GM4BN7B3S0A

LCD backlight LED device
Aug 8, 2014
SPECIFICATIONS
LIGHT EMITTING DIODE
GM4BN7B3S0A
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
http://www.sharp-world.com/products/device/
Electronic Components And Devices Group
SHARP CORPORATION
sharp LD-E9-1-14-A
Model No. GM4BN7B3S0A
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1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp").
Please do not reproduce or cause anyone to reproduce them without Sharp's consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) Please do verify the validity of this part after assembling it in customerʼs products, when customer
wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) This products is designed for use in the following application areas;
* OA equipment
* Audio visual equipment
* Home appliance
* Telecommunication equipment (Terminal)
* Measuring equipment
* Tooling machines
* Computers
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(3) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers
* Rescue and security equipment * Other safety equipment
(4) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Telecommunication equipment (for trunk lines)
* Nuclear power control equipment
* Medical equipment
(5)Please contact and consult with a Sharp sales representative if there are any questions
reg arding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
sharp LD-E9-1-14-A
Model No. GM4BN7B3S0A
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GM4BN7B3S0A Specifications
1. Application
Model No. GM4BN7B3S0A.
[White (from InGaN blue LED chip + green and red Phosphor) LED device]
Main applications : Small type LCD back light
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3-5.
3-1.
3-2.
3-3.
3-4.
Absolute maximum ratings
Electro-optical characteristics
Derating curve
Characteristics diagram
4. Reliability
Refer to Page 6.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
Refer to Page 7.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
6-1.
6-2.
6-3.
6-4.
6-5.
6-6.
Refer to Page 8-12.
Taping
Packing specification
Label
Luminous flux rank table
Chromaticity rank table
Information on environmental impact substances
7. Precautions
Refer to Page 13-14.
7-1. General handling
7-2. Soldering
7-3. Cleaning method
1
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±0.04
0.84
0.60
±0.04
0.58
2.31
0.60
Cathode mark
0.44
2.80
±0.02
2．External dimensions and equivalent circuit
2.00
0.18
0.50
0.50
②
①
（0.05）
0.18
0.58
0.54
3.00
1. Equivalent circuit
①
②
Anode
Cathode
②
①
2. Tolerance : ±0.1mm
3. (
) is reference.
Item
Description
Package Materials
Encapsulating Resin Materials
Heat-Resistant Polymer
Silicone Resin
Electrodes Materials
Weight
Ag-plated Copper Alloy
Approx. 3.0 mg
2
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3．Ratings and characteristics
3-1.Absolute maximum ratings
(Ta*＝25℃)※３
Symbol
Rating
Unit
Power dissipation
P
93.0
mW
Forward current
IF
30
mA
Peak pulsed forward current（※１）
I FM
60
mA
DC
-0.57
mA/℃
Pulse
-0.80
mA/℃
Reverse voltage
VR
5
V
Operating temperature（※3）
Topr
-30 to +85
℃
Storage temp erature
Tstg
-40 to +90
℃
Soldering temp erature（※2）
Tsol
260
℃
Forward current derating factor
(※1) Duty ratio = 1/10, Pulse width = 0.1msec
(※2) For reflow soldering (Max.10s)
Refer to "7-2.Soldering" for the condition in the hand solder.
(※3) Ta* and Topr mean atmospheric temperature near surface of the device when the device does not operate.
3-2.Electro-optical characteristics
Parameter
Symbol
Forward Voltage
VF
Luminous flux（※４）
Φv
Chromaticity coordinates（※5）
x
y
Reverse Current
IR
(Ta*＝25℃)
Condition
I F = 20 mA
VR = 5 V
MIN.
TYP.
MAX.
Unit
2.7
2.9
3.1
V
7.10
8.3※
8.85
lm
-
0.280※
-
-
0.270※
-
-
-
10
μA
(※4) Monitored by 8 inch integrating sphere of Sharp Standard.　(Measurement accuracy ：±7%)
(※5) Monitored by 8 inch integrating sphere of Sharp Standard. (Measurement accuracy ： x,y:±0.007)　*Chromaticity coordinates and luminous flux are determined after discussion.
