Power Management Switch ICs for PCs and Digital Consumer Products 2ch High Side Switch ICs for USB Devices and Memory Cards BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ No.11029EBT11 ●Description High side switch for USB is a high side switch having over current protection used in power supply line of universal serial bus (USB). Its switch unit has two channels of N-channel power MOSFET, and current of 500mA as USB standard can be flown to the respective channels. And, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. ●Features 1) Dual N-MOS high side switch 2) Continuous current load 0.5A 3) Control input logic Active-Low Active-High 4) Soft start circuit 5) Over current detection 6) Thermal shutdown 7) Under voltage lockout 8) Open drain error flag output 9) Reverse-current protection when switch off 10) Flag output delay filter built in ●Applications USB hub in consumer appliances, Car accessory, PC, PC peripheral equipment, and so forth ●Lineup Parameter BD6512F BD6513F BD6516F BD6517F Over current detection 1.65 1.65 - - - - A Output current at short - - 1.65 1.65 1.0 1.0 A On resistance 100 100 110 110 100 100 mΩ Control input logic High Low High Low High Low - Reverse current flow blockingat switch off - - ○ ○ ○ ○ - Flag output delay filter - - ○ ○ ○ ○ - www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/20 BD2052AFJ BD2042AFJ Unit 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Absolute Maximum Ratings ◎BD6512F/BD6513F/BD6516F/BD6517F Parameter Symbol Supply voltage VDD CTRL voltage VCTRL Flag voltage VFLAG Output voltage VOUT Ratings -0.3 to 6.0 -0.3 to VDD+0.3 -0.3 to 6.0 -0.3 to VDD+0.3 (BD6512F/ BD6513F) -0.3 to 6.0 (BD6516F/ BD6517F) Unit V V V V V Storage temperature TSTG -55 to 150 ºC Power dissipation *1 Pd 560 *1 mW Symbol Ratings Unit ◎BD2042AFJ/ BD2052AFJ Parameter Supply voltage VIN -0.3 to 6.0 V EN,/EN voltage VEN, V/EN -0.3 to 6.0 V /OC voltage V/OC -0.3 to 6.0 V /OC current IS/OC OUT voltage VOUT -0.3 6.0 V Storage temperature TSTG -55 to 150 ºC Power dissipation *1 Pd 560*1 mW Symbol Ratings Unit Supply voltage VDD 3.0 to 5.5 V Operation temperature TOPR -25 to 85 °C ILO 0 to 500 mA Symbol Ratings Unit VIN 2.7 to 5.5 V TOPR -40 to 85 ºC ILO 0 to 500 mA 10 to mA *1 This value decreases 4.48mW/℃ above Ta=25℃. * Resistance radiation design is not doing. ●Operating conditions ◎BD6512F/BD6513F/BD6516F/BD6517F Parameter Continuous output current ◎BD2042AFJ/ BD2052AFJ Parameter Supply voltage Operation temperature Continuous output current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Electrical characteristics ◎BD6512F/BD6513F(VDD =5V, Ta=25℃, unless otherwise specified.) Limits Parameter Symbol Min. Typ. Max. Operating current Unit Condition - 85 120 μA - 0.01 2 μA - - 0.7 V VCTRL=5V(BD6512F), 0V(BD6513F) OUT=OPEN VCTRL=0V(BD6512F), 5V(BD6513F) OUT=OPEN CTRL Low Level Input 2.5 - - V CTRL High Level Input -1 0.01 1 μA VCTRL=0V or 5V - 100 130 mΩ VDD=5V,IOUT=500mA - 120 160 mΩ VDD=3.3V,IOUT=500mA IDD Control input voltage VCTRL Control input current ICTRL On resistance RON Turn on delay TRD 100 600 2000 μs RL=10Ω Turn on rise time TR 200 1500 6000 μs RL=10Ω Turn off delay TFD - 3 20 μs RL=10Ω Turn off fall time TF - １ 20 μs RL=10Ω VUVLOH 2.3 2.5 2.7 V VDD increasing VUVLOL 2.1 2.3 2.5 V VDD decreasing TTS - 135 - ºC Flag output resistance RFLAG - 16 40 Ω Flag off current IFLAG - 0.01 1 μA Current limit threshold ITHLIM 1.25 1.65 2.20 A Over current limit level ILIM 0.6 