Datasheet 1ch High Side Switch ICs 1.5A Current Limit High Side Switch ICs BD82004FVJ-M BD82005FVJ-M Key Specifications General Description BD82004FVJ-M and BD82005FVJ-M are low on-resistance N-Channel MOSFET high-side power switches optimized for Universal Serial Bus (USB) applications. BD82004FVJ-M and BD82005FVJ-M are equipped with the function of over-current protection, thermal shutdown, under-voltage lockout and soft-start. Input Voltage Range: 2.7V to 5.5V ON-Resistance: 70mΩ(Typ) Over-Current Threshold: 1.0A (Min), 2.0A (Max) Number of Channels: 1ch Output Rise Time: 0.8ms(Typ) Standby Current: 0.01μA (Typ) Operating Temperature Range: -40°C to +85°C Features AEC-Q100 Qualified Built-in Low ON-Resistance (Typ 70mΩ) N-Channel MOSFET Current Limit Threshold 1.5A Control Input Logic Active “High” Control Logic: BD82004FVJ-M Active “Low” Control Logic: BD82005FVJ-M Soft-Start Circuit Over-Current Protection Thermal Shutdown Under-Voltage Lockout Protection Open-Drain Fault Flag Output TTL Enable Input Package W(Typ) D(Typ) H (Max) TSSOP-B8J 3.00mm x 4.90mm x 1.10mm Applications Car Accessory Typical Application Circuit 5V(typ.) 3.3V VOUT 10kΩ~ 100kΩ CIIN GND OUT IN OUT IN CL OUT + - EN(/EN) /OC Lineup Current Limit Threshold Min Typ Max 1.0A 1.5A 2.0A 1.0A 1.5A Control Input Logic High TSSOP-B8J Reel of 2500 BD82004FVJ-MGE2 Low TSSOP-B8J Reel of 2500 BD82005FVJ-MGE2 2.0A ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Package Orderable Part Number ○This product has not designed protection against radioactive rays 1/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Block Diagram GND OUT IN Charge Pump UVLO IN OCD OUT OUT Gate Logic /OC EN /EN TSD Pin Configurations BD82004FVJ-M (TOP VIEW) BD82005FVJ-M (TOP VIEW) 1 GND OUT 8 1 GND OUT 8 2 IN OUT 7 2 IN OUT 7 3 IN OUT 6 3 IN OUT 6 4 EN /OC 5 4 /EN /OC 5 Pin Description Pin No. Symbol I/O Function 1 GND - Ground 2, 3 IN - Switch input and the supply voltage for the IC. At use, connect both pins together. 4 EN , /EN I Enable input. EN: High level input turns on the switch.(BD82004FVJ-M) /EN: Low level input turns on the switch.(BD82005FVJ-M) High level input > 2.0V, low level input < 0.8V. 5 /OC O Over-current detection terminal. Low level output during over-current or over-temperature condition. Open-drain fault flag output. 6, 7, 8 OUT O Power switch output. At use, connect each pin together. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Rating Unit VIN -0.3 to +6.0 V VEN, V/EN -0.3 to +6.0 V /OC Voltage V/OC -0.3 to +6.0 V /OC Sink Current I/OC 5 mA OUT Voltage VOUT -0.3 to +6.0 V Storage Temperature Tstg -55 to +150 °C Supply Voltage Enable Input Voltage Power Dissipation Pd 0.58 (Note 1) W (Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.7mW/°C above Ta=25°C Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Operating Voltage Operating Temperature Symbol Rating Max Unit Min Typ VIN 2.7 - 5.5 V Topr -40 - +85 °C Electrical Characteristics ○ BD82004FVJ-M (VIN = 5.0V, Ta = 25°C, unless otherwise specified) DC Characteristics Limit Parameter Symbol Min Typ Max Operating Current Standby Current EN Input Voltage Unit Conditions - 110 160 μA VEN = 5V , OUT=OPEN ISTB - 0.01 1 μA VEN = 0V , OUT=OPEN VENH 2.0 - - V High Input IDD VENL - - 0.8 V Low Input IEN -1.0 +0.01 +1.0 μA VEN = 0V or VEN = 5V /OC Output Low Voltage V/OCL - - 0.5 V I/OC = 0.5mA /OC Output Leak Current IL/OC - 0.01 1 μA V/OC = 5V /OC Delay Time t/OC 10 15 20 ms ON-Resistance RON - 70 110 mΩ IOUT = 500mA Switch Leak Current ILSW - - 1.0 μA VEN = 0V, VOUT = 0V Current Limit Threshold ITH 1.0 1.5 2.0 A Short Circuit Current ISC 0.7 1.0 1.4 