Datasheet

High-performance Clock Generator Series
DVD-video Reference
Clock Generators for A/V Equipments
BU2280FV, BU2360FV, BU2362FV
No.12005EBT04
●Description
These clock generators are an IC generating three types of clocks - VIDEO, AUIDIO and SYSTEM clocks – necessary for
DVD player systems, with a single chip through making use of the PLL technology. Particularly, the AUDIO clock is a
DVD-Video reference and yet achieves high C/N characteristics to provide a low level of distortion factor.
●Features
1) Connecting a crystal oscillator generates multiple clock signals with a built-in PLL.
2) AUDIO clock of high C/N characteristics providing a low level of distortion factor
3) The AUDIO clock provides switching selection outputs.
4) Single power supply of 3.3 V
●Applications
DVD players
●Lineup
Part name
BU2280FV
BU2360FV
BU2362FV
Power source voltage [V]
3.0 ~ 3.6
2.7 ~ 3.6
2.7 ~ 3.6
Reference frequency [MHz]
27.0000
27.0000
27.0000
2
-
-
-
1
27.0000
27.0000
27.0000
1/2
-
-
-
DVD VIDEO
36.8640
/33.8688
24.5760
/22.5792
18.4320
/16.9344
-
-
24.5760
/22.5792
24.5760
/22.5792
-
-
256fs
-
-
-
other
-
-
36.8640
/16.9344
-
-
36.8640
768 (44.1k type)
33.8688
33.8688
33.8688
384 (44.1k type)
-
-
16.9344
Jitter 1σ [psec]
70
70
70
Long-term-Jitter p-p [nsec]
8.0
2.5
5.0
SSOP-B24
SSOP-B16
SSOP-B16
768fs
512fs
Output frequency
[MHz]
DVD AUDIO, CD
(Switching outputs)
384fs
768 (48k type)
SYSTEM
Package
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© 2012 ROHM Co., Ltd. All rights reserved.
1/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
BU2280FV
BU2360FV
BU2362FV
Unit
Supply voltage
VDD
-0.5 ~ +7.0
-0.5 ~ +7.0
-0.5 ~ +7.0
V
Input voltage
VIN
-0.5~VDD+0.5
-0.5~VDD+0.5
-0.5~VDD+0.5
V
Storage temperature range
Tstg
-30 ~ +125
-30 ~ +125
-30 ~ +125
℃
Power dissipation
PD
630
*1
450
*2
*2
450
mW
*1 In the case of exceeding Ta = 25℃, 6.3mW to be reduced per 1℃
*2 In the case of exceeding Ta = 25℃, 4.5mW to be reduced per 1℃
*Operating is not guaranteed.
*The radiation-resistance design is not carried out.
*Power dissipation is measured when the IC is mounted to the printed circuit board.
●Recommended Operating Range
Parameter
Symbol
BU2280FV
BU2360FV
BU2362FV
Unit
Parameter
VDD
3.0 ~ 3.6
2.7 ~ 3.6
2.7 ~ 3.6
V
Supply voltage
VIH
0.8VDD~VDD
0.8VDD~VDD
0.8VDD~VDD
V
Input “H” Voltage
VIL
0.0 ~ 0.2VDD
0.0 ~ 0.2VDD
0.0 ~ 0.2VDD
V
Input “L” Voltage
Topr
-5 ~ +70
-25 ~ +85
-25 ~ +85
℃
Operating temperature
CL
15
15
15
pF
Output load
CL_27M1
-
40 (CLK27M1)
-
pF
27M output load 1
CL_27M2
-
25 (CLK27M2)
-
pF
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© 2012 ROHM Co., Ltd. All rights reserved.
2/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Electrical characteristics
◎BU2280FV(VDD=3.3V, Ta=25℃, Crystal frequency 27.0000MHz, unless otherwise specified.)
Limits
Symbol
Unit
Conditions
Parameter
Min.
Typ.
Max.
Output L voltage
VOL
-
Output H voltage
VOH
2.4
-
-
V
Consumption current
IDD
-
30
50
mA
At no load
CLK768-44
-
33.8688
-
MHz
At FSEL=L, XTAL×3136 / 625 / 4
CLK768-48
-
36.8640
-
MHz
At FSEL=H, XTAL×2048 / 375 / 4
CLK512-44
-
22.5792
-
MHz
At FSEL=L, XTAL×3136 / 625 / 6
CLK768FS
CLK512FS
CLK384FS
-
0.4
V
IOL=4.0mA
IOH=-4.0mA
CLK512-48
-
24.5760
-
MHz
At FSEL=H, XTAL×2048 / 375 / 6
CLK384-44
-
16.9344
-
MHz
At FSEL=L, XTAL×3136 / 625 / 8
CLK384-48
-
18.4320
-
MHz
At FSEL=H, XTAL×2048 / 375 / 8
CLK33M
CLK33M
-
33.8688
-
MHz
XTAL×147 / 40 / 4
CLK16M
CLK16M
-
16.9344
-
MHz
XTAL×147 / 40 / 8
Duty
Duty
45
50
55
%
P-J 1σ
P-J
MIN-MAX
-
70
-
psec
*1
-
420
-
psec
*2
Rise Time
Tr
-
2.5
-
nsec
Fall Time
Tf
-
2.5
-
nsec
Tlock
-
-
1
msec
Period-Jitter 1σ
Period-Jitter MIN-MAX
Output Lock-Time
Measured at a voltage of 1/2 of VDD
Period of transition time required for the
output reach 80% from 20% of VDD.
Period of transition time required for the
output reach 20% from 80% of VDD.
*3
Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XTALIN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
◎BU2360FV(VDD=3.3V, Ta=25℃, Crystal frequency 27.0000MHz, unless otherwise specified.)
Limits
Symbol
Unit
Conditions
Parameter
Min.
Typ.
Max.
