PEMIxQFN; PEMI2STD family Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Rev. 2 — 3 November 2011 Product data sheet 1. Product profile 1.1 General description The devices are a family of RC low pass filters. They are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. The devices incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV. The devices are fabricated using monolithic silicon technology in lead-free plastic packages. Table 1. Product overview Type number Package Number of channels Package pitch (mm) Package configuration PEMI1QFN SOT883 1 - 3-pin MicroPak (QFN compatible) PEMI2QFN SOT886 2 0.5 6-pin MicroPak (QFN compatible) PEMI2STD SOT665 1 - 5-pin microlead PEMI4QFN SOT1157-1 4 0.4 8-pin extremely thin leadless PEMI6QFN SOT1158-1 6 0.4 12-pin extremely thin leadless PEMI8QFN SOT1159-1 8 0.4 16-pin extremely thin leadless 1.2 Features and benefits Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) Integrated 1-, 2-, 4-, 6- and 8-channel -type RC filter network ESD protection up to 25 kV contact discharge according to IEC 61000-4-2, far exceeding level 4 1.3 Applications General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: Cellular phone and Personal Communication Systems (PCS) mobile handsets Cordless telephones Wireless data (WAN/LAN) systems PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Typ Unit Rs(ch) channel series resistance 20 PEMIxxxx/Hx 45 PEMIxxxx/Lx 65 PEMIxxxx/Rx 100 PEMIxxxx/Wx 200 PEMIxxxx/xE 15 pF PEMIxxxx/xG 19 pF PEMIxxxx/xK 23 pF PEMIxxxx/xM 28 pF PEMIxxxx/xP 32 pF PEMIxxxx/xR 36 pF PEMIxxxx/xT 40 pF PEMIxxxx/Cx Cch channel capacitance for the total channel; f = 100 kHz; Vbias(DC) = 0 V 2. Pinning information Table 3. Pin Pinning Description Simplified outline Graphic symbol PEMI1QFN (SOT883) 1 and 2 filter channel 3 ground (GND) Rs(ch) 1 3 1 2 2 Cch 2 Transparent top view Cch 2 3 018aaa042 PEMI2QFN (SOT886) 1 and 6 filter channel 1 2 and 5 ground (GND) 3 and 4 6 5 Rs(ch) 4 1,3 4,6 Cch 2 filter channel 2 Cch 2 2,5 1 PEMIXQFN_PEMI2STD_FAM Product data sheet 2 3 Transparent top view All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 018aaa044 © NXP B.V. 2011. All rights reserved. 2 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Table 3. Pin Pinning …continued Description Simplified outline Graphic symbol PEMI2STD (SOT665) 1 and 5 filter channel 1 2 ground (GND) 3 and 4 5 Rs(ch) 4 1,3 4,5 Cch 2 filter channel 2 Cch 2 2 1 2 3 018aaa043 PEMI4QFN (SOT1157-1) 1 and 8 filter channel 1 2 and 7 filter channel 2 3 and 6 filter channel 3 4 and 5 filter channel 4 ground pad ground (GND) 8 Rs(ch) 5 1 to 4 5 to 8 Cch 2 Cch 2 1 4 Transparent top view GND 018aaa071 PEMI6QFN (SOT1158-1) 1 and 12 filter channel 1 2 and 11 filter channel 2 3 and 10 filter channel 3 4 and 9 filter channel 4 5 and 8 filter channel 5 6 and 7 filter channel 6 ground pad ground (GND) 12 Rs(ch) 7 1 to 6 7 to 12 Cch 2 1 Cch 2 6 Transparent top view GND 018aaa072 PEMI8QFN (SOT1159-1) PEMIXQFN_PEMI2STD_FAM Product data sheet 1 and 16 filter channel 1 2 and 15 filter channel 2 3 and 14 filter channel 3 4 and 13 filter channel 4 5 and 12 filter channel 5 6 and 11 filter channel 6 7 and 10 filter channel 7 8 and 9 filter channel 8 ground pad ground (GND) 16 Rs(ch) 9 1 to 8 9 to 16 Cch 2 Cch 2 1 8 Transparent top view All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 GND 018aaa073 © NXP B.V. 2011. All rights reserved. 