IP4791CZ12 HDMI ESD protection, level shifter and backdrive protection Rev. 3 — 7 January 2011 Product data sheet 1. General description The IP4791CZ12 is designed to protect mobile High-Definition Multimedia Interface (HDMI) transmitter interfaces. It includes level shifting for the Data Display Channel (DDC), Consumer Electronic Control (CEC), hot plug signal and backdrive protection. In addition, all signals are protected by high-level ElectroStatic Discharge (ESD) protection diodes. The level shifting function is required to protect the I/Os against overvoltages when the transmitter operates at a supply voltage lower than the external devices. The IP4791CZ12 contains active buffers to provide the level shifting function, hot plug detect input and the CEC pull-up current source. The ESD protection diodes provide protection from ESD voltages up to ±8 kV, according to IEC 61000-4-2, level 4. 2. Features and benefits HDMI 1.3 compliant Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) Robust ESD protection without degradation after multiple ESD strikes Low leakage even after several hundred ESD discharges Bidirectional level shifting buffer provided for DDC clock and data channels Backdrive protection Power management CEC pull-up current source and level shifting buffer Hot plug detect module with pull-down resistor Matched 0.4 mm trace spacing for HDMI type C connector 3. Applications The IP4791CZ12 can be used with a range of HDMI transmitter devices including: Personal computer Notebook Mobile phone DV camcorder Digital still camera MP3 player IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 4. Ordering information Table 1. Ordering information Type number IP4791CZ12 Package Name Description Version HXSON12 plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 2.1 × 2.5 × 0.5 mm SOT1156-1 5. Functional diagram ESD rail 5.0 V Enable ESD rail 5.0 V 1.8 V DDC data (connector) DDC data (system) ESD rail 5.0 V 1.8 V 1.85 kΩ 3.6 kΩ 1.85 kΩ Enable 3.6 kΩ DDC clock (connector) DDC clock (system) ESD rail 5.0 V 1.8 V Enable 1.8 V 3V3 10 kΩ 26 kΩ Active Enable CEC out (connector) CEC in (system) 100 kΩ ESD rail 5.0 V 1.8 V ESD rail HDMI_5V0_IN Hot plug in HDMI_5V0_OUT Hot plug out 100 kΩ 100 kΩ 001aak735 Fig 1. IP4791CZ12 Product data sheet Functional diagram All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 2 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 6. Pinning information 6.1 Pinning CEC_IN 1 12 CEC_OUT DDC_CLK_IN 2 11 DDC_CLK_OUT DDC_DAT_IN 3 10 DDC_DAT_OUT VCC_LOW 4 9 ACTIVE HDMI_5V0_IN 5 HOTPLUG_DET_OUT 6 8 HDMI_5V0_OUT GND 7 HOTPLUG_DET_IN 001aak734 Fig 2. Pin configuration (transparent top view) 6.2 Pin description Table 2. IP4791CZ12 Product data sheet Pin description Symbol Pin Description CEC_IN 1 CEC system side DDC_CLK_IN 2 DDC clock system side DDC_DAT_IN 3 DDC data system side VCC_LOW 4 supply voltage, low voltage side for level shifting HDMI_5V0_IN 5 5 V line from main supply HOTPLUG_DET_OUT 6 hot plug detect system side HOTPLUG_DET_IN 7 hot plug detect connector side HDMI_5V0_OUT 8 5 V line to HDMI connector ACTIVE 9 power saving mode DDC_DAT_OUT 10 DDC data connector side DDC_CLK_OUT 11 DDC clock connector side CEC_OUT 12 CEC connector side GND Pad ground All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 3 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 7. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VESD electrostatic discharge voltage VCC supply voltage VI input voltage Ptot total power dissipation Conditions Min Max Unit signal pins to ground at HDMI/DVI connector side [1] - ±10 kV all pins [2] - ±200 V all pins [3] - ±2 kV GND − 0.5 5.5 ACTIVE = HIGH; DDC operating at 100 kHz, 50 % duty cycle; CEC operating at 1 kHz, 50 % duty cycle [4] disable: HDMI cable not connected; ACTIVE = LOW, DDC bus in Idle mode V GND − 0.5 5.5 V - 30 mW - 0.2 mW Tstg storage temperature −55 +125 °C Tamb ambient temperature −40 +85 °C [1] IEC 61000-4-2, level 4, contact discharge. [2] Machine Model (MM) according to JESD22-A115-A. [3] Human Body Model (HBM) according to JESD22-A-J114D. [4] Including the current through the internal pull-up resistors. 8. Characteristics Table 4. Supplies GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter VCC(5V0) VCC(1V8) Conditions Min Typ Max Unit supply voltage (5.0 V) 4.5 5.0 5.5 V supply voltage (1.8 V) 1.62 1.8 3.63 V Table 5. Static characteristics VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 0.6 - Ω HDMI_5V0_OUT Rdyn [1] dynamic resistance positive transient - 0.4 - Ω [2] - 8.0 - V [3] 1.2 - - V negative transient VCL(ch)trt(pos) positive transient channel VESD = 8 kV, tp = 100 ns clamping voltage ACTIVE VIH HIGH-level input voltage VIL LOW-level input voltage - - 0.8 V Rpd pull-down resistance 60 100 140 kΩ IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 4 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection Table 5. Static characteristics …continued VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions DDC buffer - connector side (pin 10 and pin 11) Min Typ Max Unit 0.5 × VCC(5V0) - 5.5 V [3] VIH HIGH-level input voltage VIL LOW-level input voltage VIK input clamping voltage VOL LOW-level output voltage internal pull-down current II = −18 mA −0.5 - 0.3 × VCC(5V0) V - −1.0 - V - 100 200 mV HIGH-level output voltage [4] VCC(5V0) − 0.02 - VCC(5V0) + 0.02 V CIO input/output capacitance [4] - 8 10 pF Rpu pull-up resistance 1.6 1.8 2.0 kΩ 0.26 × VCC(1V8) - - V - - 0.20 × VCC(1V8) V - −1.0 - - VOH VCC(5V0) = 0 V; VCC(1V8) = 0 V; Vbias = 2.5 V; AC input = 3.5 V(p-p); f = 100 kHz DDC buffer - system side (pin 2 and pin 3) VIH HIGH-level input voltage VIL LOW-level input voltage VIK input clamping voltage VOL LOW-level output voltage [3] II = −18 mA V - 0.28 × VCC(1V8) V HIGH-level output voltage [4] VCC(1V8) − 0.02 - VCC(1V8) + 0.02 V input/output capacitance [4] - 6 8 pF pull-up resistance 3.2 3.65 4.1 kΩ VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.80 V VOH HIGH-level output voltage 2.88 3.3 3.63 V VOL LOW-level output voltage IOL = 1.5 mA - 100 200 mV - 8 10 pF 23.4 26.0 28.6 kΩ VOH CIO Rpu CEC_OUT VCC(5V0) = 0 V; VCC(1V8) = 0 V; Vbias = 2.5 V; AC input = 3.5 V(p-p); f = 100 kHz [3] CIO input/output capacitance Rpu pull-up resistance IP4791CZ12 Product data sheet VCC(5V0) = 0 V; VCC(1V8) = 0 V; Vbias = 2.5 V; AC input = 3.5 V(p-p); f = 100 kHz [4] All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 5 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection Table 5. Static characteristics …continued VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol CEC_IN Parameter Conditions Min Typ Max Unit - V [3] VIH HIGH-level input voltage VIL LOW-level input voltage VOH HIGH-level output voltage VOL LOW-level output voltage CIO input/output capacitance Rpu pull-up resistance 0.26 × VCC(1V8) - 0.20 × VCC(1V8) V VCC(1V8) − 0.02 - VCC(1V8) + 0.02 V - - 0.28 × VCC(1V8) V - 6 7 pF 8.5 10.0 11.5 kΩ [4] VCC(5V0) = 0 V; VCC(1V8) = 0 V; Vbias = 2.5 V; AC input = 3.5 V(p-p); f = 100 kHz [4] HOTPLUG_DET_IN [3] VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V Rpd pull-down resistance 60 100 140 kΩ Ci input capacitance - 8 10 pF 0.7 × VCC(1V8) - - V VCC(5V0) = 0 V; VCC(1V8) = 0 V; Vbias = 2.5 V; AC input = 3.5 V(p-p); f = 100 kHz [4] HOTPLUG_DET_OUT [3] VOH HIGH-level output voltage IOL = 1 mA VOL LOW-level output voltage IOL = −1 mA - 200 300 mV Rpd pull-down resistance 60 100 140 kΩ [1] ANSI-ESDSP5.5.1-2004, ESD sensitivity testing TLP component level method 50 TDR. [2] According to IEC 61000, level 4, contact discharge. [3] The device is active if the input voltage at pin ACTIVE is above the HIGH level. [4] This parameter is guaranteed by design. Table 6. Dynamic characteristics VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit DDC_DAT_IN, DDC_CLK_IN, DDC_DAT_OUT, DDC_CLK_OUT LOW to HIGH propagation delay tPLH HIGH to LOW propagation delay tPHL system side to connector side Figure 3 [1] - 80 - ns system side to connector side Figure 3 [1] - 60 - ns tPLH LOW to HIGH propagation delay connector side to system side Figure 4 [1] - 120 - ns tPHL HIGH to LOW propagation delay connector side to system side Figure 4 [1] - 80 - ns connector side Figure 5 [1] - 150 - ns connector side Figure 5 [1] - 100 - ns - 250 - ns - 80 - ns LOW to HIGH transition time tTLH HIGH to LOW transition time tTHL tTLH LOW to HIGH transition time system side Figure 6 [1] tTHL HIGH to LOW transition time system side Figure 6 [1] [1] All dynamic measurements are done with a 50 pF load. Rise times are determined by internal pull-up resistors. IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 6 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 9. AC waveforms 9.1 DDC propagation delay VCC(1V8) DDC system side 0.5 VCC(1V8) 0.28 VCC(1V8) VOL VCC(5V0) DDC connector side 0.5 VCC(5V0) 0.5 VCC(5V0) VOL tPHL Fig 3. tPLH 001aak736 Propagation delay DDC, DDC system side to DDC connector side VCC(5V0) DDC connector side 0.5 VCC(5V0) 0.5 VCC(5V0) VOL VCC(1V8) DDC system side 0.5 VCC(1V8) 0.5 VCC(1V8) VOL tPHL Fig 4. IP4791CZ12 Product data sheet tPLH 001aak737 Propagation delay DDC, DDC connector side to DDC system side All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 7 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 9.2 DDC transition time DDC system side VCC(1V8) VOL VCC(5V0) DDC connector side 80 % VCC(5V0) 20 % VCC(5V0) VOL tPHL Fig 5. tPLH 001aak738 Transition time DDC connector side VCC(5V0) DDC connector side VOL VCC(1V8) DDC system side 80 % VCC(1V8) 20 % VCC(1V8) VOL tPHL Fig 6. IP4791CZ12 Product data sheet tPLH 001aak739 Transition time DDC system side All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 8 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 10. Application information 10.1 HDMI source The IP4791CZ12 simplifies the application of a mobile HDMI source. No external components are needed for the application to adapt the HDMI port to the HDMI transmitter. Note: The 5 V supply voltage must be in the range 4.8 V to 5.3 V to pass the HDMI compliance test. HDMI-D receptacle TMDS_DATA 2+ TMDS_GND TMDS_DATA 2− TMDS_DATA 1+ TMDS_GND TMDS_DATA 1− TMDS_DATA 0+ TMDS_GND TMDS_DATA 0− TMDS_CLK+ TMDS_GND TMDS_CLK− CEC DDC/CEC GND SCL SDA P 5V0 GND 2 U1 3 IP4283CZ10 D2_P 4 1 D2_N 10 2 5 9 3 D0_P 6 4 D0_N 7 6 5 7 D2_P D2_N 8 (1) D0_P D0_N 8 U2 9 IP4283CZ10 D1_P 10 1 D1_N 10 2 11 9 (1) 3 12 CLK_P CLK_N 13 D1_P D1_N 8 4 7 6 5 CLK_P CLK_N 14 15 U3 IP4791CZ12 16 CEC_con 17 18 12 SCL_con 11 SDA_con 10 ACTIVE 19 +5 V HDMI 20 HPD_IN J1 9 8 1 SYSTEM UTILITY 1 CONNECTOR HOT PLUG 2 3 4 5 7 6 CEC_sys SCL_sys SDA_sys 1V8 5V0_in HPD_out 0 GND 001aal767 (1) The TDMS lines are 100 Ω differential impedance transmission lines which pass underneath the chip without being interrupted by it. Fig 7. HDMI transmitter application The ACTIVE pin is enabling the IP4791CZ12 with a voltage above 1.2 V. Connecting the ACTIVE pin to the HOT PLUG line will enable the IP4791CZ12 automatically if any HDMI sink is connected to the HDMI port and disable (switch to power-saving