1.1 1.6 A UVLO threshold voltage Thermal shutdown threshold ◎BD6516F/BD6517F (VDD =5V, Ta=25℃, unless otherwise specified.) Limits Parameter Symbol Min. Typ. Max. Current consumption IFLAG=5mA Unit Condition - 100 140 μA - 0.01 2 μA - - 0.7 V VCTRL=5V(BD6516F), 0V(BD6517F) OUT=OPEN VCTRL=0V(BD6516F), 5V(BD6517F) OUT=OPEN Low level input voltage 2.5 - - V High level input voltage IDD CTRL input voltage VCTRL CTRL input current ICTRL -1 0.01 1 μA VCTRL=0V or 5V FLAG output resistance RFLAG - 250 450 Ω IFLAG=1mA FLAG output leak current IFLAG - 0.01 1 μA VFLAG=5V FLAG output delay TDFL - 1 4 ms ON resistance RON - 110 150 mΩ VDD=5V,IOUT=500mA - 140 180 mΩ VDD=3.3V,IOUT=500mA Short circuit output current ISC 1.2 1.65 2.2 A VOUT=0V ILEAK - - 10 μA VCTRL=0V(BD6516F), 5V(BD6517F) Thermal shutdown threshold TTS - 135 - ºC At Tj increase Output rise time TON1 100 1300 4000 μs RL=10Ω Output turn on delay time TON2 200 1500 6000 μs RL=10Ω Output fall time TOFF1 - 1 20 μs RL=10Ω Output turn off delay time TOFF2 - 3 20 μs RL=10Ω Output leak current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ◎BD2042AFJ/BD2052AFJ (VDD =5V, Ta=25℃, unless otherwise specified.) Limits Parameter Symbol Unit Min. Typ. Max. Condition Operating Current IDD - 110 140 μA V/EN = 0V, OUT = OPEN (BD2042AFJ) VEN = 5V, OUT = OPEN (BD2052AFJ) Standby Current ISTB - 0.01 1 μA V/EN = 5V, OUT = OPEN (BD2042AFJ) VEN = 0V, OUT = OPEN (BD2052AFJ) 2.0 - - V High input - - 0.8 V Low input - - 0.4 V Low input2.7V≤ VIN ≤4.5V I/EN,EN -1.0 0.01 1.0 μA V/EN,EN = 0V or V/EN,EN = 5V /OC output LOW voltage V/OC - - 0.5 V I/OC = 5mA /OC output leak current IL/OC - 0.01 1 μA V/OC = 5V ON resistance RON - 100 130 mΩ IOUT = 500mA Output current at short ISC 0.7 1.0 1.3 A Output rise time TON1 - 1.8 10 ms Output turn on time TON2 - 2.1 20 ms Output fall time TOFF1 - 1 20 μs Output turn off time TOFF2 - 3 40 μs VTUVH 2.1 2.3 2.5 V Increasing VIN VTUVL 2.0 2.2 2.4 V Decreasing VIN /EN input voltage V/EN,EN /EN input current UVLO threshold www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/20 VIN = 5V, VOUT = 0V, CL = 100μF (RMS) RL = 10Ω , CL = OPEN 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Measurement circuit ◎BD6512F/ BD6513F/ BD6516F/ BD6517F VDD VDD VCTRL CTRLA OUTA FLAGA VDD FLAGB GND CTRLB OUTB VCTRL A VCTRL Operating current VCTRL VCTRL FLAGA VDD RL CL VDD CTRLA OUTA FLAGA VDD FLAGB GND CTRLB OUTB FLAGB GND CTRLB OUTB RL CL CTRL input voltage, Output rise, fall time VDD 10k 10k OUTA 1µF 1µF VCTRL CTRLA IFLAG VCTRL IOUT VDD IFLAG CL CTRLA OUTA FLAGA VDD FLAGB GND CTRLB OUTB 1µF 1µF VCTRL IOUT CL ON resistance, Over current detection FLAG output resistance ◎BD2042AFJ/ BD2052AFJ VDD VDD 1µF 1µF A GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 RL RL Operating current VDD 1µF GND 10k OUT1 VEN EN1 OUT2 VEN EN2 /OC2 CL EN, /EN input voltage, Output rise, fall time VDD 10k VDD 1µF GND /OC1 IN CL IOUT IOUT IOUT /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 ON resistance, Over current detection IOUT /OC output LOW voltage Fig.1 Measurement circuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Timing diagram ◎BD6513F ◎BD6512F TF TF TR TR 90% 90% VOUT 50% 90% VOUT 50% 50% 10% 10% 50% 10% 10% TFD TFD TRD VCTRL 90% TRD 50% VCTRL 50% 50% ◎BD6515F/BD2042AFJ 50% ◎BD6516F/BD2052AFJ TOFF1 TOFF1 TON1 TON1 90% VOUT 90% 10% 10% TON2 VCTRL V/EN 50% 90% VOUT 90% 10% 10% TON2 TOFF2 50% VCTRL VEN 50% TOFF2 50% Fig.2 Timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Reference