ROHM BD2248G-TR

BD2248G
Datasheet
Power Management Switch ICs for PCs and Digital Consumer Products
1ch Small Package
High Side Switch ICs
for USB Devices and Memory Cards
BD2248G
●Description
BD2248G is low on-resistance N-channel MOSFET
high-side power switches, optimized for Universal
Serial Bus (USB) applications. BD2248G is equipped
with the function of over-current detection, thermal
shutdown, under-voltage lockout and soft-start.
●Key Specifications
„ Input voltage range:
2.7V to 5.5V
„ ON resistance: (VIN=5V)
110mΩ(Typ.)
„ Over current threshold:
0.2A min., 0.4A max.
„ Standby current:
0.01μA (Typ.)
„ Operating temperature range:
-40℃ to +85℃
●Features
„ Reverse Current Protection when Power Switch Off
„ Output Discharge Function
„ Over-Current Detection
„ Thermal Shutdown
„ Open-Drain Fault Flag Output
„ Under-Voltage Lockout
„ Soft-Start Circuit
„ Control Input Logic Active-High
„ ESD protection
(Typ.)
(Typ.)
(Max.)
2.90mm x 2.80mm x 1.25mm
●Package
SSOP5
●Applications
USB hub in consumer appliances, Car accessory, PC,
PC peripheral equipment, and so forth
SSOP5
●Typical Application Circuit
5V (Typ.)
3.3V
CIN
VIN
VOUT
GND
10kΩ~
100kΩ
EN
CL
+
-
/OC
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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Datasheet
BD2248G
●Block Diagram
Figure 2. Block Diagram
●Pin Configuration
1 VIN
VOUT 5
2 GND
3 EN
/OC 4
Figure 3. Pin Configuration (TOP VIEW)
●Pin Descriptions
Pin No.
Symbol
I/O
Function
1
VIN
-
Switch input and the supply voltage for the IC.
2
GND
-
Ground.
3
EN
I
Enable input.
High level input turns on the switch.
4
/OC
O
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
5
VOUT
O
Switch output.
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Datasheet
BD2248G
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Ratings
Unit
VIN supply voltage
VIN
-0.3 to 6.0
V
EN input voltage
VEN
-0.3 to 6.0
V
/OC voltage
V/OC
-0.3 to 6.0
V
/OC sink current
I/OC
5
mA
VOUT voltage
VOUT
-0.3 to 6.0
V
Storage temperature
TSTG
-55 to 150
℃
Power dissipation
Pd
675
*1
mW
*1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃
●Recommended Operating Ratings
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
VIN operating voltage
VIN
2.7
5.0
5.5
V
Operating temperature
TOPR
-40
-
85
℃
●Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.)
DC Characteristics
Parameter
Symbol
EN input voltage
Unit
Conditions
Min.
Typ.
Max.
-
130
175
-
90
120
ISTB
-
0.01
5
μA
VEN = 0V, VOUT = open, VIN = 5V
VENH
2.0
-
-
V
High input, VIN = 3.3 to 5V
-
-
0.8
Operating current
Standby current
Limits
IDD
VENL
EN input leakage
IEN
On-resistance
RON
Reverse leak current
IREV
Over-current threshold
ITH
Short circuit output current
ISC
-
-
0.6
-1
0.01
1
-
110
155
-
130
180
-
-
1
200
300
400
190
290
390
100
200
300
30
60
120
μA
V
μA
mΩ
μA
mA
mA
VEN = 3.3V, VOUT = open, VIN = 3.3V
Low input, VIN = 5V
Low input, VIN = 3.3V
VEN = 0V or 5V
IOUT = 100mA, VIN = 5V
IOUT = 100mA, VIN = 3.3V
VOUT = 5V, VIN = 0V
VIN = 5V
VIN = 3.3V
VOUT = 0V,RMS, VIN = 3.3 to 5V
IDISC = 1mA, VIN = 5V
Output discharge resistance
RDISC
50
100
200
/OC output low voltage
V/OC
-
-
0.4
V
I/OC = 0.5mA, VIN = 3.3 to 5V
VTUVH
2.1
2.3
2.5
V
VIN increasing
VTUVL
2.0
2.2
2.4
V
VIN decreasing
UVLO threshold
Ω
VEN = 5V, VOUT = open, VIN = 5V
IDISC = 1mA, VIN = 3.3V
AC Characteristics
Parameter
Symbol
Limits
Unit
Conditions
Min.
