SC1101 - Semtech

SC1101
Asynchronous Voltage
Mode PWM Controller
POWER MANAGEMENT
Description
Features
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The SC1101 is a versatile, low-cost, voltage-mode PWM
controller designed for low output voltage DC/DC power
supply applications. A simple, fixed-voltage buck
regulator can be implemented using the SC1101 with a
minimum of external components. Internal level shift and
drive circuitry eliminates the need for an expensive
p-channel, high-side switch. The small device footprint
allows for compact circuit design.
SC1101 features include a temperature compensated
voltage reference, triangle wave oscillator, current limit
comparator, frequency shift over-current protection, and
an internally compensated error amplifier. Pulse by pulse
current limiting is implemented by sensing the
differential voltage across an external resistor, or an
appropriately sized PC board trace.
Low cost / small size
Switch mode efficiency up to 95%
1% reference voltage accuracy
Over current protection
500mA output drive
SO-8 package
Applications
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Pentium® P55 Core Supply
Low Cost Microprocessor Supplies
Peripheral Card Supplies
Industrial Power Supplies
High Density DC/DC Conversion
The SC1101 operates at a fixed frequency of 200kHz,
providing an optimum compromise between efficiency,
external component size, and cost.
Typical Application Circuit
L1
4uH
Q1
IRLR3103
Vout = 2V @ 10A
R5
0.05
+
+5V
C1
1.0
C2
150/6.3V
C3
150/6.3V
D2
MBRD1035L
GND
C8
330/2.5V
C9
330/2.5V
C10
330/2.5V
C11
1.0
R6
76.8 *see note
R7
127
GND
+12V
R1
10
R2
1k
R3
1k
U1
SC1101
1
GND
CS(-)
FB
3
CS(+)
BST
6
4
PGND
DH
5
2
C4
0.1
8
VCC
C6
0.01
R4
2.2
7
C5
0.001
C7
0.1
* NOTE:
R6 = R7 x (Vout/1.25 - 1) rounded to nearest 1%value
Revision: May 25, 2005
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SC1101
POWER MANAGEMENT
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Parameter
Symbol
Maximum
Units
Input Voltage
VCC to GND
-0.3 to +7
V
Ground Differential
PGND to GND
±1
V
Boost Input Voltage
BST to GND
-0.3 to +15
V
Operating Ambient Temperature Range
TAMB
0 to +70
°C
Storage Temperature Range
TSTG
-45 to 125
°C
TJ
125
°C
TLEAD
300
°C
Thermal Resistance Junction to Ambient
θJ A
165
°C/W
Thermal Resistance Junction to Case
θJ C
40
°C/W
Maximum Junction Temperature
Lead Temperature (Soldering) 10 Sec.
Electrical Characteristics
Unless specified: VCC = 4.75 to 5.25, GND = PGND = 0V, VO = 2.5V, TA = 25°C, BST = 12V.
Per test circuit, unless otherwise specified.
Parameter
Symbol
Reference
VREF
Conditions
Min
Typ
Max
Units
1.238
1.250
1.263
V
1.225
1.250
1.275
2.0
8.0
uA
Current into VCC pin
5.0
8.0
mA
Load Regulation
IO = 1A to 10A
0.5
1.0
%
Line Regulation
IO = 10A
0.5
%
Over 0 to 125°C Temp. range
Feedback Bias Current
IFB
Quiescent Current
IQ
Current Limit Threshold
CS(+) to CS(-)
Oscillator Frequency
Oscillator Frequency Shift
UVLO Threshold
70
80
mV
170
200
230
kHz
VFB < VREF/2
Max Duty Cycle
DH Sink/Source Current
60
90
IO
VBST - VDH = 4.5V / VDH -VPGND = 2V
50
kHz
95
%
500
VUVLO
mA
3.8
V
Note:
(1) This device is ESD sensitive. Use of standard ESD handling precautions is required.
