YS TEM C ERT I F I C IS O 90 01 STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com AT N IO S MILITARY PRODUCTS HIGH FREQUENCY OSCILLATORS WITH STANDARD MILITARY TESTING OVERVIEW For over 35 years, Statek has supported military programs with both standard products (normally purchased without a drawing and without modifications or special testing) and specialized products (normally purchased to a drawing and requiring modifications or special testing). For those desiring standard products (not governed by a source control document) but still desiring construction and testing to military standards, Statek offers a portfolio of oscillators manufactured and tested to MIL-PRF-55310, Product Level B. Because of our dedication to servicing specialized needs and continued support of the military market over the years, Statek is a preferred supplier to a number of major defense contractors. GUIDELINES FOR MILITARY PRODUCTS Materials Statek uses only the highest quality materials from carefully selected suppliers. Whenever possible, we use domestic suppliers and try to cultivate a long-term relationship to provide stable sources of high-quality materials. Statek’s incoming inspection assures compliance to our requirements. We manufacture our crystals with ultra-pure synthetically grown alpha-quartz bars. (Swept quartz is also available, e.g., for applications requiring radiation hardness.) To simplify and minimize the device circuitry, we use oscillator-dedicated integrated circuits. Lastly, we design our own ceramic packages, which are then manufactured for us by our package supplier. Assembly Statek optimizes its manufacturing process to guarantee high quality. Our time-proven assembly process includes many proprietary techniques to ensure robust parts suitable for the harshest environments. All military oscillators are inspected to MIL-STD-883 prior to seal. Testing In order to meet COTS (commercial-off-the-shelf) requirements, Statek offers oscillators meeting the testing requirements of MIL-PRF-55310 Product Level B. However, Statek gladly accepts fully customized testing to meet your needs; just contact us with your requirements. Continuity Statek offers the continuity of support required for long-term military programs. We maintain records so that we can trace each delivery back through its manufacturing history. Statek also has production redundancy and an established Business Continuity Plan, which will allow us to recover in the event of an unforeseen occurrence. Quality Assurance Statek uses the ISO 9001:2000 process approach model and plans its continual improvements in order to achieve total customer satisfaction. IN-HOUSE TEST CAPABILITIES FOR OSCILLATORS: (INCLUDE BUT NOT LIMITED TO) Aging (Elevated Temp) . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-PRF-55310, Paragraph 4.8.35) Burn-in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-PRF-55310, Table III) Die Shear Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2019) Fine/Gross Leak Testing . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 1014; MIL-STD-202, Method 112) Lead Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2004) Mechanical Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2002) Moisture Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-202, Method 106) PIND (Particle Impact Noise Detection) . . . . . . . . . . . . . .(MIL-STD-883, Method 2020; MIL-STD-202, Method 217) Salt Atmosphere . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 1009) Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2003) Temperature Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 1010) Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-PRF-55310, Paragraph 1.2.1.3, Table III) Thermal Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-202, Method 107) Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-202, Method 204) Wirebond Pull Test . