ROHM BD9535MUV_08

TECHNICAL NOTE
High-performance Regulator IC Series for PCs
Switching Regulators
for DDR-SDRAM Cores
BD9535MUV
Description
BD9535MUV is a 2ch switching regulator controller with high output current which can achieve low output voltage (0.7V~
2.0V) from a wide input voltage range (4.5V~25V). High efficiency for the switching regulator can be realized by utilizing an
3
TM
external N-MOSFET power transistor. A new technology called H Reg is a Rohm proprietary control method to realize
TM
ultra high transient response against load change. SLLM (Simple Light Load Mode) technology is also integrated to
improve efficiency in light load mode, providing high efficiency over a wide load range. For the soft start/stop function,
variable frequency function, short circuit protection function with timer latch, and tracking function are all built in. This 2ch
switching regulator is specially designed for Chipset and Front Side Bus.
Features
3
TM
1) 2ch H REG Switching Regulator Controller
2) Light Load Mode and Continuous Mode Changeable
3) Thermal Shut Down (TSD), Under Voltage LockOut (UVLO),
Over Current (detect the peak current) Protection (OCP), Over Voltage Protection (OVP),
Short circuit protection with built-in timer-latch
4) Soft start function to minimize rush current during startup
5) Switching Frequency Variable (f=200KHz~600kHz)
6) VQFN032V5050 package
7) Built-in Power good circuit
8) Adjustable to chip set spec by tracking function
Applications
Laptop PC, Desktop PC, LCD-TV, Digital Components
Sep. 2008
●Maximum Absolute Ratings (Ta=25℃)
Parameter
Symbol
Rating
V
V
Input Voltage 1
VCC
7
Input Voltage 2
VDD
7 *1
Input Voltage 3
BOOT Voltage
BOOT-SW Voltage
HG-SW Voltage
VIN
VBOOT1/2
VBOOT1-VSW1, VBOOT2-VSW2
VHG1-VSW1, VHG2-VSW2
Unit
*1
30
*1
V
35
*1
V
7 *1
V
*1
V
7
LG Voltage
VLG1/2
VDD
V
Setting for Output Voltage
VREF1/2
VCC
V
Output voltage
VIs+1/2, VIs-1/2
VCC
V
SS Voltage
VSS1/2
VCC
V
FS Voltage
VFS
VCC
V
VREG
VCC
V
VILIM1/2
VCC
V
*1
V
7 *1
V
*1
V
VREG voltage
Current Limit setting Voltage
Logic Input Voltage
PGOOD Voltage
CE Voltage
Power dissipation
Operating Temperature Range
Storage Temperature Range
VEN1/2
7
VPGOOD1/2
VCE1/2
7
Pd
T.B.D
W
Topr
-10~+100
℃
Tstg
-55~+150
℃
Tjmax
+150
℃
Symbol
Min.
Max.
Unit
Input Voltage 1
VCC
4.5
5.5
V
Input Voltage 2
VDD
4.5
5.5
V
Input Voltage 3
VIN
3.0
28
V
BOOT Voltage
VBOOT1/2
4.5
30
V
VSW1/2
-2
33
V
BOOT-SW Voltage
VHG1-VSW1, VHG2-VSW2
4.5
5.5
V
Logic Input Voltage
VEN1/2
0
5.5
V
Setting Voltage for Output Voltage
VREF1/2
0.7
2.0
V
VIs+1/2, VIs-1/2
0.7
2.0
V
tonmin
-
100
nsec
Junction Temperature
*1 Not to exceed Pd.
●Operating Conditions (Ta=25℃)
Parameter
SW Voltage
Is Input Voltage
MIN ON time
★ This product should not be used in a radioactive environment.
2/18
●ELECTRICAL CHARACTERISTICS
(unless otherwise noted, Ta=25℃ VCC=5V,VDD=5V,VEN=3V,VIN=12V,VREF=1.8V,RFS=68kΩ)
Standard Value
Parameter
Symbol
MIN.
TYP.
MAX.
