ROHM BD6538G

Power Management Switch IC Series for PCs and Digital Consumer Product
1ch Small Current Output
Power Management Switch IC
BD6538G
No.09029EAT14
●Outline
BD6538G is single channel high side powers switch with low ON resistance Nch power MOSFET.
Rich safety functions such as Over current detection, Thermal shutdown (TSD), Under Voltage Lock Out(UVLO) and
Soft start function which are required for the power supply port protection are integrated into 1chip.
●Feature
1) Single channel of low ON resistance (Typ = 150mΩ) Nch power MOSFET built in
2) 500mA Continuous current load
3) Active”High”Control Logic
4) Soft start function
5) Over current detection（Output Off-latch Operating）
6) Thermal shutdown
7) Open drain error flag output
8) Under voltage lockout
9) Power supply voltage range 2.7V~5.5V
10) Operating temperature range-40°C~85°C
11) SSOP5 Package
●Absolute maximum ratings
Parameter
Supply voltage
Enable voltage
/OC voltage
/OC current
OUT voltage
Storage temperature
Power dissipation
*1
*
Symbol
Rating
VIN
VEN
V/OC
I/OC
VOUT
TSTG
PD
Unit
-0.3
-0.3
-0.3
to 6.0
to 6.0
to 6.0
5
-0.3 to VIN + 0.3
-55 to 150
675 *1
V
V
V
mA
V
°C
mW
1 Mounted on 70mm * 70mm * 1.6mm grass-epoxy PCB. Derating : 5.4mW / °C for operating above Ta=25°C.
This product is not designed for protection against radioactive rays.
●Operating conditions
Parameter
Operating voltage
Operating temperature
Continuous output current
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Symbol
Min
Typ
Max
Unit
VIN
TOPR
IOUT
2.7
-40
0
-
5.5
85
0.5
V
°C
A
1/11
2009.05 - Rev.A
Technical Note
BD6538G
●Electric characteristics
Unless otherwise specified VIN = 5.0V, Ta = 25°C
DC characteristics
Parameter
Symbol
Min.
Typ.
Max.
unit
Operating Current
IDD
-
110
160
μA
VEN = 5.0V, VOUT = Open
Standby Current
ISTB
-
0.01
5
μA
VEN = 0V, VOUT = Open
EN input voltage
VEN
VEN
2.0
-
-
0.8
V
V
High input
Low input
EN input current
IEN
-1.0
0.01
1.0
μA
VEN =0Vor5V
ON resistance
RON
-
150
200
mΩ
IOUT = 50mA
Over current threshold
ITH
0.5
-
1.0
A
-
Output current at short
ISC
0.35
-
-
A
VOUT = 0V (RMS)
/OC output lOW voltage
V/OC
-
-
0.4
V
I/OC = 0.5mA
VTUVH
VTUVL
2.1
2.0
2.3
2.2
2.5
2.4
V
V
Increasing VIN
Decreasing VIN
Symbol
Min.
Typ.
Max.
unit
Condition
Output rise time
TON1
-
1
6
ms
RL = 20Ω, Fig. 2 Ref.
Output rise delay time
TON2
-
1.5
10
ms
RL = 20Ω, Fig. 2 Ref.
Output fall time
TOFF1
-
1
20
μs
RL = 20Ω, Fig. 2 Ref.
Output fall delay time
TOFF2
-
3
40
μs
RL = 20Ω, Fig. 2 Ref.
Blanking time
TBLANK
10
15
20
ms
UVLO Threshold
Condition
AC characteristics
Parameter
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2/11
-
2009.05 - Rev.A
Technical Note
BD6538G
●Measurement circuit
VIN
VIN
A
A
VIN
VOUT
VIN
1µF
VOUT
1µF
GND
VEN
EN
RL
GND
VEN
/OC
Operating current
EN
/OC
EN input voltage, Output rise, fall time
VIN
VIN
A
A
10k
IOC
VIN
VOUT
1µF
IOUT
GND
VEN
EN
VIN
VOUT
1µF
GND
VEN
/OC
ON resistance, Over current
EN
/OC
/OC output LOW voltage
Fig.1 Measurement circuit
●Timing diagram
VEN
50%
50%
TON2
TOFF2
90%
VOUT
10%
10%
TON1
Fig.2
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90%
TOFF1
Timing chart at output rise / fall time
3/11
2009.05 - Rev.A
Technical Note
BD6538G
●Reference data
140
140
Ta=25°C
120
100
100
80
60
40
20
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
0.6
80
60
0.4
40
0.2
20
0
-50
0
6
Fig.3 Operating current
EN Enable
0.6
0.4
0.2
0.0
2.0
1.5
VIN=5.0V
Low to High
0.5
0.5
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
-50
6
1.0
200
200
Ta=25°C
VIN=5.0V
ON RESISTANCE :
RON[mΩ]
100
50
Overcurrent threshold : I TH[A]
Ta=25°C
150
150
100
50
0
0
0.6
0.5
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.12 Over current detection
