RClamp1255P

RClamp1255P
Low Capacitance RClamp®
Surge Protection for uUSB Interfaces
PROTECTION PRODUCTS - RailClamp®
Description
PRELIMINARY
Features
 ESD and surge protection for USB Voltage Bus to
RailClamp® TVS arrays are low capacitance ESD
protection devices designed to protect high speed data
interfaces. The RClamp®1255P provides dedicated
surge and ESD protection for uUSB ports. It is designed to replace multiple discrete components in
portable applications. This device features low capacitance TVS diodes for protection of the USB data (DP,
DM) and USB ID pins operating up to +/- 4 volts.
These diodes provide ESD protection to ±10kV contact
discharge per IEC 61000-4-2. Loading capacitance on
these lines is <0.50pF. An integrated 12 volt TVS
diode is used for protection of the USB voltage bus.
The VBus TVS is designed with a high surge current
capability of 100A (tp=8/20us) and low clamping
voltage.
The RClamp1255P is in a 6-pin SLP2018P6 package. It
measures 2.0 x 1.8mm with a nominal height of 0.57mm.
This highly integrated device requires less board space
than existing solutions.
The combination of small size, low capacitance, and high
level of surge and ESD protection makes this device a
flexible solution for protection of USB interfaces in mobile phones, laptops, and other portable electonics.







IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact)
IEC 61000-4-5 (Lightning) 100A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
ESD protection for USB data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±10kV (contact)
Protects USB DP, DM, and ID Pins operating up to
+/- 4V
Protects USB VBus operating up to 12V
Low capacitance (<0.50pF) on DP, DM, and ID Pins
Low clamping voltage
Low dynamic resistance on DP, DM, and ID Pins
Solid-state silicon-avalanche technology
Mechanical Characteristics







SLP2018P6 6L package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 2.0 x 1.8 x 0.57 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking Code + Date Code
Packaging : Tape and Reel
Applications
 USB 2.0
 USB OTG
 uUSB
Circuit Diagram
Pin Configuration (Top View)
VBus
1
2
3
4
4V
12V
D+
5, 6,
Tabs
DID
Revision 06/18/2013
1
GND
GND
GND
GND
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
40
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
3
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
±15
±10
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Peak Pulse Power (tp = 8/20μs)
Pp k
2500
Watts
Peak Pulse Current (tp = 8/20μs)
IP P
100
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
±30
±30
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
D P, D M , U S B I D T V S
Operating Temperature
Storage Temperature
VBus T VS
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
V B u s T V S ( P i n 1)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 to GN D
Reverse Breakdown Voltage
V BR
It = 1mA,
Pin 1 to GN D
Reverse Leakage Current
IR
VRWM = 12V
Pin 1 to GN D
Forward Voltage
VF
If = 10mA
GN D to Pin 1
Clamp ing Voltage
VC
Clamp ing Voltage
Junction Cap acitance
© 2013 Semtech Corporation
Maximum
Units
12
V
16.5
V
0.300
μA
0.7
1.0
V
IPP = 30A, tp = 8/20μs
Pin 1 to Ground
15.5
18
V
VC
IPP = 100A, tp = 8/20μs
Pin 1 to Ground
18.5
25
V
Cj
VR = 0V, f = 1MHz
Pin 1 to GN D
1950
2500
pF
2
Minimum
13.5
0.6
Typical
14.5
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Electrical Characteristics (T=25oC)
D M , D P, U S B I D ( P i n s 2 , 3 , 4 )
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
4
V
5.7
6.3
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA,
Pin 2, 3, 4 to GN D