Output L voltage
VOL
-
-
0.4
V
IOL=4.0mA
Output H voltage
VOH
2.4
-
-
V
IOH=-4.0mA
FSEL input VthL
VthL
0.2VDD
-
-
V
*4
FSEL input VthH
VthH
-
-
0.8VDD
V
*4
Hysteresis range
Vhys
0.2
-
-
V
Action circuit current
IDD
-
27.0
40.5
mA
At no load
CLK27M
-
27.0000
-
MHz
XTAL direct out
CLK33M
-
33.8688
-
MHz
XTAL×3136 / 625 / 4
CLK512_48
-
24.5760
-
MHz
At FSEL=H, XTAL×2048 / 375 / 6
CLK512_44
-
22.5792
-
MHz
Duty
45
50
55
%
P-J 1σ
P-J
MIN-MAX
-
70
-
psec
*1
-
420
-
psec
*2
Rise Time
Tr
-
2.5
-
nsec
Fall Time
Tf
-
2.5
-
nsec
Tlock
-
-
1
msec
CLK27M
CLK33M
CLK512FS
Duty
Period-Jitter 1σ
Period-Jitter MIN-MAX
Output Lock-Time
Vhys = VthH - VthL *4
At FSEL=L, XTAL×3136 / 625 / 6
Measured at a voltage of 1/2 of VDD
Period of transition time required for the
output reach 80% from 20% of VDD.
Period of transition time required for the
output reach 20% from 80% of VDD.
*3
Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XTALIN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
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3/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
◎BU2362FV(VDD=3.3V, Ta=25℃, Crystal frequency 27.0000MHz, unless otherwise specified.)
Limits
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Output L voltage
VOH
2.4
-
-
V
IOH=-4.0mA
Output H voltage
VOL
-
-
0.4
V
IOL=4.0mA
Action circuit current
IDD
-
35
45
mA
At no load
CLK512FS
CLKA
CLK512-44
-
22.5792
-
MHz
At FSEL1=OPEN XTAL*3136/625/6
CLK512-48
-
24.5760
-
MHz
At FSEL1=L XTAL*2048/375/6
CLKA-A
-
16.9344
-
MHz
At FSEL1=OPEN XTAL*3136/625/8
CLKA-B
-
36.8640
-
MHz
At FSEL1=L XTAL*2048/375/8
CLK36M
CLK36M
-
36.8640
-
MHz
XTAL*2048/375/4
CLK33M
CLK33M
-
33.8688
-
MHz
XTAL*3136/625/4
CLK16M
CLK16M
-
16.9344
-
MHz
XTAL*3136/625/8
CLK27M
CLK27M
-
27.0000
-
MHz
XTAL direct out
Duty
45
50
55
%
P-J 1σ
P-J
MIN-MAX
-
70
-
psec
*1
-
420
-
psec
*2
Rise Time
Tr
-
2.5
-
nsec
Fall Time
Tf
-
2.5
-
nsec
Tlock
-
-
1
msec
Duty
Period-Jitter 1σ
Period-Jitter MIN-MAX
Output Lock-Time
Measured at a voltage of 1/2 of VDD
Period of transition time required for the
output reach 80% from 20% of VDD.
Period of transition time required for the
output reach 20% from 80% of VDD.
*3
Note) The output frequency is determined by the arithmetic (frequency division) expression of a frequency input to XTALIN.
If the input frequency is set to 27.0000MHz, the output frequency will be as listed above.
Common to BU2280FV, BU2360FV and BU2362FV:
*1
Period-Jitter 1σ
This parameter represents standard deviation (1 ) on cycle distribution data at the time when the output clock cycles
are sampled 1000 times consecutively with the TDS7104 Digital Phosphor Oscilloscope of Tektronix Japan, Ltd.
*2
Period-Jitter MIN-MAX
This parameter represents a maximum distribution width on cycle distribution data at the time when the output clock
cycles are sampled 1000 times consecutively with the TDS7104 Digital Phosphor Oscilloscope of Tektronix Japan, Ltd.
*3
Output Lock-Time
The Lock-Time represents elapsed time after power supply turns ON to reach a 3.0V voltage, after the system is
switched from Power-Down state to normal operation state, or after the output frequency is switched, until it is stabilized
at a specified frequency, respectively.
BU2360FV
4 This parameter represents lower and upper limit voltages at the Schmitt trigger input PIN having hysteresis
characteristics shown in figure below. The width requested by these differences is assumed to be a hysteresis width.
0.2VDD
0.8VDD
Output Voltage [V]
Vhys
0
VthL
VthH
Input Voltage [V]
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© 2012 ROHM Co., Ltd. All rights reserved.
4/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2280FV basic data)
1.0V/div
1.0V/div
10dB/div
RBW=1kHz
VBW=100Hz
5.0nsec/div
Fig.1 33.9MHz output waveform
VDD=3.3V, at CL=15pF
500psec/div
10kHz/div
Fig.2 33.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
Fig.3 33.9MHz Spectrum
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
10kHz/div
500psec/div
5.0nsec/div
Fig.4 36.9MHz output waveform
VDD=3.3V, at CL=15pF
Fig.5 36.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
Fig.6 36.9MHz Spectrum
VDD=3.3V, at CL=15pF
5.0nsec/div
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.7 22.6MHz output waveform
VDD=3.3V, at CL=15pF
Fig.8 22.6MHz Period-Jitter
VDD=3.3V, at CL=15pF
10kHz/div
Fig.9 22.6MHz Spectrum
VDD=3.3V, at CL=15pF
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
5.0nsec/div
Fig.10 24.6MHz output waveform
VDD=3.3V, at CL=15pF
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© 2012 ROHM Co., Ltd. All rights reserved.