3 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 3. Ordering information Table 4. Ordering information Type number Package Name Description Version PEMI1QFN SC-101 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm SOT883 PEMI2QFN XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 1.45 0.5 mm SOT886 PEMI2STD - plastic surface-mounted package; 5 leads SOT665 PEMI4QFN HXSON8 plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.2 1.7 0.5 mm SOT1157-1 PEMI6QFN HXSON12 plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.2 2.5 0.5 mm SOT1158-1 PEMI8QFN HXSON16 plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; body 1.2 3.3 0.5 mm SOT1159-1 4. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). PEMIXQFN_PEMI2STD_FAM Product data sheet Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.5 +5.6 V VESD electrostatic discharge voltage contact discharge - 15 kV air discharge - 15 kV PEMIxxxx/xM; PEMIxxxx/xP contact discharge - 20 kV air discharge - 20 kV PEMIxxxx/xR; PEMIxxxx/xT contact discharge - 25 kV air discharge - 25 kV IEC 61000-4-2, level 4 all pins to ground Pch channel power dissipation continuous power; Tamb = 85 C - 60 mW Ptot total power dissipation - 120 mW Tstg storage temperature 55 +150 C Tamb ambient temperature 40 +85 C continuous power; Tamb = 85 C All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 4 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 5. Characteristics Table 6. Channel characteristics Tamb = 25 C; unless otherwise specified. Symbol Parameter Rs(ch) Conditions Min Typ Max Unit PEMIxxxx/Cx 18 20 22 PEMIxxxx/Hx 40 45 50 PEMIxxxx/Lx 58 65 72 PEMIxxxx/Rx 90 100 110 180 200 220 - 15 - pF channel series resistance PEMIxxxx/Wx Cch channel capacitance PEMIxxxx/xE PEMIxxxx/xG PEMIxxxx/xK PEMIxxxx/xM PEMIxxxx/xP PEMIxxxx/xR PEMIxxxx/xT PEMIXQFN_PEMI2STD_FAM Product data sheet for the total channel; f = 100 kHz Vbias(DC) = 0 V Vbias(DC) = 2.5 V - 8.5 - pF Vbias(DC) = 0 V - 19 - pF Vbias(DC) = 2.5 V - 11 - pF Vbias(DC) = 0 V - 23 - pF Vbias(DC) = 2.5 V - 13.5 - pF Vbias(DC) = 0 V - 28 - pF Vbias(DC) = 2.5 V - 16 - pF Vbias(DC) = 0 V - 32 - pF Vbias(DC) = 2.5 V - 18.5 - pF Vbias(DC) = 0 V - 36 - pF Vbias(DC) = 2.5 V - 21 - pF Vbias(DC) = 0 V - 40 - pF Vbias(DC) = 2.5 V - 23 - pF VBR breakdown voltage positive clamp; II = 1 mA 5.8 - 9 V VF forward voltage negative clamp; IF = 1 mA 1.5 - 0.4 V ILR reverse leakage current per channel; VI = 3.5 V - - 0.1 A All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 5 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Table 7. Frequency characteristics Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 . Symbol Parameter Conditions il insertion loss Cch = 15 pF PEMIxxxx/CE PEMIxxxx/HE PEMIxxxx/LE PEMIxxxx/RE PEMIxxxx/WE il insertion loss PEMIxxxx/CG PEMIxxxx/HG PEMIxxxx/LG PEMIxxxx/RG PEMIxxxx/WG PEMIXQFN_PEMI2STD_FAM Product data sheet Min Typ Max Unit 800 MHz < f < 3 GHz 7 - - dB f = 5 GHz - 30 - dB 800 MHz < f < 3 GHz 9 - - dB f = 4 GHz - 31 - dB 800 MHz < f < 3 GHz 11 - - dB f = 3.5 GHz - 32 - dB 800 MHz < f < 3 GHz 13 - - dB f = 3 GHz - 33 - dB 800 MHz < f < 3 GHz 18 - - dB f = 2.2 GHz - 34 - dB 800 MHz < f < 3 GHz 9 - - dB f = 4 GHz - 32 - dB 800 MHz < f < 3 GHz 11 - - dB f = 3.2 GHz - 33 - dB Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 Rs(ch) = 100 Rs(ch) = 200 Cch = 19 pF Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 800 MHz < f < 3 GHz 13 - - dB f = 2.8 GHz - 33.5 - dB 800 MHz < f < 3 GHz 15 - - dB f = 2.5 GHz - 34 - dB 800 MHz < f < 3 GHz 21 - - dB f = 1.9 GHz - 35.5 - dB Rs(ch) = 100 Rs(ch) = 200 All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 6 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Table 7. Frequency characteristics …continued Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 . Symbol Parameter Conditions il insertion loss Cch = 23 pF PEMIxxxx/CK PEMIxxxx/HK PEMIxxxx/LK PEMIxxxx/RK PEMIxxxx/WK il insertion loss PEMIxxxx/CM PEMIxxxx/HM PEMIxxxx/LM PEMIxxxx/RM PEMIxxxx/WM PEMIXQFN_PEMI2STD_FAM Product data sheet Min Typ Max Unit 800 MHz < f < 3 GHz 10 - - dB f = 3.6 GHz - 33 - dB 800 MHz < f < 3 GHz 13 - - dB f = 2.8 GHz - 34 - dB 800 MHz < f < 3 GHz 15 - - dB f = 2.5 GHz - 35 - dB 800 MHz < f < 3 GHz 18 - - dB f = 2.1 GHz - 36 - dB 800 MHz < f < 3 GHz 24 - - dB f = 1.6 GHz - 37 - dB 800 MHz < f < 3 GHz 12 - - dB f = 3.2 GHz - 34 - dB 800 MHz < f < 3 GHz 15 - - dB f = 2.5 GHz - 35 - dB 800 MHz < f < 3 GHz 17 - - dB f = 2.1 GHz - 36 - dB 800 MHz < f < 3 GHz 21 - - dB f = 1.8 GHz - 37 - dB 800 MHz < f < 3 GHz 27 - - dB f = 1.4 GHz - 38 - dB Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 Rs(ch) = 100 Rs(ch) = 200 Cch = 28 pF Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 Rs(ch) = 100 Rs(ch) = 200 All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 7 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Table 7. Frequency characteristics …continued Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 . Symbol Parameter Conditions il insertion loss Cch = 32 pF PEMIxxxx/CP PEMIxxxx/HP PEMIxxxx/LP PEMIxxxx/RP PEMIxxxx/WP il insertion loss PEMIxxxx/CR PEMIxxxx/HR PEMIxxxx/LR PEMIxxxx/RR PEMIxxxx/WR PEMIXQFN_PEMI2STD_FAM Product data sheet Min Typ Max Unit 800 MHz < f < 3 GHz 13 - - dB f = 2.9 GHz - 36 - dB 800 MHz < f < 3 GHz 17 - - dB f = 2.2 GHz - 36 - dB 800 MHz < f < 3 GHz 19 - - dB f = 1.9 GHz - 37 - dB 800 MHz < f < 3 GHz 23 - - dB f = 1.6 GHz - 38 - dB 800 MHz < f < 3 GHz 30 - - dB f = 1.2 GHz - 39 - dB 800 MHz < f < 3 GHz 14 - - dB f = 2.6 GHz - 36 - dB 800 MHz < f < 3 GHz 18 - - dB f = 2.0 GHz - 37 - dB 800 MHz < f < 3 GHz 21 - - dB f = 1.8 GHz - 38 - dB 800 MHz < f < 3 GHz 25 - - dB f = 1.6 GHz - 39 - dB 800 MHz < f < 3 GHz 32 - - dB f = 1.2 GHz - 40 - dB Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 Rs(ch) = 100 Rs(ch) = 200 Cch = 36 pF Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 Rs(ch) = 100 Rs(ch) = 200 All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 8 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Table 7. Frequency characteristics …continued Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 . Symbol Parameter Conditions il insertion loss Cch = 40 pF PEMIxxxx/CT PEMIxxxx/HT PEMIxxxx/LT PEMIxxxx/RT PEMIxxxx/WT Min Typ Max Unit 800 MHz < f < 3 GHz 16 - - dB f = 2.5 GHz - 36 - dB 800 MHz < f < 3 GHz 20 - - dB f = 1.9 GHz - 38 - dB 800 MHz < f < 3 GHz 23 - - dB f = 1.6 GHz - 39 - dB 800 MHz < f < 3 GHz 27 - - dB f = 1.4 GHz - 40 - dB 800 MHz < f < 3 GHz 32 - - dB f = 1.0 GHz - 41 - dB Rs(ch) = 20 Rs(ch) = 45 Rs(ch) = 65 Rs(ch) = 100 Rs(ch) = 200 6. Application information 6.1 Use cases The selection of one of the filter devices has to be performed in dependence of the maximum clock frequency, the driver strength, the capacitive load of the sink and the maximum applicable rise and fall times. 