APPLICATION NOTE APN1011: A 5–6 GHz Switch Using Low-Cost Plastic Packaged PIN Diodes Introduction Input/Common VCTL1 Short-range wireless LANs are being developed for use in the ISM frequency bands between 5.15 and 5.875 GHz. Using lowcost, plastic packaged, surface mount components, such as PIN diodes, is problematic in this frequency range because of package parasitics. In traditional designs, using low-cost packages like the SOT-23, coverage is limited to about 2.5 GHz. In this Application Note, a new design for an SPDT switch in the 5–6 GHz range will be described using PIN diodes in a low inductance SOT-23 package. The design has performance approaching 1 dB insertion loss and 20 dB isolation. PIN Diode Switch Fundamentals PIN diodes are widely used in switches at frequencies below 2.5 GHz. A typical design for a simple SPDT switch, covering a fixed bandwidth, consists of shunt connected PIN diodes each connected a quarter wavelength from the common input port, as shown in Figure 1. Using low-cost plastic packaged PIN diodes, the isolation of this circuit is limited by package inductance. The expression for attenuation based on the inductance, L, and resistance, R, of PIN diode is shown above. A PIN diode in a SC-79 package with typical inductance of 0.7 nH and PIN diode resistance of 1 Ω results in approximately 9 dB isolation, in this switch design at 5.8 GHz. This level of performance is not satisfactory. This paper describes the design and performance of an SPDT switch covering 5–6 GHz using low-cost, commercially available PIN diodes in SOT-23 packages that use a low inductance internal lead configuration. The design is based on a Libra IV simulation. 2 RZ ISO = 10 log 1 + 0 +Z0 R 2 + (ω L) 4 2 λ/4 VCTL2 λ/4 Output A Output B D1(RS1) D2(RS2) Figure 1. Typical SPDT Switch Design The Libra IV Circuit Model In the Libra IV model shown in Figure 2, the PIN diodes, X1 and X4 are shunt connected to the RF path. The PIN diodes X1 and X4 are designated to work complimentary. That is, when the PIN diode in one arm is forward biased (isolation or OFF state) the diode in the other arm is reverse biased (insertion loss or ON state). This operation is provided by defining X1 bias voltage as VCTL; therefore, the bias for X2 is VCTL2 = 3 - VCTL. Thus, switching VCTL from 0–3 V, VCTL2 would toggle from 3–0 V synchronously. The function of the transmission lines TL6 + SRLC1 + TL7 and TL5 + SRLC2 + TL10 is to match the impedance of the forward and reverse-biased PIN diodes, X1 and X4 at the coupling point TEE1, to the 50 Ω source. Since both RF branches (Port 2 and Port 3) are symmetrical, the input impedance at Port 1 should not change as the switch changes its state from ON/OFF to ON/OFF, or opposite. + 6 dB Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200321 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 21, 2005 1 APPLICATION NOTE • APN1011 The transmission lines TL1 and the DC decoupling capacitors SRLC4 and SRLC3 match the impedance of the ON diodes to the 50 Ω RF ports. DC biasing is provided through the 3 k resistors, R1 and R2, which are connected to the RF lines through transmission lines TL7 and TL9. The decoupling capacitors SRLC1–SRLC4 are modeled as series RLC networks to account for both the parasitic inductance (L = 0.75 nH) and ohmic loss (R = 0.2 Ω) typical for 0402 ceramic capacitors. The variable values of the circuit-like capacitances and transmission line lengths and widths were optimized to fit both minimum insertion loss and maximum isolation requirements in the band from 5–6 GHz. Capacitors C1, C3, C4, C5, C6, C7, C9, C10 and C11 are modeled as parasitic effects of component mounting pads on the PCB. Inductors L1 and L3 are modeled as the inductive effects of grounding VIA-holes and connecting lines. Figure 2. Libra Switch Model Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 July 21, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200321 Rev. A APPLICATION NOTE • APN1011 Iout RF Input RF Output L1, L2 1 nH Dpin L2 0.4 nH Ish Figure 4. Low Inductance SOT-23 Figure 3. Default Bench Values SMP1320 and SMP1304 SPICE Models The SMP1304-007 and SMP1320-007 are silicon PIN diodes