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2023) PRODUCT FAMILY DESCRIPTIONS Statek’s high-frequency military grade oscillators are designed specifically to meet the demanding requirements of today’s precision military applications. The CXO oscillator is compatible with conventional soldering, epoxy attachment, wirebonding, has high shock resistance, and excellent long-term reliability. The CXOM oscillator is a miniaturized version of the CXO, with a low profile ceramic package and one of the smallest footprints available in the industry. The HGXO is a miniature surface mount oscillator that can survive extremely high shocks up to 100,000 g. The LXOAT, LXOMAT, and SQXO2AT are thru-hole oscillators. For applications requiring other types of crystals, oscillators, or sensors, please contact the factory. The CXOHG and CXOMHG oscillators are high-shock versions of the CXO and CXOM that can survive shocks up to 10,000 g (and higher if required). MILITARY APPLICATIONS Smart Munitions Airborne Communication Systems Battlefield Simulation MILITARY PROGRAM PARTICIPATION AMRAAM (Advanced Medium-Range Air to Air Missile) ASRAAM (Advance Short-Range Air to Air Missile) CSEL (Combat Survivor Evader Locator) DAS (Distributed Aperture System) Portable Field Equipment ERGM (Extended Range Guided Munitions) Projectile Electronics EXCALIBER (Next Generation Fuze) Robust Computing Platform JASSM (Joint Air to Surface Standoff Missile) Telemetry JCM (Joint Common Missile) Navigation GPS JTRS (Joint Tactical Radio System) JSF (Joint Strike Fighter) LGB (Laser Guided Bomb) MRM (Medium Range Munition) PAC-3 (Patriot Advanced Capabilities) PREDATOR (Hand-Held Missile) SFW (Sensor Fuzed Weapons) WCMD (Wind Corrected Munitions Dispenser) MAXIMUM RATINGS Supply Voltage VDD Storage Temperature -0.5 V to 7.0 V -55OC to +125OC ENABLE/DISABLE OPTIONS (E/T/N) Statek offers three enable/disable options: E, T, and N. Both the E-version and T-version have Tri-State outputs and differ in whether the oscillator continues to run internally when the output is put into the high Z state: it stops in the E-version and continues to run in the T-version. So, the E-version offers very low current consumption when the oscillator is disabled and the T-version offers very fast output recovery when the oscillator is re-enabled. The N-version does not have PIN 1 connected internally and so has no enable/disable capability. The following table summarizes the three options. SUMMARY OF ENABLE/DISABLE OPTIONS E/T/N E T N When enabled (PIN 1 is high*) Output Freq. output Freq.output Freq. output Oscillator Oscillates Oscillates Oscillates Current consumption Normal Normal Normal When disabled (PIN 1 is low) Output High Z state High Z state Freq. output Oscillator Stops Oscillates Oscillates Current consumption Very low Lower than normal Normal Immediate N/A When re-enabled (PIN 1 changes from low to high) Output recovery Delayed * When PIN 1 is allowed to float, it is held high by an internal pull-up resistor. 0.275 (6.99) DIMENSIONS 3 2 2 3 TYP. E A D TOP 1 B inches mm inches mm A 0.400 10.16 0.405 10.29 B 0.180 4.57 0.190 4.83 C* 0.051 1.30 0.055 1.40 D 0.340 8.64 0.350 8.89 E 0.125 3.18 0.135 3.43 F 0.050 1.27 0.060 1.52 1 C 4 * SM1 Termination F 2 TOP 0.135 (3.43) 4 D B TYP. 0.070 (1.78) MAX. 3 BOTTOM 1 C PIN CONNECTIONS 1. 2. 3. 4. 0.140 (3.56) 0.067 (1.70) DIMENSIONS CXOM/ CXOMHG 0.060 (1.52) Enable/Disable (E or T) or not connected (N) Ground Output VDD D A 0.070 (1.78) GRID PLACEMENT COURTYARD PIN CONNECTIONS 1. 2. 3. 4. 