SHARP LT1F67

ELEC-XROMC COMI’ONEXTS GROUP
SW
CORPORATION
f
\
DEVICE SPECIFICATION
FOR
Light Emitting Diode
MODEL No.
1
LTlF67AF
/
1. These specification sheetsinclude materials protected under the copyrjght of Sharp Corporation (“Sharp”).
Please do not reproduce or causeanyone to reproduce them without S*..
consent
2. When using this product, please 0bsen.e the absolute maximum ratin&!q.nd the instructions for use outlined
in these specification sheets,as well as the precautions mentioned bei@%.Sharp assumesno responsibility
for any damage resulting from use of the product which does not c&r+&
tith the absolute maximum ratings
and the instructions inchrded in these specification sheets,and the precautions
mentioned below.
.Ii:. )
(Precautions)
(1) This products is designed for use in the foUowtig application areas;
* OA equipment * Audio visual equipment * Home tippliance
* Telecommunication equipment (Terminal)
* [email protected]
3
*
Tooling
machines
*
Computers
I
[
If the use of the product in the above application areas is for equipment listed in paragraphs .
(2) or (3), please be sure to observethe precautions given ixi those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safec design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which d&$nds high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, t@n, automobile etc.)
* Traffic signals * Gas leakage sensorbreakers * R@ue and security equipment
*
L Other safetyequipment
I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in fnnction and precision, such as ;
* Space equipment * Tekcommunication equipment (for trunk lines)
+
C Nuclear power control equipment * Medical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
PRESENTED BY:
hp.
&
Department General Manager of
Enginewing Dept.,BI
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
I t?b
:
This data sheet is to introduce
Model No. LTlF61.G. delivered
the light
emitting
diode device’
to
l.Structure
and characteristics
Structure:
CaP gellorgreen
chip LED device
Outline dimensions and pin connections:
Taping specification:
Packing specification:
Soldering method:
@ate l.)Duty ratio=l/lO,
(Note 2)Tore!ance:
Pulse width*.
See
See
See
See
lm~
415%
4. Luminous intensity
rank
.
(Ta=25”C)
Condition
c
H
I
J
K
L
19.7
22.1
24.7
27.7
31.0
34.7
Cvote 3)Measured
-
24. 0
26. 9
30. I
33.7 .
37. 0
42. 4
mcd
IF=201n4
t.olerance; f 15?
by SH.UP EC&C ~lODEL660 (RadiometeriPhotometersystem)
page
page
page
page
2
3 4 5 6
7
8
M
bxq
1. Plated.
j!:.; area
ReqJ
area
2. Pin Conection
0
Cathode
@
Anode
0-0
3. Unspecified
tel.
to be iO.1
Outline
terminal
dimensions
connections
and
1.
This
&tO
* dcrlcc.
2
0h~t
10
to
i*troduor
thr
lapin*
sodi,i,fi~mlioO
.Of
LJ!U
lode1 Ho. LmwAF
taping spcciflcatlaa
2. I
tapiag
2.2
Shipment
rptciflc2tioo
.
table
‘SHIPMENT
TABLE
/-Hodel
number
PA-IT NO.
-Quantity
QUANTITY
-
Lot
-
Luminous intensity
LOT No.
SHARP
UADC
IN
of prodqcts
amber*
: noi3[1oaaa
-m
--v
@ 0 ‘0
@ 8
rank
JAI.4.Y
. *:Lo e indication
0 Production
plant
code(to
be indicated
alphabetically)
$3 Production Lot(singie or double figures)
3 Year of producrion(che
last tuo figures of the year)
8 Konch of production
(to be indicated alphabetically
with January corresponding
d Date
of production(Ol-31)
to A)
2.3
Rcl+tcd
l ttcrs
2.3.1.
Packing
There
2.3.2.
should
not
true strength
1)Cover’trpe
strength
Forward
2) Tape strength
against
against
Taking
radius
out
11 Products
2) Products
2.3.4..
Jointing
There
3: @anti
of
tbrte
products.
