PBSS4032SPN 30 V NPN/PNP low VCEsat (BISS) transistor Rev. 1 — 14 July 2010 Product data sheet 1. Product profile 1.1 General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number PBSS4032SPN Package NXP Name NPN/NPN complement SOT96-1 SO8 PBSS4032SN PNP/PNP complement PBSS4032SP 1.2 Features and benefits Low collector-emitter saturation voltage VCEsat Optimized switching time High collector current capability IC and ICM High collector current gain (hFE) at high IC High efficiency due to less heat generation Smaller required Printed-Circuit Board (PCB) area than for conventional transistors 1.3 Applications DC-to-DC conversion Battery-driven devices Power management Charging circuits 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit open base - - 30 V - - 5.7 A - - 10 A - 45 62.5 mΩ TR1; NPN low VCEsat transistor VCEO collector-emitter voltage IC collector current ICM peak collector current single pulse; tp ≤ 1 ms RCEsat collector-emitter saturation resistance IC = 4 A; IB = 0.4 A [1] PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor Table 2. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit open base - - −30 V - - −4.8 A - - −10 A - 65 98 mΩ TR2; PNP low VCEsat transistor VCEO collector-emitter voltage IC collector current ICM peak collector current single pulse; tp ≤ 1 ms RCEsat collector-emitter saturation resistance IC = −4 A; IB = −0.4 A [1] [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. 2. Pinning information Table 3. Pinning Pin Description 1 emitter TR1 2 base TR1 3 emitter TR2 4 base TR2 5 collector TR2 Simplified outline 8 5 Graphic symbol 8 7 TR1 6 collector TR2 7 collector TR1 8 collector TR1 1 4 1 6 5 TR2 2 3 4 006aaa985 3. Ordering information Table 4. Ordering information Type number Package Name Description PBSS4032SPN SO8 Version plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 4. Marking Table 5. PBSS4032SPN Product data sheet Marking codes Type number Marking code PBSS4032SPN 4032SPN All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 2 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit collector current - 5.7 A collector current - −4.8 A TR1 (NPN) IC TR2 (PNP) IC Per transistor; for the PNP transistor with negative polarity VCBO collector-base voltage open emitter - 30 V VCEO collector-emitter voltage open base - 30 V VEBO emitter-base voltage open collector - 5 V ICM peak collector current single pulse; tp ≤ 1 ms - 10 A IB base current total power dissipation Ptot Tamb ≤ 25 °C - 1 A [1] - 0.73 W [2] - 1 W [3] - 1.7 W [1] - 0.86 W [2] - 1.4 W Per device total power dissipation Ptot Tamb ≤ 25 °C [3] PBSS4032SPN Product data sheet - 2.3 W Tj junction temperature - 150 °C Tamb ambient temperature −55 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 3 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac302 3.0 Ptot (W) (1) 2.0 (2) 1.0 0.0 −75 (3) −25 25 75 125 175 Tamb (°C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Per device: Power derating curves 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit [1] - - 170 K/W [2] - - 125 K/W [3] - - 75 K/W - - 40 K/W [1] - - 145 K/W [2] - - 90 K/W [3] - - 55 K/W Per transistor Rth(j-a) Rth(j-sp) thermal resistance from junction to ambient in free air thermal resistance from junction to solder point Per device Rth(j-a) PBSS4032SPN Product data sheet thermal resistance from junction to ambient in free air [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 4 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac303 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aac304 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, mounting pad for collector 1 cm2 Fig 3. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 5 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac305 102 duty cycle = 1 0.75 Zth(j-a) (K/W) 0.5 0.33 0.2 10 0.1 0.05 0.02 0.01 1 0 10−1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) Ceramic PCB, Al2O3, standard footprint Fig 4. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 6 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit TR1; NPN low VCEsat transistor collector-base cut-off current VCB = 30 V; IE = 0 A - - 100 nA VCB = 30 V; IE = 0 A; Tj = 150 °C - - 50 μA ICES collector-emitter cut-off current VCE = 24 V; VBE = 0 V - - 100 nA IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 nA hFE DC current gain VCE = 2 V IC = 500 mA 300 500 - IC = 1 A 300 500 - IC = 2 A 250 450 - IC = 4 A 200 400 - 150 300 - IC = 1 A; IB = 50 mA - 90 125 mV IC = 1 A; IB = 10 mA - 130 180 mV IC = 2 A; IB = 40 mA - 150 210 mV IC = 4 A; IB = 400 mA - 185 250 mV IC = 4 A; IB = 40 mA - 250 375 mV - 300 450 mV - 45 62.5 mΩ - 0.76 0.9 V - 0.91 1.05 V - 0.77 0.85 V - 35 - ns ICBO [1] IC = 6 A VCEsat collector-emitter saturation voltage [1] IC = 6 A; IB = 300 mA RCEsat collector-emitter IC = 4 A; IB = 400 mA saturation resistance [1] VBEsat base-emitter saturation voltage [1] IC = 1 A; IB = 100 mA IC = 4 A; IB = 400 mA PBSS4032SPN Product data sheet VBEon base-emitter turn-on voltage VCE = 2 V; IC = 2 A td delay time VCC = 12.5 V; IC = 1 A; IBon = 0.05 A; IBoff = −0.05 A [1] tr rise time - 30 - ns ton turn-on time - 65 - ns ts storage time - 150 - ns tf fall time - 65 - ns toff turn-off time - 215 - ns fT transition frequency VCE = 10 V; IC = 100 mA; f = 100 MHz - 140 - MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - 65 - pF All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 7 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor Table 8. Characteristics …continued Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCB = −30 V; IE = 0 A - - −100 nA VCB = −30 V; IE = 0 A; Tj = 150 °C - - −50 μA TR2; PNP low VCEsat transistor ICBO collector-base cut-off current ICES collector-emitter cut-off current VCE = −24 V; VBE = 0 V - - −100 nA IEBO emitter-base cut-off current VEB = −5 V; IC = 0 A - - −100 nA hFE DC current gain VCE = −2 V IC = −500 mA 200 380 - IC = −1 A 200 330 - IC = −2 A 150 250 - IC = −4 A 60 100 - 40 60 - IC = −1 A; IB = −50 mA - −115 −165 mV IC = −1 A; IB = −10 mA - −170 −240 mV IC = −2 A; IB = −40 mA - −210 −300 mV IC = −4 A; IB = −400 mA - −260 −390 mV IC = −4 A; IB = −200 mA - −300 −450 mV - −340 −510 mV - 65 98 mΩ - −0.8 −0.9 V - −0.99 −1.1 V - −0.81 −0.9 V - 30 - ns - 60 - ns [1] IC = −5 A VCEsat collector-emitter saturation voltage [1] IC = −5 A; IB = −250 mA RCEsat collector-emitter IC = −4 A; IB = −400 mA saturation resistance [1] VBEsat base-emitter saturation voltage [1] IC = −1 A; IB = −100 mA IC = −4 A; IB = −400 mA VBEon base-emitter turn-on voltage VCE = −2 V; IC = −2 A td delay time tr rise time VCC = −12.5 V; IC = −1 A; IBon = −0.05 A; IBoff = 0.05 A ton turn-on time - 90 - ns ts storage time - 140 - ns tf fall time - 80 - ns toff turn-off time - 220 - ns fT transition frequency - 115 - MHz Cc collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz - 85 - pF [1] PBSS4032SPN Product data sheet VCE = −10 V; IC = −100 mA; f = 100 MHz [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 8 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac306 1000 006aac307 12.0 hFE IB (mA) = 70 IC (A) (1) 800 56 42 8.0 (2) 600 63 49 35 28 21 14 400 (3) 4.0 7 200 0 10−1 1 102 10 0.0 0.0 103 104 IC (mA) 1.0 2.0 3.0 4.0 5.0 VCE (V) Tamb = 25 °C VCE = 2 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 5. TR1 (NPN): DC current gain as a function of collector current; typical values Fig 6. 006aac308 1.2 TR1 (NPN): Collector current as a function of collector-emitter voltage; typical values 006aac309 1.2 VBEsat (V) VBE (V) 1.0 (1) 0.8 (1) 0.8 (2) (2) (3) 0.6 0.4 (3) 0.4 0.0 10−1 1 10 102 0.2 10−1 103 104 IC (mA) 1 VCE = 2 V IC/IB = 20 (1) Tamb = −55 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = 100 °C (3) Tamb = 100 °C Fig 7. TR1 (NPN): Base-emitter voltage as a function of collector current; typical values PBSS4032SPN Product data sheet Fig 8. 102 103 104 IC (mA) TR1 (NPN): Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 10 © NXP B.V. 2010. All rights reserved. 9 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac310 1 006aac311 1 VCEsat (V) VCEsat (V) 10−1 10−1 (1) (1) (2) (2) (3) 10−2 10−1 1 10 (3) 102 103 104 IC (mA) 10−2 10−1 1 102 103 104 IC (mA) Tamb = 25 °C IC/IB = 20 (1) Tamb = 100 °C (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Fig 9. 10 TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values 006aac312 103 Fig 10. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values RCEsat (Ω) RCEsat (Ω) 102 102 10 10 1 006aac313 103 1 (1) (1) (2) (2) 10−1 10−1 (3) 10−2 10−1 1 10 102 (3) 103 104 IC (mA) 10−2 10−1 1 (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Fig 11. TR1 (NPN): Collector-emitter saturation resistance as a function of collector current; typical values Product data sheet 102 103 104 IC (mA) Tamb = 25 °C IC/IB = 20 (1) Tamb = 100 °C PBSS4032SPN 10 Fig 12. TR1 (NPN): Collector-emitter saturation resistance as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 10 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac314 800 006aac315 −12.0 hFE IB (mA) = −600 IC (A) (1) −480 −360 600 −8.0 −240 (2) −540 −420 −300 −180 −120 400 −60 −4.0 (3) 200 0 −10−1 −1 −10 −102 −103 −104 IC (mA) 0.0 0.0 VCE = −2 V −1.0 −2.0 −3.0 −4.0 −5.0 VCE (V) Tamb = 25 °C (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 13. TR2 (PNP): DC current gain as a function of collector current; typical values 006aac316 −1.4 Fig 14. TR2 (PNP): Collector current as a function of collector-emitter voltage; typical values 006aac317 −1.4 VBE (V) VBEsat (V) −1.0 −1.0 (1) (1) (2) (2) −0.6 −0.6 (3) (3) −0.2 −10−1 −1 −10 −102 −103 −104 IC (mA) −0.2 −10−1 VCE = −2 V −1 −103 −104 IC (mA) (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = 100 °C (3) Tamb = 100 °C Fig 15. TR2 (PNP): Base-emitter voltage as a function of collector current; typical values Product data sheet −102 IC/IB = 20 (1) Tamb = −55 °C PBSS4032SPN −10 Fig 16. TR2 (PNP): Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 11 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 006aac318 −1 006aac319 −1 VCEsat (V) VCEsat (V) −10−1 −10−1 (1) (1) (2) (2) (3) −10−2 −10−1 −1 (3) −10 −102 −103 −104 IC (mA) −10−2 −10−1 −1 −10 −102 −103 −104 IC (mA) Tamb = 25 °C IC/IB = 20 (1) Tamb = 100 °C (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Fig 17. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values 006aac320 103 Fig 18. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values RCEsat (Ω) RCEsat (Ω) 102 102 10 10 1 006aac321 103 1 (1) (1) (2) (2) 10−1 10−1 (3) 10−2 −10−1 −1 −10 −102 (3) −103 −104 IC (mA) 10−2 −10−1 −1 (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Fig 19. TR2 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values Product data sheet −102 −103 −104 IC (mA) Tamb = 25 °C IC/IB = 20 (1) Tamb = 100 °C PBSS4032SPN −10 Fig 20. TR2 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 12 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 8. Test information IB input pulse (idealized waveform) 90 % IBon (100 %) 10 % IBoff output pulse (idealized waveform) IC 90 % IC (100 %) 10 % t td ts tr ton tf toff 006aaa003 Fig 21. TR1 (NPN): BISS transistor switching time definition VBB RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω oscilloscope R2 VI DUT R1 mlb826 VCC = 12.5 V; IC = 1 A; IBon = 0.05 A; IBoff = −0.05 A Fig 22. TR1 (NPN): Test circuit for switching times PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 13 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor − IB input pulse (idealized waveform) 90 % − I Bon (100 %) 10 % − I Boff output pulse (idealized waveform) − IC 90 % − I C (100 %) 10 % t td ts tr t on tf t off 006aaa266 Fig 23. TR2 (PNP): BISS transistor switching time definition VBB RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω oscilloscope R2 VI DUT R1 mgd624 VCC = −12.5 V; IC = −1 A; IBon = −0.05 A; IBoff = 0.05 A Fig 24. TR2 (PNP): Test circuit for switching times PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 14 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 9. Package outline 5.0 4.8 1.75 1.0 0.4 6.2 5.8 4.0 3.8 pin 1 index 1.27 0.49 0.36 Dimensions in mm 0.25 0.19 03-02-18 Fig 25. Package outline SOT96-1 (SO8) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PBSS4032SPN [1] PBSS4032SPN Product data sheet Package SOT96-1 Description 8 mm pitch, 12 mm tape and reel Packing quantity 1000 2500 -115 -118 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 15 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 11. Soldering 5.50 0.60 (8×) 1.30 4.00 6.60 7.00 1.27 (6×) solder lands occupied area placement accuracy ± 0.25 Dimensions in mm sot096-1_fr Fig 26. Reflow soldering footprint SOT96-1 (SO8) 1.20 (2×) 0.60 (6×) enlarged solder land 0.3 (2×) 1.30 4.00 6.60 7.00 1.27 (6×) 5.50 board direction solder lands occupied area solder resist placement accurracy ± 0.25 Dimensions in mm sot096-1_fw Fig 27. Wave soldering footprint SOT96-1 (SO8) PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 16 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PBSS4032SPN v.1 20100714 Product data sheet - - PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 17 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. 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No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 18 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PBSS4032SPN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 14 July 2010 © NXP B.V. 2010. All rights reserved. 19 of 20 PBSS4032SPN NXP Semiconductors 30 V NPN/PNP low VCEsat (BISS) transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Packing information . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 July 2010 Document identifier: PBSS4032SPN