TS12001 nanoSmart® Battery Management Under-Voltage Load Switch TRIUNE PRODUCTS Features Description • • • • • The TS12001 Off-Active™ battery management load switch is used to protect a battery from excessive discharge. It consists of an internally generated threshold voltage (VTHRESH), comparator with hysteresis, slew rate control for the load switch, a P-Channel load switch, and an open-drain indicator pin. When the input battery voltage is above VTHRESH, the load switch is on-active. When the input battery voltage falls to VTHRESH, the load switch is Off-Active™ and the quiescent current draw is approximately 100pA. • • • • • Off-Active™ feature with ultra-low pico-amp current Best-in-class Off-active™ quiescent current of 100pA Ultra-low on-active quiescent current of 70nA Accurate on to Off-active™ voltage threshold Threshold voltage options of 1.2V - 4.2V in 100mV steps (programmed at manufacturing) Supervisory over-current limit shutdown Low Rds(on): 175mΩ typical @ 5V Low drop out disconnect from VBAT to loads Turn-on slew rate controlled 500mV off to on-active hysteresis Applications Summary Specifications • • Wide input voltage range: 1.2V – 5.5V Packaged in a 8pin DFN (2x2) • • • • • • Portable Battery Industrial Medical SmartCard RFID Energy Harvesting Systems Block Diagram VCC VOUT R e g u la te d T h re s h o ld nPG GND TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com 1 of 11 Semtech Typical Applications Disconnect the Battery Charger Load TS12001 VOUT VCC nPG CBYP GND Note: When the TS12001 is Off-Active™, the battery will continue to charge through the body diode between VOUT and VCC. Disconnect the Load Charger TS12001 VOUT VCC CBYP TS12001 Final Datasheet April 30, 2015 Rev 1.3 Load nPG GND www.semtech.com 2 of 11 Semtech Pin Description Pin # Pin Name Pin Type (1) Description 1 GND P GND 2 VOUT O Output to System Load 3 NC No Connect (connect to GND or float) 4 NC No Connect (connect to GND or float) 5 NC No Connect (connect to GND or float) 6 VCC I/P Supply Input 7 VCC I/P Supply Input 8 nPG O Open-Drain N-Channel Output (low indicates Power Good) (1) I = Input, O = Output, P = Power Absolute Maximum Ratings Over operating free–air temperature range unless otherwise noted(2, 3, 4) Parameter Value Unit -0.3 to 6.0 V 2 kV Operating Junction Temperature Range, TJ -20 to 85 °C Storage Temperature Range, TSTG -65 to 150 °C 260 °C VCC, VOUT, nPG Electrostatic Discharge – Human Body Model Lead Temperature (soldering, 10 seconds) (2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (3) All voltage values are with respect to network ground terminal. (4) ESD testing is performed according to the respective JESD22 JEDEC standard. Thermal Characteristics Package DFN 8 pin θJA (°C/W) (See Note 5) θJC (°C/W) (See Note 6) 73.1 10.7 (5) This assumes a FR4 board only. (6) This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note for more information. TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com 3 of 11 Semtech Recommended Operating Conditions Parameter Min Unregulated Supply Input Voltage (VCC) Max Unit 1.2 5.5 V Operating Ambient Temperature, TA (Note 7) -20 55 °C Operating Junction Temperature, TJ -20 85 °C Input Bypass Capacitor (CBYP) Typ 100 nF (7) TA Max shown here is a guideline. Higher TA can be tolerated if TJ does not exceed the Absolute Maximum Rating. Characteristics Electrical characteristics, VCC = 1.2V to 5.5V, TJ = 25C, unless otherwise noted Symbol Parameter Condition Min Typ Max Unit 5.5 V 150 nA Input Supply VCC Input Supply Voltage 1.2 Quiescent current: on-active Mode Quiescent current: Off-Active™ Mode VCC = 5V, No Load 70 VCC < V THRESH, No Load 100 pA IOC Over Current Shutdown VCC = 5.0V 3 A TOC Over Current Retry Period VCC = 5.0V 1.7 ms Output Switch Leakage Current VCC < V THRESH; VOUT Grounded 100 pA VCC = 5.0V 175 mΩ VCC = 3.3V 200 mΩ VCC = 1.8V 350 mΩ Iq-ON Iq-OFF Load Switch ILEAK-SW Rds-on Switch On Resistance Transition Times VOFF = 2.0V, VCC = 3.0V → 1.5V 650 μs td2 Transition delay: on-active to Off-Active™ Transition delay: Off-Active™ to on-active VOFF = 2.0V, VCC = 1.5V → 3.0V 1.7 ms tON Output