3
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3-3.Derating curve
Forward Current Derating Curve
Peak Pulsed Forward Current Derating Curve
Peak Pulsed Forward Current IFM [mA]
Forward Current IF [mA]
50
40
(49,30)
30
20
(85,8.5)
10
0
-30
0
30
60
90
120
90
80
70
(25,60)
60
50
40
30
20
(85,12)
10
0
-30
0
30
60
90
120
Atmospheric temperature Ta* [℃]
Atmospheric temperature Ta* [℃]
Peak Pulsed Forward Current vs Duty Ratio (Ta*=25℃)
Peak Forward Current IFM [mA]
90
80
70
60
50
40
30
20
10
0
1/100
1/10
1
Duty Ratio DR
3-4. Characteristics Diagram　(*6)
3-4-1.Luminous spectrum
3-4-2.Directivity
Ta*=25℃,IF=20mA
1.0
Ta*=25℃　IF=20mA
Relative Luminous Intensity [a.u.]
ANGLE [deg]
A-A
B-B
0°
0.8
30°
30°
B
A
0.6
B
0.4
60°
60°
0.2
0.0
350
450
550
650
750
90°
-100
Wave Length λ [nm]
4
90°
-50
0
50
100
RELATIVE INTENSITY [%]
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3-4-3. Characteristics Diagram　(*7)
Relative Luminous Flux vs. Forward Current
Ta*=25℃
1000
Ta*=25℃
0.004
0.002
100
10mA
10
-0.002
1
1
10
30mA
-0.004
-0.002
100
0.000
0.002
Forward currrent IF [mA]
Relative Luminous Flux [%]
Chromaticity Coordinate y
0
50
IF=20mA
0.29
50
-50
0.28
-30℃ 0℃
0.27
0.26
0.25
0.26
100
Forward Voltage VF [V]
Forward Voltage VF [V]
0.29
0.30
IF=20mA
4.0
3.0
10
0.28
Forward Voltage vs. Device Surface Temperature
Ta*=25℃
1
0.27
85℃
Chromaticity Coordinate x
Forward Voltage vs. Forward Current
2.0
25℃
60℃
Device Surface Temperature Ta* [℃]
4.0
0.006
Chromaticity Coordinate vs. Device Surface Temperature
IF=20mA
100
0
0.004
Δx
Relative Luminous Flux vs. Device Surface Temperature
150
1mA
5mA
20mA
0.000
Δy
Relative Luminous Flux [%]
Chromaticity Coordinate vs. Forward Current
3.0
2.0
100
Forward Current IF [mA]
5
-50
0
50
100
Device Surface Temperature Ta*[℃]
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4．Reliability
The reliability of products shall satisfied with items listed below.
4-1. Test items and test conditions
Confidence level: 90%
No.
Test items
Test conditions
1
Temperature cycle
2
Thermal shock
3
Temperature humidity
storage
Samples Defective
LTPD
n
C
[%]
-40℃（30min）～ +100℃（30min）, 100 times
22
0
10
-0℃（15sec）～ +100℃（15sec）, 20 times
22
0
10
Ta* = +60℃ , RH = 90% , t = 1000h
22
0
10
4
High temperature storage
Ta* = +100℃ , t = 1000h
22
0
10
5
Low temperature storage
Ta* = -40℃ , t = 1000h
22
0
10
Ta* = +25℃ , I F = 20mA , t = 1000h
22
0
10
Ta* = +25℃ , I F = 30mA , t = 500h
22
0
10
Ta* = +85℃ , I F = 8.5mA , t = 1000h
22
0
10
Ta* = +60℃ , RH = 90% , I F = 20mA , t = 500h
22
0
10
Ta* = -30℃ , I F = 20mA , t = 1000h
22
0
10
11
0
20
11
0
20
11
0
20
11
0
20
6
7
8
9
10
Steady state operating life
Condition 1
Steady state operating life
Condition 2
Steady state operating life
of high temperature
Steady state operating life
of high humidity temperature
Steady state operating life
of low temperature
2
1500 m/s , 0.5ms
11
Shock
12
Vibration
13
Resistance to soldering heat
14
Solderability
± X ・ Y ・ Z direction , 3 times
200 m/s 2, 100 ～ 2000 ～ 100Hz/sweep for 4 min.