Typ.
Max.
TON1
-
1
6
ms
RL = 500Ω, VIN = 3.3 to 5V
Output turn-on time
TON2
-
1.5
10
ms
RL = 500Ω, VIN = 3.3 to 5V
Output fall time
TOFF1
-
1
20
μs
RL = 500Ω, VIN = 3.3 to 5V
Output turn-off time
TOFF2
-
3
40
μs
RL = 500Ω, VIN = 3.3 to 5V
Output rise time
/OC delay time
T/OC
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15
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11
16
21
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ms
VIN = 5V
VIN = 3.3V
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Datasheet
BD2248G
●Measurement Circuit
VIN
VIN
A
A
VIN
VOUT
VIN
1µF
RL
GND
VEN
VOUT
1µF
GND
VEN
/OC
EN
Operating current
EN
/OC
EN, Input voltage, Output rise/fall time
VIN
VIN
A
A
10kΩ
IOC
VIN
VOUT
1µF
IOUT
GND
VEN
EN
VIN
VOUT
1µF
GND
VEN
/OC
On-resistance, Over-current detection
EN
/OC
/OC Output low voltage
Figure 4. Measurement circuit
●Timing Diagram
VEN
50%
50%
TON2
TOFF2
90%
VOUT
90%
10%
10%
TON1
TOFF1
Figure 5. Output rise/fall time
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Datasheet
BD2248G
●Typical Performance Curves
160
160
VIN=5.0V
Ta=25°C
DD [μA]
140
120
OPERATING CURRENT : I
OPERATING CURRENT : I
DD [μA]
140
100
80
60
40
20
0
120
100
80
60
40
20
0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
1.0
1.0
VIN=5.0V
Ta=25°C
STB [μA]
0.8
STANDBY CURRENT : I
STB [μA]
100
Figure 7. Operating current
EN enable
Figure 6. Operating current
EN enable
STANDBY CURRENT : I
0
50
AMBIENT TEMPERATURE : Ta[℃]
0.6
0.4
0.2
0.0
0.8
0.6
0.4
0.2
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 8. Standby current
EN disable
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0
50
AMBIENT TEMPERATURE : Ta[℃]
100
Figure 9. Standby current
EN disable
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Datasheet
BD2248G
●Typical Performance Curves - continued
2.0
2.0
VIN=5.0V
1.5
ENABLE INPUT VOLTAGE : V EN [V]
ENABLE INPUT VOLTAGE : V EN [V]
Ta=25°C
Low to High
High to Low
1.0
0.5
0.0
Low to High
1.5
High to Low
1.0
0.5
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 10. EN input voltage
200
VIN=5.0V
ON [mΩ]
Ta=25°C
150
ON RESISTANCE : R
ON [mΩ]
100
Figure 11. EN input voltage
200
ON RESISTANCE : R
0
50
AMBIENT TEMPERATURE : Ta[℃]
100
50
0
150
100
50
0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 12. On-resistance
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0
50
AMBIENT TEMPERATURE : Ta[℃]
100
Figure 13. On-resistance
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BD2248G
●Typical Performance Curves - continued
0.6
0.6
TH[A]
0.5
OVERCURRENT THRESHOLD : I
OVERCURRENT THRESHOLD : I
TH[A]
Ta=25°C
0.4
0.3
0.2
0.1
0.0
VIN=5.0V
0.5
0.4
0.3
0.2
0.1
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
-50
6
0
50
AMBIENT TEMPERATURE : Ta[℃]
Figure 14. Over-current threshold
Figure 15. Over-current threshold
100
100
VIN=5.0V
Ta=25°C
80
/OC OUTPUT LOW
VOLTAGE:V/OC [mV]
80
/OC OUTPUT LOW
VOLTAGE:V/OC [mV]
100
60
40
20
60
40
20
0
0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 16. /OC output low voltage
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0
50
AMBIENT TEMPERATURE : Ta[℃]
100
Figure 17. /OC output low voltage
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Datasheet