[Whole Device]
VCC bias current
VIN bias current
VCC standby current
VIN standby current
EN Low voltage 1,2
EN High voltage 1,2
(forced continuous mode)
EN High voltage 1,2 (SLLM mode)
EN bias current 1,2
VREG voltage
[Under voltage lock out block]
VCC threshold voltage
VCC hysteresis voltage
VIN threshold voltage
VIN hysteresis voltage
VREG threshold voltage
VREG hysteresis voltage
[Over Voltage Protection block]
VOUT threshold voltage 1,2
[Power Good block]
VOUT Power Good Low voltage 1,2
VOUT Power Good High voltage 1,2
Discharge ON resistance 1,2
Delay time 1,2
[H3REGTM Control block]
ON Time1
MAX ON Time 1
MIN OFF Time 1
ON Time 2
MAX ON Time 2
MIN OFF Time 2
[FET Driver block]
HG upper side ON resistance 1,2
HG lower side ON resistance 1,2
LG upper side ON resistance 1,2
LG lower side ON resistance 1,2
[Soft Start block]
Charge current
Discharge current
Discharge threshold voltage
Standby voltage
[Current Limit block]
Current limit threshold voltage 1_1,2
Current limit threshold voltage 2_1,2
Reflux current limit threshold voltage1_1,2
Reflux current limit threshold voltage2_1,2
[Output Voltage Sense block]
VIs offset voltage1,2
REF bias current1,2
Is+ input current1,2
Is- input current1,2
[SCP block]
Threshold voltage 1,2
Delay time 1,2
Unit
Icc
IIN
Istb
IIN_Stb
VEN_low1,2
GND
1.4
200
20
-
2.0
400
20
40
0.8
mA
μA
μA
μA
V
VENth_con1,2
2.3
-
3.8
V
VENth_sllm1,2
IEN1,2
4.2
-
7
5.5
10
V
μA
VREG1,2
2.475
2.500
2.525
V
Vcc_UVLO
dVcc_UVLO
VIN_UVLO
dVIN_UVLO
VREG_UVLO
dVREG_UVLO
4.1
100
2.4
100
2.0
100
4.3
160
2.6
160
2.2
160
4.5
220
2.8
220
2.4
220
V
mV
V
mV
V
mV
VOUT_OVP1,2
VREF×1.15 VREF×1.20 VREF×1.25
Conditions
VEN1=VEN2=0V
VEN1=VEN2=0V
IREG=500μA
Ta=-10~100℃*2
VCC:Sweep up
VCC:Sweep down
VIN:Sweep up
VIN:Sweep down
VREG:Sweep up
VREG:Sweep down
V
VPGOOD_low1,2 VREF×0.87 VREF×0.90 VREF×0.93
V
VREF×
VREF×
VREF×
VPGOOD_high1,2
V
1.07
1.10
1.13
Ron_PGOOD1,2
1.0
2.0
kΩ
TPGOOD1,2
150
250
350
μsec
ton1
Tonmax1
Toffmin1
500
3.0
600
350
3.0
600
600
3.5
700
450
3.5
700
nsec
μsec
nsec
RFS=68kΩ
nsec
RFS=68kΩ
Tonmax2
Toffmin2
400
2.5
500
250
2.5
500
RHGhon1,2
RHGlon1,2
RLGhon1,2
RLGlon1,2
-
3.0
2.0
2.0
0.5
6.0
4.0
4.0
1.0
Ω
Ω
Ω
Ω
ISS_char1,2
ISS_dis1,2
VSS_disth1,2
VSS_STB1,2
1.5
1.5
-
2
2
0.1
-
2.5
2.5
0.2
50
μA
μA
V
mV
VIlim11,2
VIlim21,2
VReIlim11,2
VReIlim21,2
40
170
-60
-230
50
200
-50
-200
60
230
-40
-170
mV
mV
mV
mV
VILIM=0.5V
VILIM =2.0V
VILIM =0.5V
VILIM =2.0V
VIS_off1,2
IREF1,2
IIs+1,2
IIs-1,2
VREF -3m
-100
-100
-100
VREF
0
0
0
VREF +3m
100
100
100
V
nA
nA
nA
Ta=-10~100℃*2
Vthscp1,2
tscp1,2
0.7
VREF×0.7
1
1.3
V
msec
ton2
*2
Designed guarantee
3/18
μsec
nsec
VIs+=1.8V
VIs-=1.8V
●Block Diagram
VCC
EN1
VIN
VREF
VIN
Reference
Block
VREG
SS1
UVLO
SS
2.5V
BOOT1
2.5VReg
SLLM1
REF×0.7
SS×0.7
Is-1
EN1
EN2
Delay
3
H Reg
Controller
Block
FS
SS
IS-1
Soft Start /Stop Block
HG1
SW1
SCP
REF1
Thermal
Protection
BEN
+
+
-
TSD
Q
R
S
Driver
Circuit
SLLM
VDD
LG1
SLLM1
Current Limit
PGND1
OVP1
+
-
ILIM
UVLO
ILIM
SCP
TSD
CE1
Is-1
Is+1
ILIM1
PGOOD1
VCC
Is-1
Is-2
VREF
VIN
Reference
Block
EN2
UVLO
SLLM2
SS2
BOOT2
HG2
SCP
Delay
3
H Reg
Controller
Block
REF2
+
+
-
Q
R
S
SLLM
SW2
Driver
Circuit
VDD
SLLM2
Current Limit
ILIM
UVLO
ILIM
SCP
TSD
GND
PGOOD2
OVP2
Soft Start /Stop Block
BEN
SS
IS-2
OVP1
GOOD
SS
VIN
REF×0.7
SS×0.7
Is-2
POWER
LG2
+
-
PGND2
OVP2
CE2
ILIM2
FS
●Pin Function Table
PGOOD2
EN2
SS2
ILIM2
REF2
EN1
CE2
PIN name
BOOT1
CE1
PGOOD1
BOOT2
PIN No.
