Datasheet 5.5V to 28V Input, 2ch Synchronous Buck DC/DC Controller BD95602MUV-LB General Description Applications This is the product guarantees long time support in Industrial market. BD95602MUV-LB is a dual buck regulator controller with adjustable output voltage from1.0V to 5.5V and an input voltage range of 5.5 to 28V. High efficiency is achieved with an external synchronous Nch-MOSFET. H3RegTM, Rohm’s advanced proprietary control method that uses constant on-time control to provide ultra high transient responses to load changes is used. SLLM(Simple Light Load Mode) technology is added to improve efficiency with light loads giving high efficiency over a wide load range. In addition to the dual buck regulator controllers, here are 2 LDO regulators included that are fixed output voltage of 3.3V and 5.0V. Other functions included are soft start, variable frequency, short circuit protection with timer latch, over voltage, and power good outputs. This buck regulator is optimal for high-current applications. Industrial Equipment ,FPGA, POL Power Supply, Mobile PC, Desktop PC, LCD-TV, Digital Components, etc. Key Specifications Input Voltage Range: 5.5V to 28V Output Voltage Range: 1.0V to 5.5V Switching Frequency: 150k to 500MHz(Typ) Operating Temperature Range: -20°C to +85°C Package VQFN032V5050 W(Typ) x D(Typ) x H(Max) 5.00mm x 5.00mm x 1.00mm Features Long Time Support Product for Industrial Applications. Adjustable Simple Light Load Mode (SLLM), Quiet light Load Mode (QLLM), Forced continuous Mode. Multifunctional Protection Circuit -Settable Over Current Protection (OCP) -Thermal Shut down (TSD) -Under Voltage Lock Out (UVLO) -Over Voltage Protection (OVP) -Short Circuit Protection with Timer-Latch (SCP) 150kHz to 500kHz Switching frequency. Adjustable Soft Start. Power Good. Dual Linear Regulator (5V/3.3V (total 50mA)). Output Discharge. Reference voltage Circuit (0.7V). ○Product structure : Silicon monolithic integrated circuit www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 VQFN032V5050 ○This product has no designed protection against radioactive rays 1/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB R8 R25 16 15 14 13 12 11 10 9 MCTL2 FS1 FB1 AGND REF FB2 FS2 CTL C4 R7 R15 R26 R16 Typical Application Circuit R5 17 ILIM1 R6 ILIM2 8 18 MCTL1 VO2 7 19 SS1 SS2 6 C5 C6 20 PGOOD1 PGOOD2 5 U1 U1 BD95602MUV BD95602MUV-LB 21 EN1 23 HG1 HG2 2 Q3 Q1 C7 BOOT2 3 C8 22 BOOT1 C9 EN_2.5 EN2 4 C12 EN_3.3 REG2 REG1 VIN LG2 PGND2 26 27 28 29 30 31 32 C1 C2 C3 Q4 C29 VO1 25 2.5V SW2 1 Q2 C19 LG1 L2 24 SW1 PGND1 L1 3.3V +12V REG1_5V REG2_3.3V GND PGND Figure 1. Application Circuit SW1 HG1 BOOT1 EN1 PGOOD1 SS1 MCTL1 ILIM1 Pin Configuration 24 23 22 21 20 19 18 17 PGND1 25 16 MCTL2 LG1 26 15 FS1 Vo1 27 14 FB1 REG2 28 13 AGND FIN 9 CTL SW2 1 2 3 4 5 6 7 8 ILIM2 PGND2 32 Vo2 10 FS2 SS2 LG2 31 PGOOD2 11 FB2 EN2 VIN 30 BOOT2 12 REF HG2 REG1 29 Figure 2. Pin Configuration www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Pin Descriptions Pin No. Pin Name 1 24 SW2 SW1 Ground pin for High-side FET. The maximum voltage range of this pin is 30V. 2 23 HG2 HG1 High-side FET gate drive pin. 3 22 BOOT2 BOOT1 4 21 EN2 EN1 5 20 PGOOD2 PGOOD1 6 19 SS2 SS1 This is the setting pin for soft start. The rising time is determined by the capacitor connected between SS and ground, and the fixed current inside IC after it is the status of low in standby mode. It controls the output voltage till SS voltage catch up the REF pin to become the SS terminal voltage. 7 27 VO2 VO1 This is the output discharge pin, and output voltage feedback pin for frequency setting. 8 17 ILIM2 ILIM1 This is the coil current limit setting pin. Set the resistor which is connected in between ground. 9 CTL When CTL pin voltage is at least 2.3V, the status of the linear regulator REG1 and REG2 output becomes active. Conversely, the status switches off when CTL pin voltage goes lower than 0.8V. The switching regulator doesn’t become active when the status of CTL pin is low, if the status of EN pin is high. This pin is pulled up to VIN with 1MΩ resistor. 10 15 FS2 FS1 Frequency input. A resistor to ground will set the switching frequency. Frequencies from 150kHz to 500kHz are possible. 