X ・ Y ・ Z direction , 4 times
Refer to the attached sheet, Page 15., 2times
Solder temperature: 250±10℃, Soldering time: 5±1s
Solder/Flux: M705/ESR250(SENJU METAL INDUSTY CO., LTD)
4-2. Failure criteria
No.
1 ～ 13
14
(Ta*=25℃)
Parameter
Symbol
Condition
Failure criteria(*8)
Forward voltage
VF
I F =20mA
VF > U.S.L ×1.1
Reverse current
IR
I R > U.S.L ×2.0
Luminous flux
Φv
VR =5V
I F =20mA
Φv＜ Initial value × 0.7, Φv ＞Initial value × 2.0
Solderability
-
-
Solder area rate ＜ 95%
6
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5．Quality level
5-1. Applied standard : ISO 2859-1
5-2. Sampling inspection
A single normal sampling inspection,level S-4.
5-3. Inspection items and defect criteria
No.
Inspection items
1
No radiation
2
3
4
Taping
Defect criteria
No light emission
Not conforming to the inserted direction shown in the
specifications
Electro-optical
Not conforming to the specification
characteristics
(Forward voltage, Reverse current, Luminous intensity)
External dimensions
Not conforming to the specification
(vertical size , horizontal size and thickness)
・ Dust and scratch on emission area (obstacle to emission)
5
Appearance
Classification
Major
defect
Major
defect
AQL
0.1
0.4
・ Resin burr over the tolerance of out line dimensions
・ Chipping of resin and electrode : 0.3mm or more
7
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6．Supplements
6-1. Taping
6-1-1. Shape and dimension of tape (Ref.)
4.00 ± 0.10
Unit : mm
2.00 ± 0.05
Φ　1.50 ± 0.10
4.00 ± 0.05
1.75 ± 0.10
5°　MAX
8.00
+ 0.30
3.50 ± 0.05
- 0.10
Cathode (-)
3.11 ± 0.05
.20 ± 0.02
5° MAX
0.71 ± 0.05
Anode (+)
0.95 ± 0.05
6-1-2. Shape and dimension of reel (Ref.)
Ａ
Ｎ
178±1.0
60±0.5
Ｗ1
9.0
+0.5
-0.0
Ｗ2
12.0
+0.5
-0.0
8
Ｗ3
Ｄ
Ｂ
Ｃ
＞8.0
21.3±0.2
2.3±0.2
13.5±0.2
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6-1-3. Taping specification
(1) Lead tape
Feeding direction
Empty
Stuffed
Empty
10 pitch or more
40 pitch or more
Leading
60～70 pitch
(2) Cover tape strength against peeling:F=0.1~0.8 N (Ref.) (θ=10 °or less)
F
Cover tape
Θ = 0 ～ 10°
Tape speed:5 mm/s
Forward
Carrier tape
(3)Empty + Leading lengrh : More 400 mm ( More 100pitch )
(4) Tape strength against bending: The radius of bending circle should be 30 mm or more.
If it is less than 30 mm, the cover may peel.
(5) Jointing of tape: There should not be joint of cover tape or carrier tape.
(6) Quantity per reel: 4,000 pcs. per reel　(standard)
(7) Others: ①There should not be missing above continuous two products.
②The laking quantity of the products should be 5pcs or less.
③Products should be easily taken out.
6-2. Packing specification
6-2-1. Moisture proof package
In order to avoid the absorption of humidity in transport and storage, the devices are packed
in aluminum moisture proof package.
Label (Sharp materials flow label)
Aluminum Sleeve
Sillicagel
Reel
Label (EIAJ C3)
6-2-2. Strage condition
Temperature：5 to 30℃　Humidity：less than 60%RH s
Storage limitation : Within one year after delivery.
6-2-3.Treatment after opening
(1)Please be sure to give them the soldering within 3 days under the following conditions.
Temperature: 5 ℃ to 30 ℃　Relative humidity: 60 % or less
(2) In case the devices are not used for a long time after opening ,the storage in dry box is recommendable.
Or it is better to repack the devices with a desiccative by the sealer and put them in the some storage
conditions as 6-2-2.