1
2
3
HG2
●Pin Configuration
IS+2 IS-2
4
24
23
22
21
20
19
18
17
5
SW2 25
16 VIN
PGND2 26
15 Is-2
LG2 27
14 Is+2
VDD 28
13 VCC
LG1 29
12 GND
1
2
3
4
5
6
7
8
19
SS2
ILIM1
REF1
VREG
9 FS
SS1
HG1 32
EN1
10 Is-1
PGOOD1
SW1 31
CE1
11 Is+1
ILIM1
REF1
VREG
FS
Is-1
Is+1
GND
VCC
Is+2
Is-2
VIN
REF2
ILIM2
BOOT1
PGND1 30
SS1
6
7
8
9
10
11
12
13
14
15
16
17
18
20
EN2
21
22
23
24
25
26
27
28
29
30
31
32
reverse
PGOOD2
CE2
BOOT2
HG2
SW2
PGND2
LG2
VDD
LG1
PGND1
SW1
HG1
FIN
4/18
PIN function
HG driver power supply pin 1
Reactive pin 1 for lower ESR output capacitor
Power good signal output pin 1
Enable input pin 1 (0~0.8V:OFF,
TM
2.3~3.8V:continuous mode, 4.2~5.5V:SLLM )
Connective pin 1 of capacitor for soft start/soft
stop
Current limitsetting pin 1
Output voltage setting pin 1
Reference voltage inside IC (Output : 2.5V)
Resistance connective pin for setting frequency
Current sense pin- 1
Current sense pin+ 1
Sense GND
Power supply input pin
Current sense pin+ 2
Current sense pin- 2
Battery voltage sense pin
Output voltage setting pin 2
Current limit setting pin 2
Connective pin 2 of capacitor for soft start/soft
stop
Enable input pin 2 (0~0.8V:OFF,
TM
2.3~3.8V:continuous mode, 4.2~5.5V:SLLM )
Power good signal input pin 2
Reactive pin 2 for lower ESR output capacitor
HG driver power supply pin 2
High side FET gate drive pin 2
High side FET source pin 2
Power GND2
Low side FET gate drive pin 2
Power supply input pin
Low side FET gate drive pin 1
Power GND 1
High side FET source pin 1
High side FET gate drive pin 1
substrate
●Reference Data
100
100
90
VO
80
Efficiency[%]
Efficiency[%]
80
60
40
VIN=7V
VIN =12V
VIN =19V
20
100[mV/div]
70
60
40
VIN=7V
VIN =12V
VIN =19V
30
20
0
HG
LG
50
IO
5[A/div]
10
0.01
0.1
1
Load Current[A]
10
0.01
Fig.1 Io-efficiency
(SLLM)
0.1
1
Load Current[A]
10
Fig.2 Io- efficiency
(Continuous mode)
VO
VO
VO
100[mV/div]
Fig.3 Transitional response
(Io=0→5A)
(Continuous mode)
100[mV/div]
100[mV/div]
HG
LG
HG
LG
HG
LG
IO
5[A/div]
IO
5[A/div]
IO
5[A/div]
Fig.4
Transitional response
(Io=5→0A)
(Continuous mode)
Fig.5
Transitional response
(Io=0→5A)
(SLLM)
Fig.6
VO
VO
VO
HG
SW
LG
HG
SW
LG
HG
SW
LG
Fig.7 SLLM:Io=0A
Transitional response
(Io=5→0A)
(SLLM)
Fig.9 SLLM:Io=1A
Fig.8 SLLM:Io=0.4A
500
EN
Frequency [kHz]
400
EN
300
200
100
Continuous
mode
VIN=7V
VIN =12V
VIN =19V
PGOOD
SLLM
VIN=7V
VIN =12V
VIN =19V
0.1
1
Load Current[A]
Fig.10 Io-Frequency
SS
VO
SS
VO
0
0.01
PGOOD
10
Fig.11 starting wave
5/18
Fig.12 stopping wave
●Evaluation Board Circuit
VDD
VCC
5V
VREG
VIN
R4
12V
0.5V
R5
VDD
VDD
BOOT1
C2
HG1
VREG
VREG
R3
C3
VCC
R7
5V
R8
R6
U1
VCC BD9535MUV
VQFN032V5050
C1
VDD
R2
SW1
C6
VREG
R1
EN1
VIN
R31
HG1
C14
SW1