with I region thickness of 100 um and 8 um respectively and carrier lifetimes of 1.0 us and 0.4 us respectively. Both devices exhibit a wide range of resistance vs. current and are capable of operating with low distortion as a switching element. For the same RF resistance, the SMP1320 requires less DC current than SMP1304. However, at zero bias the SMP1304 has higher impedance. The 007 low inductance package style for the SOT-23 was designed to minimize inductance for shunt connected diodes. To be effective, it must be inserted with each anode contact attached to either side of a gap in a microstrip trace, as shown in Figure 4. When the Dpin diode is OFF (no DC current) the diode is at high impedance and the current, Ish, is minimal. The RF input current primarily flows directly to the output, IOUT. Parasitic inductances, L1 and L2, formed mostly by bonding wires and partially by the package leadframe, combine, resulting in about 2–2.5 nH total inductance on the IOUT current path. When the diode Dpin is ON, the forward bias condition, the shunt current Ish is high. The voltage drop between Dpin anode and the ground is mostly due to the small (0.4–0.5 nH) inductance of the lead and the PCB VIA-hole. This small shunt impedance causes the through current, IOUT, to be relatively small. This allows the PIN diode in this package to provide useful attenuation at frequencies to beyond 6 GHz. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200321 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 21, 2005 3 APPLICATION NOTE • APN1011 Figure 5. SMP1320-007 Small-Signal SPICE Model SPICE models for the SMP1320-007 and SMP1304-007 PIN diodes defined for the Libra IV environment are shown in Figure 5 with a description of the parameters employed. In each model, two diodes were used fitting both the DC and the RF properties of each PIN diode. The PIN diode built-in model of Libra IV is used to model behavior of RF resistance vs. DC current, while the PN-junction diode model is used to model DC voltage-current characteristics. Both diodes are connected in series to ensure the same current flow with the PN-junction diode effectively RF shorted with capacitor C2 set at 1011 pF. The portion of the RF resistance that reflects residual series resistance was modeled with R2 = 2.2 Ω. This is in shunt with an ideal inductor, L1 = 1019 nH, to avoid affecting DC performance. Capacitors CG, CP and inductor L2 reflect junction and package properties of SMP1320/1304-007 diodes. The described model is a linear model that emulates the DC and RF properties of PIN diode. It is described in Reference 2. For details on the fundamental properties of PIN diodes refer to Reference 1. Tables 1 and 2 describe the model parameters for a silicon PIN diode and silicon PN diode. It shows default values appropriate for silicon diodes that may be used by the Libra IV simulator. Some of the values of PIN diode built-in model of Libra IV were not used. Those are marked “not used” in the tables. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 July 21, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200321 Rev. A APPLICATION NOTE • APN1011 Parameter Description Unit Default SMP1320/1304 IS Saturation current (not used) A 1.9E-9 VI I region forward bias voltage drop V 7.5E-4 UN Electron mobility cm**2/(V*S) (not used) cm**2/(V*S) 900 WI I region width ( not used) M 1.2E-4 RR I region reverse bias resistance Ω 4E5 CMIN PIN punchthrough capacitance F 0 TAU Ambipolar lifetime within I region (not used) S 1E-12 RS Series resistance Ω 0 CJ0 Zero-bias junction capacitance F 1.8E-15 VJ Junction potential V 1 M Grading coefficient - 1.01 KF Flicker noise coefficient (not used) - 0 AF Flicker noise exponent (not used) - 1 FC Coefficient for forward bias depletion capacitance (not used) - 0.5 FFE Flicker noise frequency exponent (not used) - 1 Table 1. Silicon PIN Diode Values in Libra IV Assumed for SMP1320/1304 Models Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200321 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 21, 2005 5 APPLICATION NOTE • APN1011 Parameter Description Unit Default SMP1320 Default SMP1304 IS Saturation current A 2.4E-10 2.2E-9 