0.1-O. 8N
tape
be 30~ or aore.
cover tape may psi.
should
products
should be easily
taken out.
should
not be attached to the eover’taph
rt txeling.
of true
should
(I=lO*
bending
of bending circ!e
If it .is less than 30aa.‘the
2.3.3.
peel iag: F=
Cdneir
+--
The
continuous
be missing’rbova
not
be joint
of cover
tp per reel
Average: 4.000 pcs. per reel
tape
or csrrier
tape.
or Ied)
4-1. Taping
4-1-I. Shape and diwnsion of tape(TYP. >
.
r3- \/I
Parameter
:
P2
PI
~ysbol~imens
’
-I
iod
Benarks
Concave square
‘fere icai
A
hole
Horitoatal
Pitch
B
1 1.1)am Dimeasioq excludes cocaes R
I 1.9mm at inside bottom
Diameter
pi
Da
1 4. Omm
1. sala
Pitch
PO
Center Co ten-
Position
Vert.dire
E
P2
AccumuLa{:ed error
i0.5mm/lO pitch
1.75mm DistaaciI:becueen
tape edge and hole center
Ceacer
Line
of
the
concave square hole and
2.omm
cer dimension
Hori .dire
F
3.5ms
Cover
Wid:h
Thickness
( W,
1 t3
5.5mm
Uidch
1 wo
8. Omm )
Thickness
entire
1 cl
0.2mm 1
lot
part
iasertion
Round
sprocket
hole
_
cape
Carrier
kickness
unit
3 i-taterial
tape
of
the
Carrier
to
cape . ..PET.
..
4.Omn
round
sprocket
hole
1
0. lnm [
1.2IIFA
Cover
.
With cover
tape...Polyescer
tape
and carrier
tape combined
1
X--I
a-l-2.Shapc
Parameter
Flange
Hub
and dimensian of reel (TYP. )
Diameter
Thickness
Inner space direccioa
External diameter
Spindle bale diameter
Key slit
Width
Degch
Notation
3 Hatcrial:
for part came etc.
Reel.. .Polystyrene
1 Symbol } Dimension )’ &e@rks
9178mm
I A
l.Smm
I c
1 W
Diqension
1anlm
E
)6Qmm
C
+13fUlQ
1
E
1
U
1
of shaft
2.0mm
4.5mm
I Labeling on one side of f Lange.
1 (Part name.quantity,loc
No.)
core
Packing
Specification
In order to avoid the absorption of humidity in transport .a& storage, the~devices are
psdtcd
in alusim0
skve.
4
1. Storage Conditions
The storage should lx done under follaaing
conditions:
Temperature . 5 to 3oc
less than 6OUl-l
Humidity
2. Treatment after Opening
1) Please makea soldering within 2 days after opening under following conditions:
.-
Temperature 5 to 3OC
less than 60;YRH
Humidity
2) In case the devices are not used for a long time after opening, the storage in dq box
is recommendable.Or it is better to repack the devices with a desiccative by the sealer
and put them in the samestorage conditions as 6-I. Then they should be used rithin 2
W?XkS.
3) Please makea soldering after a following baking treatment if unused term should be
over the amditions of 2).
Remmendable Gmdi tions:
(TJ in taping
Tesprature 60t Time 90 to 100 Hours
@ in individual ( on PIB or metallic tray >
Temperature 11OC Time 3 to 4 Nours
M aunt ing precautions
1. Soldering
l-1
Xeflow
soldering
To be doae’undet
the following
conditiqa.
UN. EOse c
P3(
ux. 5’5ec
Recommendable T hermal M ode1
1-2 Reflow soldering precautions
Second time soldering shoufd be done witin 8 ham after the first one is l%shcd
(Storage condition:at30C,RH(60%)
I
1
2. Soldering iron method
At 3OOCwithln r seconds
When using a soldering
(Pay attion
not to
iran.care
must be taken not to damage the package
altou
any undue stress or heat on package.)
Z
X-l
LT1F67AF