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0.6
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.11 Over current detection
100
Ta=25°C
/OC OUTPUT LOW VOLTAGE :
V/OC[mV]
0.7
/OC OUTPUT LOW VOLTAGE :
V/OC[mV]
0.8
0.7
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
100
1.0
0.9
0.8
Fig.10 ON resistance
Fig.9 ON resistance
VIN=5.0V
0.9
0.5
-50
6
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.8 EN input voltage
Fig.7 EN input voltage
Fig.6 Operating current
EN Disable
3
4
5
SUPPLY VOLTAGE : VIN[V]
High to Low
1.0
1.0
0.0
2
Low to High
1.5
High to Low
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
6
Fig.5 Operating current
EN Disable
ENABLE INPUT VOLTAGE :
VEN[V]
0.8
-50
3
4
5
SUPPLY VOLTAGE : VIN [V]
Ta=25°C
ENABLE INPUT VOLTAGE :
VEN[V] 0
OPERATING CURRENT :
ISTB[μA]
2
2.0
VIN=5.0V
ON RESISTANCE :
RON[mΩ]
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.4 Operating current
EN Enable
1.0
Overcurrent threshold : ITH[A]
Ta=25°C
0.8
OPERATING CURRENT :
ISTB[µA]
OPERATING CURRENT :
IDD [μA]
OPERATING CURRENT :
IDD[μA]
120
1.0
VIN=5.0V
80
60
40
20
VIN=5.0V
80
60
40
20
0
0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.13 /OC output LOW voltage
4/11
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.14 /OC output LOW voltage
2009.05 - Rev.A
Technical Note
BD6538G
2.3
VTUVH
2.2
VTUVL
2.1
2.0
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
1.0
5.0
0.8
4.0
Ta=25°C
RISE TIME : TON1[ms]
2.4
UVLO HYSTERESIS VOLTAGE : VHYS[V]
UVLO THRESHOLD : VTUVH, VTUVL[V]
2.5
0.6
0.4
0.2
-50
3.0
2.0
1.0
VIN=5.0V
4.0
3.0
2.0
1.0
4.0
3.0
2.0
1.0
0.0
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
-50
6
Ta=25°C
0.0
TURN OFF TIME : TOFF2[μs]
FALL TIME : TOFF1[μs]
4.0
1.0
3.0
2.0
1.0
0.0
6
Fig.21 Output fall time
1.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.24 Output turn off time
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3
4
5
SUPPLY VOLTAGE : VIN[V]
6
Fig.23 Output turn off time
20
VIN=5.0V
18
16
14
12
10
0.0
1.0
2
BLANK TIME : TBLANK[ms]
2.0
2.0
Ta=25°C
BLANKING TIME : TBLANK[ms]
3.0
3.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
20
4.0
4.0
Fig.22 Output fall time
VIN=5.0V
5.0
5.0
0.0
-50
6.0
100
6.0
VIN=5.0V
2.0
50
Fig.20 Output turn on time
5.0
Ta=25°C
3.0
0
AMBIENT TEMPERATURE : Ta[℃]
Fig.19 Output turn on time
4.0
6
5.0
0.0
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
5.0
-50
3
4
5
SUPPLY VOLTAGE : VIN[V]
Fig.17 Output rise time
TURN ON TIME : TON2[ms]
TURN ON TIME : TON2[ms]
RISE TIME : TON1 [ms]
2
100
Ta=25°C
Fig.18 Output rise time
FALL TIME : TOFF1[μs]
50
5.0
4.0
TURN OFF TIME : TOFF2[μs]
0
Fig.16 UVLO hysteresis voltage
VIN=5.0V
3
4
5
SUPPLY VOLTAGE : VIN[V]
1.0
AMBIENT TEMPERATURE : Ta[℃]
5.0
2
2.0
0.0
0.0
Fig.15 UVLO Threshold
0.0
-50
3.0
18
16
14
12
10
2
3
4
5
SUPPLY VOLTAGE : VIN[V]
Fig.25 Blanking time
5/11
6
-50
0
50
100
AMBIENT TEMPERATURE : Ta[℃]
Fig.26 Blanking time
2009.05 - Rev.A
Technical Note
BD6538G
●Waveform data
VEN
(5V/div.)
VEN
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
CL=147uF
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
CL=100uF
VIN=5V
RL=20Ω
IOUT
(0.5A/div.)
IOUT
(0.2A/div.)
CL=47uF
VIN=5V
RL=20Ω
TIME(1ms/div.)
TIME(1us/div.)
TIME (2ms/div.)
Fig.27 Output rise characteristic
Fig.28 Output fall characteristic
Fig29. Inrush current respone
V/OC
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VIN=5V
VIN=5V
TIME (20ms/div.)
TIME (5ms/div.)
TIME (5ms/div.)
Fig.30 Over current response
Ramped load
Fig.31 Over current response
Ramped load
Fig.32 Over current response
Enable to short circuit
V/OC
(5V/div.)
VIN
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VOUT
(5V/div.)
VIN=5V
IOUT
(0.2A/div.)