BD2248G
●Typical Performance Curves - continued
2.5
1.0
VIN=5.0V
UVLO HYSTERESIS VOLTAGE:V HSY [V]
UVLO THRESHOLD : V
TUVH ,
VTUVL [V]
VIN=5.0V
2.4
2.3
VTUVH
2.2
VTUVL
2.1
2.0
0.8
0.6
0.4
0.2
0.0
-50
0
50
AMBIENT TEMPERATURE : Ta[℃]
100
-50
100
Figure 19. UVLO hysteresis voltage
Figure 18. UVLO threshold
5.0
5.0
Ta=25°C
VIN=5.0V
4.0
RISE TIME : T ON1 [ms]
4.0
RISE TIME : T ON1 [ms]
0
50
AMBIENT TEMPERATURE : Ta[℃]
3.0
2.0
1.0
3.0
2.0
1.0
0.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 20. Output rise time
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0
50
AMBIENT TEMPERATURE : Ta[℃]
100
Figure 21. Output rise time
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Datasheet
BD2248G
●Typical Performance Curves - continued
5.0
5.0
Ta=25°C
VIN=5.0V
4.0
TURN ON TIME : T ON2 [ms]
TURN ON TIME : T ON2 [ms]
4.0
3.0
2.0
1.0
0.0
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
Figure 22. Output turn-on time
100
Figure 23. Output turn-on time
5.0
5.0
VIN=5.0V
Ta=25°C
4.0
4.0
FALL TIME : TOFF1 [μs]
FALL TIME : TOFF1 [μs]
0
50
AMBIENT TEMPERATURE : Ta[℃]
3.0
2.0
3.0
2.0
1.0
1.0
0.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
100
Figure 25. Output fall time
Figure 24. Output fall time
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0
50
AMBIENT TEMPERATURE : Ta[℃]
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Datasheet
BD2248G
●Typical Performance Curves - continued
6.0
6.0
Ta=25°C
VIN=5.0V
5.0
TURN OFF TIME : T OFF2 [μs]
TURN OFF TIME : T OFF2 [μs]
5.0
4.0
3.0
2.0
1.0
0.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
-50
100
Figure 27. Output turn-off time
Figure 26. Output turn-off time
20
20
Ta=25°C
VIN=5.0V
18
/OC DDLAY TIME : T /OC [ms]
18
/OC DDLAY TIME : T /OC [ms]
0
50
AMBIENT TEMPERATURE : Ta[℃]
16
14
12
10
16
14
12
10
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
0
50
AMBIENT TEMPERATURE : Ta[℃]
100
Figure 29. /OC delay time
Figure 28. /OC delay time
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Datasheet
BD2248G
●Typical Performance Curves - continued
200
Ta=25°C
DISC [Ω]
VIN=5.0V
150
DISC ON RESISTANCE : R
DISC ON RESISTANCE : R
DISC [Ω ]
200
100
50
0
150
100
50
0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
0
50
AMBIENT TEMPERATURE : Ta[℃]
100
Figure 31. Discharge on resistance
Figure 30. Discharge on resistance
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Datasheet
BD2248G
●Typical Wave Forms
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.1A/div.)
IOUT
(0.1A/div.)
VIN=5V
VIN=5V
RL=50Ω
RL=50Ω
TIME (1ms/div.)
Figure 32. Output rise characteristic
TIME (1us/div.)
Figure 33. Output fall characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
CL=100uF
CL=47uF
IOUT
(0.1A/div.)
IOUT
(0.2A/div.)
VIN=5V
CL=22uF
TIME (1ms/div.)
Figure 34. Inrush current response
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VIN=5V
RL=50Ω
TIME (5ms/div.)
Figure 35. Over-current response
ramped load
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Datasheet
BD2248G
●Typical Wave Forms - continued
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VIN=5V
VIN=5V
VIN=5V
TIME (5ms/div.)
Figure 36. Over-current response
enable to shortcircuit
TIME (500ms/div.)