RS Series resistance Ω 2.6 0.62 N Emission coefficient (not used) - 1.75 2.0 TT Transit time (not used) S 0 0 CJO Zero-bias junction capacitance (not used) F 0 0 VJ Junction potential (not used) V 1 1 M Grading coefficient (not used) - 0.5 0.5 EG Energy gap (with XTI, helps define the dependence of IS on temperature) EV 1.11 1.11 XTI Saturation current temperature exponent (with EG, helps define the dependence of IS on temperature) - 3 3 KF Flicker noise coefficient (not used) - 0 0 AF Flicker noise exponent (not used) - 1 1 FC Forward bias depletion capacitance coefficient (not used) - 0.5 0.5 BV Reverse breakdown voltage (not used) V Infinity Infinity IBV Current at reverse breakdown voltage (not used) A 1E-3 1E-3 ISR Recombination current parameter (not used) A 0 0 NR Emission coefficient for ISR (not used) - 2 2 IKF High-injection knee current (not used) A Infinity Infinity NBV Reverse breakdown Ideality factor (not used) - 1 1 IBVL Low Level reverse breakdown knee current (not used) A 0 0 NBVL Low Level reverse breakdown Ideality factor (not used) - 1 1 TNOM Nominal ambient remperature at which rhese model Parameters were derived °C 27 27 1 1 FFE Flicker noise frequency exponent (not used) Table 2. Silicon PN Diode Values in Libra IV Assumed for SMP1320/1304 Models Circuit Design and Layout The circuit diagram for the switch is shown in Figure 6 and the PC board layout is shown in Figure 7. The bill of materials for the switch is shown in Table 3. The PC board was made using 0.78 mm thick standard FR4 material. For convenience, the PC board also has a printed TRL calibration. A through-line should be prepared from a spare PCB by cutting it along the designated board cut mark followed by cleaning and polishing the interface surfaces. The RF terminations were shaped to fit the Wiltron 3680 Series Universal Test Fixture. We do not recommend using SMA adapters because in this frequency range and board thickness a microstrip-to-SMA coaxial may significantly differ from 50 Ω. This may cause substantial measurement errors. The loss of the 10 mm long 50 Ω line on this circuit board was less than 0.2 dB. The measurement data shown are two-port measurements with the third port loaded with a 50 Ω discrete resistor. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 July 21, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200321 Rev. A APPLICATION NOTE • APN1011 Ant Input VCTL 0/3 V D1–D2 SMP1320-007 R1 3k C3 10 pF RF Output 50 Ω C1 5 pF D1 L5 (0.3 x 0.2 mm) L7 (0.2 x 0.49 mm) L3 (0.68 x 0.22 mm) L2 (0.68 x 0.22 mm) L6 (0.2 x 0.49 mm) R2 3k L1, 50 Ω (1.7 x 8 mm) L4 (0.3 x 0.2 mm) L8, 50 Ω (1.7 x 8 mm) VCTL 0/3 V C2 5 pF L9, 50 Ω (1.7 x 8 mm) C4 10 pF D2 RF Output 50 Ω t = 0.02 mm H = 0.78 mm FR4, Er = 4.2 Figure 6. 5–6 GHz Switch Circuit Diagram Designator Value Part Number C1 5p CM05CG5R0K10AB 0402 AVX/KYOCERA C2 5p CM05CG5R0K10AB 0402 AVX/KYOCERA C3 10 p CM05CG100K10AB 0402 AVX/KYOCERA C4 10 p CM05CG100K10AB 0402 AVX/KYOCERA R1 3k CR05-302J-T 0402 AVX R2 100 CR05-302J-T 0402 AVX D1 SMP1320-007 SMP1320-007 SOT-23 Solutions Solutions D2 SMP1320-007 SMP1320-007 SOT-23 Solutions Solutions L1 1.7 x 8 mm L2 0.68 x 0.22 mm L3 MSL, 50 Ω Footprint Manufacturer 1.7 x 8 mm (printed on PCB) MSL 0.68 x 0.22 mm (printed on PCB) 0.68 x 0.22 mm MSL 0.68 x 0.22 mm (printed on PCB) L4 0.3 x 0.2 mm MSL 0.3 x 0.2 mm (printed on PCB) L5 0.3 x 0.2 mm MSL 0.3 x 0.2 mm (printed on PCB) L6 0.2 x 0.49 mm MSL 0.2 x 0.49 mm (printed on PCB) L7 0.2 x 0.49 mm MSL 0.2 x 0.49 mm (printed on PCB) L8 1.7 x 8 mm 1.7 x 8 mm (printed on PCB) L9 1.7 x 8 mm MSL, 50 Ω (printed on PCB) Table 3. Bill of Materials for the 5–6 GHz Switch Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200321 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 21, 2005 7 APPLICATION NOTE • APN1011 Switch Performance Measurement results using the SMP1320-007 are shown in Figure 8 for both ON and OFF states. The dashed line shows that an improvement of at least 0.5 dB in the insertion loss was obtained when the OFF state diode was reverse biased to 5 V from zero bias. This improvement is due to the reduction in junction capacitance for the SMP1320 with increased reverse