RClamp1644T Low Capacitance RClamp® ESD Protection for uUSB Interfaces PROTECTION PRODUCTS - RailClamp® Description PRELIMINARY Features RailClamp is a low capacitance TVS array designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp1644T is specifically designed to protect portable devices that utilize a uUSB port. The unique design of this device features low capacitance TVS diodes for protection of the USB data (DP, DM) and USB ID pins operating up to 5 volts. Loading capacitance on these lines is <0.6pF for maximum signal integrity. An integrated 12 volt TVS diode is used for protection of the USB voltage bus. This ensures the device will remain in a high-impedance state during normal USB operation or when the battery is being charged. Leakage current of the VBus protection is <50nA when operating at 12 volts. The RClamp1644T is in a 6-pin SLP1508N5T package. It measures 1.5 x 0.8 x 0.40mm. The leads are spaced at a pitch of 0.35mm and are finished with lead-free NiPdAu. They may be used to meet the ESD immunity requirements of IEC 61000-4-2. ® ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) ±25kV (air), ±20kV (contact) IEC 61000-4-5 (Lightning) 10A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns) Protects USB DP, DM, and ID Pin operating to 5V Protects USB VBus operating up to 12V Low capacitance (<0.60pF) on DP, DM, and ID Pins Low clamping voltage Extremely low dynamic resistance: 0.33 Ohms (Typ) on DP, DM, and ID Pins Innovative flow-through design allows easy pcb layout Solid-state silicon-avalanche technology Mechanical Characteristics SLP1508N5T 5L package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.5 x 0.8 x 0.40 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code + date code Packaging : Tape and Reel Applications USB 2.0 USB OTG Micro USB Circuit Diagram Pin Configuration VBus 1 1 DM 2 2 3 GND 4 5V DP 12V ID 5 SLP (Top View) Revision 4/12/2012 1 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 75 Watts Peak Pulse Current (tp = 8/20μs) IP P 5 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±25 ±20 kV TJ -55 to +125 °C TSTG -55 to +150 °C Peak Pulse Power (tp = 8/20μs) Pp k 300 Watts Peak Pulse Current (tp = 8/20μs) IP P 10 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD ±30 ±30 kV TJ -55 to +125 °C TSTG -55 to +150 °C D P, D M , U S B I D Operating Temperature Storage Temperature VBus T VS Operating Temperature Storage Temperature VBus T VS Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to GN D Reverse Breakdown Voltage V BR It = 1mA, Pin 1 to GN D Reverse Leakage Current IR VRWM = 12V Pin 1 to GN D Forward Voltage VF If = 10mA GN D to Pin 1 Clamping Voltage VC Forward Clamping Voltage Junction Capacitance © 2012 Semtech Corporation Maximum Units 12 V 16.5 18 V 0.005 0.100 μA 1.0 V IPP = 10A, tp = 8/20μs Pin 1 to Ground 30 V VFC IPP = 10A, tp = 8/20μs Ground to Pin 1 3 V Cj VR = 0V, f = 1MHz Pin 1 to GN D 75 pF 2 Minimum 15 Typical 0.6 55 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Electrical Characteristics (T=25oC) D M , D P, U S B I D Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 2, 3, or 4 to GN D Reverse Breakdown Voltage V BR It = 1mA, Pin 2, 3, or 4 