Datasheet 1 Channel Compact High Side Switch ICs 2.0A Current Limit High Side Switch ICs BD82023FVJ Description Key Specifications BD82023FVJ is a Single Channel High Side Switch IC employing N-channel power MOSFET with low on resistance and low supply current for the power supply line of universal serial bus (USB). This IC has a built-in over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuits. Package Features Input Voltage Range: ON Resistance: (VIN=5V) Over Current Threshold: Standby Current: Operating Temperature Range: 2.8V to 5.5V 90mΩ(Typ) 2.0A 0.01µA (Typ) -40℃ to +85℃ W(Typ) D(Typ) H(Max) 3.00mm x 4.90mm x 1.10mm TSSOP-B8J Over-Current Protection：2.0A Control Input Logic：Active-Low Output Discharge Function Reverse Current Protection when Power Switch Off Thermal Shutdown Open-Drain Fault Flag Output Under-Voltage Lockout OCP Fast Response Soft-Start Circuit ESD Protection UL：File No. E243261 IEC 60950-1 CB_scheme: File No.US-18106-UL TSSOP-B8J ( MSOP8 Jedec ) Applications USB hub in consumer appliances, PC, PC peripheral equipment, and so forth Typical Application Circuit 5V(Typ) 5V(typ.) 3.3V VOUT 10kΩ to 10kΩ~ 100kΩ 100kΩ CI N GND OUT IN OUT IN OUT CL + - EN(/EN) /OC Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product has no designed protection against radioactive rays 1/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Block Diagram OUT GND IN Charge Pump UVLO IN OUT OCD OUT Gate Logic EN(/EN) /OC TSD Figure 2. Block Diagram Pin Configuration 8 OUT 7 OUT 3 6 OUT 4 5 /OC GND 1 IN 2 IN EN(/EN) Top View Figure 3. Pin Configuration (TOP VIEW) Pin Descriptions Pin No. Symbol I/O Function 1 GND - Ground 2, 3 IN I Power supply input Input terminal to the power switch and power supply input terminal of the internal circuit Short these pins externally 4 EN, /EN I Enable input Active low power on switch High level input > 2.0V, Low level input < 0.8V 5 /OC O Error flag output Low when over-current or thermal shutdown is activated Open drain output 6, 7, 8 OUT O Power switch output Short these pins externally www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit VIN -0.3 to +6.0 V /EN Input Voltage V/EN -0.3 to +6.0 V /OC Voltage V/OC -0.3 to +6.0 V /OC Sink Current I/OC 5 mA IN Supply Voltage OUT Voltage VOUT -0.3 to +6.0 V Storage Temperature Tstg -55 to +150 ℃ Pd 587.5 (1) mW Power Dissipation (1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.7mW per 1℃ above 25℃ Recommended Operating Ratings Parameter IN Operating Voltage Operating Temperature Symbol Rating Unit Min Typ Max VIN 2.8 - 5.5 V Topr -40 - +85 ℃ Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.) DC Characteristics Parameter Operating Current Standby Current Symbol IDD Limit Unit Min Typ Max - 95 135 µA Condition V/EN = 0V, VOUT = open ISTB - 0.01 1 µA V/EN = 5V, VOUT = open V/ENH 2.0 - - V High input V/ENL - - 0.8 V Low input /EN Input Leakage I/EN -1 0.01 +1 µA V/EN = 0V or 5V On Resistance RON - 90 115 mΩ IOUT = 1.0A Reverse Leak Current IREV - - 1 µA /EN Input Voltage Over-Current Threshold ITH 1.5 2.0 2.6 A Short Circuit Output Current ISC 1.1 1.4 1.9 A Output Discharge Resistance RDISC - 75 150 Ω VOUT = 5.5V, VIN = 0V Current Load Slew rate 100A/s VOUT=0V CL=100µF RMS IOUT = 1mA, V/EN = 5V /OC Output Low Voltage V/OC - - 0.4 V I/OC = 1mA /OC Output Leak Current IL/OC - 0.01 1 µA V/OC = 5V VTUVH 2.0 2.3 2.5 V VIN increasing VTUVL 1.9 2.2 2.4 V VIN decreasing UVLO Threshold AC Characteristics Parameter Output Rise Time Symbol tON1 Limit Unit Min Typ Max - 0.4 10 ms Output Turn-on Time tON2 - 0.6 20 ms Output Fall Time tOFF1 - 2 20 µs Output Turn-off Time tOFF2 - 4 40 µs t/OC 5 12 20 ms /OC Delay Time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/21 Condition RL=10Ω TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Measurement Circuit VIN VIN A 10kΩ 1µF 1µF GND OUT GND OUT IN OUT IN OUT IN OUT IN OUT EN(/EN) EN(/EN) /OC VEN(V/EN) RL /OC VEN(V/EN) Operating Current /EN, Input Voltage, Output Rise/Fall Time VIN V IN A ※10µF VIN A VIN I/OC A 10kΩ 1µF 1µF GND OUT GND OUT IN OUT IN OUT IN OUT IN