TS14001 nanoSmart® Ultra-Low-Power Linear Regulator TRIUNE PRODUCTS Features Description • • • • The TS14001 linear regulator is an ultra-low-power circuit which draws low nA level quiescent current at light load, but has the capability to regulate current loads as high as 200mA. • • Ultra-low nA operating current at light load Best-in-class quiescent current of 20nA at Iload=0 Best-in-class quiescent current of 100pA in disable mode Output voltage options of 1.2V - 4.2V in 100mV steps (programmed at manufacturing) Accurate output regulation Over-current protection • • • • • • Summary Specifications • • Applications Low input operating voltage of 2.5V to 5.5V Packaged in a 8pin VDFN (2x2) Portable electronics RFID Industrial Medical Energy harvesting systems SmartCard Typical Applications TS14001 Load VOUT VCC CBYP COUT EN FB GND TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 1 of 13 Semtech Block Diagram VOUT VCC Current Limit FB Reference Voltage EN GND Pin Description Pin # Pin Name Pin Type (1) Description 1 GND P Ground 2 VOUT O Regulated Output Voltage 3 NC No Connect (connect to GND or float) 4 NC No Connect (connect to GND or float) 5 NC No Connect (connect to GND or float) 6 FB I Feedback Input 7 VCC P Input Power 8 EN I Enable Input (1) I = Input, O = Output, P = Power Absolute Maximum Rating Over operating free–air temperature range unless otherwise noted(2, 3, 4) Parameter Value Unit -0.3 to 6.0 V 2 kV Operating Junction Temperature Range, TJ -20 to 85 °C Storage Temperature Range, TSTG -65 to 150 °C 260 °C VCC, VOUT, EN, FB Electrostatic Discharge (Human Body Model) Lead Temperature (soldering, 10 seconds) (2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (3) All voltage values are with respect to network ground terminal. (4) ESD testing is performed according to the respective JESD22 JEDEC standard. TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 2 of 13 Semtech Thermal Characteristics Package DFN θJA (°C/W) (See Note 5) θJC (°C/W) (See Note 6) 73.1 10.7 8 pin (5) This assumes a FR4 board only. (6) This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note for more information. Recommended Operating Conditions Parameter Min Unregulated Supply Input Voltage (VCC) Max Unit 2.5 5.5 V Enable Input (EN) 0 5 V Regulated Supply Output Voltage (VOUT ) typical 1.2 4.2 V Operating Ambient Temperature, TA (Note 7) -40 55 °C Operating Junction Temperature, TJ -40 85 °C Input Bypass Capacitor (CBYP) Output Bypass Capacitor (COUT ) Typ 2.2 1 2.2 uF 4.7 uf (7) TA Max shown here is a guideline. Higher TA can be tolerated if TJ does not exceed the Absolute Maximum Rating. Characteristics Electrical characteristics, VCC = 2.5V to 5V, TJ = 25C, unless otherwise noted Symbol Parameter VBAT Input Supply Voltage VilEN Input Low Logic Level VihEN Input High Logic Level Condition Min Typ 2.5 Max Unit 5.5 V 0.3*VCC V 0.7*VCC V Iqq Quiescent Current VCC = 2.5V to 5.5V, IOUT = 0 20 nA Iqq-disable Quiescent Current: Disable Mode IOUT = 0, EN = 0 100 pA 200 uA Operating Current VCC = VCC_MIN, IOUT = 200mA (Note 8) VCC = VCC_NOM, IOUT = 200mA (Note 8) VCC = VCC_MAX, IOUT = 200mA (Note 8) 200 uA 200 uA Iop-gnd Iout Load Capability Voutnominal from 1.2V to 3.5V 0 200 Voutnominal >3.5V 0 100 mA (8) If Voutnominal < 2.5V, then VCC_MIN = 2.5V, otherwise VCC_MIN = Vout + 0.3V. VCC_MAX is always 5.5V. VCC_NOM is the average of VCC_MAX and VCC_MIN. TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 3 of 13 Semtech Characteristics Continued Electrical characteristics, VCC = 2.5V to 5V, TJ = 25C, unless otherwise noted Symbol VLine VLoad Ilimit TS14001 Final Datasheet April 30, 2015 Parameter DC Line Regulation DC Load Regulation Current Limit Rev 1.5 Condition VCC = VCC_MIN to VCC_MAX, VOUT =1.8V to 4.2V, IOUT = 50mA Min Typ Max Unit 