TS31023/223 Version 1.1 High Input Voltage Linear Regulator DESCRIPTION FEATURES The TS31x23 high voltage linear regulator consists of a low power amplifier with a high voltage p-channel pass gate. The linear regulator has a wide operating range, and is ideal for systems that may have large voltage transients and require the output load to remain regulated. Wide input supply operating range TS31023 : 5V-16V TS31223 : 5V-36V Adjustable output voltage from 1.25V to VIN Vdropout 60mA output current capability Enable control function An analog current limit is used to limit output current and protect the regulator from external short circuits. SUMMARY SPECIFICATIONS APPLICATIONS Ambient operating temperature 0C to 85C Packaged in a 8pin DFN (2x2) Set-top Boxes Automotive Industrial Medical Energy harvesting systems Wireless Power TYPICAL APPLICATION VIN VOUT FB Vref EN Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -1- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 PIN-OUT CONFIGURATION PIN # 1 2 3 4 5 6 7 8 NAME GND VOUT N/C N/C N/C FB VIN EN I/O/P P O I P I DESCRIPTION Ground Regulated Output Voltage No Connect No Connect No Connect Feedback Voltage Input Voltage ENABLE Input ABSOLUTE MAXIMUM RATINGS Over operating free–air temperature range unless otherwise noted (1,2) UNIT VIN -0.3 to 18 (TS31023) -0.3 to 40 (TS31223) V VOUT -0.3 to 18 (TS31023) -0.3 to 40 (TS31223) V EN, FB -0.3 to 6.0 V 2 kV 150 C -65 to 150 C 260 C Electrostatic Discharge – Human Body Model Maximum junction temperature, TJ Storage temperature range, Tstg Lead Temperature (soldering, 10 seconds) Note 1: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. Note 2: All voltage values are with respect to network ground terminal. THERMAL CHARACTERISTICS Package DFN JA (C/W) (See Note 4) JC (C/W) (See Note 5) 8 pin 73.1 10.7 Note 4: This assumes a FR4 board only. Note 5: This assumes a 1oz. Copper JEDEC standard board with thermal vias. See Exposed Pad section and application note for more information. Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -2- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 RECOMMENDED OPERATING CONDITIONS Parameter Min Max Unit Unregulated Supply Input Voltage (VIN) 5 16 (TS31023) 36 (TS31223) V Enable Input (EN) 0 5 V Regulated Supply Output Voltage (VOUT) 1.25 VIN - Vdropout V Operating Junction Temperature, TJ -40 125 °C CHARACTERISTICS Electrical characteristics, VIN = 12V, TJ = 25C, unless otherwise noted Symbol Parameter Condition VIN Input Supply Voltage TS31023 TS31223 VOUT Output Voltage FB COUT Ioff(VIN) Iqq(VIN) Iout VLine VLoad Ilimit Feedback Voltage Output Bypass Capacitor Disabled Current Quiescent Current Load Capability DC Line Regulation (TS31023) DC Line Regulation (TS31223) DC Load Regulation (TS31023) Current Limit Specifications subject to change VIN = 12V EN=0V, VIN=12V EN=5V, Iout = 0 VIN = 5.5V to 16V, Vout=5.0V, Iout = 5mA VIN = 5.5V to 36V, Vout=5.0V, Iout = 5mA VIN = 12V, Vout=5.0V, Iout = 1mA to 60mA VIN = 6V, Vout=5.0V, Iout = 1mA to 60mA Vin =12V WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -3- Min 5 5 1.25 Typ 1.10 1 1.20 2.2 1 220 Max 16 36 VIN Vdropout 1.30 4.7 Unit V V V 60 V uF uA uA mA 0.1 0.6 % 0.1 0.6 % 0.02 0.35 % 0.02 0.15 % 100 mA Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 TYPICAL CHARACTERISTICS Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -4- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 VCC = 4.9V Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -5- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 PACKAGE MECHANICAL DRAWINGS Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -6- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 RECOMMENDED PCB LAND PATTERN Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -7- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 APPLICATION USING A MULTI-LAYER PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Solder Pad (Land Pattern) Package Thermal Pad Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad Component Traces 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane 4 Plane 1.5748mm Thermal Via 1.0142 - 1.0502 mm Ground Plane (1oz Cu) Thermal Isolation Power plane only 0.5246 - 0.5606 mm Power Plane (1oz Cu) 0.0 - 0.071 mm Board Base & Bottom Pad Package Solder Pad (bottom trace) Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -8- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Bottom Layer, 2oz Cu Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. APPLICATION USING A SINGLE LAYER PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE -9- Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 IR REFLOW PROFILE Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 10 - Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 11 - Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 ROHS AND REACH COMPLIANCE Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: Cadmium (Cd) Chlorofluorocarbons (CFCs) Chlorinate Hydrocarbons (CHCs) Halons Hexavalent Chromium (CrVI) Hydrobromofluorocarbons (HBFCs) Hydrochlorofluorocarbons (HCFCs) Lead (Pb) Mercury (Hg) Perfluorocarbons (PFCs) Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDEs) Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 12 - Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 ORDERING INFORMATION Part Number: TS31023-CDFNR (7 inch reel) TS31023-CDFNR-13 (13 inch reel) TS31223-CDFNR (7 inch reel) TS31223-CDFNR-13 (13 inch reel) REEL DIMENSIONS (7 INCH) Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 13 - Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 REEL DIMENSIONS (13 INCH) Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 14 - Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 CARRIER TAPE SPECIFICATION Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 15 - Copyright © 2012, Triune Systems, LLC TS31023/223 Version 1.1 Legal Notices Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. “Typical” parameters which may be provided in Triune Systems data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for your application by your technical experts. TRIUNE SYSTEMS MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Triune Systems disclaims all liability arising from this information and its use. Triune System products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Triune Systems product could create a situation where personal injury or death may occur. Should the Buyer purchase or use Triune Systems products for any such unintended or unauthorized application, the Buyer shall indemnify and hold Triune Systems, and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Triune Systems was negligent regarding the design or manufacture of the part. No licenses are conveyed, implicitly or otherwise, under any Triune Systems intellectual property rights. Trademarks The Triune Systems® name and logo, MPPT-lite™, and nanoSmart® are trademarks of Triune Systems, LLC. in the U.S.A.. All other trademarks mentioned herein are property of their respective companies. © 2012 Triune Systems, LLC. All Rights Reserved. Specifications subject to change WWW.TRIUNESYSTEMS.COM Triune Systems Proprietary & Confidential Information DO NOT DUPLICATE - 16 - Copyright © 2012, Triune Systems, LLC