11 14 FB2 FB1 This is the output voltage feedback pin. The IC controls reference voltage and FB terminal voltage are almost same. 12 REF This is the output voltage setting pin. The IC controls reference voltage and FB terminal voltage are almost same. 13 AGND 16 18 MCTL2 MCTL1 25 32 PGND1 PGND2 26 31 LG1 LG2 28 REG2 29 REG1 30 VIN FIN FIN Function This is the power supply pin for High-side FET driver. The maximum voltage range to ground is to 35V, to SW pin is to 7V. In switching operations, the voltage swings from (VIN+REG1) to REG1 by BOOT pin operation. When EN pin voltage is at least 2.3V, the status of the switching regulator becomes active. Conversely, the status switches off when EN pin voltage goes lower than 0.8V. This pin is pulled down to AGND with 1MΩ resistor. If FB pin voltage is 15% or less of reference voltage, it will output low level. The output format is open drain, so please connect pull-up resistance. Ground input for control circuit. This is the operation mode setting pin. If terminal voltage reaches less than 0.8V, it will be Low Level. If terminal voltage reaches more than 2.3V, it will be High Level. This pin is pulled down to AGND with 300kΩ resistor. Input Control Mode MCTL1 MCTL2 Low Low SLLM Low High QLLM High Low Continuous PWM Mode High High Continuous PWM Mode This is the ground pin for Low-side FET drive. This is the Low-side FET gate drive pin. It is operated in switching between REG1 to PGND. ON resistance of output stage when High, it is 2Ω and when Low, it is 0.5Ω drive Low-side FET gate with the high pace. This is the output pin for 3.3V/50mA linear regulator (5V/3.3V (total 50mA)). Please connect 10µF capacitor which characteristic is more than X5R near the pin. This is the output pin for 5V/50mA linear regulator (5V/3.3V (total 50mA)). Please connect 10µF capacitor which characteristic is more than X5R near the pin. Supply pin of H3RegTM control circuit and linear regulator. Monitor input voltage and determine necessary on-time. As a result, this terminal voltage changes, and then the IC operation become unstable. Please connect 10µF capacitor which characteristic is more than X5R near the pin. This is the thermal PAD. Please connect to the ground. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Output condition table Input Output CTL EN1 EN2 REG1(5V) REG2(3.3V) DC/DC1 DC/DC2 Low Low Low OFF OFF OFF OFF Low Low High OFF OFF OFF OFF Low High Low OFF OFF OFF OFF Low High High OFF OFF OFF OFF High Low Low ON ON OFF OFF High Low High ON ON OFF ON High High Low ON ON ON OFF High High High ON ON ON ON * CTL pin is connected to VIN pin with 1MΩ resistor(pull up) internal IC. * EN pin is connected to AGND pin with 1MΩ resistor(pull down) internal IC. 3 2 1 31 32 22 PGND1 SW1 23 LG1 HG1 BOOT1 PGND2 LG2 SW2 HG2 BOOT2 VIN VIN Vo2 Adjustable Vo1 Adjustable Block Diagram 24 26 25 REG1 REG1 REG1 REG1 CL2 SCP2 OVP2 AGND Short through Protection Circuit Short through Protection Circuit SLLMTM Block SLLMTM Block 13 CL1 SCP1 OVP1 FS1 FS2 UVLO EN2 REF FB2 11 REG1 SCP1 Timer EN1 FB1 Thermal Protection 14 6 REF 12 SS1 19 ILIM2 ILIM1 17 3.3V Reg EN2 SW1 PGND1 SLLM Mode Control MCTL 5V Reg Vo1 Reference Block REG1 PGND2 SW2 REF 8 CL1 Over Current Protect CL2 Over Current Protect SS2 PGOOD1 Power Good H Reg Controller Block FS1 20 Timer FS2 Short Circuit Protect H Reg Controller Block TM OVP1 3 TM Over Voltage Protect MCTL REF 3 MCTL TSD OVP2 Timer Short Circuit Protect Timer Power Good Over Voltage Protect SCP2 REG1 5 PGOOD2 RFS1 15 10 EN1 4 5V 5.5～28V 16 Vo1 18 MCTL2 REG2 REG2 REG1 28 MCTL1 29 27 3.3V 30 REG1 VIN 9 VIN 7 CTL Vo2 21 Figure 3. Block Diagram www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Absolute Maximum Ratings(Ta = 25°C) Parameter Symbol Rating Unit Conditions VIN, CTL, SW1, SW2 30 V Note 1 6 V Note 1, Note 2 REG1+0.3 V Note 1 BOOT1, BOOT2 35 V Note 1, Note 2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 7 V Note 1, Note 2 HG1 BOOT1+0.3 V Note 1, Note 2 HG2 BOOT2+0.3 V Note 1, Note 2 PGND1, PGND2 AGND±0.3 V Note 1, Note 2 Power Dissipation1 Pd1 0.38 W Note 3 Power Dissipation2 Pd2 0.88 W Note 4 Power Dissipation3 Pd3 3.26 W Note 5 Power Dissipation4 Pd4 4.56 W Note 6 EN1, EN2, PGOOD1, PGOOD2 Vo1, Vo2, MCTL1, MCTL2 FS1, FS2, FB1, FB2, ILIM1, ILIM2, SS1, SS2, LG1, LG2, REF,REG2 Terminal Voltage Operating Temperature Range Topr -20 to +85 °C Storage Temperature Range Tstg -55 to +150 °C Junction Temperature Tjmax +150 °C (Note 1) Not to exceed Pd. (Note 2) Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. (Note 3) Derating in done 3.0 mW/°C for operating above Ta ≥ 25°C (when don’t mounted on a heat radiation board). (Note 4) Derating in done 7.0 mW/°C for operating above Ta ≥ 25°C (Mount on 1-layer 74.2mm x 74.2mm x 1.6mm board). Surface heat dissipation copper foil:20.2mm2. (Note 5) Derating in done 26.1 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board Two sides heat dissipation copperfoil:20.2mm2. 2 or 3-layer : heat dissipation copper foil : 5505mm2). (Note 6) Derating in done 36.5 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board) All layers heat dissipation copper foil:5505mm2. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25°C) Parameter Symbol Min Typ Max Unit VIN 5.5 - 28 V CTL -0.3 - 28 V EN1, EN2, MCTL1, MCTL2 -0.3 - 5.5 V BOOT1, BOOT2 4.5 - 33 V SW1, SW2 BOOT1-SW1, BOOT2-SW2, HG1-SW1, HG2-SW2 Vo1, Vo2, PGOOD1, PGOOD2 -0.3 - 28 V -0.3 - 5.5 V -0.3 - 5.5 V TONMIN - - 150 nsec Terminal Voltage Minimum ON Time Conditions This product should not be used in a radioactive environment. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Electrical Characteristics (Unless otherwise noted, Ta=25°CVIN=12V, CTL=OPEN, EN1=EN2=5V, FS1=FS2=51kΩ) Parameter VIN Standby Current Symbol Min Typ Max Unit Conditions ISTB 70 150 250 μA EN1= EN2= 0V, CTL= 5V IIN 60 130 230 μA Vo1= 5V ISHD 6 12 18 μA CTL= 0V CTL Low Voltage VCTLL -0.3 - 0.8 V CTL High Voltage VCTLH 2.3 - 28 V CTL Bias Current ICTL -18 -12 -6 μA EN Low Voltage VENL -0.3 - 0.8 V EN High Voltage VENH 2.3 - 5.5 V EN Bias Current IEN - 3 6 μA EN= 3V VREG1 4.90 5.00 5.10 V IREG1=1mA Maximum Current IREG1 50 - - mA IREG2= 0mA, (Note 7) Line Regulation REG.I1 - 90 180 mV VIN= 5.5 to 28V Load Regulation REG.L1 - 30 50 mV IREG1= 0 to 30mA VREG2 3.27 3.30 3.33 V Maximum Current IREG2 50 - - mA IREG1= 0mA, (Note 7) Line Regulation REG.I2 - - 20 mV VIN= 5.5 to 28V Load Regulation REG.L2 - - 30 mV IREG2= 0 to 30mA REG1th 4.1 4.4 4.7 V Input Delay Time TREG1 1.5 3 6 ms Switch Resistance RREG1 - 1.0 3.0 Ω REG1_ UVLO 3.9 4.2 4.5 V dV_ UVLO 50 100 200 mV Feedback Voltage1 VFB1 0.693 0.700 0.707 V FB1 Bias Current IFB1 - 0 1 μA VIN Bias Current VIN Shut Down Mode Current CTL= 0V 5V Linear Regulator -VIN REG1 Output Voltage 3.3V Linear Regulator REG2 Output Voltage IREG2= 1mA 5V Linear Regulator -Vo1 Input Threshold Voltage Vo1: Sweep up Under Voltage Lock Out Block REG1 Threshold Voltage Hysteresis Voltage REG1: Sweep up REG1: Sweep down Output Voltage Sense Block Output Discharge Resistance1 Feedback Voltage2 RDISOUT1 50 100 200 Ω VFB2 0.693 0.700 0.707 V FB1= REF IFB2 - 0 1 μA RDISOUT2 50 100 200 Ω On Time1 tON1 0.760 0.910 1.060 μs Vo1= 5V,FS1= 51kΩ On Time2 tON2 0.470 0.620 0.770 μs Vo2= 3.3V ,FS2= 51kΩ FB2 Bias Current Output Discharge Resistance2 FB2= REF H3REGTM Control Block Maximum On Time 1 tONMAX1 2.5 5 10 μs Vo1= 5V Maximum On Time 2 tONMAX2 1.65 3.3 6.6 μs Vo2= 3.3V Minimum Off Time tOFFMIN - 0.2 0.4 μs HG High Side ON Resistance HGHON - 3.0 6.0 Ω HG Low Side ON Resistance HGLON - 2.0 4.0 Ω LG High Side ON Resistance LGHON - 2.0 4.0 Ω LG Low Side ON Resistance LGLON - 0.5 1.0 Ω FET Driver Block (Note 7) IREG1+IREG2 ≤ 50mA. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Electrical Characteristics (Unless otherwise noted, Ta=25°CVIN=12V, CTL=OPEN, EN1=EN2=5V, FS1=FS2=51kΩ) Over Voltage Protection Block OVP Threshold Voltage OVP Hysteresis VOVP dV_OVP 0.77 (+10%) 50 0.84 0.91 (+20%) (+30%) 150 300 0.49 (-30%) 0.75 0.56 (-20%) 1.5 ms mV V mV Output Short Protection Block SCP Threshold Voltage VSCP Delay Time TSCP 0.42 (-40%) 0.4 dVSMAX 80 100 120 0.595 (-15%) 0.1 0.665 (-5%) 0.2 V Over Current Protection Block Offset Voltage ILIM= 100kΩ Power Good Block VPGL 0.525 (-25%) - Delay Time TPGOOD 0.4 0.75 1.5 ms Power Good Leakage Current ILEAKPG -2 0 2 μA Charge Current ISS 1.5 2.3 3.1 μA Standby Voltage VSS_STB - - 50 mV MCTL Low Voltage VMCTL_L -0.3 - V MCTL High Voltage VMCTL_H 2.3 - MCTL Bias Current IMCTL 8 16 0.3 REG1 +0.3 24 Power Good Low Threshold Power Good Low Voltage VPGTHL V V IPGOOD= 1mA VPGOOD= 5V Soft Start Block Mode Control Block www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/39 V μA MCTL= 5V TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves (Reference data) HG 10V/div HG 10V/div SW 10V/div SW 10V/div LG 5V/div LG 5V/div 2μs 2μs Figure 4. Switching Waveform (Vo= 5V, Io= 0A, PWM) グラフ中の文字は 9pt Figure 5. Switching Waveform (Vo= 5V, Io= 8A, PWM) HG 10V/div HG 10V/div SW 10V/div SW 10V/div LG 5V/div LG 5V/div 10μs 10μs Figure 6. Switching Waveform (Vo= 5V, Io= 0A, QLLM) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 7. Switching Waveform (Vo= 5V, Io= 0A, SLLM) 8/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued HG 10V/div HG 10V/div SW 10V/div SW 10V/div LG 5V/div LG 5V/div 2μs 2μs Figure 8. Switching Waveform (Vo= 3.3V, Io= 0A, PWM) Figure 9. Switching Waveform (Vo= 3.3V, Io= 8A, PWM) HG 10V/div HG 10V/div SW 10V/div SW 10V/div LG 5V/div LG 5V/div 10μs 10μs Figure 10. Switching Waveform (Vo= 3.3V, Io= 0A, QLLM) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 11. Switching Waveform (Vo= 3.3V, Io= 0A, SLLM) 9/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued HG 10V/div HG 10V/div SW 10V/div SW 10V/div LG 5V/div LG 5V/div 2μs 2μs Figure 12. Switching Waveform (Vo= 1V, Io= 0A, PWM) Figure 13. Switching Waveform (Vo= 1V, Io= 8A, PWM) HG 10V/div HG 10V/div SW 10V/div SW 10V/div LG 5V/div LG 5V/div 10μs 10μs Figure 14. Switching Waveform (Vo= 1V, Io= 0A, QLLM) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 15. Switching Waveform (Vo= 1V, Io= 0A, SLLM) 