500psec/div
Fig.11 24.6MHz Period-Jitter
VDD=3.3V, at CL=15pF
5/23
10kHz/div
Fig.12 24.6MHz Spectrum
VDD=3.3V, at CL=15pF
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2280FV basic data)
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
10.0nsec/div
Fig.13 16.9MHz output waveform
VDD=3.3V, at CL=15pF
10kHz/div
Fig.15 16.9MHz Spectrum
VDD=3.3V, at CL=15pF
500psec/div
Fig.14 16.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
10.0nsec/div
Fig.16 18.4MHz output waveform
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
10kHz/div
Fig.18 18.4MHz Spectrum
VDD=3.3V, at CL=15pF
500psec/div
Fig.17 18.4MHz Period-Jitter
VDD=3.3V, at CL=15pF
5.0nsec/div
Fig.19 27MHz output waveform
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
10kHz/div
Fig.21 27MHz Spectrum
VDD=3.3V, at CL=15pF
1.0V/div
1.0V/div
500psec/div
Fig.20 27MHz Period-Jitter
VDD=3.3V, at CL=15pF
LT Jitter 6.2nsec
2.0nsec/div
Fig.22 24.6MHz LT Jitter
VDD=3.3V, at CL=15pF
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© 2012 ROHM Co., Ltd. All rights reserved.
LT Jitter 8.1nsec
2.0nsec/div
Fig.23 22.6MHz LT Jitter
VDD=3.3V, at CL=15pF
6/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2280FV Temperature and Supply voltage variations data)
100
54
90
52
VDD=3.3V
VDD=3.7V
51
50
49
VDD=2.9V
48
47
46
45
80
60
50
40
VDD=3.7V
30
20
25
50
75
100
200
0
90
Period-jitter1σ ： PJ-1σ[psec]
100
54
VDD=3.3V
VDD=2.9V
51
50
49
25
50
75
100
-25
VDD=3.7V
48
47
46
25
50
75
VDD=2.9V
80
70
60
50
VDD=3.3V
40
VDD=3.7V
30
20
500
300
VDD=3.3V
200
100
0
90
Period-jitter1σ ： PJ-1σ[psec]
100
VDD=3.7V
VDD=2.9V
50
49
25
50
75
100
-25
VDD=3.3V
48
47
46
45
0
25
50
75
VDD=3.7V
VDD=3.3V
60
50
VDD=2.9V
40
30
20
0
25
50
75
Period-jitter1σ ： PJ-1σ[psec]
VDD=3.3V
51
50
VDD=3.7V
48
47
46
45
25
50
75
VDD=2.9V
VDD=3.3V
200
100
-25
0
100
Temperature： T[ ℃]
Fig.33 24.6MHz
Temperature-Duty
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© 2012 ROHM Co., Ltd. All rights reserved.
25
50
75
100
Temperature：T[℃]
Fig.32 22.6MHz
Temperature-Period-Jitter MIN-MAX
600
80
VDD=2.9V
70
VDD=3.3V
60
50
40
VDD=3.7V
30
20
500
VDD=3.7V
VDD=3.3V
400
300
VDD=2.9V
200
100
10
0
0
300
Temperature： T[ ℃]
90
-25
VDD=3.7V
400
100
Fig.31 22.6MHz
Temperature-Period-Jitter 1σ
100
49
500
0
-25
54
VDD=2.9V
100
10
55
52
75
Temperature：T[℃]
70
Temperature： T[ ℃]
53
50
600
80
100
Fig.30 22.6MHz
Temperature-Duty
25
Fig.29 36.9MHz
Temperature r-Period-Jitter MIN-MAX
0
-25
0
Temperature：T[℃]
54
51
VDD=2.9V
VDD=3.7V
400
Fig.28 36.9MHz
Temperature-Period-Jitter 1σ
55
52
100
0
-25
Temperature： T[ ℃]
53
75
10
100
Fig.27 36.9MHz
Temperature-Duty
50
600
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
0
25
Fig.26 33.9MHz
Temperature-Period-Jitter MIN-MAX
0
45
-25
0
Temperature：T[℃]
Fig.25 33.9MHz
Temperature-Period-Jitter 1σ
55
52
VDD=3.7V
100
Temperature： T[ ℃]
53
Duty ： Duty[%]
300
0
-25
Fig.24 33.9MHz
Temperature-Duty
VDD=2.9V
400
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
0
VDD=3.3V
10
Temperature：T[℃]
Duty ： Duty[%]
500
0
-25
Duty ： Duty[%]
VDD=2.9V
VDD=3.3V
70
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
Duty ： Duty[%]
53
600
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
55
Period-jitter1σ ： PJ-1σ[psec]
5
0
-25
0
25
50
75
Temperature： T[ ℃]
Fig.34 24.6MHz
Temperature-Period-Jitter 1σ
7/23
100
-25
0
25
50
75
100
Temperature：T[℃]
Fig.35 24.6MHz
Temperature-Period-Jitter MIN-MAX
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2280FV Temperature and Supply voltage variations data)
100
54
90
52
VDD=2.9V
51
VDD=3.7V
50
49
VDD=3.3V
48
47
46
80
70
VDD=3.7V
60
50
40
30
VDD=3.3V
20
VDD=2.9V
0
25
50
75
-25
100
0
100
54
90
Period-jitter1σ ： PJ-1σ[psec]
55
Duty ： Duty[%]
52
51
VDD=3.3V
50
49
VDD=2.9V
48
47
46
45
75
0
25
50
75
VDD=3.7V
70
60
50
40
VDD=3.3V
VDD=2.9V
30
20
-25
90
Period-jitter1σ ： PJ-1σ[psec]
100
VDD=3.7V
VDD=2.9V
VDD=3.3V
48
47
46
45
0
25
50
75
25
50
75
100
Temperature：T[℃]
VDD=3.7V
300
VDD=2.9V
200
VDD=3.3V
100
-25
0
25
50
75
100
Temperature： T[ ℃]
Fig.41 18.4MHz
Temperature-Period-Jitter MIN-MAX
600
80
VDD=2.9V
70
VDD=3.3V
60
50
40
30
VDD=3.7V
20
VDD=2.9V
500
400
300
VDD=3.3V
200
VDD=3.7V
100
10
0
-25
0
25
50
75
100
Temperature：T[℃]
Fig.42 27MHz
Temperature-Duty
100
400
100
0
0
75
500
Temperature：T[℃]
52
50
Fig.38 16.9MHz
Temperature-Period-Jitter MIN-MAX
Fig.40 18.4MHz
Temperature-Period-Jitter 1σ
53
25
0
-25
54
-25
0
10
55
49
100
600
Temperature：T[℃]
50
VDD=3.3V
Temperature： T[ ℃]
80
100
Fig.39 18.4MHz
Temperature-Duty
51
200
100
0
-25
Duty ： Duty[%]
50
Fig.37 16.9MHz
Temperature-Period-Jitter 1σ
53
VDD=2.9V
300
Temperature：T[℃]
Temperature：T[℃]
Fig.36 16.9MHz
Temperature-Duty
VDD=3.7V
25
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
-25
VDD=3.7V
400
0
0
45
500
10
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
Duty：Duty[%]
53
600
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
Period-jitter1σ ： PJ-1σ[psec]
55
Fig.43 27MHz
Temperature-Period-Jitter 1σ
-25
0
25
50
75
100
Temperature： T[ ℃]
Fig.44 27MHz
Temperature-Period-Jitter MIN-MAX
Circuit Current ： IDD[mA]
50
VDD=3.7V
VDD=3.3V
40
30
20
VDD=2.9V
10
0
-25
0
25
50
75
100
Temperature：T[℃]
Fig.45 Action circuit current
(with maximum output load)
Temperature-Consumption current
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© 2012 ROHM Co., Ltd. All rights reserved.