6.2 LCD interfaces, medium-speed interfaces For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock speeds between 10 MHz and 25 MHz or more, the devices can be used in dependence of the sink load, the clock speed, the driver strength and the rise and fall time requirements. The minimum EMI filter requirements may be an important factor, too. 6.3 Keypad, low-speed interfaces Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and low-speed control signals, the devices offer a very robust ESD protection and strong suppression of unwanted frequencies (EMI filtering). Due to their small size the devices can easily be spread on a Printed-Circuit Board (PCB) in order to move the ESD and EMI protection close to the part of the design which shall be protected. PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 9 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 6.4 Insertion loss The devices are designed as EMI/RFI filters for multichannel interfaces. All measurements were performed in a typical 50 NetWork Analyzer (NWA) setup as shown in Figure 1. The insertion loss was measured with a test Printed-Circuit Board (PCB) utilizing laser-drilled micro-via holes which connect the PCB ground plane to the devices ground pins. DUT IN OUT 50 Ω 50 Ω Vgen 018aaa074 Fig 1. Frequency response setup 018aaa161 0 S21 (dB) S21 (dB) (1) (2) –10 (1) (2) –10 (3) –20 018aaa162 0 (3) (4) (4) (5) (5) –20 (6) (6) (7) –30 (7) –30 –40 –40 –50 1 10 102 103 104 –50 1 10 f (MHz) Rs(ch) = 20 (2) PEMIxxxx/CG (2) PEMIxxxx/HG (3) PEMIxxxx/CK (3) PEMIxxxx/HK (4) PEMIxxxx/CM (4) PEMIxxxx/HM (5) PEMIxxxx/CP (5) PEMIxxxx/HP (6) PEMIxxxx/CR (6) PEMIxxxx/HR (7) PEMIxxxx/CT (7) PEMIxxxx/HT PEMIxxxx/Cx: Frequency response curves Product data sheet 104 Rs(ch) = 45 (1) PEMIxxxx/HE PEMIXQFN_PEMI2STD_FAM 103 f (MHz) (1) PEMIxxxx/CE Fig 2. 102 Fig 3. PEMIxxxx/Hx: Frequency response curves All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 10 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 018aaa163 0 S21 (dB) S21 (dB) (1) (2) –10 018aaa164 0 (1) (2) –10 (3) (3) (4) (4) (5) –20 (5) –20 (6) (6) (7) –30 (7) –30 –40 –40 –50 1 10 102 103 104 –50 1 10 f (MHz) Rs(ch) = 100 (1) PEMIxxxx/LE (1) PEMIxxxx/RE (2) PEMIxxxx/LG (2) PEMIxxxx/RG (3) PEMIxxxx/LK (3) PEMIxxxx/RK (4) PEMIxxxx/LM (4) PEMIxxxx/RM (5) PEMIxxxx/LP (5) PEMIxxxx/RP (6) PEMIxxxx/LR (6) PEMIxxxx/RR (7) PEMIxxxx/LT (7) PEMIxxxx/RT PEMIxxxx/Lx: Frequency response curves PEMIXQFN_PEMI2STD_FAM Product data sheet 103 104 f (MHz) Rs(ch) = 65 Fig 4. 102 Fig 5. PEMIxxxx/Rx: Frequency response curves All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 11 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 018aaa165 0 S21 (dB) –10 (1) (2) (3) –20 (4) (5) (6) –30 (7) –40 –50 10 1 102 103 104 f (MHz) Rs(ch) = 200 (1) PEMIxxxx/WE (2) PEMIxxxx/WG (3) PEMIxxxx/WK (4) PEMIxxxx/WM (5) PEMIxxxx/WP (6) PEMIxxxx/WR (7) PEMIxxxx/WT Fig 6. PEMIxxxx/Wx: Frequency response curves All important values of the RF behavior such as relative 3dB frequency, insertion loss at 800 MHz and above and also the DC attenuation in an NWA environment can be derived from the insertion loss response curves depicted in Figure 2 to 6. Note: insertion loss at low frequencies (1 MHz) is nearly independent from the channel capacitance values available within the PEMI family. 