data ◎BD6512F/ BD6513F 120 OPERATING CURRENT : IDD [uA] Ta=25ºC 100 80 60 40 20 3 4 5 SUPPLY VOLTAGE : VDD [V] VDD=5.0V 100 80 60 40 20 0 -50 0 2 3.0 6 0 0.5 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.5 CTRL input voltage 200 Low to High 1.5 High to Low 1.0 0.5 ON RESISTANCE : RON [mΩ] ON RESISTANCE : RON [mΩ] CONTROL INPUT VOLTAGE : VCTRL [V] 2.0 150 100 50 0 0.0 2 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 3 4 5 SUPPLY VOLTAGE : VDD [V] Fig.6 CTRL input voltage 150 VDD=3.3V 100 VDD=5.0V 50 0 6 -50 1000 3000 2000 1000 4 5 6 3000 2000 1000 0 0 -50 0 3 Ta=25ºC TURN ON DELAY : TRD [us] TURN ON RISE TIME : TR [us] 2000 0 50 2 100 Fig.9 Output rise time 5.0 5.0 Ta=25ºC 2000 1000 VDD=5.0V TURN OFF FALL TIME : T F[us] TURN OFF FALL TIME : T F[us] 3000 4.0 3.0 2.0 1.0 100 AMBIENT TEMPERATURE : Ta[℃ ] Fig.12 Output rise delay time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4.0 3.0 2.0 1.0 0.0 0.0 50 6 Fig.11 Output rise delay time Fig.10 Output rise time VDD=5.0V 0 3 4 5 SUPPLY VOLTAGE : VDD [V] AMBIENT TEMPERATURE : Ta[℃ ] SUPPLY VOLTAGE : VDD [V] 4000 100 4000 VDD=5.0V 3000 50 Fig.8 ON resistance 4000 Ta=25ºC 0 AMBIENT TEMPERATURE : Ta[℃] Fig.7 ON resistance 4000 0 -50 High to Low 1.0 Ta=25ºC 2.5 2 Low to High 1.5 100 200 VDD=5.0V -50 2.0 Fig.4 Operating current 3.0 TURN ON RISE TIME : TR [us] 50 Ta=25ºC 2.5 AMBIENT TEMPERATURE : Ta[℃] Fig.3 Operating current TURN ON DELAY : TRD [us] CONTROL INPUT VOLTAGE : VCTRL [V] OPERATING CURRENT : IDD [uA] 120 2 3 4 5 SUPPLY VOLTAGE : VDD [V] Fig.13 Output fall time 7/20 6 -50 0 50 100 AMBIENT T EMPERATURE : Ta[℃ ] Fig.14 Output fall time 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ 5.0 3.0 5.0 4.0 3.0 2.0 1.0 4.0 3.0 2.0 1.0 0.0 0.0 3 4 5 SUPPLY VOLTAGE : VDD [V] -50 6 0.6 0.4 0.2 0.0 100 CURRENT LIMIT THRESHOLD : ITHLIM[A] Ta=25ºC 2.0 1.0 0.0 2 FLAG OUTPUT RESISTANCE : RFLAG[Ω] Ta=25ºC 25 20 15 10 5 0 5 0 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 6 Fig.21 Flag output resistance 100 3.0 VDD=5.0V 2.0 1.0 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.20 Over current threshold 1.0 VDD=5.0V 25 20 15 10 5 Ta=25ºC 0.8 0.6 0.4 0.2 0.0 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Supply Voltage : VDD [V] 50 AMBIENT TEMPERATURE : Ta[℃] 30 30 4 VUVLOL 2.2 Fig.19 Over current threshold Fig.18 UVLO hysteresis voltage 3 2.4 Fig.17 UVLO threshold voltage 3.0 AMBIENT TEMPERATURE : Ta[℃] 2 VUVLOH -50 OPERATING CURRENT : IDD [uA] UVLO HYSTERESIS VOLTAGE : VHYS[V] 0.8 50 2.6 2.0 100 Fig.16 Output fall delay time 1.0 0 50 2.8 AMBIENT TEMPERATURE : Ta[℃] Fig.15 Output fall delay time -50 0 CURRENT LIMIT THRESHOLD : ITHLIM[A] 2 FLAG OUTPUT RESISTANCE : RFLAG[Ω] UVLO THRESHOLD VOLTAGE VUVLOH , VUVLOL [V] VDD=5.0V TURN OFF DELAY : TFD [us] TURN OFF DELAY : TFD [us] Ta=25ºC Fig.22 Flag output resistance 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] Fig.23 Operating current CTRL Disable OPERATING CURRENT : IDD [uA] 1.0 VDD=5.0V 0.8 0.6 0.4 0.2 0.0 2 3 4 5 6 SUPPLY VOLTAGE : VDD [V] Fig.24 Operating current CTRL Disable www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Reference data ◎BD6516F/ BD6517F 120 100 80 60 40 20 3 4 5 VDD=5.0V 100 80 60 40 20 0 -50 0 2 3.0 6 Fig.25 Operating current 50 1.0 0.5 100 2 2.0 1.5 1.0 0.5 2.0 Low to High 1.5 High to Low 1.0 0.5 VDD=5.0V 2.5 2.0 Low to High 1.5 High to Low 1.0 0.5 0.0 3 4 5 -50 6 Fig.28 CTRL input voltage Fig.29 CTRL input voltage (BD6516F) (BD6517F) 