Datasheet EARTH LEAKAGE CURRENT DETECTOR Automotive EARTH LEAKAGE CURRENT DETECTOR IC BD9582F-M ●General Description BD9582F-M integrates leakage detector and amplifier. Especially, it is suitable for high sensitivity and a highspeed operation use, and since the operating temperature range is wide, it can be used for various uses. ●Key Specifications ■ Operating supply voltage range： 12V to 22V ■ Operating temperature range： －40°C to ＋105°C ■ Supply current： 330μA(typ.) ■ Trip voltage： 4.48mV to 11.06mV ■ Output current ability(Ta=－40℃)： －200μA～(min.) ●Features ■ Small temperature fluctuation and high input sensitivity ■ Wide operating temperature range W(Typ.) x D(Typ.) x H(Max.) 5.00mm x 6.20mm x 1.71mm ●Packages SOP8 ●Applications ■ Earth leakage circuit breaker ■ Earth leakage circuit relay ●Typical Application Circuit Example SCR RVS COS VZ 8 7 C1 5 NR SC IN GND OD VR Trip Coil 6 OS Reference voltage output block VS Latch block CVS 1 CIN CVR 2 3 RIN 4 COD ZCT:Zero current transformer TEST SW&R ○Product structure：Silicon monolithic integrated circuit www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays. 1/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Pin Configurations ●Block Diagrams SOP8 (TOP VIEW) 8 7 VS 7 6 5 1 2 3 4 5 NR SC Latch block Reference voltage output block 8 6 OS VR 1 IN 2 GND 3 OD 4 ●Pin Descriptions Pin No. Symbol Function 1 VR Reference voltage 2 IN Input 3 GND 4 OD Output of input comparator 5 SC Input of latch circuit 6 NR Noise absorption 7 OS Output 8 VS Power supply Ground ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit *1 IS 8 mA IN-VR current IIN-VR ±250 mA VR pin current IVR 30 mA IN terminal current IIN 30 mA SC terminal current ISC 5 mA Power Supply voltage VS 36 V Input terminal voltage VVR/IN 17 V VOD/SC/NR/OS 8 V Power dissipation Pd 680 *2 mW Storage temperature Tstg －55 to ＋150 ℃ Supply current OD/SC/NR/OS terminal voltage *1 *2 The power-supply voltage is limited by the internal clamping circuit. To use at temperature above Ta＝25℃ reduce 5.5mW/℃. Mounted on a glass epoxy PCB (70mm×70mm×1.6mm) www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Recommended Operating Ratings Parameter Symbol Limits Unit Supply voltage VS 12 to 22 V Operating temperature Topr －40 to ＋105 ℃ CVS 1≦ μF External capacitor between VS and GND External capacitor between OS and GND COS ≦1 μF ●Electrical Characteristics (Unless otherwise specified, VS=12V, GND=0V, Ta=25℃) Limits Temperature range Min. Typ. Max. -40℃ - - 520 25℃ - 330 500 105℃ - - 460 VT -40℃ to +105℃ 4.48 7.50 OD Source current IODSO 25℃ -27.2 OD Sink current IODSI 25℃ Parameter Symbol IS1 Supply current Trip voltage OS Source current IOSSO Unit Conditions μA ΔVIN=VVR-VIN=30mV 11.06 mV VT=ΔVIN=VVR-VIN -20.6 -14.0 μA 16.7 26.0 35.3 μA -40℃ -200 - - 25℃ -100 - - 105℃ -75 - - ΔVIN=VVR-VIN=30mV, VOD=1.2V VOD=0.8V, ΔVIN=VVR-VIN=0mV μA VSC=2.0V, VOS=0.8V VSC=0.2V, VOS=0.2V OS Sink current IOSSI -40℃ to +105℃ 200 - - μA SC ON voltage VSCON 25℃ 1.00 1.24 1.48 V Input clamp voltage VIC -40℃ to +105℃ 4.2 5.5 6.8 V IIC=20mA Differential input clamp voltage VIDC -40℃ to +105℃ 0.5 1.0 1.5 V IIDC=100mA Maximum current voltage VSM 25℃ 26 29 32 V IS=7mA IOS2 -40℃ to +105℃ -100 - - μA IS=900μA,VSC=2.0V VOS=0.8V VSOFF 25℃ 2.7 3.7 4.7 V tON 25℃ 1.8 2.9 4.0 Ms Supply current 2 ＊1 Latch OFF Supply Voltage Operating time ＊2 *1 Supply current 2 is OS source current value when the power supply current(Is=900μA) is given. *2 Operating time is time until output voltage reaches 0.8V after detecting the leakage signal. Conditions : Capacitor(0.047μF) is connected between OD(OS) and GND. www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Test circuits 1.IS1 2.VT 3.IODSO VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS 1 2 5 6 7 8 1 2 4 5 6 7 8 1 2 4 5 6 7 8 A IOD 3 4 + A 3 VS IS + ΔVIN ΔVIN 4.IODSI VS V VOD VS ΔVIN 3 5.IOSSO/IOSSI VOD 6.VSCON VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS 1 2 4 5 6 7 8 1 2 4 5 6 7 8 1 2 4 5 6 7 8 A IOD 3 3 VSC + VS + VOD 3 A VS VSC IOS V Vos VOS 7.VIC 8.VIDC 9.VSM VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS 1 2 5 6 7 8 1 2 4 5 6 7 8 1 2 4 5 6 7 8 3 4 3 3 VS VSM V IIDC V IC V VIC IS VIDC 10.IOS2 11.VSOFF 12.tON VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS VR IN GND OD SC NR OS VS 1 2 4 5 6 7 8 1 2 4 5 6 7 8 1 2 4 5 6 7 8 0.047 μF V 3 VSC IS + A IOS 3 3 VS 0.047 μF V VOS ΔVIN VOS VS 0.047 μF ●Timing Chart Input voltage between IN and VR ΔVIN(IN-VR) VT VSCON OD/SC terminal voltage VOD/VSC OS terminal voltage VOS 0.8V tON www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Typical Performance Curves(reference data) 1.0 800 0.9 700 600 0.7 S u p p ly C u rre n t IS [u A ] P ow e r D issipa tion [W ] 0.8 105℃ 0.6 0.5 0.4 0.3 500 －60℃ 25℃ 400 300 200 0.2 100 0.1 0.0 0 25 50 0 105 75 100 125 0 150 5 10 15 20 Power Supply VS [V] Ambient Temperature Ta [℃] Figure 