0.130 (3.30) BOTTOM CXO/CXOHG 4 MAX. DIM Enable/Disable (E or T) or not connected (N) Ground Output VDD E DIM inches mm inches mm A 0.256 6.50 0.263 6.68 B 0.197 5.00 0.204 5.18 C* 0.051 1.30 0.055 1.40 D 0.055 1.40 E 0.060 1.52 0.070 1.78 0.065 (1.65) 0.201 (5.11) 0.136 (3.45) * SM1 Termination 0.137 (3.48) GRID PLACEMENT COURTYARD Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. SPECIFICATIONS SURFACE MOUNT PRODUCTS CXO/CXOHG CXOM/CXOMHG 0 033 M T60 HGXO GM M 4.19 Frequency Range 300 kHz to 120 MHz (up to 220 MHz for 3.3V) 300 kHz to 120 MHz (up to 220 MHz for 3.3V) 460 kHz to 50 MHz Supply Voltage 1.8 V to 5.0 V 1.8 V to 5.0 V Standard Calibration Tolerances1 + _ 25 Frequency Stability Over Temp. Range 2 + _ Supply Current (Typical) 5.0 V 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz ppm, + _ 50 ppm, + _ 25 ppm to + _ + _ 25 100 ppm + _ 100 ppm ppm, + _ 25 ppm to 1.8 V to 5.0 V 50 ppm, + _ + _ + _ 25 100 ppm 5.0 V 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz 3.3 V 10 mA for 50 MHz 8 mA for 40 MHz 6 mA for 30 MHz 4 mA for 24 MHz + _ 25 100 ppm 3.3 V 10 mA for 50 MHz 8 mA for 40 MHz 6 mA for 30 MHz 4 mA for 24 MHz ppm, + _ ppm to + _ 50 ppm, + _ 100 ppm 5.0 V 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz 3.3 V 10 mA for 50 MHz 8 mA for 40 MHz 6 mA for 30 MHz 4 mA for 24 MHz Output Load (CMOS) 3 15 pF 15 pF 15 pF Start-up Time 5 ms MAX 5 ms MAX 5 ms MAX Rise/Fall Time 3 ns TYP, 6 ns MAX 3 ns TYP, 6 ns MAX 8 ns MAX Duty Cycle1 40% MIN, 60% MAX 40% MIN, 60% MAX 40% MIN, 60% MAX Aging, first year 100 ppm For high frequency oscillators, aging is dependent on frequency and Shock, survival 4 3,000 g / 10,000 g, 0.3 ms, 1/2 sine 3,000 g / 10,000 g, 0.3 ms, 1/2 sine Up to 100,000 g, 0.5 ms, 1/2 sine Vibration, survival5 20 g, 10-2000 Hz swept sine 20 g, 10-2000 Hz swept sine 20 g, 10-2000 Hz swept sine Maximum Process Temperature 260OC for 20 seconds 260OC for 20 seconds 260OC for 20 seconds 1. Other tolerances available 3. TTL loads and higher CMOS loads available. Contact Factory. 2. Does not include calibration tolerance. Other tolerances available. 4. Higher shock version available. 5. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. NOTE: All combinations may not be available. All parameters are measured at an ambient temperature with a 10 MΩ, 15 pF load. DIMENSIONS G TYP. D 2 A 3 DIM inches mm inches mm A 0.295 7.50 0.302 7.68 B 0.197 5.00 0.204 5.18 0.098 2.50 F TOP 1 HGXO 4 D B C C* 0.089 2.25 D 0.055 1.40 E 0.040 1.02 F 0.240 6.10 G 0.100 2.54 E PIN CONNECTIONS 1. 2. 3. 4. Enable/Disable (E or T) or not connected (N) Ground Output VDD E F G DIM I J A LXOAT PIN NO.1 B * SM1 Termination D PIN NO.7 C PIN NO.14 PIN NO.8 PIN CONNECTIONS 1. Enable/Disable (E or T) or not connected (N) 7. Ground 8. Output 14. VDD 0.075 (1.91) 0.240 (6.10) inches (mm) DIMENSIONS H 0.060 (1.52) 0.040 (1.02) MAX. inches mm A 0.810 MAX 20.57 MAX B 0.510 MAX 12.95 MAX C 0.300 ± 0.005 7.62 ± 0.13 D 0.600 ± 0.005 15.24 ± 0.13 E 0.430 TYP 10.92 TYP F 0.240 MAX 6.10 MAX G 0.040 TYP 1.02 TYP H 0.150 MIN 3.81 MIN I 0.018 ± 0.002 0.46 ± 0.05 J 0.070 TYP 1.78 TYP 0.165 (4.19) 0.100 (2.54) GRID PLACEMENT COURTYARD THRU-HOLE PRODUCTS LXOAT LXOMAT Hz .0M -70 LX0 SQXO2AT 2k 2T-3 250 kHz to 120 MHz (up to 220 MHz for 3.3V) 250 kHz to 120 MHz (up to 220 MHz for 3.3V) 250 kHz to 120 MHz (up to 220 MHz for 3.3V) 1.8 V to 5.0 V 1.8 V to 5.0 V 1.8 V to 5.0 V + _ 25 + _ 25 ppm, + _ ppm to 50 ppm, + _ + _ + _ 25 100 ppm + _ 25 100 ppm 5.0 V 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz 3.3 V 10 mA for 50 MHz 8 mA for 40 MHz 6 mA for 30 MHz 4 mA for 24 MHz ppm, + _ 50 ppm, ppm to + _ + _ 100 ppm + _ 25 100 ppm 5.0 V 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz + _ 25 3.3 V 10 mA for 50 MHz 8 mA for 40 MHz 6 mA for 30 MHz 4 mA for 24 MHz ppm, + _ ppm to 50 ppm, + _ 100 + _ 100 ppm ppm* 5.0 V 14 mA for 50 MHz 12 mA for 40 MHz 10 mA for 30 MHz 8 mA for 24 MHz 15 pF 15 pF 15 pF 5 ms MAX 5 ms MAX 5 ms MAX 6 ns TYP, 10 ns MAX 6 ns TYP, 10 ns MAX 3 ns TYP, 6 ns MAX 40% MIN, 60% MAX 40% MIN, 60% MAX 40% MIN, 60% MAX 3.3 V 10 mA for 50 MHz 8 mA for 40 MHz 6 mA for 30 MHz 4 mA for 24 MHz d other design considerations. Please contact factory. 