R32
LG1
C4
Is+1
R12
R18
C8
BOOT2
HG2
EN1
C9
HG2
R45
SW2
C24
M2
SS2
C12
PGOOD1
C26
C25
1.2V/5A
R50
C28 C29
R51
R61
C31
Is-2
FS
GND
C30
D4
R62
PGOOD2
TRACK2
R26
R41
L2
M2
R46
Is+2
REF2
C11
R44
PGND2
R23
R24
VCC
LG2
LG2
C10
1.2V
R39
SW2
ILIM2
R21
C20
C23
VIN
D2
R20
VREG
C19
VDD
R17
0.5V
R38
R60
R16
VREG SW2
5V
R19
C18
D3
PGOOD1
SS1
EN2
C7
1.8V/5A
R37
L1
C21
Is-1
VCC
C16
R59
REF1
TRACK1
C15
M1
M1
R33
R14
R11
VIN
PGND1
C5
R10
GND PGND1 PGND2
LG1
VREG(2.5V)
ILIM1
1.8V
C13
PGND
SW1
EN1
R9
D1
GND
R52
VCC
R54
PGOOD2
FS
R57
R25
R58
●Evaluation Board Parts List
Designation
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R14
R16
R17
R18
R19
R20
R21
R23
R24
R25
R26
R31
R32
R33
R37
R38
R39
R41
R44
R45
R46
R50
R51
R52
Value
10Ω
0Ω
1kΩ
200kΩ
51kΩ
0Ω
51kΩ
91kΩ
0Ω
22kΩ
56kΩ
0Ω
10kΩ
51kΩ
91kΩ
0Ω
200kΩ
51kΩ
0Ω
39kΩ
36kΩ
0Ω
10kΩ
0Ω
0Ω
0Ω
7mΩ
0Ω
0Ω
100kΩ
0Ω
0Ω
0Ω
7mΩ
0Ω
0Ω
Part No.
MCR03EZPF10R0
MCR03EZHJ000
MCR03EZPF1001
MCR03EZPF2003
MCR03EZPF5102
MCR03EZHJ000
MCR03EZPF5102
MCR03EZPF9102
MCR03EZHJ000
MCR03EZPF2202
MCR03EZPF5602
MCR03EZHJ000
MCR03EZPF1002
MCR03EZPF5102
MCR03EZPF9102
MCR03EZHJ000
MCR03EZPF2003
MCR03EZPF5102
MCR03EZHJ000
MCR03EZPF3902
MCR03EZPF3602
MCR03EZHJ000
MCR03EZPF1002
MCR03EZHJ000
MCR03EZHJ000
MCR03EZHJ000
PMR100HZPFU7L00
MCR03EZHJ000
MCR03EZHJ000
MCR03EZPF1003
MCR03EZHJ000
MCR03EZHJ000
MCR03EZHJ000
PMR100HZPFU7L00
MCR03EZHJ000
MCR03EZHJ000
Company
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
6/18
Designation
R54
R57
R58
R59
R60
R61
R62
C1
C2
C3
C4
C6
C7
C8
C10
C11
C12
C13
C14
C15
C18
C21
C23
C24
C26
C28
C31
D1
D2
D3
D4
L1
L2
M1
M2
U1
Value
100kΩ
75kΩ
0Ω
100Ω
100Ω
100Ω
100Ω
10uF
10uF
0.01uF
1uF
0.1uF
0.1uF
0.047uF
0.1uF
0.1uF
0.047uF
10uF
0.1uF
10uF(25V)
200uF
100pF
10uF
0.1uF
10uF(25V)
200uF
100pF
2.5uH
2.5uH
-
Part No.
MCR03EZPF1003
MCR03EZPF7502
MCR03EZHJ000
MCR03EZPF1000
MCR03EZPF1000
MCR03EZPF1000
MCR03EZPF1000
CM21B106M06A
CM21B106M06A
MCH185CN103KB
CM105B105K06A
MCH185CN104K
MCH185CN104K
MCH185CN473K
MCH185CN104K
MCH185CN104K
MCH185CN473K
CM21B106M06A
MCH185CN104K
CT32X5R106K25A
2R5TPE220MF
MCH185A101J
CM21B106M06A
MCH185CN104K
CT32X5R106K25A
2R5TPE220MF
MCH185A101J
PB521S-30
PB521S-30
RSX501L-20
RSX501L-20
CDEP105-2R5MC-32
CDEP105-2R5MC-32
SP8K4(2in1)
SP8K4(2in1)
BD9535MUV
Company
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
KYOCERA
SANYO
ROHM
ROHM
ROHM
KYOCERA
SANYO
ROHM
ROHM
ROHM
ROHM
ROHM
Sumida
Sumida
ROHM
ROHM
ROHM
●Pin Descriptions
・VCC (13pin)
This is the power supply pin for IC internal circuits, except the FET driver. The maximum circuit current is 2.0mA. The input
supply voltage range is 4.5V to 5.5V. It is recommended that a 0.1uF bypass capacitor be put in this pin.