(3) If unused term is exceeded the storage time, baking treatment should be performed.
*Baking treatment : ① In taping : 60℃ to 65℃, 24 hours
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6-3.Label
6-3-1.Label (Reel, Aluminum sleeve)
SHARP CORPORATION
GM4BN7B3S0A
Product number
***********
D part number
***********
Lot number
4000
R.C.
Quantity
Rank
***
6-3-2. Label (Container)
SHARP CORPORATION
GM4BN7B3S0A
Product number
***********
D part number
Quantity
*****pcs
R.C.
2014/08/08
6-3-3 Lot number
ＳＰＮ１１６Ｔ０００１１０７
①
②
③
④ ⑤
⑥
⑦
①Packaging
(SP：Al-pack)
②Location of manufacture
③Year of manufacture
④Month of manufacture
⑤Manufacturing method
⑥Process serial No.
⑦Reel serial No.
6-4. Luminous flux rank table(*8)
Ta*=25℃、IF=20mA
Rank
Luminous Flux [lm]
min
max
LF710
7.10
7.35
LF735
7.35
7.60
LF760
7.60
7.85
LF785
7.85
8.10
LF810
8.10
8.35
LF835
8.35
8.60
LF860
8.60
8.85
(*8) Luminous flux range in each chromaticity is based on the numerical value
of the left table.(Tolerance: ±7％)
Delivery ratio of each rank shall not matter.
With the chromaticity coordinates, luminous flux rank is determined.
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6-5. Chromaticity rank table(*9)
point1
point2
point3
point4
Rank
x
y
x
y
x
y
x
y
Bd
0.2699
0.2360
0.2588
0.2360
0.2666
0.2530
0.2777
0.2530
Be
0.2777
0.2530
0.2666
0.2530
0.2744
0.2700
0.2855
0.2700
Bf
0.2855
0.2700
0.2744
0.2700
0.2822
0.2870
0.2933
0.2870
0.30
0.29
0.28
Bf
y
0.27
Be
0.26
0.25
Bd
0.24
0.23
0.22
0.25
0.26
0.27
0.28
0.29
0.30
x
(*9) Delivery ratio of each rank shall not matter.　(Tolerance: ±0.007)
Chromaticity coordinates are determined after discussion.
11
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6-6. Information on environmental impact substances
6-6-1. RoHS compliant product
This product complies with the RoHS Directive (2011/65/EU) and
manufactured in accordance with Sharp's Green Device Guidelines.
6-6-2.Information relating to China RoHS.
Product Information Notification based on Chinese law, Management Methods for Controlling Pollution by
Electronic Information Products.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Products
Toxic and Hazardous Substances or Elements.
Lead
（Pb）
Mercury
（Hg）
Cadmium
（Cd）
Hexavalent
Chromium
（Cr(VI)）
○
○
○
○
Polybrominated
Biphenyls
（PBB）
Polybrominated
Diphenyl
Ethers
（PBDE）
○
○
○ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the
part is below the concentration limit requirement as described in SJ/T 11363-2006.
× : indicates that the content of the toxic and hazardous substance in at least one homogeneous material
of the part exceeds the concentration limit requirement as described in SJ/T 11363-2006 standard.
6-6-3. Ozone Depleting Substances
(1) This product doesn't contain the following Ozone Depleting Substances.
(2) This product doesn't have a production line whose process requires the following Ozone Depleting
Substances.
Restricted substances : CFCs,halones,CCl4,1-1-1 Trichloroethane(Methylchloroform)
6-6-4. Brominated Flame Retardants
This product doesn't contain Brominated Flame Retardants(PBBOs,PBBs).
12
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7. Precautions
7-1. General handling
・ Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of voltage can not be applied to LEDs when they are out of operation.
・ There is a case that LED to be damaged with external stresses since the devices very small.
Please make sure that not to give any hard shock to the LED.
・ This product is the LED emitting blue light emitting materials using special phosphors.
For this reason, ambient temperature, and changes color depending on the state use some other
operating current.
Color tone is subject to variation due to the afterglow of the phosphor in pulse drive.
・ Please note there is possibility to damage your eyes when person look LED in face for long time.
