PBSS5630PA 30 V, 6 A PNP low VCEsat (BISS) transistor Rev. 01 — 19 March 2010 Product data sheet 1. Product profile 1.1 General description PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability. NPN complement: PBSS4630PA. 1.2 Features and benefits Low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM Smaller required Printed-Circuit Board (PCB) area than for conventional transistors Exposed heat sink for excellent thermal and electrical conductivity Leadless small SMD plastic package with medium power capability 1.3 Applications Loadswitch Battery-driven devices Power management Charging circuits Power switches (e.g. motors, fans) 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 30 V - - 6 A - - 7 A - 39 58 m IC collector current ICM peak collector current single pulse; tp 1 ms RCEsat collector-emitter saturation resistance IC = 6 A; IB = 300 mA [1] Pulse test: tp 300 s; 0.02. [1] PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 2. Pinning information Table 2. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Graphic symbol 3 3 1 2 1 sym013 2 Transparent top view 3. Ordering information Table 3. Ordering information Type number Package Name PBSS5630PA Description Version HUSON3 plastic thermal enhanced ultra thin small outline package; SOT1061 no leads; three terminals; body 2 2 0.65 mm 4. Marking Table 4. Marking codes Type number Marking code PBSS5630PA AB 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). PBSS5630PA_1 Product data sheet Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 30 V VCEO collector-emitter voltage open base - 30 V VEBO emitter-base voltage open collector - 7 V IC collector current - 6 A ICM peak collector current - 7 A IB base current Ptot total power dissipation single pulse; tp 1 ms Tamb 25 C All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 - 600 mA [1] - 500 mW [2] - 1 W [3] - 1.4 W [4] - 2.1 W © NXP B.V. 2010. All rights reserved. 2 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Tj Conditions Min Max Unit junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. 006aab978 2.5 Ptot (W) (1) 2.0 1.5 (2) (3) 1.0 (4) 0.5 0.0 −75 −25 25 75 125 175 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 6 cm2 (3) FR4 PCB, mounting pad for collector 1 cm2 (4) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) PBSS5630PA_1 Product data sheet Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit [1] - - 250 K/W [2] - - 125 K/W [3] - - 90 K/W [4] - - 60 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 3 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 006aab979 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 1 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab980 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 1 0.01 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS5630PA_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 4 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 006aab981 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 10 0.1 0.05 0.02 0.01 1 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 6 cm2 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab982 102 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 0.2 10 0.1 0.05 0.02 1 0.01 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS5630PA_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 5 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 24 V; IE = 0 A - - 100 nA VCB = 24 V; IE = 0 A; Tj = 150 C - - 50 A ICES collector-emitter cut-off current VCE = 24 V; VBE = 0 V - - 100 nA IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 nA hFE DC current gain VCE = 2 V IC = 0.5 A 230 345 - IC = 1 A 220 320 - IC = 2 A 190 275 - [1] IC = 6 A VCEsat Product data sheet 155 - IC = 0.5 A; IB = 50 mA - 25 40 IC = 1 A; IB = 50 mA [1] - 50 80 mV IC = 1 A; IB = 10 mA [1] - 80 130 mV IC = 2 A; IB = 20 mA [1] - 135 210 mV IC = 3 A; IB = 30 mA [1] - 215 325 mV IC = 4 A; IB = 400 mA [1] - 150 230 mV IC = 6 A; IB = 300 mA [1] - 235 350 mV - 39 58 m mV RCEsat collector-emitter saturation resistance IC = 6 A; IB = 300 mA [1] VBEsat base-emitter saturation voltage IC = 1 A; IB = 10 mA [1] - 0.75 0.9 V IC = 6 A; IB = 300 mA [1] - 1.03 1.1 V [1] - 0.76 0.9 V VBEon base-emitter turn-on voltage VCE = 2 V; IC = 2 A td delay time tr rise time ton turn-on time VCC = 9 V; IC = 2 A; IBon = 0.1 A; IBoff = 0.1 A ts storage time tf fall time toff