IP4791CZ12 HDMI ESD protection, level shifter and backdrive

IP4791CZ12
HDMI ESD protection, level shifter and backdrive protection
Rev. 3 — 7 January 2011
Product data sheet
1. General description
The IP4791CZ12 is designed to protect mobile High-Definition Multimedia
Interface (HDMI) transmitter interfaces. It includes level shifting for the Data Display
Channel (DDC), Consumer Electronic Control (CEC), hot plug signal and backdrive
protection. In addition, all signals are protected by high-level ElectroStatic
Discharge (ESD) protection diodes.
The level shifting function is required to protect the I/Os against overvoltages when the
transmitter operates at a supply voltage lower than the external devices. The IP4791CZ12
contains active buffers to provide the level shifting function, hot plug detect input and the
CEC pull-up current source.
The ESD protection diodes provide protection from ESD voltages up to ±8 kV, according
to IEC 61000-4-2, level 4.
2. Features and benefits
„ HDMI 1.3 compliant
„ Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
„ Robust ESD protection without degradation after multiple ESD strikes
„ Low leakage even after several hundred ESD discharges
„ Bidirectional level shifting buffer provided for DDC clock and data channels
„ Backdrive protection
„ Power management
„ CEC pull-up current source and level shifting buffer
„ Hot plug detect module with pull-down resistor
„ Matched 0.4 mm trace spacing for HDMI type C connector
3. Applications
The IP4791CZ12 can be used with a range of HDMI transmitter devices including:
„ Personal computer
„ Notebook
„ Mobile phone
„ DV camcorder
„ Digital still camera
„ MP3 player
IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
4. Ordering information
Table 1.
Ordering information
Type number
IP4791CZ12
Package
Name
Description
Version
HXSON12
plastic, thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 2.1 × 2.5 × 0.5 mm
SOT1156-1
5. Functional diagram
ESD rail 5.0 V
Enable
ESD rail 5.0 V
1.8 V
DDC data
(connector)
DDC data
(system)
ESD rail 5.0 V
1.8 V
1.85 kΩ
3.6 kΩ
1.85 kΩ
Enable
3.6 kΩ
DDC clock
(connector)
DDC clock
(system)
ESD rail 5.0 V
1.8 V
Enable
1.8 V
3V3
10 kΩ
26
kΩ
Active
Enable
CEC out
(connector)
CEC in
(system)
100 kΩ
ESD rail 5.0 V
1.8 V
ESD rail
HDMI_5V0_IN
Hot plug in
HDMI_5V0_OUT
Hot plug out
100 kΩ
100 kΩ
001aak735
Fig 1.
IP4791CZ12
Product data sheet
Functional diagram
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Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
2 of 17
IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
6. Pinning information
6.1 Pinning
CEC_IN 1
12 CEC_OUT
DDC_CLK_IN 2
11 DDC_CLK_OUT
DDC_DAT_IN 3
10 DDC_DAT_OUT
VCC_LOW 4
9 ACTIVE
HDMI_5V0_IN 5
HOTPLUG_DET_OUT 6
8 HDMI_5V0_OUT
GND
7 HOTPLUG_DET_IN
001aak734
Fig 2.
Pin configuration (transparent top view)
6.2 Pin description
Table 2.
IP4791CZ12
Product data sheet
Pin description
Symbol
Pin
Description
CEC_IN
1
CEC system side
DDC_CLK_IN
2
DDC clock system side
DDC_DAT_IN
3
DDC data system side
VCC_LOW
4
supply voltage, low voltage side for level shifting
HDMI_5V0_IN
5
5 V line from main supply
HOTPLUG_DET_OUT
6
hot plug detect system side
HOTPLUG_DET_IN
7
hot plug detect connector side
HDMI_5V0_OUT
8
5 V line to HDMI connector
ACTIVE
9
power saving mode
DDC_DAT_OUT
10
DDC data connector side
DDC_CLK_OUT
11
DDC clock connector side
CEC_OUT
12
CEC connector side
GND
Pad
ground
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3 of 17
IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
7. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VESD
electrostatic discharge
voltage
VCC
supply voltage
VI
input voltage
Ptot
total power dissipation
Conditions
Min
Max
Unit
signal pins to ground
at HDMI/DVI connector side
[1]
-
±10
kV
all pins
[2]
-
±200
V
all pins
[3]
-
±2
kV
GND − 0.5 5.5
ACTIVE = HIGH;
DDC operating at 100 kHz, 50 % duty cycle;
CEC operating at 1 kHz, 50 % duty cycle
[4]
disable: HDMI cable not connected;
ACTIVE = LOW, DDC bus in Idle mode
V
GND − 0.5 5.5
V
-
30
mW
-
0.2
mW
Tstg
storage temperature
−55
+125
°C
Tamb
ambient temperature
−40
+85
°C
[1]
IEC 61000-4-2, level 4, contact discharge.