to GN D Reverse Leakage Current IR VRWM = 5.0V, Pin 2, 3, or 4 to GN D Forward Voltage VF If = 15mA Pin 2, 3, or 4 to GN D Clamp ing Voltage VC Clamp ing Voltage Maximum Units 5 V 9 11 V 0.005 0.100 μA 1.2 V IPP = 1A, tp = 8/20μs Pin 2, 3, or 4 to GN D 12 V VC IPP = 5A, tp = 8/20μs Pin 2, 3, or 4 to GN D 15 V ESD Clamp ing Voltage VC IPP = 4A, tlp = 0.2/100ns 12 V ESD Clamp ing Voltage VC IPP = 16A, tlp = 0.2/100ns 16 V Dynamic Resistance RD tp = 100ns 0.33 Ohms Junction Cap acitance Cj VR = 0V, f = 1MHz, Pin 2, 3, or 4 to GN D 0.45 0.60 pF VR = 0V, f = 1MHz, Between I/O p ins 0.20 0.4 pF © 2012 Semtech Corporation 3 Minimum 6.5 Typical 0.6 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 35 10 Clamping Voltage - VC (V) Peak Pulse Power - P PP (kW) 30 VBus 1 DP, DM. ID 0.1 25 VBus 20 15 10 DP, DM. ID Waveform Parameters: tr = 8μs td = 20μs 5 DR040412-300 0.01 0.1 1 10 Pulse Duration - tp (µs) 0 100 0 Capacitance vs. Reverse Voltage DM, DP. ID Pins (Pins 2, 3, 4) 3 4 5 6 7 Peak Pulse Current - IPP (A) 8 9 10 11 75 65 0.40 Capacitance - Cj (pF) 0.50 Capacitance - Cj (pF) 2 Capacitance vs. Reverse Voltage VBus Pin (Pin 1) 0.60 DM, DP, ID, To GND (Line to GND) 0.30 0.20 DM, DP, ID (Line to Line) 0.10 55 45 35 25 15 f = 1 MHz f = 1 MHz 0.00 0 1 2 3 4 Reverse Voltage - VR (V) 5 5 6 0 TLP Characteristic (Positive Pulse) 2 4 6 8 Reverse Voltage - VR (V) 10 12 TLP Characteristic (Negative Pulse) 30 0 TLP Parameters: tp = 100ns tr = 200ps 25 TLP Parameters: tp = 100ns tr = 200ps -5 DP, DM, ID RDYN = 0.33 Ohms 20 TLP Current (A) TLP Current (A) 1 15 10 -10 VBus RDYN = 0.10 Ohms -15 -20 DP, DM, ID RDYN = 0.75 Ohms VBus RDYN = 0.25 Ohms -25 5 -30 0 0 5 © 2012 Semtech Corporation 10 15 TLP Voltage (V) 20 -30 25 -25 -20 -15 -10 -5 0 TLP Voltage (V) 4 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics ESD Clamping (+8kV Contact per IEC 61000-4-2) DM, DP. ID Pins (Pins 2, 3, 4) ESD Clamping (-8kV Contact per IEC 61000-4-2) DM, DP. ID Pins (Pins 2, 3, 4) 100 0 90 -20 80 -40 -60 Voltage (V) Voltage (V) 70 60 50 40 -80 -100 -120 30 20 -140 10 -160 0 -180 -10 0 10 20 30 40 50 60 70 80 -10 0 10 20 Time (ns) 40 50 60 70 80 Time (ns) ESD Clamping (+8kV Contact per IEC 61000-4-2) VBus Pin (Pin 1) ESD Clamping (-8kV Contact per IEC 61000-4-2) VBus Pin (Pin 1) 60 0 50 -5 -10 Voltage (V) 40 Voltage (V) 30 30 20 -15 -20 -25 10 -30 0 -35 -10 0 10 20 30 40 50 60 70 -10 80 0 10 Typical Insertion Loss S21 DM, DP. ID Pins (Pins 2, 3, 4) CH1 S21 LOG 30 40 50 60 70 80 Analog Crosstalk DM, DP. ID Pins (Pins 2, 3, 4) 6 dB / REF 0 dB CH1 S21 1: - .04080 dB 800 MHz 0 dB 5 12 3 2: - .07550 dB 900 MHz LOG 20dB / REF 0 dB 0 dB 4 3: - .28930 dB 1.8 GHz -6 dB -12 dB -20 dB 4: - 1.0400 dB 2.5 GHz -18 dB -40 dB 5: - 1.1154 dB 2.7 GHz -24 dB -60 dB -80 dB -30 dB -100 dB -36 dB -120 dB -42 dB -48 dB 20 Time (ns) Time (ns) -140 dB 1 MHz START . 030 MHz © 2012 Semtech Corporation 10 MHz 100 MHz 3 1 GHz GHz -160 dB START . 030 MHz STOP 3000. 000000 MHz 5 STOP 3000. 