・EN1/EN2 (4pin/20pin)
When EN pin voltage is at least 2.3V, the status of this switching regulator become active. Conversely, the status switches
off when EN pin voltage goes lower than 0.8V and circuit current becomes 20uA or less. This pin is also switch pin of
SLLMTM. The voltage is 2.3V to 3.8V : forced continuous mode, 4.2V to 5.5V : SLLMTM. These operating modes are
changeable to control by power supply system 3.3V or 5V.
・VDD (28pin)
This is the power supply pin to drive the LOW side FET. It is recommended that a 1uF bypass capacitor be established to
compensate for rush current during the FET ON/OFF transition.
・VREG (8pin)
This is the reference voltage output pin. The voltage is 2.5V, with 100uA current ability. It is recommended that a 1uF
capacitor be established between VREF and GND. It is available to set VREF by the resistance division value from VREG in
case VREF is not set from an external power supply.
・REF1/REF2 (7pin/17pin)
This is the setting pin for output voltage of switching regulator. It is so convenient to be synchronized to outside power
supply. This IC controls the voltage in the status of VREF1≒Vis-1 or VREF2≒Vis-2.
・ILIM1/ILIM2 (6pin/18pin)
BD9535MUV detects the voltage between Is+ pin and Is- pin and limits the output current (OCP). Voltage equivalent to 1/10
of the ILIM voltage is the voltage drop of external current sense resistor. A very low current sense resistor or inductor DCR
can also be used for this platform.
・SS1/SS2 (5pin/19pin)
This is the adjustment pin to set the soft start/stop time. SS voltage is low during standby status. When EN is ON, the soft
start time can be determined by the SS charge current and capacitor between SS-GND. Until SS reaches REF voltage, the
output voltage is equivalent to SS voltage.
・VIN (16pin)
The duty cycle is determined by input voltage and controls output voltage. In other words, the output voltage is affected by
input voltage. Therefore, when VIN voltage fluctuates, the output voltage becomes also unstable. Since the VIN line is also
the input voltage of the switching regulator, stability depends on the impedance of the voltage supply. It is recommended to
establish a bypass capacitor or CR filter suitable for the actual application.
・FS (9pin)
This is the pin to adjust the switching frequency with the resistor. The frequency range is from 200kHz to 600kHz.
・Is+1/Is+2,Is-1/Is-2 (11pin/14pin/10pin/15pin)
These pins are connected to both sides of the current sense resistor to detect output current. The voltage drop between Is+
and Is- is compared with the voltage equivalent to 1/10 of ILIM voltage. When this voltage drop hits the specified voltage
level, the output voltage is OFF.
・BOOT1/BOOT2 (1pin/23pin)
This is the voltage supply to drive the high side FET. The maximum absolute ratings are 35V (from GND) and 7V (from SW).
BOOT voltage swings between (VIN+Vcc) and Vcc during active operation.
・HG1/HG2 (29pin/27pin)
This is the voltage supply to drive the Gate of the high side FET. This voltage swings between BOOT and SW. High-speed
Gate driving for the high side FET is achieved due to the low on-resistance (3 ohm when HG is high, 2 ohm when HG is low)
driver.
・SW1/SW2 (31pin/25pin)
This is the source pin for the high side FET. The maximum absolute ratings are 30V (from GND). SW voltage swings
between VIN and GND.
・LG1/LG2 (29pin/27pin)
This is the voltage supply to drive the Gate of the low side FET. This voltage swings between VDD and PGND. High-speed
Gate driving for the low side FET is achieved due to the low on-resistance (3 ohm when LG is high, 0.5 ohm when LG is low)
driver.
・PGND1/PGND2 (30pin/26pin)
This is the power ground pin connected to the source of the low side FET. This is the source pin for low-side FET. It is
prepared for each channel to reduce the interference among channels.
・PGOOD1/PGOOD2 (3pin/21pin)
This is the monitor pin for output voltage (Is-1/Is-2). When the output voltage is within 10% of setting voltage (REF1/2), High
is output. It is open drain pin and connects to other power supply through the pull-up resistance.
・CE1/PCE2 (2pin/22pin)
This pin is helpful for using ceramic capacitor as output capacitor. It is stable to use low ESR capacitor (small ripple voltage).
・GND (12pin)
This is GND pin for Analog and Digital series. Set the reverse side of IC equivalent to the voltage of this pin.