[2]
Machine Model (MM) according to JESD22-A115-A.
[3]
Human Body Model (HBM) according to JESD22-A-J114D.
[4]
Including the current through the internal pull-up resistors.
8. Characteristics
Table 4.
Supplies
GND = 0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
VCC(5V0)
VCC(1V8)
Conditions
Min
Typ
Max
Unit
supply voltage (5.0 V)
4.5
5.0
5.5
V
supply voltage (1.8 V)
1.62
1.8
3.63
V
Table 5.
Static characteristics
VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
0.6
-
Ω
HDMI_5V0_OUT
Rdyn
[1]
dynamic resistance
positive transient
-
0.4
-
Ω
[2]
-
8.0
-
V
[3]
1.2
-
-
V
negative transient
VCL(ch)trt(pos) positive transient channel VESD = 8 kV, tp = 100 ns
clamping voltage
ACTIVE
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
-
-
0.8
V
Rpd
pull-down resistance
60
100
140
kΩ
IP4791CZ12
Product data sheet
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IP4791CZ12
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HDMI ESD protection, level shifter and backdrive protection
Table 5.
Static characteristics …continued
VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
DDC buffer - connector side (pin 10 and pin 11)
Min
Typ
Max
Unit
0.5 × VCC(5V0)
-
5.5
V
[3]
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VIK
input clamping voltage
VOL
LOW-level output voltage internal pull-down current
II = −18 mA
−0.5
-
0.3 × VCC(5V0)
V
-
−1.0
-
V
-
100
200
mV
HIGH-level output voltage
[4]
VCC(5V0) − 0.02 -
VCC(5V0) + 0.02 V
CIO
input/output capacitance
[4]
-
8
10
pF
Rpu
pull-up resistance
1.6
1.8
2.0
kΩ
0.26 × VCC(1V8) -
-
V
-
-
0.20 × VCC(1V8) V
-
−1.0
-
-
VOH
VCC(5V0) = 0 V;
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
DDC buffer - system side (pin 2 and pin 3)
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VIK
input clamping voltage
VOL
LOW-level output voltage
[3]
II = −18 mA
V
-
0.28 × VCC(1V8) V
HIGH-level output voltage
[4]
VCC(1V8) − 0.02 -
VCC(1V8) + 0.02 V
input/output capacitance
[4]
-
6
8
pF
pull-up resistance
3.2
3.65
4.1
kΩ
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.80
V
VOH
HIGH-level output voltage
2.88
3.3
3.63
V
VOL
LOW-level output voltage IOL = 1.5 mA
-
100
200
mV
-
8
10
pF
23.4
26.0
28.6
kΩ
VOH
CIO
Rpu
CEC_OUT
VCC(5V0) = 0 V;
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
[3]
CIO
input/output capacitance
Rpu
pull-up resistance
IP4791CZ12
Product data sheet
VCC(5V0) = 0 V;
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
[4]
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IP4791CZ12
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HDMI ESD protection, level shifter and backdrive protection
Table 5.
Static characteristics …continued
VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
CEC_IN
Parameter
Conditions
Min
Typ
Max
Unit
-
V
[3]
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
VOH
HIGH-level output voltage
VOL
LOW-level output voltage
CIO
input/output capacitance
Rpu
pull-up resistance
0.26 × VCC(1V8) -
0.20 × VCC(1V8) V
VCC(1V8) − 0.02 -
VCC(1V8) + 0.02 V
-
-
0.28 × VCC(1V8) V
-
6
7
pF
8.5
10.0
11.5
kΩ
[4]
VCC(5V0) = 0 V;
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
[4]
HOTPLUG_DET_IN [3]
VIH
HIGH-level input voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
Rpd
pull-down resistance
60
100
140
kΩ
Ci
input capacitance
-
8
10
pF
0.7 × VCC(1V8)
-
-
V
VCC(5V0) = 0 V;
VCC(1V8) = 0 V;
Vbias = 2.5 V;
AC input = 3.5 V(p-p);
f = 100 kHz
[4]
HOTPLUG_DET_OUT [3]
VOH
HIGH-level output voltage IOL = 1 mA
VOL
LOW-level output voltage IOL = −1 mA
-
200
300
mV
Rpd
pull-down resistance
60
100
140
kΩ
[1]
ANSI-ESDSP5.5.1-2004, ESD sensitivity testing TLP component level method 50 TDR.