mode of the IP4791CZ12) when no HDMI sink is connecting to the HDMI port. IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 9 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 11. Package outline HXSON12: plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 2.1 x 2.5 x 0.5 mm SOT1156-1 X B D A E A A1 A3 detail X terminal 1 index area e1 terminal 1 index area e v w b 1 6 C C A B C y1 C y L k Eh 12 7 Dh 0 1 scale Dimensions Unit(1) mm max nom min 2 mm A A1 0.5 0.05 A3 b 0.25 0.127 0.20 0.00 0.15 D Dh E Eh 2.6 2.5 2.4 2.25 2.20 2.15 2.2 2.1 2.0 1.15 1.10 1.05 e e1 0.4 k L v 0.1 0.2 0.30 0.25 0.20 2 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1156-1 --- --- --- Fig 8. sot1156-1_po European projection Issue date 10-01-21 10-09-17 Package outline SOT1156-1 (HXSON12) IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 10 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 12. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 12.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 12.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 12.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 11 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 12.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 9) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8 Table 7. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 8. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 9. IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 12 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 9. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 13. Abbreviations Table 9. IP4791CZ12 Product data sheet Abbreviations Acronym Description CEC Consumer Electronic Control DDC Data Display Channel DVI Digital Visual Interface ESD ElectroStatic Discharge HDMI High-Definition Multimedia Interface RoHS Restriction of Hazardous Substances TDMS Transition Minimized Differential Signalling TDR Time Domain Reflectometer TLP Transmission Line Pulse All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 13 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 14. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4791CZ12 v.3 20110107 Product data sheet - IP4791CZ12 v.2 Modifications: • • • Table 3 “Limiting values”: Ptot maximum value updated. Table 5 “Static characteristics”: VIK updated. Section 10.1 “HDMI source”: enhanced. IP4791CZ12 v.2 20101111 Preliminary data sheet - IP4791CZ12 v.1 IP4791CZ12 v.1 20100401 Objective data sheet - - IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 14 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). 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Export might require a prior authorization from national authorities. IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 15 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] IP4791CZ12 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 January 2011 © NXP B.V. 2011. All rights reserved. 16 of 17 IP4791CZ12 NXP Semiconductors HDMI ESD protection, level shifter and backdrive protection 17. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 9.1 9.2 10 10.1 11 12 12.1 12.2 12.3 12.4 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 7 DDC propagation delay . . . . . . . . . . . . . . . . . . 7 DDC transition time . . . . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 9 HDMI source. . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering of SMD packages . . . . . . . . . . . . . . 11 Introduction to soldering . . . . . . . . . . . . . . . . . 11 Wave and reflow soldering . . . . . . . . . . . . . . . 11 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 7 January 2011 Document identifier: IP4791CZ12