4000 TURN ON RISE TIME : TON1 [us] ON RESISTANCE : RON[mΩ] ON RESISTANCE : RON [mΩ] 150 VDD=3.3V VDD=5.0V 100 50 3 4 5 6 Ta=25ºC 3000 2000 1000 0 0 0 -50 SUPPLY VOLTAGE : VDD [V] 0 50 2 100 4 5 6 Fig.33 Output rise time Fig.32 ON resistance Fig.31 ON resistance 3 SUPPLY VOLTAGE : VDD [V] AMBIENT TEMPERATURE : Ta[℃] 4000 4000 100 (BD6517F) 200 50 50 Fig.30 CTRL input voltage Ta=25ºC 100 0 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VDD [V] AMBIENT TEMPERATURE : Ta[℃] 150 6 3.0 2 200 5 (BD6516F) Ta=25ºC 2.5 100 4 Fig.27 CTRL input voltage 0.0 0.0 2 3 SUPPLY VOLTAGE : VDD [V] CONTROL INPUT VOLTAGE : VCTRL [V] CONTROL INPUT VOLTAGE : VCTRL [V] 2.5 50 1.5 0.0 0 3.0 VDD=5.0V 0 2.0 Fig.26 Operating current 3.0 -50 Ta=25ºC 2.5 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VDD [V] CONTROL INPUT VOLTAGE : VCTRL [V] CONTROL INPUT VOLTAGE : VCTRL [V] Ta=25ºC OPERATING CURRENT : I DD [uA] OPERATING CURRENT : IDD [uA] 120 4000 3000 VDD=3.3V 2000 VDD=5.0V 1000 TURN ON DELAY : TON2[us] TURN ON DELAY : TON2[us] TURN ON RISE TIME : TON1[us] Ta=25ºC 3000 2000 1000 0 0 -50 0 50 100 2 3 4 5 6 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VDD[V] Fig.34 Output rise time Fig.35 Output rise delay time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/20 3000 VDD=3.3V 2000 VDD=5.0V 1000 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.36 Output rise delay time 2011.05 - Rev.B Technical Note 5.0 400 300 VDD=3.3V 200 VDD=5.0V 100 5.0 Ta=25ºC 4.0 3.0 2.0 1.0 0.0 0 -50 0 50 2 100 3 Fig.37 Flag output resistance 4.0 3.0 2.0 1.0 0.0 5 3 4 5 -50 VDD=3.3V 3.0 2.0 VDD=5.0V 1.0 0.0 -50 0 50 2.0 1.0 0 50 100 2 3 4 5 Fig.42 Shortcircuit output current 4 Ta=25ºC 400 300 200 100 Ta=25ºC 3 2 1 0 0 2 3 4 5 2 6 3 4 5 AMBIENT TEMPERATURE : Ta[℃] SUPPLY VOLTAGE : VDD[V] SUPPLY VOLTAGE : VDD[V] Fig.43 Shortcircuit output current Fig.44 Flag output resistance Fig.45 Flag output delay 3 2 1 Ta=25ºC OPERATING CURRENT : IDD[uA] OPERATING CURRENT : IDD[uA] VDD=5.0V 0.8 0.6 0.4 0.2 0.0 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.46 Flag output delay www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6 1.0 1.0 4 6 SUPPLY VOLTAGE : VDD[V] 500 100 100 Ta=25ºC FLAG OUTPUT DELAY : TDFL[ms] FLAG OUTPUT RESISTANCE : RFLAG[Ω] 1.0 50 0.0 -50 Fig.41 Output fall delay time VDD=3.3V 0 3.0 Fig.40 Output fall delay time VDD=5.0V VDD=5.0V Fig.39 Output fall time AMBIENT TEMPERATURE : Ta[℃] 2.0 1.0 Fig.38 Output fall time SUPPLY VOLTAGE : VDD[V] 3.0 VDD=3.3V AMBIENT TEMPERATURE : Ta[℃] 4.0 6 2.0 6 0.0 2 SHORT CIRCUIT CURRENT : ISC[A] 4 SHORT CIRCUIT CURRENT : ISC[A] TURN OFF DELAY : TOFF2[us] TURN OFF DELAY : TOFF2[us] Ta=25ºC 3.0 SUPPLY VOLTAGE : VDD [V] 5.0 5.0 4.0 0.0 AMBIENT TEMPERATURE : Ta[℃] FLAG OUTPUT DELAY : TDFL[ms] TURN OFF FALL TIME : T OFF1[us] 500 TURN OFF FALL TIME : TOFF1 [us] FLAG OUTPUT RESISTANCE : RFLAG[Ω] BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ VDD=5.0V 0.8 0.6 0.4 0.2 0.0 2 3 4 5 6 -50 0 50 SUPPLY VOLTAGE : VDD[V] AMBIENT TEMPERATURE : Ta[℃] Fig.47 Operating current CTRL Disable Fig.48 Operating current CTRL Disable 10/20 100 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Reference data ◎BD2042AFJ/ BD2052AFJ 140 Ta=25ºC 120 OPERATING CURRENT : IDD[uA] OPERATING CURRENT : IDD[uA] 120 1.0 VIN=5.0V 100 100 80 60 40 0.6 80 60 0.4 40 0.2 20 20 0 0 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 0.0 -50 6 VIN=5.0V 0.4 0.2 ENABLE INPUT VOLTAGE : VEN, V/EN[V] ENABLE INPUT VOLTAGE : VEN, V/EN[V] 0 0.6 