[2]
According to IEC 61000, level 4, contact discharge.
[3]
The device is active if the input voltage at pin ACTIVE is above the HIGH level.
[4]
This parameter is guaranteed by design.
Table 6.
Dynamic characteristics
VCC(5V0) = 5.0 V; VCC(1V8) = 1.8 V; GND = 0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
DDC_DAT_IN, DDC_CLK_IN, DDC_DAT_OUT, DDC_CLK_OUT
LOW to HIGH propagation delay
tPLH
HIGH to LOW propagation delay
tPHL
system side to connector side Figure 3
[1]
-
80
-
ns
system side to connector side Figure 3
[1]
-
60
-
ns
tPLH
LOW to HIGH propagation delay
connector side to system side Figure 4
[1]
-
120
-
ns
tPHL
HIGH to LOW propagation delay
connector side to system side Figure 4
[1]
-
80
-
ns
connector side Figure 5
[1]
-
150
-
ns
connector side Figure 5
[1]
-
100
-
ns
-
250
-
ns
-
80
-
ns
LOW to HIGH transition time
tTLH
HIGH to LOW transition time
tTHL
tTLH
LOW to HIGH transition time
system side Figure 6
[1]
tTHL
HIGH to LOW transition time
system side Figure 6
[1]
[1]
All dynamic measurements are done with a 50 pF load. Rise times are determined by internal pull-up resistors.
IP4791CZ12
Product data sheet
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HDMI ESD protection, level shifter and backdrive protection
9. AC waveforms
9.1 DDC propagation delay
VCC(1V8)
DDC system side
0.5 VCC(1V8)
0.28 VCC(1V8)
VOL
VCC(5V0)
DDC connector side
0.5 VCC(5V0)
0.5 VCC(5V0)
VOL
tPHL
Fig 3.
tPLH
001aak736
Propagation delay DDC, DDC system side to DDC connector side
VCC(5V0)
DDC connector side
0.5 VCC(5V0)
0.5 VCC(5V0)
VOL
VCC(1V8)
DDC system side
0.5 VCC(1V8)
0.5 VCC(1V8)
VOL
tPHL
Fig 4.
IP4791CZ12
Product data sheet
tPLH
001aak737
Propagation delay DDC, DDC connector side to DDC system side
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HDMI ESD protection, level shifter and backdrive protection
9.2 DDC transition time
DDC system side
VCC(1V8)
VOL
VCC(5V0)
DDC connector side
80 % VCC(5V0)
20 % VCC(5V0)
VOL
tPHL
Fig 5.
tPLH
001aak738
Transition time DDC connector side
VCC(5V0)
DDC connector side
VOL
VCC(1V8)
DDC system side
80 % VCC(1V8)
20 % VCC(1V8)
VOL
tPHL
Fig 6.
IP4791CZ12
Product data sheet
tPLH
001aak739
Transition time DDC system side
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HDMI ESD protection, level shifter and backdrive protection
10. Application information
10.1 HDMI source
The IP4791CZ12 simplifies the application of a mobile HDMI source.
No external components are needed for the application to adapt the HDMI port to the
HDMI transmitter.
Note: The 5 V supply voltage must be in the range 4.8 V to 5.3 V to pass the
HDMI compliance test.