0.5 4 % 4 % 3 % VCC = VCC_MIN to VCC_MAX, VOUT < 1.8V, IOUT = 50mA VCC = VCC_NOM, IOUT = 0.02mA to 200mA, 1 IOUT measured at VOUT = 0.9*Voutnominal ; Voutnominal from 1.2V to 3.5V 250 IOUT measured at VOUT = 0.9*Voutnominal ; Voutnominal >3.5V 175 www.semtech.com mA 4 of 13 Semtech TS14001 Version 1.5 Typical CHARACTERISTICS Characteristics TYPICAL Iqq Performance Iqq Performance Iqq Performance vs. Load Current Iqq Performance vs. Load Current Line Regulation Performance VOUT Performance vs. Temperature Specifications subject to change TS14001 Final Datasheet April 30, 2015 Rev 1.5 WWW.TRIUNESYSTEMS.COM www.semtech.com 5 Copyright © 2012, Triune Systems, LLC 5 of 13 Semtech TS14001 Version 1.5 Dropout Voltage When VOUT Drops By 3% Load Regulation Performance Dropout Voltage = VCC - VOUT Load Step Response Load Step Response Load Step Response Line Step Response Specifications subject to change TS14001 Final Datasheet April 30, 2015 WWW.TRIUNESYSTEMS.COM Rev 1.5 www.semtech.com 6 Copyright © 2012, Triune Systems, LLC 6 of 13 Semtech TS14 Vers Output Enable Timing TS14001 Final Datasheet Rev 1.5 Specifications subject to change April 30, 2015 www.semtech.com WWW.TRIUNESYSTEMS.COM 7 7 of 13 Copyright © 2012, Triune Systems, L Semtech Package Mechanical Drawings (all dimensions in mm) Units Dimension Limits N e A A1 A3 D E2 E D2 b L K Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Width Overall Width Exposed Pad Length Contact Width Contact Length Contact-to-Exposed Pad MIN 0.80 0.00 0.75 1.55 0.18 0.20 0.20 MILLIMETERS NOM 8 0.50 BSC 0.90 0.02 0.20 REF 2.00 BSC 0.90 2.00 BSC 1.70 0.25 0.30 - MAX 1.00 0.05 1.00 1.80 0.30 0.40 - Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 8 of 13 Semtech Version 1.3 RECOMMENDED PCB Land LAND PATTERN Recommeded PCB Pattern DIMENSIONS IN MILLIMETERS Contact Pitch Optional Center Pad Width Optional Center Pad Length Contact Pad Spacing Contact Pad Spacing Contact Pad Width (X8) Contact Pad Length (X8) Distance Between Pads Specifications subject to change TS14001 Final Datasheet April 30, 2015 Units Dimension Limits E W2 T2 C1 C2 X1 Y1 G WWW.TRIUNESYSTEMS.COM Rev 1.5 www.semtech.com 7 MIN 0.15 MILLIMETERS NOM 0.50 BSC 2.00 - MAX 1.70 0.90 0.35 0.65 - Copyright © 2012, Triune Systems, LLC 9 of 13 Semtech Functional (continued) ApplicationDescription Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Solder Pad (Land Pattern) Package Thermal Pad Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane 4 Plane 1.5748mm Component Traces Thermal Via 1.0142 - 1.0502 mm Ground Plane (1oz Cu) Thermal Isolation Power plane only 0.5246 - 0.5606 mm Power Plane (1oz Cu) Package Solder Pad (bottom trace) 0.0 - 0.071 mm Board Base & Bottom Pad Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 10 of 13 Semtech Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Bottom Layer, 2oz Cu Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 11 of 13 Semtech Ordering Information TS14001-‐CvvvDFNR Part Number Description vvv Output Voltage* 012 1.2 V 018 1.8 V 025 2.5 V 033 3.3 V 042 4.2 V * Custom values also available (1.2V - 4.2V typical in 100mV increments) RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: • • • • • • • • • • • • Cadmium (Cd) Chlorofluorocarbons (CFCs) Chlorinate Hydrocarbons (CHCs) Halons (Halogen free) Hexavalent Chromium (CrVI) Hydrobromofluorocarbons (HBFCs) Hydrochlorofluorocarbons (HCFCs) Lead (Pb) Mercury (Hg) Perfluorocarbons (PFCs) Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDEs) TS14001 Final Datasheet April 30, 2015 Rev 1.5 www.semtech.com 12 of 13 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. 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Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com TS14001 Final Datasheet April 30, 2015 Rev 1.5 13 of 13 Semtech