A Output Rise Time tON1 - 0.8 10 ms VOUT = 0V CL = 47μF (RMS) RL = 10Ω Output Turn ON Time tON2 - 1.1 20 ms RL = 10Ω Output Fall Time tOFF1 - 5 20 μs RL = 10Ω EN Input Current Output Turn OFF Time UVLO Threshold tOFF2 - 10 40 μs RL = 10Ω VTUVH 2.1 2.3 2.5 V VIN Increasing VTUVL 2.0 2.2 2.4 V VIN Decreasing www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Electrical Characteristics – continued ○ BD82005FVJ-M (VIN = 5.0V, Ta = 25°C, unless otherwise specified) DC Characteristics Limits Parameter Symbol Min Typ Max /EN Input Voltage Condition - 110 160 μA V/EN = 0V , OUT=OPEN ISTB - 0.01 1 μA V/EN = 5V , OUT=OPEN V/ENH 2.0 - - V High Input Operating Current Standby Current Unit IDD V/ENL - - 0.8 V Low Input IE/N -1.0 +0.01 +1.0 μA V/EN = 0V or V/EN = 5V /OC Output Low Voltage V/OCL - - 0.5 V I/OC = 0.5mA /OC Output Leak Current IL/OC - 0.01 1 μA V/OC = 5V /OC Delay Time t/OC 10 15 20 ms ON-Resistance RON - 70 110 mΩ IOUT = 500mA Switch Leak Current ILSW - - 1.0 μA V/EN = 5V, VOUT = 0V Current Limit Threshold ITH 1.0 1.5 2.0 A Short Circuit Current ISC 0.7 1.0 1.4 A Output Rise Time tON1 - 0.8 10 ms VOUT = 0V CL = 47μF (RMS) RL = 10Ω Output Turn ON Time tON2 - 1.1 20 ms RL = 10Ω Output Fall Time tOFF1 - 5 20 μs RL = 10Ω /EN Input Current Output Turn OFF Time UVLO Threshold tOFF2 - 10 40 μs RL = 10Ω VTUVH 2.1 2.3 2.5 V VIN Increasing VTUVHL 2.0 2.2 2.4 V VIN Decreasing www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Measurement Circuit VIN VIN A VIN A 1µF 10kΩ 1µF GND OUT GND OUT IN OUT IN OUT IN OUT IN OUT EN(/EN) /OC EN(/EN) VEN(V/EN) A. RL CL /OC VEN(V/EN) B. Operating Current VIN EN, /EN Input Voltage, Output Rise / Fall Time Inrush Current VIN VIN VIN 10kΩ I/OC 1µF 1µF GND OUT IN OUT IN OUT EN(/EN) A CL IOUT /OC GND OUT IN OUT IN OUT EN(/EN) VEN(V/EN) /OC VEN(V/EN) C. ON-Resistance Over-Current Detection D. /OC Output Low Voltage Figure 1. Measurement Circuit Timing Diagram tOFF1 tOFF1 tON1 tON1 90% 90% 90% VOUT 90% VOUT 10% 10% tOFF2 tOFF2 tON2 tON2 VEN V/EN VENH VENL V/ENL Figure 2. Timing Diagram (BD82004FVJ-M) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/23 V/ENH Figure 3. Timing Diagram (BD82005FVJ-M) TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves 140 140 VIN=5.0V 120 120 Operating Current : IDD[μA] Operating Current : IDD[μA] Ta=25°C 100 80 60 40 100 80 60 40 20 20 0 0 2 3 4 5 Supply Voltage : VIN[V] 6 -50 100 Figure 5. Operating Current vs Ambient Temperature (EN, /EN Enable) Figure 4. Operating Current vs Supply Voltage (EN, /EN Enable) 1.0 1.0 Ta=25°C VIN=5.0V STANDBY Standby Current Current :: IISSTB [μA] TB[μA] STANDBY TB[μA] Standby Current Current :: ISISTB [μA] 0 50 Ambient Temperature Temperature :: Ta[°C] Ambient Ta[℃] 0.8 0.6 0.4 0.2 0.0 0.8 0.6 0.4 0.2 0.0 2 3 4 5 6 -50 Supply VOLTAGE Voltage : V:INV[V] SUPPLY IN[V] Figure 6. Standby Current vs Supply Voltage (EN, /EN Disable) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 Ambient Temperature : Ta[°C] Ambient Temperature : Ta[℃] 100 Figure 7. Standby Current vs Ambient Temperature (EN, /EN Disable) 6/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves - continued 2.0 Ta=25°C 1.5 : VEN,: V Voltage InputInput Enable /EN [V] VEN Voltage Enable [V] : V:EN, Voltage Input Enable VENV[V] Voltage Input Enable /EN 0[V] 2.0 Low to High High to Low 1.0 0.5 0.0 VIN=5.0V Low to High 1.5 High to Low 1.0 0.5 0.0 2 3 4 5 Supply Voltage : VIN[V] 6 -50 0 Figure 8. EN, /EN Input Voltage vs Supply Voltage 100 Figure 9. EN, /EN Input Voltage vs Ambient Temperature 200 200 VIN=5.0V Resistance : R R ONON-Resistance: [mΩ] [mΩ] ON ON Ta=25°C Resistance : R ON ONON-Resistance: [mΩ] RON [mΩ] 50 AmbientTemperature Temperature::Ta[℃] Ta[°C] Ambient 150 100 50 0 150 100 50 0 2 3 Supply Voltage : VIN[V] 4 0 50 Ambient : Ta[°C] AmbientTemperature Temperature : Ta[℃] Figure 10. ON-Resistance vs Supply Voltage Figure 11. ON-Resistance vs Ambient Temperature www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5 6 -50 7/23 100 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves - continued 2.0 2.0 VIN=5.0V Current Limit Threshold : I TH [A] Current Limit Threshold : I TH[A] Ta=25°C 1.8 1.6 1.4 1.2 1.8 1.6 1.4 1.2 1.0 1.0 2 3 4 5 -50 6 0 50 Ambient Temperature Ambient Temperature: Ta[℃] : Ta[°C] Supply Voltage : VIN[V] Figure 13. Current Limit Threshold vs Ambient Temperature Figure 12. Current Limit Threshold vs Supply Voltage 1.4 1.4 Ta=25°C VIN=5.0V 1.2 Short-Circuit Current : ISC[A] ISC[A] [A] Short-Circuit Current : ISC 100 1.0 0.8 0.6 0.4 1.2 1.0 0.8 0.6 0.4 2 3 4 Supply Voltage : VIN[V] 0 50 Ambient Temperature Ambient Temperature::Ta[°C] Ta[℃] Figure 14. Short Circuit Current vs Supply Voltage Figure 15. Short Circuit Current vs Ambient Temperature www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5 6 -50 8/23 100 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves - continued 100 VIN=5.0V Ta=25°C 80 /OC Output Low Voltage :V/OC[mV] /OC Output Low Voltage : V/OC[mV] 100 60 40 20 0 2 3 4 5 Supply Voltage : VIN[V] 80 60 40 20 0 -50 6 Figure 16. /OC Output Low Voltage vs Supply Voltage 100 Figure 17. /OC Output Low Voltage vs Ambient Temperature 1.0 : VHYS Voltage Hysteresis UVLO : V [V] Voltage Hysteresis UVLO 2.5 UVLO Threshold : VTUVH, VTUVL[V] 0 50 Ambient Temperature: Ta[℃] : Ta[°C] Ambient Temperature 2.4 2.3 VTUVH 2.2 VTUVL 2.1 0.8 0.6 0.4 0.2 0.0 2.0 -50 0 50 AmbientTemperature Temperature :: Ta[℃] Ta[°C] Ambient -50 100 Figure 18. UVLO Threshold Voltage vs Ambient Temperature www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AmbientTemperature Temperature : Ta[℃] Ambient : Ta[°C] Figure 19. UVLO Hysteresis Voltage vs Ambient Temperature 9/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves - continued 5.0 5.0 VIN=5.0V 4.0 Output Rise Time : tON1[ms] Output Rise Time : tON1[ms] Ta=25°C 3.0 2.0 1.0 0.0 4.0 3.0 2.0 1.0 0.0 2 3 4 5 Supply Voltage : VIN[V] 6 -50 100 Figure 21. Output Rise Time vs Ambient Temperature Figure 20. Output Rise Time vs Supply Voltage 5.0 5.0 Output Turn ON Time : tON2[ms] Ta=25°C Output Turn ON Time : tON2[ms] 0 50 Ambient Temperature : Ta[℃] 4.0 3.0 2.0 1.0 0.0 VIN=5.0V 4.0 3.0 2.0 1.0 0.0 2 3 4 5 Supply Voltage : VIN[V] 6 -50 Figure 22. Output Turn ON Time vs Supply Voltage www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 Ambient Temperature : Ta[℃] 100 Figure 23. Output Turn ON Time vs Ambient Temperature 10/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves - continued 5.0 4.0 Output Fall Time: tOFF1[µs] Output Fall Time : tOFF1[μs] Ta=25°C 3.0 2.0 1.0 0.0 2 3 4 5 Supply Voltage: VIN[V] 6 Ambient Temperature: Ta[°C] Figure 24. Output Fall Time vs Supply Voltage Figure 25. Output Fall Time vs Ambient Temperature 10 10 VIN=5.0V OFF2[µs] 8 Output Turn OFF Time : t Output Turn OFF Time : tOFF2[μs] Ta=25°C 6 4 2 8 6 4 2 0 0 2 3 4 5 Supply Voltage : VIN[V] 6 -50 Figure 26. Output Turn OFF Time vs Supply Voltage www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AmbientTemperature Temperature ::Ta[°C] Ambient Ta[℃] Figure 27. Output Turn OFF Time vs Ambient Temperature 11/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Performance Curves - continued 20 20 VV =5.0V =5.0V ININ 18 /OC Delay Time: t/OC[ms] /OC Delay Time : t/OC[ms] Ta=25°C 16 14 18 16 14 12 12 10 10 2 3 4 5 Supply