1,000 g peak, 1 ms, 1/2 sine 1,000 g peak, 1 ms, 1/2 sine 1,000 g peak, 0.3 ms, 1/2 sine 20 g, 10-2000 Hz swept sine 20 g, 10-2000 Hz swept sine 20 g, 10-2000 Hz swept sine 175OC for 20 seconds 175OC for 20 seconds 260OC for 20 seconds D E C F H G PIN NO.1 PIN NO.4 DIMENSIONS DIM A LXOMAT B PIN NO.8 PIN NO.5 PIN CONNECTIONS 1. 4. 5. 8. Enable/Disable (E or T) or not connected (N) Ground Output VDD A E C 12.83 MAX B 0.300 ± 0.005 C 0.430 TYP 10.92 TYP D 0.225 MAX 5.72 MAX E 0.025 MAX 0.64 MAX F 0.150 MIN 3.81 MIN G 0.018 ± 0.002 0.46 ± 0.05 H 0.063 TYP 1.60 TYP DIM D G F mm 0.505 MAX 7.62 ± 0.13 DIMENSIONS B SQXO2AT inches A 3 1 2 BOTTOM VIEW inches mm A 0.380 MAX 9.65 MAX B 0.185 MAX C 0.500 MIN D 0.029 0.74 E 0.326 MAX 8.28 MAX F 0.200 REF 5.08 REF G 45O 45O PIN CONNECTIONS 1. VDD 2. Output 3. Ground 4.70 MAX 12.70 MIN PRODUCT LEVEL B TEST OPTIONS MIL-STD 883 & 202 Methods Test Options Sample Size Standard Testing includes: Internal Visual, Stabilization Bake, Seal Test, Electrical and Function Test B0 Screening 883 Method Internal Visual (Pre-Seal) 2017 & 2032 100% Stabilization Bake (150OC) 1008, Cond C 100% Temperature Cycling 1010, Cond B 100% 2001, Cond A (5000g, Y1 Axis only) 100% 1014, Cond A1& C 100% Electrical and Function Test --- 100% Burn-in, operating (MIL-PRF-55310, Table III) --- 100% Final Electrical Test --- 100% Constant Acceleration Seal Test (Fine and Gross Leak) B1 BA BB Subgrp Subgrp Subgrp 3 2 1 Group A 202 Method Electrical Tests --- As specified in MIL-PRF-55310 Visual & Mechanical --- As specified in MIL-PRF-55310 208 As specified in MIL-PRF-55310 --- As specified in MIL-PRF-55310 Solderability Subgroup 2 Subgroup 3 Vibration 204, Cond D Shock 213, Cond I Thermal Shock 107, Cond B Ambient Pressure (MIL-PRF-55310, Para.4.8.46) --- Storage Temperature (MIL-PRF-55310, Para.4.8.47) --- Resistance to Soldering Heat 8 units 4 units 210, Cond B Moisture Resistance 2 units 106 Salt Atmosphere (MIL-STD-883 Method 1009, Cond A) Subgroup 4 Group C (Destructive Tests) Subgroup 1 Group B 30-day Age (MIL-PRF-55310, Para.4.7.1.5) BC --211, Cond C Terminal Strength (as applicable) Resistance to Solvents 2 units 215 • The paragraph numbers listed in this table refer to MIL-PRF-55310, Revision D • Please contact factory for a description of the standard “Electrical and Functional” battery of tests and the Statek internal visual test • Sampling is performed as per MIL-PRF-55310 Table VI at this time • Please contact factory for additional tests, including MIL-PRF-55310 Level S tests HOW TO ORDER CXOM CXO CXOHG CXOM CXOMHG HGXO LXOAT LXOMAT SQXO2AT 5 S Supply Voltage 1 = 1.8V 2 = 2.5V 3 = 3.0V 4 = 3.3V 5 = 5.0V “S” if special or custom HGXO design. only Blank if Std. Shock Level A = 5,000 g B = 10,000 g C = 20,000 g D = 30,000 g F = 50,000 g G = 75,000 g H = 100,000 g T SM3 – 32.0M , A Enable/Disable Option SM3 = Solder Dipped Frequency Accuracy @ 250C Blank otherwise E, T, or N K = kHz A = 100 ppm E and T are not M = MHz H = 50 ppm available in all F = 25 ppm frequencies; contact factory with specific requirements. For SQXO2AT, only option N is available. (Contact factory for other tolerances.) 1 BA Frequency/Temp Stability Codes 1 = 100 ppm over -40OC to +85OC 2 = 50 ppm over -40OC to +85OC 3 = 25 ppm over -40OC to +85OC 4 = 100 ppm over -55OC to +125OC 5 = 50 ppm over -55OC to +125OC Test Options B0 = Standard Testing Only B1 = Screening (MIL-PRF-55310) BA = Screening + Group A BB = Screening + Groups A & B BC = Screening + Groups A, B, & C 512 N. Main Street Orange, California 1449 Orange Grove Orange, California All products made in the USA. IS O STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com YS 90 01 TEM C ERT I F I C AT N IO S 10162 Rev B 11/05