EClamp2398P

EClamp2398P
ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClamp®
Description
PRELIMINARY
Features
 Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
 ESD protection to IEC 61000-4-2 (ESD) Level 4,
EClamp 2398P is a low pass (L-C) filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
®
±20kV (air), ±15kV (contact)
 Filter performance: 30dB minimum attenuation





EClamp2398P device consists of eight identical circuits
comprised of TVS diodes for ESD protection, and a 5pole inductor - capacitor network for EMI/RFI filtering.
A typical inductor value of 19nH and a capacitor value
of 12pF are used to achieve 30dB minimum attenuation from 800MHz to 2.7GHz. The TVS diodes provide
effective suppression of ESD voltages in excess of
±15kV (air discharge) and ±8kV (contact discharge) per
IEC 61000-4-2, level 4.
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 19nH (Typical)
Capacitance: 12pF (Typical at VR = 2.5V)
Protection and filtering for eight lines
Solid-state technology
Mechanical Characteristics







EClamp2398P is in a 16-pin SLP4016P16 package
measuring 4.0 x 1.6 x 0.58mm. Leads are spaced at a
pitch of 0.5mm and are finished with lead-free NiPd.
The small package makes it ideal for use in portable
electronics such as cell phones, digital still cameras,
and PDAs.
SLP4016P16 16-pin package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel
Applications
 Color LCD Protection
 Cell Phone CCD Camera Lines
 Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
4.00
1 2
L1
L2
IN
1.60
OUT
C1
C2
C3
0.50 BSC
GND
0.58
Device Schematic (8X)
Revision 03/4/2014
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
VESD
+/- 20
+/- 15
kV
Junction Temperature
TJ
125
o
Operating Temperature
Top
-40 to +85
o
Storage Temperature
TSTG
-55 to +150
o
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
C
C
C
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD
ground plane.
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O to GN D
Reverse Breakdown Voltage
V BR
It = 1mA,
Any I/O to GN D
IR
VRWM = 5.0V,
Any I/O to GN D
RDC
Each Channel, Between
Input and Output
18
Ohms
Filter Cut-Off Frequency
fc
ZSource = ZLoad = 50 Ohms
150
MHz
Inductance
L
19
nH
38
nH
Reverse Leakage Current
DC Resistance
Total Series Inductance
Minimum
6
Typical
8
Maximum
Units
5
V
10
V
0.100
μA
L1 + L2
Each Channel, Between
Input and Output
Capacitance
C1, C2, C3
VR = 2.5V, f = 1MHz
10
12
15
pF
Total Capacitance
C1 + C2 +
C3
VR = 2.5V, f = 1MHz,
Each Channel Input to
GN D
30
36
45
pF
© 2014 Semtech Corporation
2
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21
LOG
Analog Crosstalk (Each Line)
CH1 S21
6 dB / REF 0 dB
LOG
20 dB /REF 0 dB
1: -33.132 dB
800 MHz
0 dB
2: -36.460 dB
1.8 GHz
-6 dB
3: -31.558 dB
3 GHz
-12 dB
-18 dB
-24 dB
3
-30 dB
1
-36 dB
2
-42 dB
-48 dB
-54 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
START. 030 MHz
STOP 3000. 000000 MHz
START . 030 MHz
ESD Clamping (+8kV Contact per IEC 61000-4-2)
Each Channel to GND
ESD Clamping (-8kV Contact per IEC 61000-4-2)
Each Channel to GND
9
2
8
1
7
0
5
Voltage (V)
Voltage (V)
6
4
3
-1
-2
-3
2
-4
1
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-5
-1
-6
-10
10
30
50
70
90
-10
Time (ns)
10
30
50
70
90
Time (ns)
Capacitance vs. Reverse Voltage
(Normalized to 2.5 volts)
2
CJ(VR) / CJ(VR=0)
1.5
1
0.5
f = 1 MHz
0
0
1
2
3
Reverse Voltage - VR (V)
© 2014 Semtech Corporation
4
5
3
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2398P is comprised of eight identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
In 1
In 2
In 3
In 4
In 5
In 6
In 7
In 8
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
Equation 1: The Impedance of an Inductor at
Frequency XLF
1
16
Gnd
8
9
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
Out 7
Out 8
Pin
Identification
1-8
Inp ut Lines
9 - 16
Outp ut Lines
Center Tab
Ground
Figure 2 - Inductance of Rectangular Wire Loops
XLF(L, f )  2 *  * f * L
Where:
L= Inductance (H)
f = Frequency (Hz)
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers separated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
© 2014 Semtech Corporation
Equation 2: Inductance of Rectangular Wire Loop

LRECT(d, x, y)  10.16 *10 9 * x * ln
   y * ln 
2*y
d
2*x
d
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
4
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration.
CH1 S21
LOG
6 dB / REF 0 dB
1: -4.1029dB
150 MHz
0 dB
4
2: -34.337 dB
800 MHz
-6 dB
3: -37.930 dB
1.8 GHz
-12 dB
-18 dB
4: -34.395 dB
2.5 GHz
-24 dB
-30 dB
-36 dB
3
1
2
-42 dB
-48 dB
-54 dB
Figure 3 - Recommended Layout Using Ground Vias
1
MHz
START . 030 MHz
© 2014 Semtech Corporation
5
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
1.4nH
1.4nH
L
Line Out
38nH
Figure 1 - EClamp2398P Spice Model
Table 1 - EClamp2398P Spice Parameters
© 2014 Semtech Corporation
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
4.09E-15
4.09E-15
BV
Volt
7.435
7.435
VJ
Volt
0.743
0.743
RS
Ohm
0.584
0.584
IB V
Amp
1E-3
1E-3
CJO
Farad
31.3E-12
31.3E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.23
0.23
N
--
1.1
1.1
EG
eV
1.11
1.11
6
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP4014P16
A
B
D
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
C
A1
D1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.020 .023 .026 0.50 0.58 0.65
.000 .001 .002 0.00 .003 0.05
(.005)
(0.13)
.007 .010 .012 0.20 0.25 0.30
.153 .157 .161 3.90 4.00 4.10
.122 .126 .130 3.10 3.20 3.30
.059 .063 .067 1.50 1.60 1.70
.010 .016 .020 0.25 0.40 0.50
.020 BSC
0.50 BSC
.011 .013 .015 0.28 0.33 0.38
16
16
.003
0.08
.004
0.10
1 2
LxN
E/2
E1
N
bxN
e
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP4014P16
P
X
Z
F
G
Y
(C)
DIM
B
C
F
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
.130
3.30
.060
1.52
.018
0.45
.035
0.89
.020
0.50
0.30
.012
0.63
.025
.085
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2014 Semtech Corporation
7
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EClamp2398P
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
Ordering Information
2398P
PIN 1
INDICATOR
(LASER MARK)
Part Number
Qty per
Reel
R eel Size
EClamp 2398P.TCT
3000
7 Inch
EMIClamp and EClamp are trademarks of Semtech Corporation.
Carrier Tape Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.78 +/-0.10 mm
B0
K0
4.30 +/-0.10 mm
0.74 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
12 mm
8.2 mm
(.476)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
±0.05
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
5.5±0.05
mm
(.217±.002)
4.5 mm
(.177)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
12.0 mm
+ 0.3 mm
- 0.1 mm
(.472±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2014 Semtech Corporation
8
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