Reverse Leakage Current
IR
VRWM = 2.0V,
Pin 2, 3, 4 to GN D
<0.005
0.020
μA
Reverse Leakage Current
IR
VRWM = 4.0V,
Pin 2, 3, 4 to GN D
0.005
0.100
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
Pin 2, 3, 4 to GN D
10.5
V
Clamping Voltage
VC
IPP = 3A, tp = 8/20μs
Pin 2, 3, 4 to GN D
12.5
V
Dynamic Resistance1
RDyn
Ipp = 4A to Ipp = 16A
0.70
Ohms
Ipp = -4A to Ipp = -16A
0.70
Ohms
VR = 0V, f = 1MHz,
Pin 2, 3, 4 to GN D
0.35
Junction Capacitance
Cj
Pin 2, 3, 4 to GN D
4.5
0.50
pF
Notes
1)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to
t2 = 90ns
© 2013 Semtech Corporation
3
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
VBus Pin (Pin 1)
Non-Repetitive Peak Pulse Power vs. Pulse Time
D+, D-. ID Pins (Pins 2, 3, 4)
100
1000
TA = 25OC
Peak Pulse Power - PPP (W)
Peak Pulse Power - P PP (kW)
TA = 25OC
10
1
100
10
DR040412-40
0.1
1
0.1
1
10
100
1000
0.1
1
Pulse Duration - tp (µs)
Clamping Voltage vs. Peak Pulse Current
VBus Pin (Pin 1)
1000
3.5
Forward Clamping Voltage - VC (V)
18
Clamping Voltage - VC (V)
100
Forward Voltage vs. Peak Pulse Current
VBus Pin (Pin 1)
20
16
14
12
10
8
6
Waveform
Parameters:
tr = 8µs
td = 20µs
4
2
0
3
2.5
2
1.5
1
Waveform
Parameters:
tr = 8µs
td = 20µs
0.5
0
0
20
40
60
80
100
0
120
20
40
Clamping Voltage vs. Peak Pulse Current
D+, D-. ID Pins (Pins 2, 3, 4)
9
0.90
8
0.80
Capacitance - Cj (pF)
1.00
7
6
5
4
3
Waveform
Parameters:
tr = 8µs
td = 20µs
1
80
100
120
Capacitance vs. Reverse Voltage
D+, D-. ID Pins (Pins 2, 3, 4)
10
2
60
Peak Pulse Current - Ipp (A)
Peak Pulse Current - Ipp (A)
Clamping Voltage - VC (V)
10
Pulse Duration - tp (µs)
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
f = 1MHz
0.00
0
0.5
1
1.5
2
2.5
3
3.5
0
Peak Pulse Current - Ipp (A)
© 2013 Semtech Corporation
1
2
3
4
5
Reverse Voltage - VR (V)
4
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
ESD Clamping (+8kV Contact per IEC 61000-4-2)
D+, D-. ID Pins (Pins 2, 3, 4)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
D+, D-. ID Pins (Pins 2, 3, 4)
200
50
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane
0
100
Voltage (V)
Clamping Voltage (V)
150
50
0
-50
-100
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 40dB attenuator. ESD gun return path connected to ESD ground plane
-150
AR_2‐G+8kV
AR_2‐G‐8kV
-50
-200
-10
0
10
20
30
40
Time (ns)
50
60
70
80
-10
ESD Clamping (+8kV Contact per IEC 61000-4-2)
VBus Pin (Pin 1)
10
20
30
40
Time (ns)
60
70
80
10
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
35
5
0
Clamping Voltage (V)
30
25
20
15
10
-5
-10
-15
-20
-25
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
-30
5
-35
0
-40
-10
0
10
20
30
40
50
60
70
-10
80
0
10
20
30
40
50
60
70
80
Time (ns)
Time (ns)
ESD Clamping +30kV Contact per IEC 61000-4-2)
VBus Pin (Pin 1)
ESD Clamping -30kV Contact per IEC 61000-4-2)
VBus Pin (Pin 1)
60
10
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
0
Clamping Voltage (V)
50
Clamping Voltage (V)
50
ESD Clamping (-8kV Contact per IEC 61000-4-2)
VBus Pin (Pin 1)
40
Clamping Voltage (V)
0
40
30
20
10
0
-10
-20
-30
-40
-50
Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane
-60
-10
-70
-10
0
10
20
30
40
50
60
70
80
-10
Time (ns)
© 2013 Semtech Corporation
0
10
20
30
40
50
60
70
80
Time (ns)
5
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
TLP Characteristic (Positive Pulse)
D+, D-. ID Pins (Pins 2, 3, 4)
TLP Characteristic (Negative Pulse)
D+, D-. ID Pins (Pins 2, 3, 4)
25
0
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
-5
TLP Current (A)
TLP Current (A)
20
15
10
5
-10
-15
Transmission Line Pulse Test (TLP)
Settings:
tp = 100ns, tr = 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
