UM5060 - Union Semiconductor

UM5060
Bidirectional Single Line TVS Protection Diode
UM5060 SOD523
General Description
The UM5060 TVS protection diode is designed to replace multilayer varistors (MLVs) in portable
applications such as cell phones, notebook computers, and PDA’s. They feature large cross-sectional
area junctions for conducting high transient currents, offer desirable electrical characteristics for
board level protection, such as fast response time, lower operating voltage, lower clamping voltage
and no device degradation when compared to MLVs. The UM5060 TVS protection diode protects
sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and
other voltage induced transient events. The UM5060 is available in SOD523 package with working
voltages of 5 volt. It gives designer the flexibility to protect bidirectional single line in applications
where arrays are not practical. Additionally, it may be “sprinkled” around the board in applications
where board space is at a premium. It may be used to meet the ESD immunity requirements of IEC
61000-4-2, ±30kV air, ±30kV contact discharge.
Applications
Cell Phone Handsets and Accessories
Personal Digital Assistants (PDA’s)
Notebooks, Desktops and Servers
Portable Instrumentation
Cordless Phones
Smart Card
Digital Cameras
MP3 Players
Pin Configurations
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact)
Small package for use in portable electronics
Suitable replacement for MLV’s in ESD protection
applications
Bidirectional TVS protection
Stand off voltages: 5V
Low leakage current
Low diode capacitance
Top View
UM5060
SOD523
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UM5060
Ordering Information
Part
Number
Working
Voltage
Packaging Type
Channel
Marking
Code
Shipping Qty
UM5060
5.0V
SOD523
1
ZK
3000/7 Inch
Tape & Reel
Absolute Maximum Ratings
RATING
Peak Pulse Power (tp = 8/20μs)
Maximum Peak Pulse Current (t=8/20μs)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
SYMBOL
PPK
IPP
TL
TJ
TSTG
VALUE
140
11
260 (10 sec.)
-55 to +125
-55 to +150
UNITS
Watts
Amps
°C
°C
°C
-
Symbol Definition
PARAMETER
Maximum Reverse Peak Pulse Current
Clamping Voltage @ Ipp
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
Test Current
Peak Power Dissipation
Max. Capacitance @ VR = 0V, f = 1MHz
SYMBOL
IPP
VC
VRWM
IR
VBR
IT
PPK
CJ
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UM5060
Electrical Characteristics (T=25°C, Device for 5.0V Reverse Stand-off Voltage)
PARAMETER
SYMBOL
Reverse Stand-Off
Voltage
Reverse Breakdown
Voltage
CONDITIONS
MIN
TYP
MAX
UNIT
5
V
8.5
V
μA
VRWM
VBR
IT = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
1
Clamping Voltage
VC
IPP = 5A, tp = 8/20μS
9.7
13.6
Junction Capacitance
Junction Capacitance
CJ
CJ
IPP =11A, tp = 8/20μS
VR = 0V, f = 1MHz
6.5
40
30
VR = 2.5V, f = 1MHz
V
55
40
pF
pF
Typical Operating Characteristics
Clamping Voltage vs. Peak Pulse Current
Non-Repetitive Peak Pulse Power vs. Pulse Time
1
13
Clamping Voltage - Vc(V)
Peak Pulse Power - Ppk(kW)
14
0.1
0.02
0.04
12
11
10
9
Waveform
parameters:
tr=8uS
td=20uS
8
7
6
0.1
1
10
100
1000
0
2
Pulse Duration - tp(uS)
4
6
8
10
12
Peak Pulse Current - Ipp(A)
Junction Capacitance vs. Reverse Voltage
Junction Capacitance(pF)
50
45
40
35
30
0
1
2
3
4
5
Reverse Voltage (V)
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UM5060
Applications Information
Device Connection Options
UM5060 ESD protection diode is designed to protect one bidirectional data, I/O or power supply line
from the damage caused by ESD and surge pulses. The device is bidirectional and may be used on
lines where the signal polarity is above ground and below ground.
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Avoid using shared transient return paths to a common ground point.
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UM5060
Package Information
UM5060 SOD523
Outline Drawing
Symbol
A
A1
b
c
D
E
E1
E2
L
θ
millimeters
Min
Max
0.510
0.770
0.500
0.700
0.250
0.350
0.080
0.150
0.750
0.850
1.100
1.300
1.500
1.700
0.200REF
0.010
0.070
7°REF
Inches
Min
Max
0.020
0.031
0.020
0.028
0.010
0.014
0.003
0.006
0.030
0.033
0.043
0.051
0.059
0.067
0.008REF
0.001
0.003
7°REF
Land Pattern
NOTES:
1. Compound dimension: 1.20×0.80;
2. Unit: mm;
3. General tolerance ±0.05 mm unless otherwise specified;
4. The layout is just for reference.
Tape and Reel Orientation
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UM5060
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be accurate.
Nonetheless, this document is subject to change without notice. Union assumes no responsibility for
any inaccuracies that may be contained in this document, and makes no commitment to update or to
keep current the contained information, or to notify a person or organization of any update. Union
reserves the right to make changes, at any time, in order to improve reliability, function or design and
to attempt to supply the best product possible.
Union Semiconductor, Inc
Add: 7F, No. 5, Bibo Road, Shanghai 201203
Tel: 021-51097928
Fax: 021-51026018
Website: www.union-ic.com
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