SMD03C THRU SMD36C 300W TVS DIODE ARRAY Elektronische Bauelemente RoHS Compliant Product A suffix of "-C" specifies halogen & lead-free FEATURES •SC59 package for surface mount appllcation •Protects 3.3V up through 36V components •Protects two unidirectional line or one bidirection line •Provides electrically is olated protection •ESD>10KV •300W Peak Power Protection( tp=8/2 us) A SC-59(SOT-23) L 3 1 Top View V B S 2 G MECHANICAL DATA C •Molded: SC59 Surface Mount •Body marked with marking code. •Mounting Position: Any •Weight: 0.008 grams (approx.) H D APPLICATIONS J K 3 •Cellular Handsets and Accessories •Portable Electronics •Industrial Controls •Set -Top Box •Servers, Notebook, and Desktop PC 1 Min Max A 2.700 3.100 B 1.200 1.400 C 0.900 1.150 D 0.350 0.500 G 1.700 2.100 H 0.013 0.100 J 0.085 0.200 K 0.450 0.600 L 0.900 1.000 S 2.200 2.600 V 0.450 0.600 All Dimension in mm 3 1 Dim 2 2 MAXIMUM RATING SAND ELECTRICAL CHARACTERISTICS Rating Symbol Value Units Peak Pulse Power (tp=8/20us) Ppk 300 Watts Thermal Resistance, Junction to Ambient 0JA 556 ℃/W Lead Soldering Temperature TL 260 (10 sec.) ℃ Operating Temperature TJ -55 to +125 ℃ Storage Temperature TSTG -55 to +150 ℃ ELECTRICAL CHARACTERISTICS PER LINE @ 25º C Unless otherwise specified PART NUMBER DEVICE MARKING CLAMPING VOLTAGE VC @ 5 Amp (FIGURE 2) VOLTS LEAKAGE CURRENT ID @ V WM VOLTS CLAMPING VOLTAGE VC @ 1 Amp (FIGURE 2) VOLTS MIN MAX MAX STAND OFF VOLTAGE VWM BREAKDOWN VOLTAGE VBR @1 mA VOLTS CAPACITANCE @0V, 1 MHz C Pin 1-3 or 2-3 pF CAPACITANCE @0V, 1 MHz C Pin 1-2 pF MAX MAX MAX µA SMD03C M03 3.3 4 7 8.5 100 700 350 SMD05C M05 5.0 6.1 9.8 11 12 420 210 SMD12C M12 12.0 13.3 19 24 0.5 150 75 SMD15C M15 15.0 16.7 24 30 0.5 100 50 SMD24C M24 24.0 26.7 43 55 0.5 60 30 SMD36C M36 36.0 40.0 60 75 0.5 60 30 NOTE: Transient Voltage Suppression (TVS) product is normally selected based on its stand off Voltage VWM. Product selected voltage should be equal to or greater than the continuous peak operating voltage of the circuit to be protected. http://www.SeCoSGmbH.com 1-Feb-2007 Rev. D Any changing of specification will not be informed individual Page 1 of 2 SMD03C THRU SMD36C 300W TVS DIODE ARRAY Elektronische Bauelemente Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 % of Rated Power or I PP Peak Puse Power - P PP (kW) 100 1 0. 1 90 80 70 60 50 40 30 20 10 0 0. 01 0.1 1 10 100 1000 P ulse Duration - tp (u s) 0 25 50 75 100 125 150 Ambient Temperature - TA ( o C) Applications Information Pulse Waveform 110 Wave form Paramete rs: tr = 8 s td = 20 s 100 90 Percent of I PP 80 70 e 60 -t 50 40 td = I PP /2 30 20 10 0 0 5 10 15 20 25 Time (us) Part Number Marking Code SMD05C M05 SMD12C M12 SMD15C M15 SMD24C M24 SMD36C M36 Suggested Solder Pad Layout 0.9 1.4 4.0 1.2 1.4 0.9 0.95 http://www.SeCoSGmbH.com 1-Feb-2007 Rev. D 2.6 mm 30 Device Connection Options The SM series is designed to protect one bidirectional or two unidirectional data or l/O lines operating at 5 to 36 volts.Connection options are as follows: •Bidirectional:Pin 1 is connected to the data line and pin 2 is connected to ground (Since the device lls symmetrical,these conmtions may be reVer3ed).For best results,the ground connection should be made directly to a ground plane on the board.The path length should be kept as short as possible to minimize parasitic inductance-Pin 3 is not connected. •Unidirectional:Data lines are connected to pin1 and pin2.Pin 3 is connected to ground.For best results,this pin should be connected directly to a ground plane on the board.The path lengh should be kept as short as possible to minimize parasitic inductance. Circuit Board Layout Recommendations for suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD.The following guidelines are recommended (Refer to application note Sl99.01 for more detailed information): •Place the TVS near the input terminals or connectors to restrict transient coupling. •Minimize the path length between the TVS and the protected line. •Minimize all conductive loops including power and ground loops. •The ESD transient return path toground should be kept as short as possible. •Never run critical signals near board edges •Use ground planes whenever possib|e. Any changing of specification will not be informed individual Page 2 of 2