turn-off time fT transition frequency VCE = 10 V; IC = 100 mA; f = 100 MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz [1] PBSS5630PA_1 collector-emitter saturation voltage 110 [1] - 19 - ns - 59 - ns - 78 - ns - 265 - ns - 55 - ns - 320 - ns 50 80 - MHz - 75 90 pF Pulse test: tp 300 s; 0.02. All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 6 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 006aab991 600 006aab992 −8.0 IB (mA) = −50 (1) IC (A) hFE −45 −40 −6.0 400 −30 (2) −15 (3) −10 −2.0 0 −10−1 −1 −10 −102 −25 −20 −4.0 200 −35 −5 0.0 0.0 −103 −104 IC (mA) VCE = 2 V −1.0 −2.0 −3.0 −4.0 −5.0 VCE (V) Tamb = 25 C (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 6. DC current gain as a function of collector current; typical values 006aab993 −1.2 VBE (V) Fig 7. Collector current as a function of collector-emitter voltage; typical values 006aab994 −1.2 VBEsat (V) (1) (1) −0.8 −0.8 (2) (2) (3) (3) −0.4 −0.4 0.0 −10−1 −1 −10 −102 0.0 −10−1 −103 −104 IC (mA) VCE = 2 V −1 (1) Tamb = 55 C (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 100 C Base-emitter voltage as a function of collector current; typical values PBSS5630PA_1 Product data sheet −102 −103 −104 IC (mA) IC/IB = 20 (2) Tamb = 25 C Fig 8. −10 Fig 9. Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 7 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 006aab995 −1 VCEsat (V) 006aab996 −1 VCEsat (V) −10−1 −10−1 (1) (2) (1) (3) (2) −10−2 −10−2 (3) −10−3 −10−1 −1 −10 −102 −103 −104 IC (mA) −10−3 −10−1 −1 −10 −102 −103 −104 IC (mA) Tamb = 25 C IC/IB = 20 (1) Tamb = 100 C (1) IC/IB = 100 (2) Tamb = 25 C (2) IC/IB = 50 (3) Tamb = 55 C (3) IC/IB = 10 Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values 006aab997 103 Fig 11. Collector-emitter saturation voltage as a function of collector current; typical values 006aab998 103 RCEsat (Ω) RCEsat (Ω) 102 102 10 10 1 1 (1) (2) (1) (2) (3) 10−1 10−2 −10−1 −1 −10 −102 10−1 −103 −104 IC (mA) (3) 10−2 −10−1 −1 (1) IC/IB = 100 (2) Tamb = 25 C (2) IC/IB = 50 (3) Tamb = 55 C (3) IC/IB = 10 Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values Product data sheet −102 −103 −104 IC (mA) Tamb = 25 C IC/IB = 20 (1) Tamb = 100 C PBSS5630PA_1 −10 Fig 13. Collector-emitter saturation resistance as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 8 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 8. Test information − IB input pulse (idealized waveform) 90 % − I Bon (100 %) 10 % − I Boff output pulse (idealized waveform) − IC 90 % − I C (100 %) 10 % t td ts tr t on tf t off 006aaa266 Fig 14. BISS transistor switching time definition VCC VBB RB oscilloscope RC Vo (probe) 450 Ω (probe) 450 Ω oscilloscope R2 VI DUT R1 mgd624 VCC = 9 V; IC = 2 A; IBon = 0.1 A; IBoff = 0.1 A Fig 15. Test circuit for switching times PBSS5630PA_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 9 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 9. Package outline 1.3 0.65 max 0.35 0.25 1 1.05 0.95 2 0.45 0.35 1.1 0.9 0.3 0.2 2.1 1.9 3 1.6 1.4 Dimensions in mm 2.1 1.9 09-11-12 Fig 16. Package outline SOT1061 (HUSON3) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 PBSS5630PA [1] PBSS5630PA_1 Product data sheet SOT1061 4 mm pitch, 8 mm tape and reel -115 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 10 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 11. Soldering 2.1 1.3 0.5 (2×) 0.4 (2×) 0.5 (2×) 0.6 (2×) 1.05 2.3 0.6 0.55 0.25 1.1 0.25 1.2 0.25 0.4 0.5 1.6 1.7 Dimensions in mm solder paste = solder lands solder resist occupied area sot1061_fr Reflow soldering is the only recommended soldering method. Fig 17. Reflow soldering footprint SOT1061 (HUSON3) PBSS5630PA_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 11 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PBSS5630PA_1 20100319 Product data sheet - - PBSS5630PA_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 12 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or PBSS5630PA_1 Product data sheet malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 13 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PBSS5630PA_1 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 19 March 2010 © NXP B.V. 2010. All rights reserved. 14 of 15 PBSS5630PA NXP Semiconductors 30 V, 6 A PNP low VCEsat (BISS) transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 19 March 2010 Document identifier: PBSS5630PA_1