-20
0
-25
0
5
10
15
20
25
30
-30
-25
-20
TLP Voltage (V)
Analog Crosstakk
D+, D-. ID Pins (Pins 2, 3, 4)
CH1 S21
LOG
-15
-10
-5
0
TLP Voltage (V)
Typical Insertion Loss S21
D+, D-. ID Pins (Pins 2, 3, 4)
20dB / REF 0 dB
CH1 S21
LOG
6 dB / REF 0 dB
1: - .05230 dB
800 MHz
0 dB
5
0 dB
-20 dB
12
-12 dB
4: - .09570 dB
2.5 GHz
-18 dB
-80 dB
-24 dB
-100 dB
-30 dB
-120 dB
-36 dB
-140 dB
-42 dB
-48 dB
-160 dB
STOP 3000. 000000 MHz
START . 030 MHz
2: - .05140 dB
900 MHz
4
3: - .01000 dB
1.8 GHz
-6 dB
-40 dB
-60 dB
3
5: - .01300 dB
2.7 GHz
1
MHz
START . 030 MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
Non-Repetitive Peak Pulse Power Derating Curve
120
% of Rated Power or IPP
100
80
60
40
20
DR040512:25:125:150
0
0
25
50
75
100
125
150
O
Ambient Temperature - TA ( C)
© 2013 Semtech Corporation
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection and Layout Options for Protecting
One USB Port
The RClamp1255P is optimized for protection of USB
ports. Low capacitance protection is provided for the
USB data (DM, DP) and USB ID pins. The maximum
capacitance on these lines is <0.5pF for maximum
signal integrity. USB Data and ID lines are connected
at pins 2, 3, and 4. These inputs are referenced to
an internal 4 volt TVS protection device. When the
voltage on these lines exceed 4 volts, the TVS will
conduct. Pin 1 is connected to the USB voltage bus
(VBus). This device will conduct when the voltage on
the bus exceeds 12 volts. Ground is provided at pins
5, 6, and the center tabs. Multiple micro vias
connected to ground are recommended for best ESD
performance. This will reduce parasitic inductance in
the ground path and minimize the clamping voltage
seen by the protected device.
VBus
GND
GND
GND
GND
D+
DID
Figure 1 - Pin Configuration (Top View)
1
12V
2
3
4
4V
5, 6,
Tabs
Figure 2 - Schematic
© 2013 Semtech Corporation
7
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Stencil Opening
Land Pad ( Follow drawing )
.45
Assembly Parameter
Solder Stencil Design
R ecommendation
Laser cut, Electro-polished
Aper ture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Rectangular
0.100 mm (0.004")
Type 3 size sphere or smaller
2.00
.84
Per JEDEC J-STD-020
N on-Solder mask defined
OSP OR N iAu
.70
.25
1.80
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
Land Pattern - SLP2018P6
DIMENSIONS
1.40
0.70
H
DIM
C
G
H
K
P
P1
X
Y
Z
P1
P1/2
(C) K K/2
G
MILLIMETERS
(1.95)
1.35
0.45
0.84
0.40
0.80
0.20
0.60
2.55
Z
Y
X
P/2
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2013 Semtech Corporation
8
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SLP2018P6
D
A
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
DIM
A
A1
A2
b
D
E
D1
E1
e
e1
L
N
aaa
bbb
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A1
A2
0.50 0.575 0.65
0.00 0.03 0.05
(0.127)
0.15 0.20 0.25
1.70 1.80 1.90
1.90 2.00 2.10
0.30 0.45 0.55
0.69 0.84 0.94
0.40 BSC
0.80 BSC
0.25 0.30 0.35
6
0.08
0.10
C
D/2
e
D1
e/2
R0.20
LxN
E/2
E1
E1/2
bxN
e1/2
bbb
C A B
e1
0.70
1.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Marking
12P
YW
PIN 1
INDICATOR
(LASER MARK)
YW = Date Code
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RClamp1255P
PRELIMINARY
PROTECTION PRODUCTS
Ordering Information
Part Number
Qty per
Reel
R eel Size
RClamp 1255P.TGT
10,000
13 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
Carrier Tape Specification
YW
YW
12P
12P
YW
12P
Pin 1 Location
(Towards Sprocket Holes)
Device Orientation in Tape
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2013 Semtech Corporation
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