
When mounting the IC on a board, please pay attention to the orientation and direction of the IC and possible
misalignment. Incorrect mounting may damage the IC. Damage may also occur due to short circuit if foreign material is
introduced between IC pins, between a pin and the power supply, or between a pin and GND.
(5) Operation in strong magnetic fields
Please note that malfunction may occur if this product is used in a strong magnetic field.
(6) Input pins
In IC structures, parasitic elements are inevitably formed in relation to the potential. The operation of parasitic elements
can interfere with circuit operation, leading to malfunction and even damage. Therefore, please be careful to avoid usage
methods that enable parasitic elements to operate, such as by supplying a voltage lower than the ground voltage to the
input pin. Also, do not apply voltage to an input pin when there is no power supply voltage being supplied to the IC. In
fact, even if power supply voltage is being supplied, the voltage supplied to each input pin should be either below the
power supply voltage or within the guaranteed values in the electrical characteristics.
(7) External capacitors
When a ceramic capacitor is used as an external capacitor, please consider the possible drop in nominal capacitance
due to DC bias as well as capacitance fluctuation due to temperature and the like before determining constants.
(8) Thermal design
The thermal design should take into account the power dissipation (Pd) under actual conditions. Also, please ensure that
the output transistor does not exceed the rated voltage or ASO.
(9) Rush current
In a CMOS IC, rush current may momentarily flow if the internal logic is undefined when the power supply is turned ON,
so caution is needed with regard to the power supply coupling capacitance, the width of power supply and GND pattern
wires, and how they are laid out.
(10) Handling of test pins and unused pins
As noted in the function manual, application notes, and other documents, test pins and unused pins should be handled
so as not to cause problems under actual conditions. Please contact us regarding pins that are not otherwise described.
(11) Document contents
Documents such as application notes are design resources intended for use when designing applications, and as such
their contents are not guaranteed. Therefore, before finalizing an application, please conduct a thorough study and
evaluation, including of the external parts.
Regarding this document
The Japanese version of this document is considered the formal specifications. Therefore, this translated version should be
used only as a reference when reading the formal specifications.
Accordingly, the formal specifications take priority regarding any differences that arise in the translation.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
27/28
Oct.2013.Rev.001
Datasheet
BM1P061FJ / BM1P062FJ / BM1P101FJ / BM1P102FJ
● Part Number Selection
B
M
1
P
X
X
X
F
J
-
Package
FJ: SOP-J8
Part Number
E2
Packaging and Forming Specifications
E2: Reel-type embossed tape
● Packaging Diagram and Forming Specifications
SOP-J8
<Tape and Reel information>
4.9±0.2
(MAX 5.25 include BURR)
+6°
4° −4°
6
5
0.45MIN
7
3.9±0.2
6.0±0.3
8
1
2
3
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.545
0.2±0.1
0.175
1.375±0.1
S
1.27
0.42±0.1
Direction of feed
1pin
0.1 S
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
1 <Packaging Specifications>
2 Packaging Type Embossed tape
3 Package Quantity
4 Feed Direction
5
E2 (Direction: Pin 1 is at the upper left when holding the reel in the left hand and pulling the tape
out with the right) 6 Reel
7 Pin 1
8 Feed Direction
9 Order in multiples of the package count
● Marking Diagram
● Lineup
Part No. (BM1PXXXFJ)
BM1P101FJ
BM1P102FJ
BM1P061FJ
BM1P062FJ
Pin 1 Mark
1PXXX
Lot No.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
28/28
Oct.2013.Rev.001
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifications :
3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by
ROHM.
4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
any license to use or exercise intellectual property or other rights held by ROHM or any other
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of
such technical information.
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in
this document.
7) The Products specified in this document are not designed to be radiation tolerant.
8) For use of our Products in applications requiring a high degree of reliability (as exemplified
below), please contact and consult with a ROHM representative : transportation equipment (i.e.
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety
equipment, medical systems, servers, solar cells, and power transmission systems.
9) Do not use our Products in applications requiring extremely high reliability, such as aerospace
equipment, nuclear power control systems, and submarine repeaters.
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with
the recommended usage conditions and specifications contained herein.
11) ROHM has used reasonable care to ensur the accuracy of the information contained in this
document. However, ROHM does not warrants that such information is error-free, and ROHM
shall have no responsibility for any damages arising from any inaccuracy or misprint of such
information.
12) Please use the Products in accordance with any applicable environmental laws and regulations,
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting
non-compliance with any applicable laws or regulations.
13) When providing our Products and technologies contained in this document to other countries,
you must abide by the procedures and provisions stipulated in all applicable export laws and
regulations, including without limitation the US Export Administration Regulations and the Foreign
Exchange and Foreign Trade Act.
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of
ROHM.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2013 ROHM Co., Ltd. All rights reserved.
R1102A