Voltage : VIN[V] -50 6 Figure 28. /OC Delay Time vs Supply Voltage www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 Ambient Temperature : Ta[°C] 100 Figure 29. /OC Delay Time vs Ambient Temperature 12/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Wave Forms (BD82004FVJ-M) VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IIN (0.5A/div.) IIN (0.5A/div.) VIN=5V RL=10Ω CL=100μF VIN=5V RL=10Ω CL=100μF TIME (1ms/div.) TIME (1ms/div.) Figure 30. Output Rise Characteristic Figure 31. Output Fall Characteristic VOUT (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) CL=147µF CL=100µF IOUT (0.5A/div.) CL=47µF IIN (0.5A/div.) VIN=5V RL=10Ω VIN=5V CL=100μF TIME (10ms/div.) TIME (1ms/div.) Figure 33. Over-Current Response Ramped Load Figure 32. Inrush Current Response www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Wave Forms - continued VOUT (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) VIN=5V CL=100μF VIN=5V CL=100μF TIME (2ms/div.) TIME (5ms/div.) Figure 34. Over-Current Response Ramped Load Figure 35. Over-Current Response Enable to Short Circuit V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) Thermal Shutdown IOUT (1.0A/div.) IOUT (1.0A/div.) VIN=5V CL=100μF VIN=5V CL=100μF TIME (5ms/div.) TIME (200ms/div.) Figure 36. Over-Current Response 1Ω Load Connected at Enable Figure 37. Thermal Shutdown 1Ω Load Connected at Enable www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Wave Forms - continued VIN (5V/div.) VIN (5V/div.) VOUT (5V/div.) VOUT (5V/div.) V/OC (5V/div.) V/OC (5V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) RL=10Ω CL=100μF RL=10Ω CL=100μF TIME (10ms/div.) TIME (10ms/div.) Figure 38. UVLO Response Increasing VIN Figure 39. UVLO Response Decreasing VIN www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Typical Application Circuit 5V(Typ) 5V(typ.) IN Regulator OUT USB Controller 10kΩ to 100kΩ CIN IN GND OUT IN OUT IN OUT EN(/EN) /OC VBUS + CL - D+ DGND Application Information When excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and IC. This may cause bad effects on IC operations. In order to avoid this case, a bypass capacitor (CIN) should be connected across the IN terminal and GND terminal of IC. A 1μF or higher value is recommended. Moreover, in order to decrease voltage fluctuations of power source line and IC, connect a low ESR capacitor in parallel with CIN. A 10μF to 100μF or higher is effective. Pull up /OC output by resistance 10kΩ to 100kΩ. Set up values for CL which satisfies the application. This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as dispersion of the IC. Functional Description 1. Switch Operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal is also used as power source input to internal control circuit. When the switch is turned ON from EN(/EN) control input, the IN and OUT terminals are connected by a 70mΩ (Typ) switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of IN terminal, current flows from OUT to IN terminal. On the other hand, when the switch is turned off, it is possible to prevent current from flowing reversely from OUT to IN terminal since a parasitic diode between the drain and the source of switch MOSFET is not present. 2. Thermal Shutdown Circuit (TSD) If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature goes beyond 170°C (Typ) in the condition of over-current detection, thermal shutdown circuit operates and turns power switch off, causing the IC to output a fault flag (/OC). Then, when the junction temperature decreases lower than 150°C (Typ), the power switch is turned on and the fault flag (/OC) is cancelled. This operation repeats, unless the increase of chip’s temperature is removed or the output of power switch is turned OFF. The thermal shutdown circuit operates when the switch is ON (EN(/EN) signal is active). 