7/18
● Explanation of Operation
The BD9535MUV is a 2ch synchronous buck regulator controller incorporating ROHM’s proprietary H3REG CONTROLLA
control system. When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the TON time
interval. Thus, it serves to improve the regulator’s transient response. Activating the Light Load Mode will also exercise
Simple Light Load Mode (SLLM) control when the load is light, to further increase efficiency.
3
TM
H Reg control
(Normal operation)
When VOUT falls to a threshold voltage (REF), the drop
is detected, activating the H3REG CONTROLLA system.
Is-(VOUT)
REF
tON=
REF
1
×
VIN
f
[sec]・・・(1)
HG
HG output is determined by the formula above.
LG
(VOUT drops due to a rapid load change)
When VOUT drops due to a rapid load change, and
the voltage remains below REF after the
programmed tON time interval has elapsed, the
system quickly restores VOUT by extending the tON
time, improving the transient response.
Is-(VOUT)
REF
Io
tON+α
HG
LG
Is-(VOUT)
REF
In SLLM (SLLM=0V), SLLM function is operated when
LG pin is OFF and the coil current is lower than 0A
(the current goes from VOUT to SW). And it stops to
output next HG.
When VOUT goes lower than REF voltage again, the
status of HG is ON.
HG
LG
0A
VIN
VIN
REF
H3RegTM
R
CONTROLLA
S
SLLMTM
Q
Driver
VOUT
Circuit
Is-(VOUT)
VCC
EN
EN
0~2.3V
2.3~3.8V
4.2~5.5V
4V
8/18
Output
OFF
ON
ON
Operating mode
Forced continuous mode
SLLMTM
● Timing Chart
• Soft Start Function
Soft start is exercised with the EN pin set high. Current
control takes effect at startup, enabling a moderate
output voltage “ramping start.” Soft start timing and
incoming current are calculated with formulas (2) and
(3) below.
EN
TSS(ON)
SS
Soft start time
TSS(ON)= REF×Css [sec] ・・・(2)
2μA(typ)
VOUT
rush current
IIN
IIN=
Co×VOUT
Tss
[A] ・・・(3)
(Css: Soft start capacitor; Co: Output capacitor)
• Soft Stop Function
Soft stop is exercised with the EN pin set low. Current
control takes effect at startup, enabling a moderate
output voltage. Soft start timing and incoming current
are calculated with formulas (4) below.
EN
TSS(OFF)
2VBE
SS
0.1V
Soft stop time
Is(VOUT)
Spontaneous discharge
(It is determined by load and
output capacitor.)
TSS(OFF)=
(REF+2VBE-0.1)×Css
2μA(typ)
Tdelay
[sec] ・・・(4)
VBE = 0.6[V] (typ)
Tdelay =
2VBE×CSS
2μA(typ)
[sec] ・・・(5)
・Synchronous operation with other power supply
3.3V(other power supply)
These power supply sequences are realized to connect
SS pin to other power supply output through the
resistance (10kΩ).
1.8V (BD9535 output 1)
1.2V (BD9535 output 2)
9/18
●Timing chart
・Over current protection circuit
tON
tON
tMAX
During the normal operation, when VOUT becomes less
than REF Voltage, HG becomes High during the time
TON. However, when inductor current exceeds ILIMIT
threshold, HG becomes OFF.
After MAX ON TIME, HG becomes ON again if the
output voltage is lower than the specific voltage level
and IL is lower than ILIMIT level.
tON
HG
LG
ILIMIT
IL
・Timer Latch Type Short Circuit Protection
Is(VOUT)
When output voltage (Is-) falls to REF×0.7 or less, SCP
comparator inside IC is exercised.
If the status of High is continued 1ms or more
(programmed time inside IC), the IC goes OFF. It can be
restored either by reconnecting the EN pin or disabling
UVLO.
REF×0.7
Spontaneous
discharge
1msec
SCP
EN
/UVLO
・Output Over Voltage Protection
Is(VOUT)
REF×1.2
160mV
When output rise to or above REF×1.2, output over
voltage protection is exercised, and low side FET goes
up maximum for reducing output. ( LG=High,
HG=Low). When output falls, it returns to the standard
mode.
HG
LG
Switching
10/18
● External Component Selection
1. Inductor (L) selection
The inductor value is a major influence on the output ripple
current. As formula (5) below indicates, the greater the inductor or
the switching frequency, the lower the ripple current.
(VIN-VOUT)×VOUT
ΔIL=
[A]・・・(6)
L×VIN×f
The proper output ripple current setting is about 30% of maximum
output current.