・ Static electricity or surge voltage damages the LEDs.It is recommended that a wrist band or
anti-electrostatic glove be used when handling the LEDs. All devices, equipment and machinery must
be grounded.
・ The Emitting part molded by silicone resin. For this reason excessive stress to the resin at mounting
equipment can wire deform or damage the devices.Please verify your mounting conditions prior to use
・ Since dust on the surface of the radiation part is hard to remove and may decrease the luminous
intensity, please handle the products in a clean, non-dusty condition.
・ The LED doesn't be considered using in the following special environment.
Please use the LED after confirming the performance and reliability, before using in the following
special environment.
(1)Using in place where a lot of moisture, dew, humidity, sea breezes, and causticity gases
(Cl, H2S, NH3, SO2, and NOX, etc.) exist.
(2)Using in direct sunshine, out-of-door exposure, and dust.
(3)Using in atmosphere such as water, oil, chemical solutions, and organic solvents.
(4)Using in environment with strong static electricity and electromagnetic radiation.
(5)Using the LED near the heat parts or arranging the combustibles near the LED.
・ The Heat dissiparion of this product is depend on the substrate material,circuit pattern and other facters
It recommands to design follow solder pattern.
・ Guarantee covers the compliance to the quality standards mentioned in the Specifications;
however it does not cover the compatibility with application of the end-use, including assembly and
usage environment. In case any quality problems occurred in the application of end-use, details will
be separately discussed and determined between the parties hereto.
7-2. Soldering
・ The LEDs can be soldered in place using the reflow soldering method once and twice.
Please avoid assemble using the dip soldering method.
Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitorogen reflow method.
7-2-1.Reflow soldering
(1) It is not recommended to exceed the soldering temperature and time shown below.
Caused by substrate bend or the other mechanical stress during reflow soldering
may happen gold wire disconnection etc. Therefore please check and study your
solder reflow machine's best condition.
(2) In case of 2 times reflow process,2nd reflow process should be done within 3 days
after opening package.(Strage condition ; at 5～30℃,RH less than 60%RH)
(Dry box storage is recommended in the space to reflow soldering.)
(3) LED electrode and leadframe are comprised of a silver plated copper alloy. The silver
Please avoid conditions which may cause the LED to corrode, tarnish or discolor.
surface may be attacked by environments which contain corrosive gases and so on.
This corrosion or discoloration might lower solderability or might affect on optical characteristics.
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(4) Reflow soldering temperature profile
※After reflow soldering, rapid cooling should be avoided.
Max. 10s
260
1～4℃/s
temperature [℃]
220
Max. 170
1～2.5℃/s
Max. 60s
80～100s
1～4℃/s
25
time [s]
Fig. Reflow soldering temperature profile
(5) The cautions at the time of re-reflow process
Please setup reflow process fundamentally to complete at once. When you perform the second round
reflow soldering reluctantly, please carry out promptly after completing the 1st time.
(6) The reverse side dip soldering process of the substrate after reflow soldering
In case of dip soldering process of reverse side to reflow soldering side for designing,
the reverse side dipping first, and reflow soldering after, to reduce mechanical stress
caused by dip soldering heat or substrate bend.
7-2-2. Hand soldering (with soldering iron)
Please proceed to use soldering iron capacity less than 25W within 290℃ max / 3sec.
In case if you proceed within 1 hour taking out from Aluminum Package, and not touching
to the terminals of the Device(Operation at ; under 30degree/60%RH or less) , it is usable
under 350℃ max. / 3sec. as the option.
※ In case over 1hour after opening the Aluminum package, we recommend to proceed
baking treatment before the use.
7-2-3. Recommended solder pattern
2.00
0.18
0.75
0.18
0.58
0.54
Recommend 0.1 mm to 0.2 mm thickness metal mask for screen print. Caused by solder reflow
condition, solder paste, substrate and the other material etc., may change solderbility.
Please check and study actual solderbility before usage.
7-3. Cleaning method
0.50
0.9
（0.05）
0.50
1.8
0.9
Use no-clean solder and do not clean because solvent may dissolve the package and the resin.
And do not clean the LED's by the ultrasonic.
14
sharp LD-E9-1-14-A
http://www.sharp-world.com/products/device/