IOUT
(0.5A/div.)
RL=20Ω
IOUT
(0.2A/div.)
RL=20Ω
TIME (5ms/div.)
TIME (10ms/div.)
TIME (10ms/div.)
Fig.33 Over current response
Output shortcircuit at Enable
Fig.34 UVLO response
VIN Increasing
Fig.35 UVLO response
VIN Decreasing
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6/11
2009.05 - Rev.A
Technical Note
BD6538G
●Block diagram
GND
/OC
Delay
Counter
OCD
S Q
R
Charge
pump
UVLO
VIN 1
TSD
GND 2
EN
VIN
OUT
Top View
EN 3
Fig.36 Block diagram
●Pin description
Pin No.
5 VOUT
4 /OC
Fig.37 Pin Configuration
symbol
I/O
1
VIN
-
Power supply input.
Input terminal to switch and power supply input terminal of the internal circuit.
2
GND
-
Ground.
3
EN
I
Enable input.
Power switch on at High level.
4
/OC
O
Over current output. Low level at over current detection.
Open drain output.
5
VOUT
O
Switch output.
●Terminal circuit
symbol
Pin function
Pin No.
EN
3
VOUT
5
Equivalent circuit
EN
VOUT
/OC
/OC
4
Fig.38 Terminal circuit
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7/11
2009.05 - Rev.A
Technical Note
BD6538G
●Operations Explanation
1.Overcurrent protection（OCD）
The overcurrent detection circuit limits the current and outputs an error flag (/OC) when the current flowing in switch
MOSFET exceeds overcurrent threshold (ITH).
The timer is reset when the state of the overcurrent is terminated before passing of TBLANK. After a state of overcurrent is
passed at blanking time, the switch is shut down and the overcurrent signal (/OC) changes to Low level.
The latch is reset through it input Low to EN or detects UVLO. Normal operation is returned by EN signal is set to High or
UVLO is off. (Fig. 4, Fig. 5).
The over current limit circuit works when EN signal is enable.
2. Thermal shutdown circuit（TSD）
Thermal shutdown circuit turns off the switch and outputs an error flag (/OC) when the junction temperature exceeds
150°C (typ.). Therefore, when the junction temperature goes down to 150°C (typ), the switch output and an error flag (/OC)
are recovered automatically. This operating is repeated until cause of junction temperature increase is removed or EN
signal is set Disable. Thermal shutdown circuit works when EN signal is enable.
3. Under voltage lockout （UVLO）
UVLO keeps the switch-off state at MOSFET until VIN exceeds 2.3V (Typ.). If VIN drops under 2.2V (Typ.) while the switch
is turning on, then UVLO shuts off the power switch.
Under voltage lockout works when EN signal is enable.
4. Overcurrent signal output
Overcurrent signal output（/OC）is N-MOS open drain output. At detection of overcurrent, thermal shutdown, output is Low level.
●Over current shutdown operating
TBLAN K
TBLAN K
Ou tp u t cu rre n t
ON
OFF
ON
Switch sta tu s
FL AG Ou tp u t
VTU VL
VIN
VTU VH
VEN
Fig.39 Overcurrent shutdown operation（Reset at toggle of EN）
TBLANK
TBLANK
Output current
ON
OFF
ON
Switch status
FLAG Output
VEN
Fig.40 Overcurrent shutdown operation (Reset at reclosing of power supply VIN)
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8/11
2009.05 - Rev.A
Technical Note
BD6538G
●Typical application circuit
5V(typ.)
10k~
100kΩ
Ferrite bead
CIN
VIN
VOUT
GND
Controller
EN
CL
+
-
/OC
Fig.41 Typical application circuit
●Application information
When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC, and
may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor by IN terminal and GND
terminal of IC. 1uF or higher is recommended.
Pull up /OC output by resistance 10kΩ ~ 100kΩ.
Set up value which satisfies the application as CL and Ferrite Beads.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
This system connection diagram doesn’t guarantee operating as the application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
●Power dissipation character
(SSOP5 package)
700
POWER DISSIPATION: Pd[mV]
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE: Ta[℃]
* 70mm * 70mm * 1.6mm : glass epoxy board mounting
Fig.42 Power dissipation curve (Pd-Ta Curve)
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9/11
2009.05 - Rev.A
Technical Note
BD6538G
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical
characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the
same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when
no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals
a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become detected temperatures or higher, the thermal shutdown circuit operates and turns a
switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use.
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10/11
2009.05 - Rev.A
Technical Note
BD6538G
●Ordering part number
B
D
6
Part No.
5
3
8
G
Part No.
6538
-
Package
G: SSOP5
T
R
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5)
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
0.05±0.05
1.1±0.05
1.25Max.
)
+0.05
0.42 −0.04
0.95
0.1
Direction of feed
(Unit : mm)
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Reel
11/11
∗ Order quantity needs to be multiple of the minimum quantity.
2009.05 - Rev.A
Notice
Notes
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consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
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While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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The Products are not designed or manufactured to be used with any equipment, device or
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