ΔIL=0.3×IOUTmax. [A]・・・(7)
ΔIL
VIN
IL
VOUT
L
L=
Co
(VIN-VOUT)×VOUT
L×VIN×f
[H]・・・(8)
(ΔIL: output ripple current; f: switch frequency)
Output ripple current
※Passing a current larger than the inductor’s rated current will cause magnetic saturation in the inductor and decrease
system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not exceed the
inductor rated current value.
※To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance.
2.Output Capacitor (CO) Selection
When determining the proper output capacitor, be sure to factor in the equivalent
series resistance required to smooth out ripple volume and maintain a stable output
voltage range.
Output ripple voltage is determined as in formula (9) below.
VIN
VOUT
L
ΔVOUT=ΔIL×ESR+ESL×ΔIL/TON・・・(9)
ESR
(ΔIL: Output ripple current; ESR: CO equivalent series resistance,
ESL: CO equivalent series inductance)
ESL
Co
※ In selecting a capacitor, make sure the capacitor rating allows sufficient margin
relative to output voltage. Note that a lower ESR can minimize output ripple
voltage.
Output capacitor
Please give due consideration to the conditions in formula (10) below for output capacity, bear in mind that output rise time
must be established within the soft start time frame.
Co≦
TSS×(Limit-IOUT)
VOUT
・・・(10)
Tss: Soft start time
Limit: Over current detection
IOUT: Output current
Note: Improper capacitor may cause startup malfunctions.
3. Input Capacitor (Cin) Selection
The input capacitor selected must have low enough ESR resistance to fully
support large ripple output, in order to prevent extreme over current. The formula
for ripple current IRMS is given in (11) below.
VIN
Cin
VOUT
L
Co
IRMS=IOUT×
√VOUT (VIN-VOUT)
VIN
Where VIN=2×VOUT, IRMS=
IOUT
2
Input Capacitor
A low ESR capacitor is recommended to reduce ESR loss and maximize efficiency.
11/18
[A]・・・(11)
4. MOSFET Selection
Loss on the main MOSFET
VIN
Pmain=PRON+PGATE+PTRAN
main switch
=
VOUT
VOUT
×RON×IOUT2+Qg×f×VDD+
VIN
2
VIN ×Crss×IOUT×f
IDRIVE
・・・(12)
L
(Ron: On-resistance of FET; Qg: GATE total charge
f: Switching frequency, Crss: FET inverse transfer function;
IDRIVE: Gate peak current)
Co
synchronous switch
Loss on the synchronous MOSFET
Psyn=PRON+PGATE
=
VIN-VOUT
VIN
×RON×IOUT2+ Qg×f×VDD
・・・(13)
5. Setting Detection Resistance
VIN
L
The over current protection function detects the output ripple current peak
value. This parameter (setting value) is determined as in formula (14)
below.
R
IL
VOUT
ILMIT=
Co
VILIM×0.1
R
[A]・・・(14)
(VILIM: ILIM voltage; R: Detection resistance)
Is+
Is+
Current limit
VIN
When the over current protection is detected by DCR of coil L, this
parameter (setting value) is determined as in formula (14) below.
IL
L
r
RL
C
VOUT
ILMIT=VILIM×0.1×
Co
(RL=
L
r×C
r×C
L
[A]・・・(15)
)
(VILIM:ILIM voltage
RL: the DCR value of coil)
Is+
Is+
Current limit
IL
detect point
As soon as the voltage drop between Is+ and Is- generated by the inductor
current becomes specific threshold, the gate voltage of the high side
MOSFET becomes low.
Since the peak voltage of the inductor ripple current is detected, this
operation can sense high current ripple operation caused by inductance
saturated rated current and lead to high reliable systems.
ILIMIT
0
t
12/18
6. Setting frequency
【1ch】
The On Time (TON) at steady state is determined by
resistance value connected to FS pin.
But actually SW rising time and falling time come up
due to influence of the external MOSFET gate capacity
or switching speed and TON is increased.
The frequency is determined by the following formula
after TON, input current and the REF voltage are fixed.
700
VIN=3V
5V
7V
12V
19V
Frequency [kHz]
600
500
400
300
F=
VIN×TON
200
100
0
50
100
150
200
RFS[kΩ]
【2ch】
900
800
VIN=3V
5V
7V
12V
19V
700
600
500
400
300
200
100
VREF=1.8V
0
0
50
100
150
・・・(15)
Consequently, total frequency becomes lower than the
formula above.
TON is also influenced by Dead Time around the output
current 0A area in continuous mode.
This frequency becomes lower than setting frequency.
It is recommended to check the steady frequency in
large current area (at the point where the coil current
doesn’t back up).
VREF=1.8V
0
Frequency [kHz]
REF
200
RFS[kΩ]
13/18
7. Setting standard voltage (REF)
VIN
REF
3
R
TM
H Reg
CONTROLLA
It is available to synchronize setting the reference voltage
(REF) with outside supply voltage [V] by using outside
power supply voltage.
