EClamp2506K ESD/EMI Protection for Color LCD Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClamp® Description Features The EClamp® 2506K device is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) Filter performance: 20dB minimum attenuation The device consists of six identical circuits comprised of TVS diodes for ESD protection, and a 3-pole inductor - capacitor network for EMI/RFI filtering. A typical inductor value of 17nH and a capacitor value of 12pF are used to achieve 20dB minimum attenuation from 800MHz to 2.7GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. 800MHz to 2.7GHz TVS working voltage: 5V Inductor: 17nH (Typical) Capacitors: 12pF (Typical at VR = 2.5V) Protection and filtering for six lines Solid-state technology Mechanical Characteristics The EClamp2506K is in a 12-pin, SLP2513P12 package. It measures 2.5 x 1.3 x 0.50mm. The leads are spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. SLP2513P12 12-pin package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 2.5 x 1.3 x 0.50mm Lead Pitch: 0.4mm Lead finish: NiPdAu Marking : Marking Code and Date Code Packaging : Tape and Reel Applications Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Circuit Diagram (Each Line) Package Configuration 2.50 17nH IN 1 2 OUT 12pF 1.30 12pF 0.40 BSC GND 0.50 12 Pin SLP package (Bottom Side View) Nominal Dimensions in mm Device Schematic (6X) Revision 4/14/2010 1 www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 20 +/- 15 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics (T = 25oC) P ar am et er S y m b ol Con d i t i on s T VS Reverse Stand-Off Voltage VRWM T VS Reverse Breakdown Voltage V BR It = 1mA IR VRWM = 3.3V T VS Reverse Leakage Current Mi n i mu m 6 Ty p i c a l M ax i m u m Units 5 V 8 10 V 0.03 0.1 μA 18 Ohms 250 MHz 17 nH DC Resistance RDC Filter Cut-Off Frequency fc Inductance L Capacitance C1 , C2 VR = 2.5V, f = 1MHz 10 12 15 pF Total Capacitance C1 + C2 Input to Gnd, Each Line VR = 2.5V, f = 1MHz 20 24 30 pF © 2010 Semtech Corp. ZSource = ZLoad = 50 Ohms 2 www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG Analog Crosstalk (Each Line) 6 dB / REF 0 dB CH1 S21 LOG 20 dB /REF 0 dB 1: -4. 46 dB 250 MHz 2: -26.206 dB 800 MHz 0 dB -6 dB 3: -34.349 dB 1.8 GHz 1 -12 dB 4: -33.371 dB 2.7 GHz -18 dB -24 dB 2 -30 dB 3 4 -36 dB -42 dB -48 dB 1 MHz 10 MHz 100 MHz 1 3 GHz GHz START . 030 MHz STOP 3 000. 000000 MHz STOP 3 000. 000000 MHz START . 030 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator Capacitance vs. Reverse Voltage (Normalized to 2.5 volts) 2 CJ(VR) / CJ(VR=2.5) 1.5 1 0.5 f = 1 MHz 0 0 1 2 3 4 5 Reverse Voltage - VR (V) © 2010 Semtech Corp. 3 www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Device Connection Figure 1 - Pin Identification and Configuration (Top Side View) The EClamp2506K is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 12-pin SLP package. Electrical connection is made to the 12 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. In 1 In 2 In 3 In 4 In 5 In 6 Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. 1 12 GND 6 7 Out 1 Out 2 Out 3 Out 4 Out 5 Out 6 Pin Identification 1-6 Inp ut Lines 7 - 12 Outp ut Lines Center Tab Ground Equation 1: The Impedance of an Inductor at Frequency XLF Figure 2 - Inductance of Rectangular Wire Loops XLF(L, f ) = 2 * π * f * L Ground Via 1 Where: L= Inductance (H) f = Frequency (Hz) d Signal Layer x Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. © 2010 Semtech Corp. Ground Via 2 y Ground Layer Layer Equation 2: Inductance of Rectangular Wire Loop Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) 4 www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Applications Information Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 is highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias CH1 S21 LOG 6 dB / REF 0 dB 1: -4. 46 dB 250 MHz 2: -26.206 dB 800 MHz 0 dB -6 dB 3: -34.349 dB 1.8 GHz 1 -12 dB 4: -33.371 dB 2.7 GHz -18 dB -24 dB 2 -30 dB 3 4 -36 dB -42 dB Figure 3 - Recommended Layout Using Ground Vias -48 dB 1 MHz START . 030 MHz © 2010 Semtech Corp. 5 10 MHz 100 MHz 3 1 GHz GHz STOP 3 000. 000000 MHz www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model Line In 0.5nH 0.5nH L Line Out 16nH EClamp2506K Spice Model EClamp2506K Spice Parameters © 2010 Semtech Corp. Parameter Unit D1 (T VS) D2 (T VS) IS Amp 1.48E-14 1.48E-14 BV Volt 7.44 7.44 VJ Volt 0.75 0.75 RS Ohm 0.53 0.53 IB V Amp 1E-3 1E-3 CJO Farad 19.4E-12 19.4E-12 TT sec 2.541E-9 2.541E-9 M -- 0.25 0.25 N -- 1.1 1.1 EG eV 1.11 1.11 6 www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP2513P12 A D B DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C A2 C A1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .018 .020 .022 .000 .001 .002 (.005) .006 .008 .010 .096 .098 .101 .079 .083 .087 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 12 .003 .004 0.45 0.50 0.55 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 2.45 2.50 2.575 2.00 2.10 2.20 1.25 1.30 1.375 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 12 0.08 0.10 D1 1 2 LxN E/2 E1 N bxN e bbb C A B e/2 D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP2513P12 P Z X G H DIM C G H K P X Y Z (C) Y DIMENSIONS INCHES MILLIMETERS (.050) (1.27) .027 0.69 .012 0.30 .087 2.20 .016 0.40 .008 0.20 .023 0.58 .073 1.85 K NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2010 Semtech Corp. 7 www.semtech.com EClamp2506K PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2506K PIN 1 INDICATOR YYWW Part Number Qty per Reel R eel Size EClamp 2506K.TCT 3000 7 Inch EMIClamp and EClamp are marks of Semtech Corporation Note: YYWW = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.10 mm B0 K0 2.71 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2010 Semtech Corp. 8 www.semtech.com