Figure 37. Over-current response
enable to shortcircuit
VOUT
(5V/div.)
VIN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(1A/div.)
IOUT
(10mA/div.)
TIME (5ms/div.)
Figure 39. UVLO response
increasing VIN
TIME (5ms/div.)
Figure 38. Over-current response
1Ω load to enabled device
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Datasheet
BD2248G
●Typical Wave Forms - continued
VIN
(5V/div.)
VOUT
(5V/div.)
RL=500Ω
IOUT
(10mA/div.)
TIME (10ms/div.)
Figure 40. UVLO response
decreasing VIN
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Datasheet
BD2248G
●Typical Application Circuit
5V (Typ.)
10kΩ~
100kΩ
CIN
VIN
VOUT
GND
Controller
EN
CL
+
-
/OC
Figure 41. Typical application circuit
●Application Information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,
and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor CIN by VIN terminal
and GND terminal of IC. 1μF or higher is recommended. In order to decrease voltage fluctuations of power source line to IC,
connect a low ESR capacitor in parallel with CIN. 10μF to 100μF or higher is effective.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up value, which satisfies the application as CL.
This system connection diagram doesn’t guarantee operating as the application.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as dispersion of the IC.
●Functional Description
1. Switch Operation
VIN terminal and VOUT terminal are connected to the drain and the source of switch MOSFET respectively. And the VIN
terminal is used also as power source input to internal control circuit.
When the switch is turned on from EN control input, VIN terminal and VOUT terminal are connected by an 110mΩ(Typ.)
switch. In on status, the switch is bidirectional. Therefore, when the potential of VOUT terminal is higher than that of VIN
terminal, current flows from VOUT terminal to VIN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, in the off status, it is possible to
prevent current from flowing reversely from VOUT to VIN.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 135℃(Typ.) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 115℃(Typ.), power
switch is turned on and fault flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the
output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three types of response against over-current. The over-current detection
circuit works when the switch is on (EN signal is active).
3-1. When the switch is turned on while the output is in shortcircuit status
When the switch is turned on while the output is in shortcircuit status or so, the switch gets in current limit status
soon.
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Datasheet
BD2248G
3-2. When the output shortcircuits while the switch is on
When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the
over-current limit circuit reacts. When the current detection, limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.)
while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is N-MOS open drain output. At detection of over-current, thermal shutdown, low level is output.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
Over Current
Detection
Over Current
Load Removed
VOUT
ITH
ISC
IOUT
T/OC
V/OC
Figure 42. Over-current detection
VEN
Output Shortcircuit
VOUT
Thermal Shutdown
IOUT
V/OC
Delay
Figure 43. Over-current detection, Thermal shutdown timing
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Datasheet
BD2248G
●Power Dissipation
(SSOP5 package)
700
POWER DISSIPATION : Pd [mW]
600
500
400
300
200
100
0
0
25
50
75 85
100
AMBIENT TEMPERATURE : Ta [℃]
125
150
* 70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 44. Power Dissipation Curve (Pd-Ta Curve)
●I/O Equivalence Circuit
Symbol
Pin No.
EN
3
VOUT
5
Equivalent Circuit
EN
VOUT
/OC
/OC
4
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Datasheet
BD2248G
●Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit is aimed at isolating the LSI from thermal runaway as much as possible. Do not
continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual
states of use.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/20
TSZ02201-0E3E0H300010-1-2
25.JUL.2012 Rev.001
Datasheet
BD2248G
●Ordering Information
B
D
2
2
4
8
Part Number
G
-
TR
Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
●Physical Dimension Tape and Reel Information
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
1.25Max.
)
0.05±0.05
1.1±0.05
S
+0.05
0.42 −0.04
0.95
0.1
S
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
SSOP5(TOP VIEW)
K
0
Part Number Marking
LOT Number
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
19/20
TSZ02201-0E3E0H300010-1-2
25.JUL.2012 Rev.001
Datasheet
BD2248G
●Revision History
Date
Revision
25.JUL.2012
001
Changes
New Release
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
20/20
TSZ02201-0E3E0H300010-1-2
25.JUL.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.