Q
S
Outside
voltage
VOUT
VREG
It is available to set the reference voltage (REF) by
the resistance division value from VREG in case it is
not set REF from an external power supply.
VIN
R1
REF
R
H3RegTM
CONTROLLA
Q
S
R2
REF=
R2
R1+R2
×VREG [V]・・・(17)
VOUT
8. Setting output voltage
This IC is operated that output voltage is REF≒Is-(VOUT).
And it is operated that output voltage is feed back to FB pin in case the output voltage is 0.7V to 2.0V.
Actually, the average value of ripple voltage is added to output voltage.
Output voltage =
REF +
VIN
REF
R
H3RegTM
1
2
×ΔIL×ESR・・・(18)
VIN
SLLMTM
Q
Output voltage
CONTROLLA
Driver
S
SLLM
Circuit
ESR
Is-(VOUT)
In case the output voltage range is 0.7V to 2.0V.
It is operated that the resistance division value of the output voltage is feed back to Is-pin in case the output voltage is more
than 2.0V.
output voltage =
R1+R2
R2
×
REF +
1
2
×ΔIL×ESR・・・(19)
In this time, the frequency is also amplified by power of the resistance division. It is determined as in formula (20) below.
Frequency=
R1+R2
R2
×(frequency determined by REF) [Hz]・・・(20)
VIN
REF
VIN
H3RegTM
R
CONTROLLA
S
Q
SLLM
TM
Output
Driver
SLLM
ESR
Circuit
Is-(VOUT)
R1
In case the output voltage range is more than 2.0V.
14/18
R2
●I/O Equivalent Circuit
1pin, 23pin (BOOT1/2)
2pin, 22pin (CE1/2)
3pin, 21pin (PGOOD1/2)
300Ω
HG
SW
4pin, 20pin (EN1/2)
5pin, 19pin (SS1/2)
6pin, 18pin (ILIM1/2)
8pin (VREG)
9pin (FS)
430KΩ
7pin, 17pin (REF1/2)
1.2MΩ
10pin, 15pin (Is-1/2)
24pin, 32pin (HG1/2)
BOOT
400KΩ
11pin, 14pin (Is+1/2)
16pin (VIN)
25pin, 31pin (SW1/2)
27pin, 29pin (LG1/2)
BOOT
VDD
BOOT
HG
300KΩ
100KΩ
300KΩ
300KΩ
SW
300KΩ
15/18
●Operation Notes
1.
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to
ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9. Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed
only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is
assumed.
TSD on temperature [°C] (typ.)
Hysteresis temperature [°C] (typ.)
BD9535MUV
175
15
10. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
16/18
11. Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate,
such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
C
E
Pin A
N
P
+
N
P
P
+
N
Parasitic
element
N
P
P substrate
P
C
+
N
E
Parasitic
element
P substrate
GND
Parasitic element
B
N
P+
Parasitic element
GND
GND
GND
Other adjacent elements
Fig. 13 Example of IC structure
12. Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing
a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations
caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND
wiring pattern of any external components, either.
● Power Dissipation
[mW]
1000
980mW
mounted on glass epoxy PCB
70mm×70mm×1.6mm
θj-a=127.0℃/W
Power Dissipation (Pd)
800
600
IC unit time θj-a=403.2℃/W
400
310mW
200
0
25
50
75
100
125
150
Ambient temperature (Ta)
17/18
[℃]
● Type Designations (Selections) for Ordering
B
D
Product name
・BD9535
9
5
3
5
M
U
Package type
・MUV =
V
―
E
2
Taping type name
E2= Embossed carrier tape
VQFN032V5050
VQFN032V5050
<Tape and Reel information>
<Dimension>
Tape
Embossed carrier tape(with dry pack)
Quantity
2500pcs
E2
Direction
of feed
(The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand)
1234
1234
1pin
1234
Reel
1234
1234
1234
(Unit:mm)
Direction of feed
※When you order , please order in times the amount of package quantity.
Catalog No.08T453A '08.9 ROHM ©
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM
CO.,LTD.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of
application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or
exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility
whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or
devices (such as audio visual equipment, office-automation equipment, communication devices, electronic
appliances and amusement devices).
The Products are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as
derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your
use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system
which requires an extremely high level of reliability the failure or malfunction of which may result in a direct
threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment,
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no
responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended
to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under
the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact your nearest sales office.
ROHM Customer Support System
www.rohm.com
Copyright © 2008 ROHM CO.,LTD.
THE AMERICAS / EUROPE / ASIA / JAPAN
Contact us : webmaster@ rohm.co. jp
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TEL : +81-75-311-2121
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Appendix1-Rev3.0