turn-on rise time VCC = 2.5V, RLOAD = 50Ω 200 μs ILEAK-nPG Output Leakage VCC = 5.0V, VnPG = 5.5V 100 nA VOL-nPG Low-Level Output Voltage InPG = 5 mA 0.4 V VOFF Off-Active™ Threshold V THRESH = 1.2V to 3.3V 1.05* V THRESH V VHys Off-Active™ to on-active Hysteresis Rising Transition: Off-Active™ to on-active td1 nPG Output Off-Active Thresholds TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com 0.95* V THRESH V THRESH 500 mV 4 of 11 Semtech TS12001 Version 1.3 Typical Characteristics TYPICAL CHARACTERISTICS On-Active / Off-Active™ Characteristics On-Active Switching Behavior On-Active / Off-Active™ Iq Off-Active™ VTHRESH Temperature Performance TS12001 Version 1.3 On-Active / Off-Active™ Transition Delay Specifications subject to change WWW.TRIUNESYSTEMS.COM TS12001 www.semtech.com 5 PACKAGE MECHANICAL DRAWINGS Final Datasheet Rev 1.3 April 30, 2015 Over Current Retry Performance Copyright © 2012, Triune Systems, LLC 5 of 11 Semtech Package Mechanical Drawings (all dimensions in mm) Units Dimension Limits N e A A1 A3 D E2 E D2 b L K Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Width Overall Width Exposed Pad Length Contact Width Contact Length Contact-to-Exposed Pad Notes: Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com MIN 0.80 0.00 0.75 1.55 0.18 0.20 0.20 MILLIMETERS NOM 8 0.50 BSC 0.90 0.02 0.20 REF 2.00 BSC 0.90 2.00 BSC 1.70 0.25 0.30 - MAX 1.00 0.05 1.00 1.80 0.30 0.40 - 6 of 11 Semtech Version 1.3 RECOMMENDED PCB Land LAND PATTERN Recommeded PCB Pattern DIMENSIONS IN MILLIMETERS Contact Pitch Optional Center Pad Width Optional Center Pad Length Contact Pad Spacing Contact Pad Spacing Contact Pad Width (X8) Contact Pad Length (X8) Distance Between Pads Specifications subject to change TS12001 Final Datasheet April 30, 2015 Units Dimension Limits E W2 T2 C1 C2 X1 Y1 G WWW.TRIUNESYSTEMS.COM Rev 1.3 www.semtech.com 7 MIN 0.15 MILLIMETERS NOM 0.50 BSC 2.00 - MAX 1.70 0.90 0.35 0.65 - Copyright © 2012, Triune Systems, LLC 7 of 11 Semtech Functional (continued) ApplicationDescription Using A Multi-Layer PCB To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed when laying out this part on the PCB. The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane. Solder Pad (Land Pattern) Package Thermal Pad Thermal Via's Package Outline Package and PCB Land Configuration For a Multi-Layer PCB JEDEC standard FR4 PCB Cross-section: (square) Package Solder Pad 1.5038 - 1.5748 mm Component Trace (2oz Cu) 2 Plane 4 Plane 1.5748mm Component Traces Thermal Via 1.0142 - 1.0502 mm Ground Plane (1oz Cu) Thermal Isolation Power plane only 0.5246 - 0.5606 mm Power Plane (1oz Cu) Package Solder Pad (bottom trace) 0.0 - 0.071 mm Board Base & Bottom Pad Multi-Layer Board (Cross-sectional View) In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com 8 of 11 Semtech Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Bottom Layer, 2oz Cu Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com 9 of 11 Semtech Ordering Information TS12001-CvvvDFNR Part Number Description vvv Threshold Voltage (V THRESH)* 017 1.7 V 021 2.1 V 023 2.3 V 024 2.4 V 025 2.5 V 026 2.6 V 028 2.8 V 030 3.0 V * Custom values also available (1.2V - 4.2V typical in 100mV increments) RoHS and Reach Compliance Triune Systems is fully committed to environmental quality. All Triune Systems materials and suppliers are fully compliant with RoHS (European Union Directive 2011/65/EU), REACH SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level 3 materials declarations, and their subsequent amendments. Triune Systems maintains certified laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: • • • • • • • • • • • • Cadmium (Cd) Chlorofluorocarbons (CFCs) Chlorinate Hydrocarbons (CHCs) Halons (Halogen free) Hexavalent Chromium (CrVI) Hydrobromofluorocarbons (HBFCs) Hydrochlorofluorocarbons (HCFCs) Lead (Pb) Mercury (Hg) Perfluorocarbons (PFCs) Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDEs) TS12001 Final Datasheet April 30, 2015 Rev 1.3 www.semtech.com 10 of 11 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com TS12001 Final Datasheet April 30, 2015 Rev 1.3 11 of 11 Semtech