HDMI-D receptacle
TMDS_DATA 2+
TMDS_GND
TMDS_DATA 2−
TMDS_DATA 1+
TMDS_GND
TMDS_DATA 1−
TMDS_DATA 0+
TMDS_GND
TMDS_DATA 0−
TMDS_CLK+
TMDS_GND
TMDS_CLK−
CEC
DDC/CEC GND
SCL
SDA
P 5V0
GND
2
U1
3
IP4283CZ10
D2_P
4
1
D2_N
10
2
5
9
3
D0_P
6
4
D0_N
7
6
5
7
D2_P
D2_N
8
(1)
D0_P
D0_N
8
U2
9
IP4283CZ10
D1_P
10
1
D1_N
10
2
11
9
(1)
3
12
CLK_P
CLK_N
13
D1_P
D1_N
8
4
7
6
5
CLK_P
CLK_N
14
15
U3
IP4791CZ12
16
CEC_con
17
18
12
SCL_con
11
SDA_con
10
ACTIVE
19
+5 V HDMI
20
HPD_IN
J1
9
8
1
SYSTEM
UTILITY
1
CONNECTOR
HOT PLUG
2
3
4
5
7
6
CEC_sys
SCL_sys
SDA_sys
1V8
5V0_in
HPD_out
0
GND
001aal767
(1) The TDMS lines are 100 Ω differential impedance transmission lines which pass underneath
the chip without being interrupted by it.
Fig 7.
HDMI transmitter application
The ACTIVE pin is enabling the IP4791CZ12 with a voltage above 1.2 V. Connecting the
ACTIVE pin to the HOT PLUG line will enable the IP4791CZ12 automatically if any HDMI
sink is connected to the HDMI port and disable (switch to power-saving mode of the
IP4791CZ12) when no HDMI sink is connecting to the HDMI port.
IP4791CZ12
Product data sheet
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Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
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IP4791CZ12
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HDMI ESD protection, level shifter and backdrive protection
11. Package outline
HXSON12: plastic, thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 2.1 x 2.5 x 0.5 mm
SOT1156-1
X
B
D
A
E
A
A1
A3
detail X
terminal 1
index area
e1
terminal 1
index area
e
v
w
b
1
6
C
C A B
C
y1 C
y
L
k
Eh
12
7
Dh
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.00
0.15
D
Dh
E
Eh
2.6
2.5
2.4
2.25
2.20
2.15
2.2
2.1
2.0
1.15
1.10
1.05
e
e1
0.4
k
L
v
0.1
0.2
0.30
0.25
0.20
2
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1156-1
---
---
---
Fig 8.
sot1156-1_po
European
projection
Issue date
10-01-21
10-09-17
Package outline SOT1156-1 (HXSON12)
IP4791CZ12
Product data sheet
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HDMI ESD protection, level shifter and backdrive protection
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
IP4791CZ12
Product data sheet
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HDMI ESD protection, level shifter and backdrive protection
12.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9.
IP4791CZ12
Product data sheet
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IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 9.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
13. Abbreviations
Table 9.
IP4791CZ12
Product data sheet
Abbreviations
Acronym
Description
CEC
Consumer Electronic Control
DDC
Data Display Channel
DVI
Digital Visual Interface
ESD
ElectroStatic Discharge
HDMI
High-Definition Multimedia Interface
RoHS
Restriction of Hazardous Substances
TDMS
Transition Minimized Differential Signalling
TDR
Time Domain Reflectometer
TLP
Transmission Line Pulse
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HDMI ESD protection, level shifter and backdrive protection
14. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4791CZ12 v.3
20110107
Product data sheet
-
IP4791CZ12 v.2
Modifications:
•
•
•
Table 3 “Limiting values”: Ptot maximum value updated.
Table 5 “Static characteristics”: VIK updated.
Section 10.1 “HDMI source”: enhanced.
IP4791CZ12 v.2
20101111
Preliminary data sheet
-
IP4791CZ12 v.1
IP4791CZ12 v.1
20100401
Objective data sheet
-
-
IP4791CZ12
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
14 of 17
IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4791CZ12
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
15 of 17
IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4791CZ12
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 January 2011
© NXP B.V. 2011. All rights reserved.
16 of 17
IP4791CZ12
NXP Semiconductors
HDMI ESD protection, level shifter and backdrive protection
17. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
9.1
9.2
10
10.1
11
12
12.1
12.2
12.3
12.4
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 7
DDC propagation delay . . . . . . . . . . . . . . . . . . 7
DDC transition time . . . . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . . 9
HDMI source. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering of SMD packages . . . . . . . . . . . . . . 11
Introduction to soldering . . . . . . . . . . . . . . . . . 11
Wave and reflow soldering . . . . . . . . . . . . . . . 11
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 January 2011
Document identifier: IP4791CZ12