6.4.1 Relative 3dB frequency (-filter structure) Table 8. Relative 3dB frequency (MHz) per RC combination; typical values Tamb = 25 C; unless otherwise specified. PEMIXQFN_PEMI2STD_FAM Product data sheet PEMIxxxx/ xE xG xK xM xP xR xT Cch (pF) 15 19 23 28 32 36 40 PEMIxxxx/ Rs(ch) Cx 20 397 MHz 317 MHz 264 MHz 218 MHz 194 MHz 170 MHz 153 MHz Hx 45 376 MHz 300 MHz 249 MHz 206 MHz 185 MHz 161 MHz 145 MHz Lx 65 361 MHz 288 MHz 239 MHz 197 MHz 176 MHz 155 MHz 139 MHz Rx 100 343 MHz 272 MHz 227 MHz 187 MHz 166 MHz 145 MHz 131 MHz Wx 200 311 MHz 247 MHz 205 MHz 169 MHz 150 MHz 132 MHz 119 MHz All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 12 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 6.4.2 Insertion loss (dB) at 800 MHz (-filter structure) Table 9. Insertion loss (dB) at 800 MHz per RC combination; typical values Tamb = 25 C; unless otherwise specified. PEMIxxxx/ Cch (pF) xE xG xK xM xP xR xT 15 19 23 28 32 36 40 PEMIxxxx/ Rs(ch) Cx 20 9 dB 11 dB 13 dB 15 dB 16 dB 18 dB 19 dB Hx 45 12 dB 14 dB 17 dB 19 dB 21 dB 23 dB 25 dB Lx 65 14 dB 17 dB 19 dB 22 dB 25 dB 27 dB 29 dB Rx 100 17 dB 20 dB 23 dB 26 dB 29 dB 32 dB 35 dB Wx 200 22 dB 26 dB 29 dB 34 dB 36 dB 39 dB 41 dB 6.4.3 Insertion loss (dB) at frequencies lower than 1 MHz (-filter structure) Table 10. Insertion loss (dB) at 1 MHz per RC combination; typical values Tamb = 25 C; unless otherwise specified. PEMIxxxx/ xE xG xK xM xP xR xT Cch (pF) 15 19 23 28 32 36 40 PEMIxxxx/ Rs(ch) Cx 20 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB Hx 45 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB Lx 65 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB Rx 100 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB Wx 200 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 7. Marking Table 11. Marking codes Type number Marking code Type number Marking code Type number Marking code Type number Marking code PEMI1QFN/CE CE PEMI2QFN/LP LP PEMI4QFN/CE CE PEMI6QFN/LP LP PEMI1QFN/CG CG PEMI2QFN/LR LR PEMI4QFN/CG CG PEMI6QFN/LR LR PEMI1QFN/CK CK PEMI2QFN/LT LT PEMI4QFN/CK CK PEMI6QFN/LT LT PEMI1QFN/CM CM PEMI2QFN/RE RE PEMI4QFN/CM CM PEMI6QFN/RE RE PEMI1QFN/CP CP PEMI2QFN/RG RG PEMI4QFN/CP CP PEMI6QFN/RG RG PEMI1QFN/CR CR PEMI2QFN/RK RK PEMI4QFN/CR CR PEMI6QFN/RK RK PEMI1QFN/CT CT PEMI2QFN/RM RM PEMI4QFN/CT CT PEMI6QFN/RM RM PEMI1QFN/HE HE PEMI2QFN/RP RP PEMI4QFN/HE HE PEMI6QFN/RP RP PEMI1QFN/HG HG PEMI2QFN/RR RR PEMI4QFN/HG HG PEMI6QFN/RR RR PEMI1QFN/HK HK PEMI2QFN/RT RT PEMI4QFN/HK HK PEMI6QFN/RT RT PEMI1QFN/HM HM PEMI2QFN/WE WE PEMI4QFN/HM HM PEMI6QFN/WE WE PEMI1QFN/HP HP PEMI2QFN/WG WG PEMI4QFN/HP HP PEMI6QFN/WG WG PEMI1QFN/HR HR PEMI2QFN/WK WK PEMI4QFN/HR HR PEMI6QFN/WK WK PEMI1QFN/HT HT PEMI2QFN/WM WM PEMI4QFN/HT HT PEMI6QFN/WM WM PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 13 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Table 11. Marking codes …continued Type number Marking code Type number Marking code Type number Marking code Type number Marking code PEMI1QFN/LE LE PEMI2QFN/WP WP PEMI4QFN/LE LE PEMI6QFN/WP WP PEMI1QFN/LG LG PEMI2QFN/WR WR PEMI4QFN/LG LG PEMI6QFN/WR