10/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued 100 100 80 80 5V 60 7V η [%] η [%] 7V 12V 21V 40 40 20 20 0 0 1 10 100 Io[mA] 1000 21V 1 10000 Figure 16. Efficiency (Vo= 5V, PWM) 10 100 Io[mA] 1000 10000 Figure 17. Efficiency (Vo= 5V, QLLM) 100 100 7V 80 80 12V 21V 60 η [%] η [%] 12V 60 40 20 7V 12V 60 21V 40 20 0 1 10 100 1000 0 10000 1 Io[mA] Figure 18. Efficiency (Vo= 5V, SLLM) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10 100 Io[mA] 1000 10000 Figure 19. Efficiency (Vo= 3.3V, PWM) 11/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued 100 100 7V 80 80 12V 12V 21V 60 η[%] η[%] 7V 60 21V 40 40 20 20 0 0 1 10 100 Io[mA] 1000 1 10000 10 1000 10000 Figure 21. Efficiency (Vo= 3.3V, SLLM) Figure 20. Efficiency (Vo= 3.3V, QLLM) 100 100 80 80 7V 100 Io[mA] 12V 7V 12V 60 η[%] η[%] 60 21V 21V 40 40 20 20 0 0 1 10 100 1000 10000 Io[mA] 10 100 1000 10000 Io[mA] Figure 22. Efficiency (Vo= 1V, PWM) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 Figure 23. Efficiency (Vo= 1V, QLLM) 12/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued 100 7V 80 η[%] Vo 100mV/div 60 12V 21V 40 IL 5A/div IO 5A/div 20 20μs 0 1 10 100 1000 10000 Io[mA] Figure 24. Efficiency (Vo= 1V, SLLM) Figure 25. Transient Response (Vo= 5V, PWM, Io= 0A→8A) Vo 100mV/div Vo 100mV/div IL 5A/div IO 5A/div IL 5A/div IO 5A/div 20μs 20μs Figure 26. Transient Response (Vo= 5V, PWM, Io= 8A→0A) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 27. Transient Response (Vo= 3.3V, PWM, Io= 0A→8A) 13/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued Vo 100mV/div Vo 100mV/div IL 5A/div IO 5A/div IL 5A/div IO 5A/div 20μs 20μs Figure 28. Transient Response (Vo= 3.3V, PWM, Io= 8A→0A) Figure 29. Transient Response (Vo= 1V, PWM, Io= 0A→8A) Vo 100mV/div 20μs IL 5A/div IO 5A/div Figure 30. Transient Response (Vo= 1V, PWM, Io= 8A→0A) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Vo 50mV/div 2μs Figure 31. Output Voltage (Vo= 5V, PWM, Io= 0A) 14/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued Vo 50mV/div 2μs Vo 50mV/div 10μs Figure 32. Output Voltage (Vo= 5V, PWM, Io= 8A) Figure 33. Output Voltage (Vo= 5V, QLLM, Io= 0A) Vo 50mV/div Vo 50mV/div 2μs 2μs Figure 34. Output Voltage (Vo= 5V, SLLM, Io= 0A) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 35. Output Voltage (Vo= 3.3V, PWM, Io= 0A) 15/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued Vo 50mV/div Vo 50mV/div 10μs 2μs Figure 36. Output Voltage (Vo= 3.3V, PWM, Io= 8A) Figure 37. Output Voltage (Vo= 3.3V, QLLM, Io= 0A) Vo 50mV/div Vo 50mV/div 2μs 2μs Figure 38. Output Voltage (Vo= 3.3V, SLLM, Io= 0A) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 39. Output Voltage (Vo= 1V, PWM, Io= 0A) 16/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued Vo 50mV/div Vo 50mV/div 10μs 2μs Figure 40. Output Voltage (Vo= 1V, PWM, Io= 8A) Figure 41. Output Voltage (Vo= 1V, QLLM, Io= 0A) EN1 5V/div Vo1 2V/div Vo 50mV/div EN2 5V/div Vo2 2V/div 400μs 2μs Figure 42. Output Voltage (Vo= 1V, SLLM, Io= 0A) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 43. Start-up (EN1= EN2) 17/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued EN1 5V/div Vo1 2V/div EN1 5V/div Vo1 2V/div EN2 5V/div EN2 5V/div Vo2 2V/div Vo2 2V/div 40ms 40ms Figure 44. Start-up (EN2→EN1) Figure 45. Start-up (EN1→EN2) IOUT-frequency (VOUT=5V, R(FS)=68kΩ ) 500 EN2 5V/div PGOOD2 2V/div 40ms 450 frequency [kHz] EN1 5V/div PGOOD1 2V/div 400 VIN=7.5V VIN=12V VIN=18V 350 300 0 Figure 46. Start-up (EN1/2→PGOOD1/2) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 2 3 4 IOUT [A] 5 6 7 Figure 47. Io-frequency (Vo= 5V, PWM, RFS= 68kΩ) 18/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued IOUT-frequency (VOUT=5V, R(FS)=68kΩ ) 2.5 500 VOUT=5V 2 VOUT=3.3V ONTIME [usec] frequency [kHz] 450 400 VIN=7.5V VIN=12V VIN=18V 350 1.5 1 0.5 0 300 0 1 2 3 4 IOUT [A] 5 6 0 7 50 100 150 RFS [kΩ ] Figure 49. On time-RFS Figure 48. lo-frequency (Vo= 3.3V, PWM, RFS= 68kΩ) 700 5.500 5.000 500 VOUT=5V 4.500 VOUT=3.3V 4.000 VIN=7.5V(-5℃） VIN=21V（-5℃） VIN=7.5V(75℃） VIN=21V（75℃） 3.500 400 VOUT [V] frequency [kHz] 600 300 3.000 2.500 2.000 200 1.500 1.000 100 0.500 0 0.000 0 50 100 150 0 RFS [kΩ ] 4 6 8 10 12 14 16 IOUT [A] Figure 50. SW Frequency-RFS www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2 Figure 51. Current Limit (Vo= 5V) 19/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Typical Performance Curves - continued IOUT - REG1 voltage 5.1 3.500 3.000 5 VOUT [V] 2.500 REG1 voltage [V] VIN=7.5V(-5℃） VIN=21V（-5℃） VIN=7.5V(75℃） VIN=21V（75℃） 2.000 1.500 1.000 4.9 4.8 4.7 4.6 0.500 4.5 0.000 0 2 4 6 8 IOUT [A] 10 12 14 16 0 50 100 150 200 250 IOUT [mA] Figure 53. REG1 Load Regulation Figure 52. Current Limit (Vo= 3.3V) IOUT - REG2 voltage 3.4 REG2 voltage [V] 3.3 3.2 3.1 3 2.9 2.8 0 50 100 150 200 250 IOUT [mA] Figure 54. REG2 Load Regulation www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Description of Block BD95602MUV-LB is a dual channel synchronous buck regulator using H3RegTM, Rohm’s latest constant on-time controller technology. Fast load response is achieved by controlling the output voltage using a comparator without relying on the switching frequency. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it serves to improve the regulator’s transient response. Activation of the light load mode further increases efficiency by using VIN Simple Light Load Mode (SLLM) control. H3RegTM Control Comparator for Output voltage control VOUT/VIN Circuit HG FB A ○ Driver B ○ Internal Reference Voltage REF SW VOUT LG Transient Circuit (Normal operation) FB When FB falls to a reference voltage (REF), the drop is detected, activating the H3RegTM control system REF VOUT VIN tON = LG HG output on-time is determined by the formula (1). When HG is off, LG is on until the output voltage becomes FB= REF. After the status of HG is off, LG go on outputting until output voltage become FB= REF. (VOUT drops due to a rapid load change) FB [sec]・・・(1) When VOUT drops due to a rapid load change, and the voltage remains below the output setting following the programmed tON time, the system quickly restores VOUT by extending the tON time, thus improving the transient response. Once VOUT is restored, the controller continues normal operation. REF Io x 1 f HG tON +α HG LG (When VIN drops) VIN tON 1 t ON 2 t ON 4+α t ON 4 t ON 3 H3 RegTM HG t OFF 1 t OFF2 t OFF 3 t OFF 4=t OFF3 t OFF 4=t OFF3 LG FB FB=REF REF Output voltage drops Based on the value of VIN, the on-time tON and off-time tOFF are determined by tON= VOUT / VIN x I/f and tOFF= (VIN- VOUT )/VIN. As the VIN voltage drops, in order to maintain the output voltage, tON becomes longer and tOFF is shorter. However, for normal operation, if VIN drops further, tON is longer and tOFF= tminoff (minimum off- time is defined internally), the output voltage will decrease because tOFF cannot be any shorter than the minimum off-time. With H3RegTM, if VIN goes even lower, the output voltage is maintained as the tON time is extended. (tON time is extended until FB>REF). In this case, the switching frequency is lowered so that the tON time can be extended. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Description of Block - continued Light Load Control (SLLM) FB SLLM will activate when the LG pin is off and the coil current is near 0A (current flows from VOUT to SW). When the FB input is lower than the REF voltage again, HG will be enabled once again. REF HG LG 0A (QLLM) FB QLLM will activate when the LG pin is off and the coil current is near 0A (current flows from VOUT to SW). In this case, the next HG is prevented. Then, when FB falls below the output programmed voltage within the programmed time (Typ= 40μs), HG will resume. In the case where FB doesn’t fall in the programmed time, LG is forced on causing VOUT to fall. As a result, the next HG is on. REF HG LG 0A MCTL1 MCTL2 Control Mode Start-up L L L H SLLM QLLM PWM PWM H X PWM PWM *Attention: To effect the rapid transient response, the H3RegTM control monitors the current from the output capacitor to the load using the ESR of the output capacitor Do not use ceramic capacitors on COUT side of power supply. Ceramic bypass capacitors can be used near the individual loads if desired. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/39 The BD95602MUV-LB operates in PWM mode until the SS input reaches the clamp voltage (2.5V), regardless of the control mode setting, this assures stable operation while the during soft start. COUT Load TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Timing Chart ・Soft Start Function Soft start is exercised with the EN pin set high. Current control takes effect at startup, enabling a moderate output voltage “ramping start.” Soft start timing and incoming current are calculated with formulas (2) and (3) below. EN tSS SS ・Soft start time 0.7(Typ) x CSS tSS = 2.3μA(Typ) VOUT IIN [sec] ・・・(2) CSS(pF) Soft start time(ms) 18000 5 33000 10 68000 20 ・ Inrush current Co x VOUT VOUT [A] ・・・(3) VIN (Css: Soft start capacitor Co: Output capacitor) Iin www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/39 = tSS x TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Timing Chart - continued ・Notes when waking up with CTL pin or VIN pin If EN pin is high or short (or pull up resistor) to REG1 pin, IC starts up by switching CTL pin, the IC might fail to start up (SCP function) with the reason below, please be careful of SS pin and REF pin capacitor capacity. REG1 REG2 FB VIN CTL BG Inner Reference Circuit SCP circuit Delay SCP REF SCP_REF 1ms(Typ) SCP PWM SS (Switching control