bias. The forward bias current was less than 2 mA. Our measurements showed approximately 1 dB insertion loss and 15 dB isolation achievable for the SMP1320-007 with 5 V negative bias over the 5–6 GHz frequency range. Figure 9 shows the simulated switch performance using the SMP1320-007. The PIN diode model used was not able to model capacitance vs. voltage. It was simulated, however, by changing the capacitance value from 0.45 pF to 0.35 pF as shown. Some of the differences of the measured curves vs. simulation may be attributed to imperfections of the calibration standards, the switch model and/or the components used. For example, dimensionless lumped models were used for the passive elements; at these frequencies the effect of a physical length of even 1 mm may be significant. The multiple sharp peaks in the measured insertion loss graphs are probably due to imperfections of the calibration standards. Our estimate for measurement accuracy is ±0.25 dB, which is about the size of the peaks shown in the graphs. The reason for this large error is probably the inconsistency of the FR4 material and the standard PCB printing process used, which may have caused impedance deviations in the calibration standards at these frequencies. Figure 7. PCB Layout Switch performance with the SMP1304-007 diode is shown in Figure 10. This PIN diode, by virtue of its thicker I region width, displays no measured change in capacitance or loss with reverse bias. Because it has about three times higher resistance than the SMP1320-007, at the same forward current, the forward control voltage was raised to 15 V. Both insertion loss and isolation show improvement in the range between 5.5–6 GHz, with insertion loss of about 1 dB and isolation slightly better than 20 dB. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 8 July 21, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200321 Rev. A APPLICATION NOTE • APN1011 0 0 6 IL -5/5 V 5 SWR -5/5 V -3 3 4.00 -15 S21 -20 3.00 -25 SWR -30 -4 2 SWR 4 Isolation (dB) IL 0/5 V -10 SWR Insertion Loss (dB) -1 -2 5.00 -5 2.00 -35 SWR 0/5 V -5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 -40 1 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Frequency (GHz) Frequency (GHz) “On” State “Off” State 6.5 7.0 7.5 1.00 Figure 8. The measurement results for the SMP1320-007 Isolation/ Insertion Loss (dB) 0 CJ = 45 pF CJ = 35 pF Insertion Loss -5 -10 -15 CJ = 45 pF -20 Isolation CJ = 35 pF -25 -30 3 4 5 6 7 Frequency (GHz) Figure 9. The simulation results for SMP1320-007 6 5 -5 5 -10 4 S21 0/15 V -2 4 -3 3 SWR 0/15 V -4 2 -15 S21 SWR 0 SWR Insertion Loss (dB) -1 6 Isolation (dB) 0 3 -20 2 SWR -5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 1 -25 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 Frequency (GHz) Frequency (GHz) SMP1304-007 “On” State SMP1304-007 “Off” State 7.0 7.5 1 Figure 10. The measurement results for SMP1304-007 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200321 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 21, 2005 9 APPLICATION NOTE • APN1011 References 1. Gerald Hiller, “Design with PIN Diodes,” Applications Note, Skyworks Solutions, Inc. 2. J. Walston, “Spice Circuit Yields Recipe for PIN Diode,” Microwaves and RF, Nov. 1992. 3. Gerald Hiller, “Predict Intercept Points in PIN Diode Switches,” Microwaves & RF, Dec. 1985. 4. Robert Caverly and Gerald Hiller, “Distortion in PIN Diode Control Circuits,” IEEE Trans. Microwave Theory Tech., May 1987. 5. Gerald Hiller and Peter Shveshkeyev, “A Wideband General Purpose PIN Diode Attenuator,” Applications Note, Skyworks Solutions, Inc., 1999. List of Available Documents 1. The 5.8 GHz switch simulation project files for Libra IV. 2. The 5.8 GHz switch PCB Gerber photo-plot files. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 10 July 21, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200321 Rev. A APPLICATION NOTE • APN1011 Copyright © 2002, 2003, 2004, 2005, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. 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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 200321 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • July 21, 2005 11