OUT EN(/EN) CL IOUT /OC EN(/EN) V EN(V/EN) /OC VEN(V/EN) /OC Output Low Voltage On Resistance, Over-Current Protection ※Use capacitance of more than 10uF at output short test by using external supply. Figure 4. Measurement Circuit Timing Diagram TOFF1 TON1 90% 90% VOUT 10% 10% TOFF2 TON2 V/EN 50% 50% Figure 5. Output Rise/Fall Time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves 140 140 VIN=5.0V Ta=25°C 120 Operating Current : IDD [µA] Operating Current : IDD [µA] 120 100 80 60 40 20 100 80 60 40 20 0 0 2 3 4 5 6 -50 Supply Voltage : VIN [V] 0 50 Ambient Temperature ; Ta[°C] Figure 6. Operating Current EN Enable Figure 7. Operating Current EN Enable 1.0 1.0 VIN=5.0V Ta=25°C 0.8 0.8 Standby Current : ISTB [µA] Standby Current : ISTB [µA] 100 0.6 0.4 0.2 0.0 0.6 0.4 0.2 0.0 2 3 4 5 6 Supply Voltage : VIN [V] 0 50 100 Ambient Temperature ; Ta[°C] Figure 8. Standby Current EN Disable www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 Figure 9. Standby Current EN Disable 5/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves - continued 2.0 2.0 VIN=5.0V Low to High Enable Input Voltage : V/EN[V] Enable Input Voltage : V/EN[V] Ta=25°C 1.5 Low to High High to Low 1.0 0.5 0.0 1.5 High to Low 1.0 0.5 0.0 2 3 4 5 6 -50 Ambient Temperature ; Ta[°C] Figure 10. /EN Input Voltage Figure 11. /EN Input Voltage 100 200 Ta=25°C 150 100 50 : RON[mΩ] VIN=5.0V 150 On Resistance : RON[mΩ] 50 Supply Voltage : VIN [V] 200 On Resistance 0 100 50 0 0 2 3 4 5 Supply Voltage : VIN [V] -50 6 50 100 Ambient Temperature ; Ta[°C] Figure 12. On Resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 13. On Resistance 6/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves - continued 3.0 3.0 VIN=5.0V Over Current Threshold : ITH[A} Over Current Threshold : ITH[A} Ta=25°C 2.5 2.0 1.5 1.0 2.5 2.0 1.5 1.0 2 3 4 5 6 -50 Supply Voltage : VIN [V] Figure 14. Over-Current Threshold 100 100 100 VIN=5.0V Ta=25°C 80 /OC Output Low Voltage : V/OC[mV] /OC Output Low Voltage : V/OC[mV] 0 50 Ambient Temperature ; Ta[°C] Figure 15. Over-Current Threshold 60 40 20 0 80 60 40 20 0 2 3 4 5 6 -50 Supply Voltage : VIN [V] 50 100 Ambient Temperature ; Ta[°C] Figure 17. /OC Output Low Voltage Figure 16. /OC Output Low Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 7/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves - continued 2.5 1.0 Ta=25°C VIN=5.0V UVLO Hysteresis Voltage : VHYS[V] UVLO Threshold : VTUVL[V] 2.4 VTUVH 2.3 VTUVL 2.2 2.1 0.8 0.6 0.4 0.2 0.0 2.0 -50 0 50 Ambient Temperature ; Ta[°C] -50 100 100 Figure 19. UVLO Hysteresis Voltage Figure 18. UVLO Threshold 5.0 5.0 Ta=25°C VIN=5.0V 4.0 4.0 Rise Time : TON1[ms] Rise Time : TON1[ms] 0 50 Ambient Temperature ; Ta[°C] 3.0 2.0 3.0 2.0 1.0 1.0 0.0 0.0 2 3 4 Supply Voltage : VIN [V] 5 6 Figure 20. Output Rise Time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 0 50 Ambient Temperature ; Ta[°C] 100 Figure 21. Output Rise Time 8/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves - continued 5.0 5.0 Ta=25°C VIN=5.0V 4.0 Turn On Time : TON2[ms] Turn On Time : TON2[ms] 4.0 3.0 2.0 3.0 2.0 1.0 1.0 0.0 0.0 2 3 4 5 Supply Voltage : VIN [V] -50 6 50 100 Ambient Temperature ; Ta[°C] Figure 23. Output Turn-on Time Figure 22. Output Turn-on Time 5.0 5.0 Ta=25°C VIN=5.0V 4.0 4.0 Fall Time : TOFF1[µs] Fall Time : TOFF1[µs] 0 3.0 2.0 1.0 3.0 2.0 1.0 0.0 0.0 2 3 4 5 Supply Voltage : VIN [V] Figure 24. Output Fall Time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6 9/21 -50 0 50 Ambient Temperature ; Ta[°C] Figure 25. Output Fall Time 100 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves - continued 10.0 10.0 Ta=25°C VIN=5.0V 8.0 Turn-off Time : TOFF2[µs] Turn-off Time : TOFF2[µs] 8.0 6.0 4.0 2.0 6.0 4.0 2.0 0.0 0.0 2 3 4 5 6 -50 Supply Voltage : VIN [V] Figure 26. Output Turn-off Time 20 0 50 Ambient Temperature ; Ta[°C] Figure 27. Output Turn-off Time 100 20 Ta=25°C VIN=5.0V /OC Delay Time : T/OC[ms] /OC Delay Time : T/OC[ms] 18 16 14 15 10 12 5 10 2 3 4 5 Supply Voltage : VIN [V] 6 0 50 Ambient Temperature ; Ta[°C] 100 Figure 29. /OC Delay Time Figure 28. /OC