8/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2360FV basic data)
5.0nsec/div
Fig.46 27MHz output waveform
VDD=3.3V, at CL=40pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.47 27MHz Period-Jitter
VDD=3.3V, at CL=40pF
10kHz/div
Fig.48 27MHz Spectrum
VDD=3.3V, at CL=40pF
5.0nsec/div
Fig.49 27MHz output waveform
VDD=3.3V, at CL=25pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.50 27MHz Period-Jitter
VDD=3.3V, at CL=25pF
10kHz/div
Fig.51 27MHz Spectrum
VDD=3.3V, at CL=25pF
5.0nsec/div
Fig.52 33.9MHz output waveform
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.53 33.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
10kHz/div
Fig.54 33.9MHz Spectrum
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
5.0nsec/div
Fig.55 24.6MHz output waveform
VDD=3.3V, at CL=15pF
500psec/div
Fig.56 24.6MHz Period-Jitter
VDD=3.3V, at CL=15pF
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© 2012 ROHM Co., Ltd. All rights reserved.
9/23
10kHz/div
Fig.57 24.6MHz Spectrum
VDD=3.3V, at CL=15pF
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2360FV basic data)
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.59 22.6MHz Period-Jitter
VDD=3.3V, at CL=15pF
10kHz/div
Fig.60 22.6MHz Spectrum
VDD=3.3V, at CL=15pF
1.0V/div
1.0V/div
5.0nsec/div
Fig.58 22.6MHz output waveform
VDD=3.3V, at CL=15pF
LT Jitter 2.5nsec
LT Jitter 2.3nsec
1.0nsec/div
Fig62. 22.6MHz LT Jitter
VDD=3.3V, at CL=15pF
1.0nsec/div
Fig61. 24.6MHz LT Jitter
VDD=3.3V, at CL=15pF
●Reference data (BU2360FV Temperature and Supply voltage variations data)
100
54
90
52
51
VDD=3.7V
VDD=3.3V
50
49
48
VDD=2.4V
47
46
45
70
60
50
40
VDD=3.3V
VDD=3.7V
30
20
0
25
50
75
-25
25
50
75
Fig.64 27MHz (40pF)
Temperature-Period-Jitter 1σ
90
Period-jitter1σ ： PJ-1σ[psec]
100
54
VDD=2.4V
50
49
48
VDD=3.7V
VDD=3.3V
46
-25
0
25
50
75
100
VDD=3.7V
200
100
-25
0
25
50
75
100
Fig.65 27MHz (40pF)
Temperature-Period-Jitter MIN-MAX
600
VDD=2.4V
80
VDD=3.3V
70
60
50
40
VDD=3.7V
30
20
VDD=2.4V
500
400
300
VDD=3.7V
200
VDD=3.3V
100
10
0
45
VDD=3.3V
Temperature： T[ ℃]
Fig.63 27MHz (40pF)
Temperature-Duty
51
300
100
Temperature：T[℃]
55
47
0
Temperature：T[℃]
52
400
0
100
53
500
10
0
-25
Duty ： Duty[%]
VDD=2.4V
80
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
Duty ： Duty[%]
53
600
VDD=2.4V
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
Period-jitter1σ ： PJ-1σ[psec]
55
0
-25
0
25
50
75
100
-25
0
25
50
75
100
Temperature：T[℃]
Temperature：T[℃]
Temperature： T[ ℃]
Fig.66 27MHz (25pF)
Temperature-Duty
Fig.67 27MHz (25pF)
Temperature-Period-Jitter 1σ
Fig.68 27MHz (25pF)
Temperature-Period-Jitter MIN-MAX
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© 2012 ROHM Co., Ltd. All rights reserved.