signal) CTL (Vin) REG1(5V) REG2(3.3V) SCP invalid for SS has not reached 1.5V. SS SCP becomes valid from the point SS reached 1.5V. about 1.5V FB FB SCP_REF SCP is effective at SCP_REF>FB condition. SCP protection (function) activates when output shorts and FB falls below the activation standard of SCP. FB SCP valid area Inclination of REF is influenced by the external condenserconnected to REF. REF FB SCP is valid here, because this is SCP valid area and also because FB fall below SCP_REF. SCP will be effective with EN=ON at this section. SCP is valid here,but with FB exceeding SCP_REF it is normally activate-able area. EN Start up NG SW SCP EN Start up OK SW www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ? To be accurate,Delay occurs after SCP activating. But this shows the relationship of each signals briefly. 24/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Output Discharge It will be available to use if connecting VOUT pin to DC/DC output. (about 100Ω) . Discharge function operates when <1> EN=’L’ <2> UVLO= ON(If input voltage is low) <3> SCP latch <4> TSD= ON. The function at output discharge time is shown as left. VIN,CTL EN [1] When switch to low from high with EN pin. If EN pin voltage is below than EN threshold voltage, output discharge function is operated, and discharge output capacitor charge. VOUT VIN, CTL REG1 VOUT The efficiency of VIN voltage drop output discharge Output discharge Output Hi-Z [2] When switch to low from high with EN pin 1) IC is in normal operation until REG1 voltage becomes lower than UVLO voltage. However, because VIN voltage also becomes low, output voltage will drop, too. 2) If REG1 voltage reaches the UVLO voltage, output discharge function is operated, and discharge output capacitor charge. 3) In addition, if REG1 voltage drops, inner IC logic cannot operate, so that output discharge function does not work, and becomes output Hi-z. (In case, FB has resistor against ground, discharge at the resistor. ) UVLO ON ・Timer Latch Type Output Short Circuit Protection FB Short protection is enabled when the output voltage falls to or below REF X 0.7. Once the programmed time period has elapsed, the output is latched off to prevent destruction of the circuit. (HG= Low, LG= Low) Output voltage can be restored either by cycling the EN pin or disabling UVLO. REF x 0.7 SCP 0.75ms(Typ) EN / UVLO ・Over Voltage Protection When the output voltage increases to or above REF x 1.2(Typ), output over voltage protection is enabled, and the Low-side FET turns on to reduce the output. (LG= High, HG= Low). When the output falls to within normal operation, the function is restored to normal operation. REF x 1.2 FB HG LG Switching www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB ・Over current protection circuit tON tON tON tON During normal operation, if FB is less than REF, HG is high during the time tON, but when the coil current exceeds the ILIMIT threshold, HG is set to off. The next pulse returns to normal operation if the output voltage drops after the maximum on-time or IL becomes lower than ILIMIT. HG LG tOFF1 tOFF1 tOFF1 tOFFα IL Over current protection setting value www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 OCP detection 26/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Selection of Components Externally Connected 1.Inductor (L) selection The inductor value is a major influence on the output ripple current. As formula (4) below indicates, the greater the inductor or the switching frequency, the lower the ripple current. ΔIL ΔIL= VIN (VIIN-VOUT) x VOUT [A]・・・(4) L x VIN x f Generally, lower inductance values offer faster response times but also result in increased output ripple and lower efficiency. IL VOUT 0.47µH to 2.2µH are recommended as appropriate setting value. L Co The peak current rating of coil is approximated by formula (5). Please select inductor which is higher than this value. (VIN-VOUT) x VOUT ILPEAK= IOUTMAX + Output ripple current 2 x L x VIN x f [A]・・・(5) *Passing a current larger than inductor’s rated current will cause magnetic saturation in the inductor and decrease system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the inductor rated current value. *To minimize possible inductor damage and maximize efficiency, choose an inductor with a low (DCR, ACR) resistance. 