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SC1101
POWER MANAGEMENT
Pin Configuration
Ordering Information
Device
Top View
(1)
SC1101CS.TR
VCC
1
8
GND
CS(-)
2
7
FB
CS(+)
3
6
BST
PGND
4
5
DH
SC1101CSTRT(2)
P ackag e
Temp Range (TJ)
SO-8
0° to 125°C
Notes:
(1) Only available in tape and reel packaging. A reel
contains 2500 devices.
(2) Lead free product. This product is fully WEEE and
RoHS compliant.
(8 Lead Plastic SOIC)
Pin Descriptions
Pin Number
Pin Name
Pin Function
1
VC C
Device input voltage.
2
CS(-)
Current sense input (Negative) .
3
CS(+)
Current sense input (Positive) .
4
PGND
Device power ground .
5
DH
High side driver output .
6
BST
High side driver VCC (Boost) .
7
FB
8
GND
Error amplifier input (-) .
Signal ground .
Block Diagram
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SC1101
POWER MANAGEMENT
Applications Information
Layout Guidelines
Careful attention to layout requirements are necessary
for successful implementation of the SC1101 PWM
controller. High currents switching at 200kHz are present
in the application and their effect on ground plane voltage differentials must be understood and minimized.
rents are supplied by Cout only, and connections between
Cout and the load must be short, wide copper areas to
minimize inductance and resistance.
5) The SC1101 is best placed over an isolated ground
plane area. GND and PGND should be returned to this
isolated ground. This isolated ground area should be connected to the main ground by a trace that runs from the
GND pin to the ground side of (one of) the output
capacitor(s). If this is not possible, the GND pin may be
connected to the ground path between the Output
Capacitor(s) and the Cin, Q1, D1 loop. Under no circumstances should GND be returned to a ground inside the
Cin, Q1, D1 loop.
1). The high power parts of the circuit should be laid out
first. A ground plane should be used, the number and
position of ground plane interruptions should be such as
to not unnecessarily compromise ground plane integrity.
Isolated or semi-isolated areas of the ground plane may
be deliberately introduced to constrain ground currents
to particular areas, for example the input capacitor and
bottom Schottky ground.
2). The loop formed by the Input Capacitor(s) (Cin), the
Top FET (Q1) and the Schottky (D1) must be kept as small
as possible. This loop contains all the high current, fast
transition switching. Connections should be as wide and
as short as possible to minimize loop inductance. Minimizing this loop area will reduce EMI, lower ground injection currents, resulting in electrically “cleaner” grounds
for the rest of the system and minimize source ringing,
resulting in more reliable gate switching signals.
6) Vcc for the SC1101 should be supplied from the 5V
supply through a 10Ω resistor, the Vcc pin should be
decoupled directly to GND by a 0.1µF ceramic capacitor,
trace lengths should be as short as possible.
3). The connection between the junction of Q1, D1 and
the output inductor should be a wide trace or copper
region. It should be as short as practical. Since this connection has fast voltage transitions, keeping this connection short will minimize EMI. The connection between
the output inductor and the sense resistor should be a
wide trace or copper area, there are no fast voltage or
current transitions in this connection and length is not
so important, however adding unnecessary impedance
will reduce efficiency.
8) To minimize noise pickup at the sensitive FB pin, the
feedback resistors should both be close to the SC1101
with the bottom resistor (Rb) returned to ground at the
GND pin.
7) The Current Sense resistor and the divider across it
should form as small a loop as possible, the traces running back to CS(+) and CS(-) on the SC1101 should run
parallel and close to each other.
Under Voltage Lockout
The under voltage lockout circuit of the SC1101 assures
that the high-side MOSFET driver outputs remain in the
off state whenever the supply voltage drops below set
parameters. Lockout occurs if VCC falls below 3.8V. Normal operation resumes once VCC rises above 3.8V.
4) The Output Capacitor(s) (Cout) should be located as
close to the load as possible, fast transient load cur-
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SC1101
POWER MANAGEMENT
Applications Information (Cont.)