10/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2360FV Temperature and Supply voltage variations data)
100
54
90
52
VDD=2.4V
51
VDD=3.3V
50
49
48
VDD=3.7V
47
46
45
80
70
VDD=2.4V
60
VDD=3.3V
50
40
VDD=3.7V
30
20
0
0
25
50
75
100
0
Temperature： T[ ℃]
90
Period-jitter1σ ： PJ-1σ[psec]
100
54
Duty ： Duty[%]
53
52
VDD=2.4V
50
49
48
VDD=3.3V
VDD=3.7V
47
46
45
50
75
0
25
50
75
-25
60
50
VDD=3.3V
40
500
VDD=2.4V
30
20
Period-jitter1σ ： PJ-1σ[psec]
90
49
VDD=3.7V
47
46
45
0
25
50
75
300
VDD=3.3V
VDD=3.7V
200
100
100
0
25
50
-25
75
0
100
Temperature： T[ ℃]
50
75
100
Fig.74 24.6MHz
Temperature-Period-Jitter MIN-MAX
600
VDD=3.7V
80
70
VDD=3.3V
60
50
40
VDD=2.4V
30
20
VDD=3.7V
500
400
300
200
VDD=2.4V
VDD=3.3V
100
10
0
-25
0
25
50
75
100
Temperature：T[℃]
Fig.75 22.6MHz
Temperature-Duty
25
Temperature： T[ ℃]
0
-25
VDD=2.4V
0
-25
100
50
100
10
54
VDD=3.3V
75
400
Fig.73 24.6MHz
Temperature-Period-Jitter 1σ
52
50
Fig.71 33.9MHz
Temperature-Period-Jitter MIN-MAX
Temperature：T[℃]
53
25
600
70
55
48
0
Temperature： T[ ℃]
80
100
Fig.72 24.6MHz
Temperature-Duty
VDD=2.4V
100
VDD=3.7V
Temperature： T[ ℃]
51
VDD=3.7V
200
100
0
-25
Duty ： Duty[ ％]
25
Fig.70 33.9MHz
Temperature-Period-Jitter 1σ
55
51
300
Temperature：T[℃]
Fig.69 33.9MHz
Temperature-Duty
VDD=3.3V
VDD=2.4V
400
0
-25
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
-25
500
10
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
Duty ： Duty[%]
53
600
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
Period-jitter1σ ： PJ-1σ[psec]
55
Fig.76 22.6MHz
Temperature-Period-Jitter 1σ
-25
0
25
50
75
100
Temperature： T[ ℃]
Fig.77 22.6MHz
Temperature-Period-Jitter MIN-MAX
Circuit Current ： IDD[mA]
50
VDD=3.7V
VDD=3.3V
40
30
20
VDD=2.4V
10
0
-25
0
25
50
75
100
Temperature： T[ ℃]
Fig.78 Action circuit current
(with maximum output load)
Temperature-Consumption current
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© 2012 ROHM Co., Ltd. All rights reserved.
11/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data(BU2362FV basic data)
5.0nsec/div
Fig.79 33.9MHz output waveform
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
10kHz/div
Fig.80 33.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
Fig.81 33.9MHz Spectrum
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
5.0nsec/div
Fig.82 36.9MHz output waveform
VDD=3.3V, at CL=15pF
500psec/div
Fig.83 36.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
10kHz/div
Fig.84 36.9MHz Spectrum
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.86 22.6MHz Period-Jitter
VDD=3.3V, at CL=15pF
5.0nsec/div
Fig.85. 22.6MHz output waveform
VDD=3.3V, at CL=15pF
10kHz/div
Fig.87 22.6MHz Spectrum
VDD=3.3V, at CL=15pF
5.0nsec/div
Fig.88 24.6MHz output waveform
VDD=3.3V, at CL=15pF
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© 2012 ROHM Co., Ltd. All rights reserved.
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.89 24.6MHz Period-Jitter
VDD=3.3V, at CL=15pF
12/23
Fig.90 24.6MHz Spectrum
VDD=3.3V, at CL=15pF
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data(BU2362FV basic data)
5.0nsec/div
Fig.91 16.9MHz output waveform
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
500psec/div
Fig.92 16.9MHz Period-Jitter
VDD=3.3V, at CL=15pF
10kHz/div
Fig.93 16.9MHz Spectrum
VDD=3.3V, at CL=15pF
5.0nsec/div
Fig.94 27MHz output waveform
VDD=3.3V, at CL=15pF
10dB/div
1.0V/div
1.0V/div
RBW=1kHz
VBW=100Hz
10kHz/div
Fig.96 27MHz Spectrum
VDD=3.3V, at CL=15pF
1.0V/div
1.0V/div
500psec/div
Fig.95 27MHz Period-Jitter
VDD=3.3V, at CL=15pF
LT Jitter 4.8nsec
2.0nsec/div
Fig.97 24.6MHz LT Jitter
VDD=3.3V, at CL=15pF
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© 2012 ROHM Co., Ltd. All rights reserved.
2.0nsec/div
Fig.98 22.6MHz LT Jitter
VDD=3.3V, at CL=15pF
13/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2362FV Temperature and Supply voltage variations data)
100
90
90
53
51
VDD=3.3V
VDD=3.7V
VDD=2.4V
50
49
48
47
46
45
80
70
60
VDD=2.4V
50
40
30
VDD=3.3V
20
10
0
0
25
50
75
100
Fig.99 33.9MHz
Temperature-Duty
90
Period-jitter1σ ： PJ-1σ[psec]
100
54
VDD=3.3V
VDD=2.4V
50
49
VDD=3.7V
47
46
50
75
-25
0
25
50
75
70
VDD=2.4V
VDD=3.7V
60
50
40
30
20
VDD=3.3V
0
25
50
75
Period-jitter1σ ： PJ-1σ[psec]
90
52
VDD=3.3V
50
49
VDD=3.7V
47
46
50
75
60
VDD=3.7V
50
VDD=2.4V
40
30
20
VDD=3.3V
0
25
50
75
90
Period-jitter1σ ： PJ-1σ[psec]
100
54
50
49
VDD=3.3V
47
46
0
25
50
75
100
Temperature：T[℃]
Fig.108 24.6MHz
Temperature-Duty
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© 2012 ROHM Co., Ltd. All rights reserved.