3. Over-Current Detection (OCD) The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. The over-current detection circuit works when the switch is on (EN(/EN) signal is active). There are three types of response against over-current: (1) (2) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status immediately. When the output short-circuits or high capacity load is connected while the switch is on, very large current flows until the over-current limit circuit reacts. When the current detection and limit circuit operates, current limitation is carried out. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M (3) When the output current increases gradually, current limitation would not operate unless the output current exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under-Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the switch is still ON, then UVLO shuts off the power switch. UVLO has a hysteresis of 100mV(Typ). Under-voltage lockout circuit operates when the switch is on (EN(/EN) signal is active). 5. Fault Flag (/OC) Output Fault flag output is N-MOS open drain output. During detection of over-current and/or thermal shutdown, the output level will turn low. Over-current detection has delay filter. This delay filter prevents current detection flags from being sent during instantaneous events such as inrush current at switch on or during hot plug. If fault flag output is unused, /OC pin should be connected to ground line or open. EN VEN /EN Output Short shortcircuit Circuit VOUT OUT OUT Thermal Thermal Shutdown shut down IOUT OUT V/OC /OC /OC delay Delay /OC Delay Time Figure 40. Over-Current Detection, Thermal Shutdown Timing (BD82004FVJ-M) V/EN Output shortcircuit VOUT Thermal shut down IOUT V/OC /OC Delay Time Figure 41. Over-Current Detection, Thermal Shutdown Timing (BD82005FVJ-M) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Power Dissipation (TSSOP-B8J Package) 600 [mW] Dissipation: PdPd[mW] PowerDISSIPATION: POWER 500 400 300 200 100 0 0 25 50 75 100 125 150 AmbientTEMPERATURE: Temperature: Ta Ta [°C][℃] AMBIENT Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Figure 42. Power Dissipation Curve (Pd-Ta Curve) I/O Equivalence Circuit Symbol Pin No. EN(/EN) 4 /OC 5 OUT 6,7,8 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Equivalence Circuit 18/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. In rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Operational Notes - continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 43. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Ordering Information B D 8 2 0 0 4 Part Number B D F V J - Package FVJ : TSSOP-B8J 8 2 0 0 Part Number 5 F V J Package FVJ : TSSOP-B8J MGE2 Product Rank M: for Automotive Packaging and forming specification G: Halogen free E2: Embossed tape and reel - MGE2 Product Rank M: for Automotive Packaging and forming specification G: Halogen free E2: Embossed tape and reel Marking Diagram TSSOP-B8J (TOP VIEW) Part Number Marking LOT Number 1PIN MARK Part Number Part Number Marking BD82004FVJ-M D82004 BD82005FVJ-M D82005 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B8J 22/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 BD82004FVJ-M BD82005FVJ-M Revision History Date Revision 05.Feb.2015 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 001 Changes New Release 23/23 TSZ02201-0GGG0H300010-1-2 05.Feb.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001