Layout diagram for the SC1101
VO = VREF (1 + Ra/Rb)
5V
12V IN
10
0.1uF
Q1
SC1101CS
1
2
3
4
0.001uF
VCC
CS(-)
CS(+)
PGND
GND
FB
Cin
+
8
Vout
7
4uH
Rb
6
BST
+
D1
Cout
5
DH
Ra
Heavy lines indicate
high current paths.
Application Circuit
5V to 2.0V @ 10A (Bootstrapped)
D1
LL42
C7
0.1
L1
4uH
Q1
IRLR3103
R5
0.05
+
+5V
C1
1.0
C2
150/6.3V
C3
150/6.3V
D2
MBRD1035L
C8
330/2.5V
C9
330/2.5V
C10
330/2.5V
C11
1.0
R6
76.8 *see note
R7
127
Vout = 2V @ 10A
GND
GND
R1
10
R2
1k
C4
0.1
R3
1k
U1
SC1101
1
VCC
GND
8
2
CS(-)
FB
7
3
CS(+)
BST
6
4
PGND
DH
5
C6
0.01
R4
2.2
C5
0.001
* NOTE:
R6 = R7 x (Vout/1.25 - 1) rounded to nearest 1%value
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SC1101
POWER MANAGEMENT
Typical Characteristics
Load Regulation
VIN = 5V
Error Amplifier, Gain and Phase
40
180
PIN Descriptions
1.0%
0.8%
35
0.6%
135
30
0.4%
20
90
15
Gain
10
45
Phase
Phase (deg)
Gain (dB)
25
3.3V
0.0%
2.5V
-0.2%
1.8V
-0.4%
5
-0.6%
0
0
-0.8%
-5
-10
100.0E+0
0.2%
-1.0%
1.0E+3
10.0E+3
100.0E+3
1.0E+6
0
-45
10.0E+6
2
4
6
8
10
12
Output Current, (A)
Frequency (Hz)
Efficiency
VIN = 5V
Line Regulation
VO = 2.5V; IO = 10A
100%
2.0%
95%
1.5%
1.0%
90%
0.5%
85%
3.3V
0.0%
80%
2.5V
-0.5%
75%
1.8V
-1.0%
70%
-1.5%
-2.0%
4.500
65%
4.750
5.000
5.250
60%
5.500
0
Input Voltage, (V)
2
4
6
8
10
12
Output Current, (A)
Output Ripple Voltage
VIN = 5V; VO = 3.3V; IO = 10A
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SC1101
POWER MANAGEMENT
Outline Drawing - SO-8
A
D
e
N
DIM
E1 E
1
2
ccc C
2X N/2 TIPS
.069
.053
.010
.004
.065
.049
.020
.012
.010
.007
.189 .193 .197
.150 .154 .157
.236 BSC
.050 BSC
.010
.020
.016 .028 .041
(.041)
8
0°
8°
.004
.010
.008
A
A1
A2
b
c
D
E1
E
e
h
L
L1
N
01
aaa
bbb
ccc
2X E/2
e/2
B
D
DIMENSIONS
MILLIMETERS
INCHES
MIN NOM MAX MIN NOM MAX
aaa C
SEATING
PLANE
h
A2 A
C
A1
bxN
bbb
1.75
1.35
0.25
0.10
1.65
1.25
0.31
0.51
0.17
0.25
4.80 4.90 5.00
3.80 3.90 4.00
6.00 BSC
1.27 BSC
0.25
0.50
0.40 0.72 1.04
(1.04)
8
8°
0°
0.10
0.25
0.20
h
H
C A-B D
c
GAGE
PLANE
0.25
SEE DETAIL
A
L
(L1)
DETAIL
SIDE VIEW
01
A
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION AA.
Minimum Land Pattern - SO-8
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
INCHES
MILLIMETERS
(.205)
.118
.050
.024
.087
.291
(5.20)
3.00
1.27
0.60
2.20
7.40
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
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