1.5 1.5 Low to High High to Low 1.0 0.5 0.0 2 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 -50 200 0.5 0.3 0.2 0.1 0.0 6 Fig.55 /OC output LOW voltage VIN=5.0V 0.3 0.2 150 0 50 100 AMBIENT TEMPERATURE : Ta[℃] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.58 ON resistance www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Fig.57 ON resistance 2.0 2.0 VIN=5.0V Ta=25ºC 1.5 1.0 0.5 0.0 0.0 -50 2 Fig.56 /OC output LOW voltage 0.5 0 50 0 -50 1.0 50 100 0.0 1.5 100 150 0.1 SHORT CIRCUIT CURRENT : ISC[A] 200 0.4 SHORT CIRCUIT CURRENT : ISC[A] 0.4 Ta=25ºC VIN=5.0V ON RESISTANCE : R ON[mΩ] /OC OUTPUT LOW VOLTAGE : V/OC[V] Ta=25ºC 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.54 EN,/EN input voltage Fig.53 EN,/EN input voltage 0.5 3 4 5 SUPPLY VOLTAGE : VDD[V] High to Low 0.5 Fig.52 Operating current EN,/EN Disable 2 Low to High 1.0 0.0 0.0 6 Fig.51 Operating current EN,/EN Disable Ta=25ºC 0.8 -50 3 4 5 SUPPLY VOLTAGE : VIN[V] 2.0 VIN=5.0V OPERATING CURRENT : ISTB[uA] 2 2.0 1.0 /OC OUTPUT LOW VOLTAGE : V/OC[V] 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.50 Operating current EN,/EN Enable Fig.49 Operating current EN,/EN Enable ON RESISTANCE : RON[mΩ] Ta=25ºC 0.8 OPERATING CURRENT : ISTB[uA] 140 2 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 Fig.59 Output current at shortcircuit 11/20 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.60 Output current at shortcircuit 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ 5.0 5.0 5.0 Ta=25ºC 4.0 4.0 2.0 1.0 TURN ON TIME : TON2[ms] RISE TIME : TON1[ms] RISE TIME : TON1[ms] 4.0 3.0 3.0 2.0 1.0 0.0 3 4 5 SUPPLY VOLTAGE : VIN[V] 6 -50 Fig.61 Output rise time 0.0 100 2 2.0 1.0 VIN=5.0V 4.0 4.0 3.0 3.0 2.0 0.0 0.0 0 50 100 2 AMBIENT TEMPERATURE : Ta[℃] 3 4 5 SUPPLY VOLTAGE : VIN[V] -50 6 Fig.65 Output fall time Fig.64 Output turn on time 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.66 Output fall time 2.5 5.0 6.0 5.0 UVLO THRESHOLD VOLTAGE : VUVLOH, VUVLOL[V] VIN=5.0V Ta=25°C TURN OFF TIME : TOFF2[us] 4.0 4.0 3.0 2.0 3.0 2.0 1.0 1.0 0.0 0.0 3 4 5 SUPPLY VOLTAGE : VIN[V] 2.0 1.0 1.0 0.0 6 5.0 FALL TIME : TOFF1[us] FALL TIME : TOFF1[us] 3.0 3 4 5 SUPPLY VOLTAGE : VIN[V] Fig.63 Output turn on time Ta=25ºC 4.0 TURN ON TIME : TON2[ms] 0 50 AMBIENT TEMPERATURE : Ta[℃] 5.0 VIN=5.0V 2 2.0 Fig.62 Output rise time 5.0 -50 3.0 1.0 0.0 2 TURN OFF TIME : TOFF2[us] Ta=25ºC VIN=5.0V 6 Fig.67 Output turn off time -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.68 Output turn off time 2.4 VUVLOH 2.3 VUVLOL 2.2 2.1 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.69 UVLO threshold voltage UVLO HYSTERESIS VOLTAGE : VHYS[V] 1.0 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Fig.70 UVLO hysteresis voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Waveform data VCTRL (5V/div.) VCTRL (5V/div.) VEN (5V/div.) VFLAG (5V/div.) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VDD=5V RL=47Ω CL=47uF IOUT (0.2A/div.) VDD=5V RL=47Ω CL=47uF VDD=5V RL=10Ω CL=100uF IOUT (0.2A/div.) IOUT (0.2A/div.) TIME(200ms/div.) TIME(200ms/div.) TIME(200ms/div.) Fig.71 Output rise, fall characteristic (BD6512F) Fig.72 Output rise, fall characteristic (BD6516F) Fig.73 Output rise, fall characteristic (BD2052AFJ) VFLAG (5V/div.) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VDD=5V CL=47uF IOUT (0.5A/div.) VDD=5V CL=47uF IOUT (0.5A/div.) VDD=5V IOUT (0.5A/div.) TIME (2ms/div.) TIME (2ms/div.) TIME (2ms/div.) Fig.74 Over current response Ramped load (BD6512F) Fig.75 Over current response Ramped load (BD6516F) Fig.76 Over current response Ramped load (BD2052AFJ) VCTRL (5V/div.) VCTRL (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) VFLAG (5V/div.) VEN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VDD=5V CL=47uF IOUT (0.5A/div.) 1ms Delay IOUT (0.5A/div.) VDD=5V CL=47uF 1.3ms Delay VDD=5V CL=100uF IOUT (0.5A/div.) TIME (2ms/div.) TIME (2ms/div.) TIME (2ms/div.) Fig.77 Over current response Enable to shortcircuit (BD6512F) Fig.78 Over current response Enable to shortcircuit (BD6516F) Fig.79 Over current response Enable to shortcircuit (BD2052AFJ) VFLAG (5V/div.) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VDD=5V CL=47uF VDD=5V CL=47uF Thermal Shutdown Thermal Shutdown IOUT (2A/div.) IOUT (2A/div.) VDD=5V CL=100uF Thermal Shutdown IOUT (2A/div.) TIME (100ms/div.) TIME (100ms/div.) TIME (200ms/div.) Fig.80 Over current response Output shortcircuit at Enable (BD6512F) Fig.81 Over current response Output shortcircuit at Enable (BD6516F) Fig.82 Over current response Output shortcircuit at Enable (BD2052AFJ) Regarding the output rise/fall and over current detection characteristics of BD6513F, BD6517F, BD2042AFJ refer to the characteristic of BD6512F, BD6516F, BD2052AFJ. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Block diagram ◎BD6512F/ BD6513F/ BD6516F/ BD6517F CTRLA (BD6516F/17F) Delay Gate Logic1 FLAGA Charge Pump1 OCD1 OUTA VDD UVLO CTRLA 1 TSD 8 OUTA OUTB CTRLB FLAGA 2 Charge Pump2 OCD2 Gate Logic2 GND 7 VDD Top View FLAGB 3 6 GND CTRLB 4 5 OUTB FLAGB Delay (BD6516F/17F) Fig.83 Block diagram Fig.84 Pin Configuration ●Pin description ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Pin No. Symbol I/O Pin function 1, 4 CTRLA CTRLB I Enable input. Switch on at Low level. (BD6513F/BD6517F) Switch on at High level. (BD6512F/BD6516F) High level input > 2.5V, Low level input < 0.7V. 2, 3 FLAGA FLAGB O Error flag output. Low at over current, thermal shutdown. Open drain output. 5, 8 OUTB OUTA O Switch output. 6 GND I Ground. 7 VDD I Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. ●I/O circuit ◎BD6512F/ BD6513F/ BD6516F/ BD6517F Symbol CTRLA CTRLB Pin No. Equivalent circuit (BD6512F/ BD6513F) CTRLA CTRLB CTRLA CTRLB 1, 4 FLAGA FLAGB FLAGA FLAGB OUTA OUTB Equivalent circuit (BD6516F/ BD6517F) FLAGA FLAGB 2, 3 5, 8 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. OUTA OUTB OUTA OUTB 14/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Block diagram ◎BD2042AFJ/BD2052AFJ TSD1 /EN1 EN1 /OC1 Gate Logic1 Delay Charge Pump1 OCD1 IN OUT1 UVLO GND 1 OUT2 /EN2 EN2 IN 2 Charge Pump2 OCD2 7 OUT1 Top View /EN1 3 (EN1) /EN2 4 (EN2) /OC2 Gate Logic2 8 /OC1 Delay GND 6 OUT2 5 /OC2 TSD2 Fig.85 Block diagram ●Pin description ◎BD2042AFJ/BD2052AFJ Pin No. Symbol Fig.86 Pin Configuration I/O Pin function 1 GND I Ground. 2 IN I Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. 3, 4 /EN, EN I Enable input. Switch on at Low level. (BD2042AFJ) Switch on at High level. (BD2052AFJ) High level input > 2.0V, Low level input < 0.8V. 5, 8 /OC O Error flag output. Low at over current, thermal shutdown. Open drain output. 