VDD=3.7V
300
200
100
VDD=3.3V
0
25
50
75
100
Fig.104 36.9MHz
Temperature-Period-Jitter MIN-MAX
500
400
VDD=3.7V
300
VDD=2.4V
200
VDD=3.3V
100
-25
0
25
50
75
100
Fig.107 22.6MHz
Temperature-Period-Jitter MIN-MAX
600
80
VDD=2.4V
70
60
50
40
30
VDD=3.3V
20
VDD=3.7V
10
0
45
-25
VDD=2.4V
400
Temperature： T[ ℃]
Fig.106 22.6MHz
Temperature-Period-Jitter 1σ
48
500
-25
100
Fig.105 22.6MHz
Temperature-Duty
VDD=3.7V
100
0
-25
Temperature：T[℃]
VDD=2.4V
75
10
Temperature：T[℃]
52
50
600
70
100
53
25
Temperature： T[ ℃]
80
55
51
0
Fig.101 33.9MHz
Temperature-Period-Jitter MIN-MAX
0
45
25
10
-25
100
Fig.103 36.9MHz
Temperature-Period-Jitter 1σ
100
0
VDD=3.7V
20
Temperature： T[ ℃]
54
-25
30
0
-25
55
48
40
10
100
53
VDD=3.3V
Temperature：T[℃]
80
Fig.102 36.9MHz
Temperature-Duty
VDD=2.4V
VDD=2.4V
50
600
Temperature：T[℃]
51
60
100
0
45
Duty ： Duty[ ％]
25
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
Duty ： Duty[%]
53
48
0
Fig.100 33.9MHz
Temperature-Period-Jitter 1σ
55
51
70
Temperature： T[ ℃]
Temperature：T[℃]
52
80
0
-25
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
-25
Duty ： Duty[%]
VDD=3.7V
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
Duty ： Duty[%]
52
Period-jitter1σ ： PJ-1σ[psec]
100
54
Period-jitter1σ ： PJ-1σ[psec]
55
500
400
VDD=2.4V
300
200
VDD=3.3V
100
VDD=3.7V
0
-25
0
25
50
75
100
Temperature：T[℃]
Fig.109 24.6MHz
Temperature-Period-Jitter 1σ
14/23
-25
0
25
50
75
100
Temperature： T[ ℃]
Fig.110 24.6MHz
Temperature-Period-Jitter MIN-MAX
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Reference data (BU2362FV Temperature and Supply voltage variations data)
100
54
90
52
51
VDD=3.7V
VDD=2.4V
50
49
VDD=3.3V
48
47
46
80
70
VDD=3.7V
60
50
40
30
VDD=3.3V
20
-25
0
25
50
75
100
0
25
50
75
54
90
Period-jitter1σ ： PJ-1σ[psec]
100
53
52
VDD=3.7V
VDD=3.3V
49
48
VDD=2.4V
46
0
25
50
VDD=2.4V
100
-25
0
75
100
80
70
VDD=3.3V
VDD=2.4V
60
50
40
30
VDD=3.7V
20
75
100
Fig.113 16.9MHz)
Temperature-Period-Jitter MIN-MAX
500
VDD=2.4V
400
VDD=3.3V
300
200
VDD=3.7V
100
10
0
-25
0
25
50
75
100
Fig.115 27MHz
Temperature-Period-Jitter 1σ
Fig.114 27MHz
Temperature-Duty
50
600
Temperature： T[ ℃]
Temperature：T[℃]
25
Temperature： T[ ℃]
0
45
-25
200
100
Fig.112 16.9MHz
Temperature-Period-Jitter 1σ
55
47
VDD=3.3V
300
Temperature：T[℃]
Fig.111 16.9MHz
Temperature-Duty
50
VDD=3.7V
400
0
-25
Temperature：T[℃]
51
500
10
0
45
Duty ： Duty[%]
VDD=2.4V
Period-jitterMIN-MAX ：
PJ-MIN-MAX[psec]
Duty ： Duty[%]
53
600
Period-jitterMIN-MAX：
PJ-MIN-MAX[psec]
Period-jitter1σ ： PJ-1σ[psec]
55
-25
0
25
50
75
100
Temperature： T[ ℃]
Fig.116 27MHz
Temperature-Period-Jitter MIN-MAX
Circuit Current ：IDD[mA]
50
40
VDD=3.7V
30
VDD=3.7V
20
10
VDD=2.4V
VDD=3.3V
0
-25
0
25
50
75
100
Temperature：T[℃]
Fig.117 Action circuit current
(with maximum output load)
Temperature-Consumption current
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© 2012 ROHM Co., Ltd. All rights reserved.
15/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Block diagram, Pin assignment
◎BU2280FV
3:CLK27M1
(27.0000MHz)
4:CLK27M2
(27.0000MHz)
24:CLK27M3
(27.0000MHz)
1/4
12:CLK33M
(33.8688MHz)
XTALIN=27.0000MHz
8:XTALIN
9:XTALOUT
XTAL
OSC
PLL1
1/6
22:CLK768FS
(CTRLFS=OPEN:36.8640MHz
CTRLFS=L
:33.8688MHz)
1/8
16:CLK512FS1
(CTRLFS=OPEN:24.5760MHz
CTRLFS=L
:22.5792MHz)
1/4
PLL2
1/6
15:CLK512FS2
(CTRLFS=OPEN:24.5760MHz
CTRLFS=L
:22.5792MHz)
1/8
20:CLK384FS
(CTRLFS=OPEN:18.4320MHz
CTRLFS=L
:16.9344MHz)
21:OE
23:CTRLFS
(FSEL=OPEN:48.0kHz type
FSEL=L
:44.1kHz type)
Fig.118
24:CLK27M3
2:VSS1
23:CTRLFS
3:CLK27M1
22:CLK768FS
4:CLK27M2
21:OE
BU2280FV
BU2280FV
1:VDD1
5:AVDD
6:AVDD
7:AVSS
8:XTALIN
9:XTALOUT
20:CLK384FS
19:DVDD
18:DVSS
17:DVSS
16:CLK512FS1
10:VSS2
15:CLK512FS2
11:VDD2
14:VDD2
12:CLK33M
13:VSS2
Fig.119
CTRLFS
CLK384FS
CLK512FS
CLK768FS
L
16.9344MHz
22.5792MHz
33.8688MHz
OPEN
18.4320MHz
24.5760MHz
36.8640MHz
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© 2012 ROHM Co., Ltd. All rights reserved.