WR PEMI1QFN/LK LK PEMI2QFN/WT WT PEMI4QFN/LK LK PEMI6QFN/WT WT PEMI1QFN/LM LM PEMI2STD/CE CE PEMI4QFN/LM LM PEMI8QFN/CE CE PEMI1QFN/LP LP PEMI2STD/CG CG PEMI4QFN/LP LP PEMI8QFN/CG CG PEMI1QFN/LR LR PEMI2STD/CK CK PEMI4QFN/LR LR PEMI8QFN/CK CK PEMI1QFN/LT LT PEMI2STD/CM CM PEMI4QFN/LT LT PEMI8QFN/CM CM PEMI1QFN/RE RE PEMI2STD/CP CP PEMI4QFN/RE RE PEMI8QFN/CP CP PEMI1QFN/RG RG PEMI2STD/CR CR PEMI4QFN/RG RG PEMI8QFN/CR CR PEMI1QFN/RK RK PEMI2STD/CT CT PEMI4QFN/RK RK PEMI8QFN/CT CT PEMI1QFN/RM RM PEMI2STD/HE HE PEMI4QFN/RM RM PEMI8QFN/HE HE PEMI1QFN/RP RP PEMI2STD/HG HG PEMI4QFN/RP RP PEMI8QFN/HG HG PEMI1QFN/RR RR PEMI2STD/HK HK PEMI4QFN/RR RR PEMI8QFN/HK HK PEMI1QFN/RT RT PEMI2STD/HM HM PEMI4QFN/RT RT PEMI8QFN/HM HM PEMI1QFN/WE WE PEMI2STD/HP HP PEMI4QFN/WE WE PEMI8QFN/HP HP PEMI1QFN/WG WG PEMI2STD/HR HR PEMI4QFN/WG WG PEMI8QFN/HR HR PEMI1QFN/WK WK PEMI2STD/HT HT PEMI4QFN/WK WK PEMI8QFN/HT HT PEMI1QFN/WM WM PEMI2STD/LE LE PEMI4QFN/WM WM PEMI8QFN/LE LE PEMI1QFN/WP WP PEMI2STD/LG LG PEMI4QFN/WP WP PEMI8QFN/LG LG PEMI1QFN/WR WR PEMI2STD/LK LK PEMI4QFN/WR WR PEMI8QFN/LK LK PEMI1QFN/WT WT PEMI2STD/LM LM PEMI4QFN/WT WT PEMI8QFN/LM LM PEMI2QFN/CE CE PEMI2STD/LP LP PEMI6QFN/CE CE PEMI8QFN/LP LP PEMI2QFN/CG CG PEMI2STD/LR LR PEMI6QFN/CG CG PEMI8QFN/LR LR PEMI2QFN/CK CK PEMI2STD/LT LT PEMI6QFN/CK CK PEMI8QFN/LT LT PEMI2QFN/CM CM PEMI2STD/RE RE PEMI6QFN/CM CM PEMI8QFN/RE RE PEMI2QFN/CP CP PEMI2STD/RG RG PEMI6QFN/CP CP PEMI8QFN/RG RG PEMI2QFN/CR CR PEMI2STD/RK RK PEMI6QFN/CR CR PEMI8QFN/RK RK PEMI2QFN/CT CT PEMI2STD/RM RM PEMI6QFN/CT CT PEMI8QFN/RM RM PEMI2QFN/HE HE PEMI2STD/RP RP PEMI6QFN/HE HE PEMI8QFN/RP RP PEMI2QFN/HG HG PEMI2STD/RR RR PEMI6QFN/HG HG PEMI8QFN/RR RR PEMI2QFN/HK HK PEMI2STD/RT RT PEMI6QFN/HK HK PEMI8QFN/RT RT PEMI2QFN/HM HM PEMI2STD/WE WE PEMI6QFN/HM HM PEMI8QFN/WE WE PEMI2QFN/HP HP PEMI2STD/WG WG PEMI6QFN/HP HP PEMI8QFN/WG WG PEMI2QFN/HR HR PEMI2STD/WK WK PEMI6QFN/HR HR PEMI8QFN/WK WK PEMI2QFN/HT HT PEMI2STD/WM WM PEMI6QFN/HT HT PEMI8QFN/WM WM PEMI2QFN/LE LE PEMI2STD/WP WP PEMI6QFN/LE LE PEMI8QFN/WP WP PEMI2QFN/LG LG PEMI2STD/WR WR PEMI6QFN/LG LG PEMI8QFN/WR WR PEMI2QFN/LK LK PEMI2STD/WT WT PEMI6QFN/LK LK PEMI8QFN/WT WT PEMI2QFN/LM LM - - PEMI6QFN/LM LM - - PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 14 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 8. Package outline Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm L SOT883 L1 2 b 3 e b1 1 e1 A A1 E D 0 0.5 1 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) A1 max. b b1 D E e e1 L L1 mm 0.50 0.46 0.03 0.20 0.12 0.55 0.47 0.62 0.55 1.02 0.95 0.35 0.65 0.30 0.22 0.30 0.22 Note 1. Including plating thickness OUTLINE VERSION REFERENCES IEC JEDEC JEITA SOT883 Fig 7. SC-101 EUROPEAN PROJECTION ISSUE DATE 03-02-05 03-04-03 Package outline PEMI1QFN (SOT883/SC-101) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 15 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× (2) L L1 e 6 5 4 e1 e1 6× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 1.5 1.4 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 MO-252 Package outline PEMI2QFN (SOT886/XSON6) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 16 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Plastic surface-mounted package; 5 leads SOT665 D E A X Y S S HE 5 4 A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC JEITA ISSUE