Delay Time www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 10/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Performance Curves - continued 200 200 VIN=5.0V Disc On Resistance: RDISC[Ω] Disc On Resistance: RDISC[Ω] Ta=25°C 150 100 50 0 150 100 50 0 2 3 4 5 Supply Voltage : VIN [V] Figure 30. Discharge On Resistance www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6 -50 11/21 0 50 Ambient Temperature ; Ta[°C] Figure 31. Discharge On Resistance 100 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Wave Forms（BD82023FVJ） V/EN (5V/div.) V/EN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IIN (0.5A /div.) IIN (0.5A/div.) VIN=5V RL=10Ω VIN=5V RL=10Ω TIME(0.5ms/div.) Figure 32. Output Rise Characteristic TIME(1µs/div.) Figure 33. Output Fall Characteristic V/EN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) CL=220µF CL=100µF CL=47µF IIN (1.0A/div.) IIN (0.5A/div.) VIN=5V RL=10Ω VIN=5V CL=100µF TIME(5ms/div.) Figure 35. Over-Current Response Ramped Load TIME(1ms/div.) Figure 34. Inrush Current Response www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Wave Forms（BD82023FVJ） V/EN (5V/div.) VOUT (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) IIN (1.0A/div.) IIN (1.0A/div.) VIN=5V VIN=5V TIME(5ms/div.) Figure 37. Over-Current Response 1ΩLoad Connected at Enable TIME(20ms/div.) Figure 36. Over-Current Response Enable to Shortcircuit VIN (5V/div.) VIN (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IIN (0.5A/div.) IIN (0.5A/div.) RL=10Ω RL=10Ω TIME(10ms/div.) Figure 38. UVLO Response Increasing VIN www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 TIME(10ms/div.) Figure 39. UVLO Response Decreasing VIN 13/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Typical Application Circuit 5V(Typ.) IN Regulator OUT USB Controller 10kΩ to 100kΩ CIN GND OUT IN OUT IN OUT VBUS + CL - D+ DGND EN(/EN) /OC Figure 40. Typical Application Circuit Application Information When excessive current flows due to output short-circuit or overload ringing occurs because of inductance between power source line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor CIN across IN terminal and GND terminal of IC. 1µF or higher is recommended. In order to decrease voltage fluctuations of power source line to IC, connect a low ESR capacitor in parallel with CIN. 10µF to 100µF or higher is recommended. Pull up /OC output via resistance value of 10kΩ to 100kΩ. Set up a value for CL which satisfies the application. This system connection diagram does not guarantee operation as the intended application. When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external components including static and transitional characteristics as well as the design tolerances of the IC. Functional Description 1. Switch Operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal is also used as power source input to internal control circuit. When the switch is turned on from /EN control input, the IN terminal and OUT terminal are connected by a 90mΩ(Typ) switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN terminal, current flows from OUT terminal to IN terminal. Since the parasitic diode between the drain and the source of switch MOSFET is canceled current flow from OUT to IN is prevented during off state. 2. Thermal Shutdown Circuit (TSD) If over current would continue, the temperature of the IC would increase drastically. If the junction temperature reaches beyond 130℃(Typ) during the condition of over current detection, thermal shutdown circuit operates and turns power switch off and outputs an error flag (/OC). Then, when the junction temperature decreases below 120℃(Typ), power switch is turned on and error flag (/OC) is cancelled. Unless the cause of the increase of the chip’s temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit operates when the switch is on (/EN signal is active). 3. Over-Current Detection (OCD) The over-current detection circuit (OCD) limits current (ISC) and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three cases when the OCD circuit is activated. The OCD operates when the switch is on (/EN signal is active). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ (1) When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status immediately. (2) When the output short-circuits or when high current load is connected while the switch is on, very large current will flow until the over-current limit circuit reacts. When this happens, the over-current limit circuit is activated and the current limitation is carried out. (3) When the output current increases gradually, current limitation does not work until the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the switch is still on, then the UVLO will shut off the power switch. UVLO has a hysteresis of 100mV(Typ). Under-voltage lockout circuit works when the switch is on (/EN signal is active). 5. Error Flag (/OC) Output Error flag output is an N-MOS open drain output. Upon detection of over current or thermal shutdown, the output level becomes low. Over-current detection has a delay filter. This delay filter prevents current detection flags from being sent during instantaneous events such as surge current due to switching or hot plug. V/EN Output shortcircuit VOUT Thermal shut down IOUT V/OC delay Figure 41. Over-Current Detection, Thermal Shutdown Timing www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Power Dissipation The power dissipation depends on output load, ambient temperature and PCB layout. The devices have current capacity of 1.5A respectively. Power dissipation can be calculated using the output current and the RON of the power switch as below. Pd = RON x IOUT2 The derating curve is shown below TSSOP-B8J (MSOP-8 JEDEC standard) Power Dissipation : Pd[mW] 1200 1000 962mw 800 758mw 600 587.5mw 4 layer board mounting 2 layer board mounting 400 1 layer board mounting 200 0 0 25 50 75 100 125 150 Ambient Temperature ; Ta[°C] Note: IC is Mounted on 70mmx70mmx1.6mm glass-epoxy PCB. Derating is 4.7mW/℃ above Ta=25℃. Figure 42. Power Dissipation Curve (Pd-Ta Curve) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ I/O Equivalent Circuit Symbol EN(/EN) Pin No. 4 Equivalent Circuit EN (/EN) /OC /OC 5 OUT 6,7,8 OUT Operational Notes 1. Absolute Maximum Ratings Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. 2. Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 3. Reverse Connection of Power Supply Connector Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 4. Power Supply Line Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 5. GND Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 6. Short Circuit between Terminals and Erroneous Mounting Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 7. Operation in Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ 8. Inspection with Set PCB When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Input Terminals In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the GND voltage should be avoided. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this IC.. 10. Ground Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 11. External Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. 13. Thermal Design Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Ordering Information B D 8 Part No. 2 0 2 3 Part No. F V J - Package FVJ : TSSOP-B8J (MSOP-8 JEDEC) E 2 Packaging and forming specification E2: Embossed tape and reel Lineup Over-Current Threshold Control Logic Part Number 2.0A Active- Low BD82023FVJ Marking Diagram TSSOP-B8J(TOP VIEW) Part Number Marking D 8 2 Part Number Marking BD82023FVJ 023 LOT Number 1PIN MARK www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Physical Dimension, Tape and Reel Information Package Name TSSOP-B8J <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 20/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet BD82023FVJ Revision History Date Revision 2.APR.2013 001 New Release 18.SEP.2013 002 Revised derating of Power Dissipation www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes 21/21 TSZ02201-0E3E0H300480-1-2 18.SEP.2013 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001