2. Output Capacitor (CO) Selection VIN The output capacitor should be determined by equivalent series resistance and equivalent series inductance so that the output ripple voltage is 30mV or more. The rating of the capacitor is selected with sufficient margin given the output voltage. VOUT L ESR ΔVOUT =ΔIL x ESR+ESL x ΔIL / tON・・・(6) Load ESL CEXT ΔIL: Output ripple current ESR: Equivalent series resistance, ESL: Equivalent series inductance Co Output Capacitor Please give due consideration to the conditions in formula (7) below for the output capacitor, bearing in mind that the output start-up time must be established within the soft start timeframe. Capacitors used as bypass capacitors are connected to the load side affect the overall output capacitance (CEXT, figure above). Please set the soft start time or over-current detection value, regarding these capacities. Co+CEXT ≤ TSS x (Limit- IOUT) VOUT TSS : Soft start time Limit : Over current detection ・・・(7) Note: If an inappropriate capacitor is used, OCP may be detected during activation and may cause startup malfunctions. 3. Input Capacitor (Cin) Selection The input capacitor selected must have low enough ESR to fully support high output ripple so as to prevent extreme over current conditions. The formula for ripple current IRMS is given in (8) below. VIN Cin √VOUT (VIN-VOUT) VOUT L IRMS= IOUT x Co [A]・・・(8) VIN IOUT Where VIN= 2 x VOUT, IRMS= 2 Input Capacitor A ceramic capacitor is recommended to reduce ESR loss and maximize efficiency. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB 4.MOSFET Selection High-side driver and Low-side driver are designed to activate N channel MOSFET’s with low on-resistance. The chosen MOSFET may result in the loss described below, please select a proper FET for each considering the input-output and load current. VIN High-side MOSFET < Loss of High-side MOSFET > VOUT Pmain= PRON+PTRAN L Co VOUT = PGND (Tr+Tf) x VIN x IOUT x f x RON x IOUT2 + 6 VIN ・・・(9) (Ron: On-resistance of FET f: Switching frequency Tr: Rise time, Tf: Fall time) PGND Low-side MONFET < Loss of Low-side MOSFET > Psyn= PRON = VIN -VOUT VIN x RON x IOUT2 ・・・(10) The High-side MOSFET generates loss when switching, along with the loss due to on-resistance. Good efficiency is achieved by selecting a MOSFET with low on-resistance and low Qg (gate total charge amount). Recommended MOSFETs for various current values are as follows: Output current High-side MOSFET Low-side MOSFET to 5A RQ3E080GN RQ3E100GN 5 to 8A RQ3E120GN RQ3E150GN 8 to 10A RQ3E150GN RQ3E180GN 5. Output Voltage Set Point This IC operates such that output voltage is REF ≌ FB. <Output Voltage> (R1+R2) VOUT = R2 1 ΔVOUT 2 x REF(0.7V)+ (ΔVOUT: Output ripple voltage) (ΔIL: ripple current of coil) ΔVOUT =ΔIL x ESR ΔIL =( VIN - VOUT) x VOUT (L x VIN x f) L: inductance[H] f: switching frequency[Hz] *(Notice)Please set output ripple voltage more than 30mV to 50mV. (Example) VIN= 20V, VOUT= 5V, f= 300kHz, L= 2.5µH, ESR= 20mΩ, R1= 56kΩ, R2= 9.1kΩ 5V ΔIL =(20V-5V) x =5(A) (2.5 x 10-6H x 20V x 300 x 103Hz) ΔVOUT =5A x 20 x 10-3Ω= 0.1(V) VOUT = 0.7V x (51kΩ+ 9.1kΩ) + 9.1kΩ 1 2 x 0.1V=5.057(V) VIN H3REG CONTROLLER REF VIN R SLLM Q Output voltage Driver Circuit S SLLM FB R1 R2 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB 6. Setting over current protection VIN The on resistance (between SW and PGND) of the low side MOSFET is used to set the over current protection. Over current reference voltage (ILIM_ref) is determined as in formula(11) below. L VOUT ILIM_ref = SW CO (RILIM: Resistance for setting of over current voltage protection value[kΩ] RON: Low-side on resistance value of FET[mΩ]) PGND RILIM 10k [A]・・・(11) RILIM[kΩ] x RON[mΩ] Over current protection is actually determined by the formula (12) below. 1 Iocp = ILIM_ref + 2 ΔIL 1 V - VO x I x Vo ・・・(12) x IN = ILIM_ref + VIN 2 f L Coil current ΔIL:Coil ripple current[A] VIN:Input voltage[V] VO:Output voltage [V] f:Switching frequency [HZ] L:Inductance [H] IOCP ILIM_ref (Example) If a load current 5A is desired with VIN=6 to 19V, VOUT=5V, f=400kHZ, L=2.5µH, RON=20mΩ, the formula would be: IOCP= 10k 1 + RILIM[kΩ] ×RON[mΩ] 2 I x x VIN – VO x f L VO VIN >5 When VIN= 6V, IOCP will be minimum(this is because the ripple current is also minimum) so that if each condition is input, the formula will be the following: RILIM<109.1[kΩ]. *To design the actual board, please consider enough margin for FET on resistance variation, Inductance variation, IC over current reference value variation, and frequency variation. 7. Relation between output voltage and tON time For BD95602MUV-LB, both channels, are high efficiency synchronous regulator controllers with variable frequency. tON time varies with Input voltage [VIN], output voltage [VOUT], and RFS of FS pin resistance. See Figure 52 and Figure 53 for tON time. 3.5 2.5 VIN=7V VIN=7V 3 VIN=1 2V VIN=12V VIN=2 1V VIN=21V 2 ontime[us] ontime[us] 2.5 2 1.5 1.5 1 1 0.5 0.5 0 0 20 40 60 80 100 0 120 0 20 RFS[kΩ ] 40 60 80 100 120 RFS[kΩ ] Figure55. RFS – ontime(VOUT= 5V) Figure56. RFS – ontime(VOUT= 3.3V) From tON time, frequency on application condition is following: Frequency = VOUT VIN x 1 tON [kHz]・・・(13) However, real-life considerations (such as the external MOSFET gate capacitor and switching speed) must be factored in as they affect the overall switching rise and fall time, so please confirm by experiment. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB R26 R8 R25 16 15 14 13 12 11 10 9 MCTL2 FS1 FB1 AGND REF FB2 FS2 CTL C4 R7 R15 R16 Application Example (Vin= 12V, Vo1= 3.3V/8A, f1= 400kHz, Vo2= 2.5V/8A, f2= 400kHz) R5 17 ILIM1 R6 ILIM2 8 18 MCTL1 VO2 7 19 SS1 SS2 6 C5 C6 20 PGOOD1 PGOOD2 5 U1 U1 BD95602MUV BD95602MUV-LB 21 EN1 Q1 C12 C7 BOOT2 3 C8 22 BOOT1 C9 EN_2.5 EN2 4 23 HG1 HG2 2 Q3 EN_3.3 REG2 REG1 VIN LG2 PGND2 26 27 28 29 30 31 32 2.5V SW2 1 C1 C2 C3 Q4 C29 VO1 25 Q2 C19 LG1 L2 24 SW1 3.3V PGND1 L1 +12V REG1_5V REG2_3.3V GND PGND Figure 57. Application Example www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Reference Designator C1, C9, C10, C11, C12 C2, C3 C4, C5, C6 C7, C8 Type Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Ceramic Capacitor Value Description Manufacturer Part Number Manufacturer Configuration (mm) 10µF 35V, X5R, ±10% GRM32ER6YA106KA12 MURATA 3225 10µF 16V, X5R, ±10% GRM21BR61C106ME15 MURATA 2012 0.1µF 16V, X5R, ±10% GRM155R61C104KA88 MURATA 1005 0.47µF 10V, X5R, ±10% GRM188R61A474KA61 MURATA 1608 SANYO 7343 GLMC1R003A ALPS 6565 RQ3E150GN ROHM 3333 RQ3E180GN ROHM 3333 C18, C19, C28, C29 POSCAP 330µF L1,L2 Inductor 1µH Q1, Q3 MOSFET - Q2, Q4 MOSFET - R5, R6 Resistor 62kΩ 6.3V, ±20%, ESR 18mΩmax ±20%,10A(L=-30%), DCR=5.8mΩ±10％ N-ch, Vdss 30V, Id 15A, Ron 4.7mΩ N-ch, Vdss 30V, Id 18A, Ron 3.3mΩ 1/16W, 50V, 5% MCR01MZPJ623 ROHM 1005 R7, R8 Resistor 51kΩ 1/16W, 50V, 5% MCR01MZPJ513 ROHM 1005 R15 Resistor 16kΩ 1/16W, 50V, 0.5% MCR01MZPD1602 ROHM 1005 R16 Resistor 4.3kΩ 1/16W, 50V, 0.5% MCR01MZPD4301 ROHM 1005 R24 Resistor 100Ω 1/16W, 50V, 5% MCR01MZPJ101 ROHM 1005 R25 Resistor 12kΩ 1/16W, 50V, 0.5% MCR01MZPD1202 ROHM 1005 R26 Resistor 4.7kΩ 1/16W, 50V, 0.5% MCR01MZPD4701 ROHM 1005 U1 IC - Buck DC/DC Controller BD95602MUV-LB ROHM VQFN032V5050 6TPE330MIL Without any ripple (about 10mV), there is a possibility that the FB signal is not stable due to the adoption of the comparator control method. Please ensure enough ripple voltage either by (1)reducing the L-value of inductor, or (2)using high ESR output capacitor. Ripple voltage can be generated in FB terminal by adding a capacitor in parallel to resistor (R17, R19) of the FB input, but the circuit will be sensitive to noise from the output (Vo1/Vo2) line and is not recommended. Stability of the circuit is influenced by the layout of the PCB, please pay careful attention to the layout. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 31/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Power Dissipation [mW] 1000 74.2mm x 74.2mm x 1.6mm Glass-epoxy PCB 880mW Power Dissipation (Pd) θj-a=142. °C /W 800 600 IC Only θj-a=328.9°C/W 380mW 400 200 0 25 50 75 85 100 125 150 [°C] Ambient Temperature (Ta) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 32/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB I/O equivalence circuits 1, 24pin (SW2, SW1) 2, 23pin (HG2, HG1) BOOT BOOT 3, 22pin (BOOT2, BOOT1) BOOT HG HG SW SW 4, 21pin (EN2, EN1) 5, 20pin (PGOOD2, PGOOD1) 6, 19pin (SS2, SS1) REG1 50Ω 1MΩ 12pin (REF) 11, 14pin (FB2, FB1) 10, 15pin (FS2, FS1) 9pin (CTL) 26, 31pin (LG1, LG2) REG1 16, 18pin (MCTL2, MCTL 1) VIN REG1 100kΩ 1MΩ 500kΩ 300kΩ www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 33/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB I/O equivalence circuit(s) - continued 7, 27pin (Vo2, Vo1) 28pin (REG2) 29pin (REG1) REG1 VIN VIN 50Ω 30pin (VIN) www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8, 17pin (ILIM2, ILIM1) 34/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 35/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 58. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 36/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Ordering Information B D 9 5 6 Part Number 0 2 M U Package MUV: VQFN V - LBE2 Product class LB for Industrial applications Packaging and forming specification E2: Embossed tape and reel (VQFN032V5050) Marking Diagrams VQFN032V5050 (TOP VIEW) Part Number Marking 9 5 6 0 2 L LOT Number 1PIN MARK www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 37/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Physical Dimension, Tape and Reel Information Package Name www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN032V5050 38/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 BD95602MUV-LB Revision History Date Revision 31.Oct.2014 26.Jun.2015 001 002 www.rohm.co.jp © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release P.31 Change ‘’the description’’ of L1,L2 39/39 TSZ02201-0J1J0AZ00040-1-2 26.Jun.2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001