6, 7 OUT O Switch output. ●I/O circuit ◎BD2042AFJ/BD2052AFJ Symbol Pin No /EN1(EN1) /EN2(EN2) Equivalent circuit /EN1(EN1) /EN2(EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 OUT1 OUT2 5, 8 OUT1 OUT2 6, 7 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Functional description 1. Switch operation VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. And the VDD(IN) pin is used also as power source input to internal control circuit. When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT is connected. In a normal condition, current flows from VDD to OUT. If voltage of OUT is higher than VDD, current flows from OUT to VDD, since the switch is bidirectional. ◎BD6512F/ BD6513F There is a parasitic diode between the drain and the source of switch MOSFET. Therefore, even when the switch is off, if the voltage of OUT is higher than that of VDD, current flows from OUT to VDD. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ There is not parasitic diode, it is possible to prevent current from flowing reversely from OUT to VDD. 2. Thermal shutdown (TSD) Thermal shut down circuit turns off the switch and outputs an error flag when the junction temperature in chip exceeds a threshold temperature. The thermal shut down circuit works when either of two control signals is active. In BD6512F/BD6513F/BD6516F/BD6517F, the switches of both OUTA and OUTB become off and error flags are output to the both. BD2042AFJ/ BD2052AFJ have dual thermal shutdown threshold. Since thermal shutdown works at a lower junction temperature when an overcurrent occurs, only the switch of an overcurrent state become off and error flag is output. ◎BD6512F/BD6513F The switch off status of the thermal shut down is latched. Therefore, even when the junction temperature goes down, switch off and error flag output status are maintained. To release the latch, it is necessary to input a signal to switch off to CTRL pin or make UVLO status. When the switch on signal is input or UVLO is released, the switch on and error flag output are recovered. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ Thermal shut down action has hysteresis. Therefore, when the junction temperature goes down, switch on and error flag output automatically recover. However, until cause of junction temperature increase such as output shortcircuit is removed or the switch is turned off, thermal shut down detection and recovery are repeated. 3. Over current detection, limit circuit The over current detection circuit limits current and outputs error flag when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection, limit circuit works when the switch is on (CTRL・EN signal is active). 3-1 When the switch is turned on while the output is in shortcircuit status When the switch is turned on while the output is in shortcircuit status, the switch become current limit mode soon. 3-2 When the output shortcircuits while the switch is on When the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over current limit circuit responds. When the current detection, limit circuit works, current limitation is carried out. 3-3 When the output current increases gradually When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under voltage lockout(UVLO) When the supply voltage is below UVLO threshold level, UVLO circuit turns off switch to prevent malfunction. The UVLO circuit works when either of two control signals is active. ◎BD6512F/BD6513F UVLO circuit prevents the switch from turning on until the VDD exceeds 2.5V(Typ.). If the VDD drops below 2.3V(Typ.) while the switch turns on, then UVLO shuts off the switch. ◎BD2042AFJ/BD2052AFJ UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ.). If the VIN drops below 2.2V(Typ.) while the switch turns on, then UVLO shuts off the switch. UVLO has hysteresis of a 100mV(Typ). 