DATE 04-11-08 06-03-16 SOT665 Fig 9. EUROPEAN PROJECTION Package outline PEMI2STD (SOT665) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 17 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.7 x 0.5 mm SOT1157-1 X A B D E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 4 C C A B C y y1 C L k E2 8 5 D2 0 1 scale Dimensions Unit(1) mm max nom min 2 mm A A1 0.5 0.05 A3 b 0.25 0.127 0.20 0.15 0.00 D D2 E E2 1.8 1.7 1.6 1.25 1.20 1.15 1.3 1.2 1.1 0.35 0.30 0.25 e e1 0.4 1.2 k L v 0.2 0.30 0.25 0.20 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1157-1 --- --- --- sot1157-1_po European projection Issue date 09-12-16 09-12-17 Fig 10. Package outline PEMI4QFN (SOT1157-1/HXSON8) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 18 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.2 x 2.5 x 0.5 mm SOT1158-1 X A B D E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 6 C C A B C y y1 C L k E2 12 7 D2 0 1 scale Dimensions Unit(1) mm max nom min 2 mm A A1 0.5 0.05 A3 b 0.25 0.127 0.20 0.15 0.00 D D2 E E2 2.6 2.5 2.4 2.1 2.0 1.9 1.3 1.2 1.1 0.35 0.30 0.25 e e1 0.4 2 k L v 0.2 0.30 0.25 0.20 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1158-1 --- --- --- sot1158-1_po European projection Issue date 09-12-16 09-12-17 Fig 11. Package outline PEMI6QFN (SOT1158-1/HXSON12) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 19 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection HXSON16: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; body 1.2 x 3.3 x 0.5 mm SOT1159-1 X B D A E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 8 C C A B C y1 C y L k E2 16 9 D2 0 1 scale Dimensions Unit(1) mm max nom min 2 mm A A1 0.5 0.05 A3 b 0.25 0.127 0.20 0.15 0.00 D D2 E E2 3.4 3.3 3.2 2.9 2.8 2.7 1.3 1.2 1.1 0.35 0.30 0.25 e e1 0.4 2.8 k L v 0.2 0.30 0.25 0.20 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1159-1 --- --- --- sot1159-1_po European projection Issue date 09-12-16 09-12-17 Fig 12. Package outline PEMI8QFN (SOT1159-1/HXSON16) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 20 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 9. Soldering 1.3 0.7 R0.05 (12×) solder lands solder resist 0.9 0.7 0.6 solder paste 0.25 (2×) occupied area 0.3 (2×) 0.3 0.4 (2×) 0.4 Dimensions in mm sot883_fr Reflow soldering is the only recommended soldering method. Fig 13. Reflow soldering PEMI1QFN (SOT883/SC-101) 1.250 0.675 0.370 (6×) 0.500 1.700 solder resist 0.500 solder paste = solderland 0.270 (6×) occupied area Dimensions in mm 0.325 (6×) 0.425 (6×) sot886_fr Reflow soldering is the only recommended soldering method. Fig 14. Reflow soldering PEMI2QFN (SOT886/XSON6) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 21 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 2.45 2.1 1.6 solder lands 0.4 (5×) 0.7 (2×) placement area 2 1 0.25 0.3 0.55 solder paste 0.45 0.4 (2×) (2×) 0.538 0.325 0.375 (2×) (2×) occupied area Dimensions in mm 1.7 0.45 (4×) 0.6 0.5 (4×) 0.65 sot665_fr Reflow soldering is the only recommended soldering method. Fig 15. Reflow soldering PEMI2STD (SOT665) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 22 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Footprint information for reflow soldering of HXSON8 package SOT1157-1 Hx Gx D 0.025 P 0.025 Ay Gy By SPy SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist DIMENSIONS in mm P Ay By D Slx Sly SPx SPy Gx Gy Hx Hy 0.40 1.75 0.75 0.22 1.25 0.35 0.6 0.2 1.65 1.45 1.95 2.0 Issue date 11-06-27 11-07-06 sot1157-1_fr Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering PEMI4QFN (SOT1157-1/HXSON8) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 23 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Footprint information for reflow soldering of HXSON12 package SOT1158-1 Hx Gx D 0.025 P 0.025 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist DIMENSIONS in mm P Ay By D Slx Sly SPx SPy Gx Gy Hx Hy 0.40 1.75 0.75 0.22 2.1 0.35 0.9 0.2 2.45 1.45 2.75 2.0 Issue date 11-06-27 11-07-06 sot1158-1_fr Reflow soldering is the only recommended soldering method. Fig 17. Reflow soldering PEMI6QFN (SOT1158-1/HXSON12) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 24 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Footprint information for reflow soldering of HXSON16 package SOT1159-1 Hx Gx D 0.025 P 0.025 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist DIMENSIONS in mm P Ay By D Slx Sly SPx SPy Gx Gy Hx Hy 0.40 2.15 0.75 0.21 2.9 0.35 1.3 0.2 3.25 1.45 3.55 2.4 Issue date 11-06-27 11-07-06 sot1159-1_fr Reflow soldering is the only recommended soldering method. Fig 18. Reflow soldering PEMI8QFN (SOT1159-1/HXSON16) PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 25 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 10. Revision history Table 12. Revision history Document ID Release date PEMIXQFN_PEMI2STD_ 20111103 FAM v.2 Modifications: Product data sheet Change notice Supersedes Product data sheet - PEMIXQFN_PEMI2STD_ FAM v.1 • Table 3 “Pinning”: corrected pinning description for PEMI8QFN (SOT1159-1); updated simplified outline of SOT886 • Section 11 “Legal information”: updated PEMIXQFN_PEMI2STD_ 20110729 FAM v.1 PEMIXQFN_PEMI2STD_FAM Data sheet status Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 - © NXP B.V. 2011. All rights reserved. 26 of 29 PEMIxQFN; PEMI2STD family NXP Semiconductors 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 27 of 29 NXP Semiconductors PEMIxQFN; PEMI2STD family 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PEMIXQFN_PEMI2STD_FAM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 28 of 29 NXP Semiconductors PEMIxQFN; PEMI2STD family 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection 13. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 6.1 6.2 6.3 6.4 6.4.1 6.4.2 6.4.3 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 9 Use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 LCD interfaces, medium-speed interfaces . . . . 9 Keypad, low-speed interfaces. . . . . . . . . . . . . . 9 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . 10 Relative -3dB frequency (p-filter structure) . . . 12 Insertion loss (dB) at 800 MHz (p-filter structure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Insertion loss (dB) at frequencies lower than 1 MHz (p-filter structure) . . . . . . . . . . . . . . . . . 13 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26 Legal information. . . . . . . . . . . . . . . . . . . . . . . 27 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information. . . . . . . . . . . . . . . . . . . . . 28 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 November 2011 Document identifier: PEMIXQFN_PEMI2STD_FAM