16/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Block diagram, Pin assignment
◎BU2360FV
3:CLK27M
1 (27.0000MHz)
4:CLK27M
2 (27.0000MHz)
15:CLK33M1
(33.8688MHz)
1/4
13:CLK33M2
(33.8688MHz)
XTALIN=27.0000MHz
7:XTALIN
8:XTALOUT
XTAL
OSC
PLL1
1/6
PLL2
1/6
10:CLK512FS1
(FSEL=OPEN:24.5760MHz
FSEL=L
:22.5792MHz)
9:CLK512FS2
(FSEL=OPEN:24.5760MHz
FSEL=L
:22.5792MHz)
16:OE
14:FSEL
(FSEL=OPEN:48.0kHz type
FSEL=L
:44.1kHz type)
Fig.120
1:VDD2
16:OE
2:VSS2
15:CLK33M1
BU2360FV
3:CLK27M1
4:CLK27M2
5:AVDD
6:AVSS
14:FSEL
13:CLK33M2
12:DVDD
11:DVSS
7:XTALIN
10:CLK512FS1
8:XTALOUT
9:CLK512FS2
Fig.121
FSEL
L
OPEN
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© 2012 ROHM Co., Ltd. All rights reserved.
CLK512FS1 / 2
22.5792MHz
24.5760MHz
17/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Block diagram, Pin assignment
◎BU2362FV
3:CLK27M
(27.0000MHz)
15:CLK33M
(33.8688MHz)
1/4
1/6
XTALIN=27.0000MHz
8:XTALIN
XTAL
OSC
7:XTALOUT
PLL1
1/8
13:CLK16M
(16.9344MHz)
PLL2
1/4
16:CLK36M
(36.8640MHz)
9:CLKA
(FSE=OPEN:16.9344MHz
FSEL=L :36.8640MHz)
10:CLK512FS
(FSE=OPEN:22.5792MHz
FSEL=L :24.5760MHz)
1/6
14:FSEL1
Fig.122
16:CLK36M
2:VSS2
15:CLK33M
3:CLK27M
4:TEST
5:AVDD
6:AVSS
BU2362FV
1:VDD2
14:FSEL1
13:CLK16M
12:DVDD
11:DVSS
7:XTALOUT
10:CLK512FS
8:XTALIN
9:CLKA
Fig.123
FSEL1
OPEN
L
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© 2012 ROHM Co., Ltd. All rights reserved.
CLK512FS
22.5792MHz
24.5760MHz
18/23
CLKA
16.9344MHz
36.8640MHz
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Example of application circuit
◎BU2280FV
1:VDD1
24:CLK27M3
2:VSS1
23:CTRLFS
27.0000MHz
3:CLK27M1
22:CLK768FS
27.0000MHz
4:CLK27M2
27.0000MHz
0.1µF
BU2280FV
5:AVDD
6:AVDD
0.1µF
7:AVSS
21:OE
20:CLK384FS
OPEN:48.0kHz type
L:44.1kHz type
36.8640MHz
or 33.8688MHz
OPEN:Enable
L:Disable
18.4320MHz
or 16.9344MHz
19:DVDD
0.1µF
18:DVSS
8:XTALIN
17:DVSS
9:XTALOUT
16:CLK512FS1
10:VSS2
15:CLK512FS2
11:VDD2
14:VDD2
12:CLK33M
13:VSS2
0.1µF
24.5760MHz
or 22.5792MHz
24.5760MHz
or 22.5792MHz
0.1µF
33.8688MHz
Fig.124
Description of terminal
PIN No.
PIN Name
1
PIN Function
VDD1
Power supply for 27MHz
2
VSS1
GND for 27MHz
3
CLK27M1
27.0000MHz Clock output terminal 1
4
CLK27M2
27.0000MHz Clock output terminal 2
5
AVDD
Power supply for Analog block
6
AVDD
Power supply for Analog block
7
AVSS
GND for Analog block
8
XTALIN
9
XTALOUT
10
VSS2
GND for 33MHz
Power supply for 33MHz
11
VDD2
12
CLK33M
13
VSS2
Crystal input terminal
Crystal output terminal
33.8688MHz Clock output terminal
GND for 33MHz
14
VDD2
15
CLK512FS2
CTRLFS=OPEN:24.5760MHz, CTRLFS=L:22.5792MHz
Power supply for 33MHz
16
CLK512FS1
CTRLFS=OPEN:24.5760MHz, CTRLFS=L:22.5792MHz
17
DVSS
GND for Digital block
18
DVSS
GND for Digital block
19
DVDD
Power supply for Digital block
20
CLK384FS
21
OE
22
CLK768FS
23
CTRLFS
24
CLK27M3
CTRLFS=OPEN:18.4320MHz, CTRLFS=L:16.9344MHz
Output enable (with pull-up), OPEN:enable, L:disable
CTRLFS=OPEN:36.8640MHz, CTRLFS=L:33.8688MHz
15, 16, 20, 22PIN output selection (with pull-up)
OPEN:24.5760MHz(15PIN, 16PIN), 18.4320MHz(20PIN), 36.8640MHz(22PIN)
L:22.5792MHz(15PIN, 16PIN), 16.9344MHz(20PIN), 33.8688MHz(22PIN)
27.0000MHz Clock output terminal 3
Note) Basically, mount ICs to the printed circuit board for use.
(If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully demonstrated.)
Mount 0.1F capacitors in the vicinity of the IC PINs between 1PIN (VDD1) and 2PIN (VSS1), 5PIN-6PIN (AVDD) and 7PIN (AVSS), 10PIN (VSS2) and
11PIN (VDD2), 13PIN(VSS2) and 14PIN (VDD2), 17PIN-18PIN (DVSS) and 19PIN(DVDD), respectively.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU2280FV from the printed circuit board or to insert a
capacitor (of 1 or less), which bypasses high frequency desired, between the power supply and the GND terminal.
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© 2012 ROHM Co., Ltd. All rights reserved.
19/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Example of application circuit
◎BU2360FV
1:VDD2
16:OE
2:VSS2
15:CLK33M1
0.1µF
3:CLK27M1
27.0000MHz
4: CLK27M2
BU2360FV
27.0000MHz
5:AVDD
0.1µF
6:AVSS
14:FSEL
13:CLK32M2
0.1µF
11:DVSS
9:CLK512FS2
8:XTALOUT
OPEN:48.0kHz type
L:44.1kHz type
33.8688MHz
12:DVDD
10:CLK512FS1
7:XTALIN
OPEN:Enable
L:Disable
33.8688MHz
24.5760MHz
or 22.5792MHz
24.5760MHz
or 22.5792MHz
Fig.125
Description of terminal
PIN No.
