RClamp0531Z Ultra Small RClamp® 1-Line ESD protection PRELIMINARY PROTECTION PRODUCTS - Z-PakTM Features Description High ESD withstand Voltage: +/-12kV (Contact) and RailClamp TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. They are designed to replace 0201 size multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The RClamp®0531Z has a typical capacitance of only 0.30pF. This allows it to be used on circuits operating in excess of 5GHz without signal attenuation. The RClamp0531Z is in a 2-pin SLP0603P2X3B package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. The leads are finished with lead-free NiAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and RF modules. ® +/- 15kV (Air) per IEC 61000-4-2 Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 1 pack age Ultra-small 020 0201 package Protects one high-speed data line Low reverse current: <5nA typical (VR=5V) Working voltage: +/- 5V Low capacitance: 0.30pF typical Dynamic resistance: 0.67 Ohm (Typ) Solid-state silicon-avalanche technology Mechanical Characteristics SLP0603P2X3B package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking : Marking code + dot matrix date code Packaging : Tape and Reel Applications RF Antenna and Modules FM Antenna USB 2.0 MHL GPS Circuit Diagram Dimensions 0.62 1 0.32 0.22 0.400 BSC 2 0.250 Nominal Dimensions (mm) Revision 1/7/2014 SLP0603P2X3B (Bottom View) 1 www.semtech.com RClamp0531Z PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 60 Watts Peak Pulse Current (tp = 8/20μs) IP P 3 A ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact)1 VESD +/- 15 +/- 12 kV TJ -55 to +125 °C TSTG -55 to +150 °C Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to 2 or 2 to 1 Reverse Breakdown Voltage V BR It = 1mA Pin 1 to 2 or 2 to 1 Reverse Leakage Current IR VRWM = 5V, T=25°C Pin 1 to 2 or 2 to 1 Clamp ing Voltage VC Clamp ing Voltage Maximum Units 5 V 9 11 V 5 20 nA IPP = 1A, tp = 8/20μs Pin 1 to 2 or 2 to 1 15 V VC IPP = 3A, tp = 8/20μs Pin 1 to 2 or 2 to 1 20 V ESD Clamp ing Voltage2 VC IPP = 4A, tlp = 0.2/100ns 13 V ESD Clamp ing Voltage2 VC IPP = 16A, tlp = 0.2/100ns 21 V Dynamic Resistance2, 3 RD tp = 100ns 0.67 Ohms Junction Cap acitance Cj VR = 0V to 5V, f = 1MHz 0.30 Junction Cap acitance4 Cj ΔCjVR Change in Cap acitance Over VR4 Minimum 7 Typical 0.40 pF VR = 0V to 5V, f = 1GHz 0.40 pF VR = 0V to 5V, f = 1MHz 0.040 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A 4)Guaranteed by design. Not production tested © 2013 Semtech Corporation 2 www.semtech.com RClamp0531Z PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Clamping Voltage vs. Peak Pulse Current Junction Capacitance vs. Reverse Voltage 14 Capacitance - Cj (pF) Clamping Voltage - VC (V) 0.50 13 13 12 12 Waveform Parameters: tr = 8µs td = 20µs 11 0.40 0.30 0.20 0.10 f = 1MHz 0.00 11 0 0.5 1 1.5 2 2.5 3 0 3.5 1 2 Typical Insertion Loss (S21) 4 5 6 25 30 TLP Characteristic 0 25 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -0.1 -0.2 20 TLP Current (A) -0.3 S21 (dB) 3 Reverse Voltage - VR (V) Peak Pulse Current - Ipp (A) -0.4 -0.5 -0.6 -0.7 -0.8 15 10 5 -0.9 -1 0 0.1 1 10 100 1000 10000 0 5 10 Frequency (MHz) ESD Clamping (+8kV Contact per IEC 61000-4-2) 20 ESD Clamping (-8kV Contact per IEC 61000-4-2) 110 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 90 -10 -30 Voltage (V) 70 Voltage (V) 15 TLP Voltage (V) 50 -50 30 -70 10 -90 -10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -110 -10 0 10 20 30 40 50 60 70 80 -10 Time (ns) © 2013 Semtech Corporation 0 10 20 30 40 50 60 70 80 Time (ns) 3 www.semtech.com RClamp0531Z PRELIMINARY PROTECTION PRODUCTS Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech’s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Assembly Parameter Laser cut, Electro-polished Aper ture shape Rectangular with rounded corners Solder Paste Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish © 2013 Semtech Corporation Land Pad ( Follow drawing ) 0.370 0.300 0.088 R ecommendation Solder Stencil Design Solder Stencil Thickness Stencil Opening All Dimensions are in mm. Land Pad. 0.100 mm (0.004") Stencil opening Component Recommended Mounting Pattern Type 4 size sphere or smaller Per JEDEC J-STD-020 N on-Solder mask defined OSP OR N iAu 4 www.semtech.com RClamp0531Z PRELIMINARY PROTECTION PRODUCTS Outline OutlineDrawing Drawing- -SO-8 SLP0603P2X3B A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.250 0.265 0.000 0.010 0.050 0.300 0.320 0.340 0.605 0.620 0.675 0.285 0.320 0.355 0.40 BSC 0.18 0.22 0.250 2 0.08 0.10 A SEATING PLANE aaa C C A1 e e/2 bxN bbb C A B 2xL BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). Land Pattern - SLP0603P2X3B (C) Z G DIM C G X Y Z DIMENSIONS MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2013 Semtech Corporation 5 www.semtech.com RClamp0531Z PRELIMINARY PROTECTION PRODUCTS Marking Codes Ordering Information R Part Number Qty per Reel Reel Size RClamp 0531Z.TN T 10,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Notes: 1)Dots represent date code matrix and Pin 1 location Carrier Tape Specification Bo Ko A0 0.40 +/-0.05 mm Ao B0 0.71 +/-0.05 mm K0 0.29 +/-0.05 mm R R R R R Note: All dimensions in mm unless otherwise specified PIN 1 Location (Towards Sprocket Holes) Device Orientation in Tape © 2013 Semtech Corporation 6 www.semtech.com RClamp0531Z PRELIMINARY PROTECTION PRODUCTS Contact Information for Semtech International AG Taiw an Branch Korea Branch Shanghai Office Japan (Osaka) Office Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Japan (Tokyo) Office Tel: 81-3-5719-7560 Fax: 81-3-5719-7561 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 Tel: 81-6-6347-6570 Fax: 81-6-6347-6571 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. © 2013 Semtech Corporation 7 www.semtech.com