5. Error flag output Error flag output is N-MOS open drain output. ◎BD6512F/BD6513F At detection of over current detection, thermal shutdown, UVLO, Low level is output. ◎BD6516F/BD6517F/BD2042AFJ/BD2052AFJ At detection of over current detection, thermal shutdown, Low level is output. Error flag output at over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ VCTRL Output shortcircuit VOUT Thermal shut down IOUT VFLAG Latch Latch release Fig.87 BD6512F/ BD6513F over current detection, thermal shutdown timing (VCTRL of BD6513F active Low) VCTRL VEN Output shortcircuit VOUT Thermal shut down IOUT VFLAG V/OC delay Fig.88 BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ over current detection, thermal shutdown timing (VCTRL, V/EN of BD6517F/BD2042AFJ active Low) ●Typical application circuit 5V(Typ) 100k 100k VBUS IN OUT CTRLA (EN) CTRLB (EN) FLAGA (/OC) FLAGA (/OC) ON/OFF D+ ON/OFF DRegulator GND OC OC VDD Ferrite Beads CIN CL GND OUTA Data OUTB CL Data USB Controller Data Fig.89 Typical application circuit www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 17/20 2011.05 - Rev.B Technical Note BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ ●Application information When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and may cause bad influences upon IC operations. In order to avoid this case, connect a bypass capacitor by VDD pin and GND pin of IC. 1uF or higher is recommended. Pull up flag output by resistance 10kΩ ~ 100kΩ. Set up value which satisfies the application as CL and Ferrite Beads. This system connection diagram doesn’t guarantee operating as the application. The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of IC including not only static characteristics but also transient characteristics. In BD6512F/BD6513F, there are cases where over current detection error flag is output to inrush current at switch on or at insertion of active line of peripheral devices. In the case of erroneous detection inBD6512F/BD6513F, use RC filter shown in Fig. 90 for FLAG output. VDD OC CTRLA OUTA FLAGA VDD FLAGB GND CTRLB OUTB USB Controller BD6512F/13F Fig.90 FLAG output RC filter ●Thermal derating characteristic (SOP8, SOP-J8) 600 POWER DISSIPATION: Pd[mW] 500 400 300 200 100 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE: Ta [℃] Fig.92 Power dissipation curve www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 18/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Thermal shutdown circuit (TSD) When junction temperatures become 135°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (13) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 19/20 2011.05 - Rev.B BD6512F,BD6513F,BD6516F,BD6517F,BD2042AFJ,BD2052AFJ Technical Note ●Ordering part number B D 6 Part No. 5 1 2 F Part No. 6512 6513 6516 6517 2042A 2052A - Package F: SOP8 E 2 Packaging and forming specification E2: Embossed tape and reel (SOP8,SOP-J8) FJ:SOP-J8 SOP8 <Tape and Reel information> 5.0±0.2 (MAX 5.35 include BURR) 6 +6° 4° −4° 5 6.2±0.3 4.4±0.2 0.3MIN 7 1 2 3 0.9±0.15 8 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. SOP-J8 <Tape and Reel information> 4.9±0.2 (MAX 5.25 include BURR) +6° 4° −4° 6 5 0.45MIN 7 3.9±0.2 6.0±0.3 8 1 2 3 Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.545 0.2±0.1 0.175 1.375±0.1 S 1.27 0.42±0.1 0.1 S 1pin Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 20/20 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.05 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A