1 Derating curve 30 Figure 2 Circuit current - Supply voltage 40 0 O S term inal S ource C urrent I O S S O [uA ] 30 R a te of fluctua tion Δ [% ] 25 20 RIN=300 10 0 -10 RIN=1kΩ -20 -30 -40 -100 105℃ -200 25℃ -300 －60℃ -400 -500 -60 -40 -20 0 20 40 60 80 100 120 0 5 10 15 20 Ambient Temperature Ta [℃] Power Supply VS [V] Figure 3 Trip voltage fluctuation rate - Ambient temperature Figure 4 OS terminal source current - Supply voltage www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/11 25 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet 5 10 4 8 O S te rm in a l v o lta g e V O S [V ] O p e ra tin g tim e t O N [m s ] BD9582F-M 3 2 1 6 4 －60℃ 2 105℃ 0 0 -60 -40 -20 0 20 40 60 80 100 0 120 1 2 Ambient Temperature Ta [℃] Figure 5 Operating time - Ambient temperature 10 10 8 8 6 105℃ 25℃ 3 4 5 6 Power Supply VS [V] 7 8 9 10 Figure 6 Latch OFF supply voltage - Ambient temperature O S te rm in a l v o lta g e V O S [V ] O S te rm in a l vo lta g e V O S [V ] 25℃ －60℃ 4 2 6 4 －60℃ 25℃ 2 105℃ 0 0 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 SC terminal input voltage VSCON [V] Figure 7 SC ON voltage - Ambient temperature www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 2 3 4 5 6 Power Supply VS [V] 7 8 9 10 Figure 8 Latch ON supply voltage - Ambient temperature 6/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature).IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this thermal resistance. Fig.9(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below θja = (Tj - Ta) / Pd ℃/W ・・・・・ (Ⅰ) Derating curve in Fig.9(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.10(a) show a derating curve for an example of BD9582F-M. LSIの 消 費 力 [W] Power dissipation of 電 LSI Pd (max) θja=(Tj-Ta)/P ℃/W P2 θja2 < θja1 周囲温度 Ta [℃] Ambient temperature θ' ja2 P1 θ ja2 Tj ' (max) Tj (max) θ' ja1 Chip surfaceチップ temperature 表面温度 Tj [℃] 0 25 50 θ ja1 75 100 Ambient temperature 周 囲 温 度 Ta [℃ ] 消費電力Pd[W] P [W] Power dissipation 125 150 (b) Derating curve (a) Thermal resistance Figure 9. Thermal resistance and derating 1.0 0.9 P o w e r D issip a tio n [W ] 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 105 100 125 150 Ambient Temperature Ta [℃] (a) BD9582F-M BD9582F-M Derating curve slope UNIT 5.5 mW/℃ When using the unit above Ta=25℃, subtract the value above per degree℃ Permissible dissipation is a value when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted. Figure 10. Derating curve www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●I/O equivalence circuit VCC VCC VS 300O Pin 1 [VR] Pin 5 [SC] 100kO ESD PRO TECT Pin 2 VCC VCC VS Pin 1 Pin 2 [IN] VCC 300O Pin 6 [NR] 100kO Pin 7 VCC VCC Pin 6 Pin 3 [GND] Pin 7 [OS] VCC VCC VCC line (Internal Power Supply Line) Pin 4 [OD] www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Pin 8 [VS] 8/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Operational Notes 1) Absolute maximum ratings Absolute maximum ratings are the values which indicate the limits, within which the given voltage range can be safely charged to the terminal. However, it does not guarantee the circuit operation. 2) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 3) Terminal short-circuits When the output and power supply terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 4) Ground terminal voltage All time, Ground terminal voltage should keep lowest voltage. In addition, please confirm whether there is not really a terminal becoming the voltage that is lower than GND including a transitional phenomenon. 5) Operation in a strong electromagnetic field Operation in a strong electromagnetic field may cause malfunctions. 6) Short-circuit between pins and erroneous mounting Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power supply, or the output and GND may result in IC destruction. 7) IC handing Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. 8) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned off before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Ordering Information B D 9 5 8 2 F Part Number - ME2 Packaging and forming specification E2: Embossed tape and reel (SOP8) Package F: SOP8 ●Physical Dimension Tape and Reel Information SOP8 <Tape and Reel information> 6 5 +6° 4° −4° 0.3MIN 7 4.4±0.2 6.2±0.3 8 1 2 3 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagrams SOP8 (TOP VIEW) 9 5 8 2 M LOT Number １PIN MARK www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet BD9582F-M ●Revision History Date Revision 2012.10.29 001 Changes New Release www.rohm.co.jp © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/11 TSZ02201-0RCR1GZ00070-1-2 2012.10.29 Rev.002 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. 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Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. 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It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.