PIN name
PIN function
1
VDD2
Power supply for 27MHz
2
VSS2
GND for 27MHz
3
CLK27M1
4
CLK27M2
5
AVDD
Power supply for Analog block
6
AVSS
GND for Analog block
27.0000MHz Clock output terminal 1 (CL=40pF)
27.0000MHz Clock output terminal 2 (CL=25pF)
7
XTALIN
8
XTALOUT
Crystal input terminal
9
CLK512FS2
10
CLK512FS1
11
DVSS
GND for Digital block
12
DVDD
Power supply for Digital block
13
CLK33M2
14
FSEL
15
CLK33M1
16
OE
Crystal output terminal
FSEL=OPEN:24.5760MHz, FSEL=L:22.5792MHz
FSEL=OPEN:24.5760MHz, FSEL=L:22.5792MHz
33.8688MHz Clock output terminal 2
9, 10PIN output selection (with pull-up)
OPEN:24.5760MHz(9, 10PIN), L:22.5792MHz(9, 10PIN)
33.8688MHz Clock output terminal 1
Output enable (with pull-up), OPEN:enable, L:disable
Note) Basically, mount ICs to the printed circuit board for use.
(If the ICs are not mounted to the printed circuit board, the characteristics of ICs may not be fully demonstrated.)
Mount 0.1F capacitors in the vicinity of the IC PINs between 1PIN (VDD2) and 2PIN (VSS2), 5PIN (AVDD) and 6PIN (AVSS), 11PIN (DVSS) and 12PIN
(DVDD), respectively.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU2360FV from the printed circuit board or to insert a
capacitor (of 1 or less), which bypasses high frequency desired, between the power supply and the GND terminal.
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© 2012 ROHM Co., Ltd. All rights reserved.
20/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Example of application circuit
◎BU2362FV
16:CLK36M
36.8640MHz
2:VSS2
15:CLK33M
33.8688MHz
14:FSEL1
H:44.1kHz mode
L:48kHz mode
13:CLK16M
16.9344MHz
BU2362FV
27.0000MHz
1:VDD2
3:CLK27M
4:TEST
5:AVDD
6:AVSS
27.0000MHz
12:DVDD
11:DVSS
10:CLK512FS1
7:XTALOUT
9:CLKA
8:XTALIN
22.5792MHz
or 24.5670MHz
16.9344MHz
or 36.8640MHz
Fig.126
Description of terminal
Pin No.
PIN NAME
Function
1
VDD2
Power supply for CLK27, CLK36M
2
VSS2
GND for CLK27, CLK36M
3
CLK27M
27MHz Clock output terminal
4
TEST
Input pin for TEST : with pull-down
(Please set ”L” or OPEN, normally)
5
AVDD
Power supply for Analog block
6
AVSS
GND for Analog block
7
XTALOUT
Crystal output terminal
8
XTALIN
Crystal input terminal
9
CLKA
CLKA output terminal (16.9344MHz or 36.8640MHz)
10
CLK512FS
512fs Clock output terminal (22.5792MHz or 24.5760MHz)
11
DVSS
Power supply for Digital block
12
DVDD
GND for Digital block
13
CLK16M
16.9344MHz Clock output terminal
14
FSEL1
CLKA or CLK512FS pin output select : with pull-up
15
CLK33M
33.8688MHz Clock output terminal
16
CLK36M
36.8640MHz Clock output terminal
●Notes for use (BU2362FV)
Basically, mount ICs to the printed circuit board for use. (If the ICs are not mounted to the printed circuit board, the
characteristics of ICs may not be fully demonstrated.)
Mount 0.1F capacitors in the vicinity of the IC PINs between 1PIN (VDD2) and 2PIN (VSS2), 5PIN (AVDD) and 6PIN
(AVSS), 11PIN (DVSS) and 12PIN (DVDD), respectively.
For the fine-tuning of frequencies, insert several numbers of pF in the 7PIN and 8PIN to GND.
Depending on the conditions of the printed circuit board, mount an additional electrolytic capacitor between the power supply
and GND terminal.
For EMI protection, it is effective to put ferrite beads in the origin of power supply to be fed to BU2362FV from the printed
circuit board or to insert a capacitor (of 1Ω or less), which bypasses high frequency desired, between the power supply and
the GND terminal.
*Even though we believe that the example of recommended circuit is worth of a recommendation, please be sure to thoroughly recheck the characteristics
before use.
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© 2012 ROHM Co., Ltd. All rights reserved.
21/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Notes for use
1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as applied voltage (VDD or VIN), operating temperature range (Topr),
etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
2) Recommended operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has
the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus
suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the
wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be
used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.
5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig.
After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition,
for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
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22/23
2012.02 - Rev.B
Technical Note
BU2280FV, BU2360FV, BU2362FV
●Ordering part number
B
U
2
Part No.
2
8
0
F
Part No.
2280
2360,2362
V
-
Package
FV:SSOP-B24
FV:SSOP-B16
E
2
Packaging and forming specification
E2: Embossed tape and reel
SSOP-B24
<Tape and Reel information>
7.8 ± 0.2
(MAX 8.15 include BURR)
13
Embossed carrier tape
Quantity
2000pcs
0.3Min.
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
12
0.15 ± 0.1
0.1
1.15 ± 0.1
Tape
Direction
of feed
5.6 ± 0.2
7.6 ± 0.3
24
0.1
0.65
0.22 ± 0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B16
<Tape and Reel information>
5.0±0.2
9
0.3Min.
4.4±0.2
6.4±0.3
16
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
8
0.10
1.15±0.1
0.15±0.1
0.1
0.65
1pin
0.22±0.1
Reel
(Unit : mm)
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© 2012 ROHM Co., Ltd. All rights reserved.
23/23
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2012.02 - Rev.B
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001