000000 MHz www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection and Layout Options for Protecting One USB Port VBus 1 The RClamp1644T is optimized for protection of USB ports. Low capacitance protection is provided for the USB data (DM, DP) and USB ID pins. The maximum capacitance on these lines is <0.60pF. USB Data and ID lines are connected at pins 2, 3, and 4. These inputs are referenced to an internal 5 volt TVS protection device. When the voltage on these lines exceed 5 volts, the TVS will conduct. Pin 1 is connected to the USB voltage bus (VBus). This device will conduct when the voltage on the bus exceeds 12 volts. Ground is provided at pin 5. Multiple micro vias connected to ground are recommended for best ESD performance. This will reduce parasitic inductance in the ground path and minimize the clamping voltage seen by the protected device. The package is designed for easy trace routing. The VBus pin is connected to the voltage layer of the PCB with a micro via as shown. Connection to ground is made at pin 5 using two micro vias. Connection to the ID pin is shown, however if the application does not utilize the ID function, pin 4 can be left not connected. The flow through layout combined with extremely low capacitance means the RClamp1644T will have minimal effect on high speed signal integrity. A typical USB 2.0 eye diagram test result with RClamp1644T is shown in Figure 3. DM 2 GND DP ID Figure 1 - Pin Configuration (Top View) Figure 2 - PCB Layout Example Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Figure 3 - USB Eye Pattern with RClamp1644T © 2012 Semtech Corporation 6 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Applications Information Stencil Opening Assembly Parameter Solder Stencil Design Aper ture shape Solder Stencil Thickness Solder Paste Type .20 R ecommendation Land Pad ( Follow drawing ) Laser cut, Electro-polished .53 Rectangular 0.100 mm (0.004") .80 .15 Type 4 size sphere or smaller .43 Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish Per JEDEC J-STD-020 .20 N on-Solder mask defined 1.50 OSP OR N iAu All Dimensions are in mm. Land Pad. Stencil opening Component Figure 4 - Recommended Mounting Pattern © 2012 Semtech Corporation 7 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SLP1508N5T D A B DIMENSIONS MILLIMETERS MIN NOM MAX DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C C A2 A1 A A1 A2 b b1 D E e e1 L L1 N aaa bbb - 0.39 0.40 0.00 0.02 0.05 (0.13) 0.10 0.15 0.20 0.125 0.175 0.225 1.45 1.50 1.55 0.75 0.80 0.85 0.35 BSC 0.48 BSC 0.20 0.25 0.30 0.30 0.35 0.40 5 0.08 0.10 e1 e bbb b1xN C A B 0.240 1 2 LxN E/2 L1 N bxN bbb D/2 C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1508N5T DIMENSIONS 0.050 Y1 Z (C) G Y X 0.240 DIM C G P P1 X Y Y1 Z MILLIMETERS (0.600) 0.200 0.35 0.48 0.175 0.350 0.450 1.000 P P1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2012 Semtech Corporation 8 www.semtech.com RClamp1644T PRELIMINARY PROTECTION PRODUCTS Marking Codes PIN 1 INDICATOR Ordering Information 1644T YW Part Number Qty per Reel Reel Size RClamp1644T.TN T 10,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. YW = Date Code Carrier Tape Specification Device Orientation in Tape YW 1644T YW 1644T YW 1644T YW 1644T YW 1644T Pin 1 Location (Towards Sprocket Holes) User Direction of feed Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2012 Semtech Corporation 9 www.semtech.com