uClamp1201H µClampTM 1-Line ESD Protection PROTECTION PRODUCTS - MicroClampTM Description Features The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. It features large cross-sectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The µClampTM1201H is in a 2-pin, RoHS compliant, SOD-523 package. The leads are finished with leadfree matte tin. Each device will protect one line operating at 12 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM Transient protection for data lines to Mechanical Characteristics EIAJ SOD-523 package Molding compound flammability rating: UL 94V-0 Marking: Marking code, cathode band Packaging: Tape and Reel per EIA 481 Lead Finish: Matte tin RoHS Compliant Applications Dimensions 0.35 IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm) Protects one I/O or power line Low clamping voltage Working voltage: 12V Low leakage current Solid-state silicon-avalanche technology Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.70 1.30 0.9 0.70 Maximum Dimensions (mm) Revision 03/08/2005 SOD-523 (Top View) 1 www.semtech.com uClamp1201H PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 200 Watts Maximum Peak Pulse Current (tp = 8/20µs) Ip p 8 Amps ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) V PP +/- 20 +/- 15 kV Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Minimum Typical Maximum Units 12 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C Forward Voltage VF IF = 10mA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µs 25 V Junction Cap acitance Cj VR = 0V, f = 1MHz 60 pF 2005 Semtech Corp. 2 13.3 V 1 µA 0.8 V www.semtech.com uClamp1201H PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 90 % of Rated Power or IPP Peak Pulse Power - P PP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 50 100 125 150 o Ambient Temperature - TA ( C) Pulse Duration - tp (us) Forward Voltage vs. Forward Current Clamping Voltage vs. Peak Pulse Current 25 3.5 3 20 Forward Voltage - VF (V) Clamping Voltage - VC (V) 75 15 10 Waveform Parameters: tr = 8µs td = 20µs 5 2.5 2 1.5 1 Waveform Parameters: tr = 8µs td = 20µs 0.5 0 0 0 1 2 3 4 5 6 7 Peak Pulse Current - IPP (A) 8 9 0 10 Junction Capacitance vs. Reverse Voltage 1 2 3 4 5 Forward Current - IF (A) 6 7 8 ESD Clamping (8kV Contact per IEC 61000-4-2) 1.1 f = 1 MHz 1 Normalized Capacitance 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2005 Semtech Corp. 2 3 Reverse Voltage - VR (V) 4 5 3 www.semtech.com uClamp1201H PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram These TVS diodes are designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2005 Semtech Corp. 4 www.semtech.com uClamp1201H PROTECTION PRODUCTS Applications Information - Spice Model 0.5 nH Figure 1 - uClamp1201H Spice Model Table 1 - uClamp1201H Spice Parameters 2005 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 1.48E-14 BV Volt 15.33 VJ Volt 0.723 RS Ohm 0.772 IB V Amp 1.0E-3 CJO Farad 52E-12 TT sec 2.541E-9 M -- 0.268 N -- 1.1 EG eV 1.11 5 www.semtech.com uClamp1201H PROTECTION PRODUCTS Outline Drawing - SOD-523 E E1 B DIM A b c D E E1 L L1 aaa D 2X b aaa C A B DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .019 .009 .003 .027 .059 .043 .003 .003 .023 .031 .063 .047 .008 .005 .008 .027 .013 .008 .035 .067 .051 .011 .008 0.50 0.25 0.10 0.70 1.50 1.10 0.10 0.10 0.60 0.70 0.35 0.20 0.80 0.90 1.60 1.70 1.20 1.30 0.20 0.30 0.15 0.20 0.20 A A c SEATING PLANE L C L1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOD-523 Y DIM X C G X Y Z G C Z DIMENSIONS INCHES MILLIMETERS (.057) .024 .018 .033 .090 (1.45) 0.60 0.45 0.85 2.30 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2005 Semtech Corp. 6 www.semtech.com uClamp1201H PROTECTION PRODUCTS Marking Code Ordering Information 2H Part Number Working Voltage uClamp 1201H.TCT 12V Device Qty per Marking Reel 2H 3,000 Reel Size 7 Inch Note: Devices are lead-free MicroClamp, uClamp and µClamp are marks of Semtech Corporation Tape and Reel Specification Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 7 www.semtech.com