UESD6V8S2B Dual Line ESD Protection Diode Array UESD6V8S2B SOT523 General Description The UESD6V8S2B of TVS diode array is designed to protect sensitive electronics from damage or latch-up due to ESD and is for use in applications where board space is at a premium. It is unidirectional device and may be used on lines where the signal polarities are above ground, each device will protect up to two lines. TVS diodes are solid-state devices feature large cross-sectional area junctions for conducting high transient currents, specifically for transient suppression. It offers desirable characteristics for board level protection including fast response time, low operating, low clamping voltage, and no device degradation. The UESD6V8S2B may be used to meet the immunity requirements of IEC 61000-4-2, ±15kV air, ±8kV contact discharge and MIL-STD-883 METHOD 3015, ±8kV HBM. The small package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. Applications Features Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Pin Configurations Transient Protection for Data & Power Lines to IEC 61000-4-2 (ESD) ±15kV (Air), ±8kV (Contact) MIL-STD-883 3015 (HBM) ±8 kV Protect Two I/O Lines Working Voltages: 5V Low Leakage Current Low Operating and Clamping Voltage Solid-State Silicon Avalanche Technology Top View M: Month Code UESD6V8S2B SOT523 ___________________________________________________________________________ http://www.union-ic.com Rev.02 Nov.2014 1/6 UESD6V8S2B Ordering Information Part Number Working Voltage Packaging Type Channel Marking Code Shipping Qty UESD6V8S2B 5.0V SOT523 2 5ZA 3000pcs/7Inch Tape & Reel Absolute Maximum Ratings RATING SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20μs) PPK 140 Watts Peak Pulse Current (tp = 8/20μs) IPP 11 A Lead Soldering Temperature TL 260(10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +125 °C TYP MAX UNIT 5 V 7.2 V μA Storage Temperature Electrical Characteristics PARAMETER SYMBOL Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current VRWM MIN VBR It = 1mA IR VRWM = 5V, T=25°C 0.1 IPP =5A, tp = 8/20μs 9.1 IPP =11A, tp = 8/20μs Pin 1,2 to 3 VR = 0V, f = 1MHz Pin 1,2 to 3 VR = 2.5V, f = 1MHz 13 Clamping Voltage VC Junction Capacitance CJ Junction Capacitance CJ Reverse dynamic resistance Forward dynamic resistance CONDITIONS Rdyn,rev 6 6.8 V 40 50 pF 30 40 pF 0.6 Ω 0.5 Ω IPP=1A~5A Rdyn,fwd ___________________________________________________________________________ http://www.union-ic.com Rev.02 Nov.2014 2/6 UESD6V8S2B Typical Operating Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current 1 Peak Pulse Power - Ppk(kW) 13 Clamping Voltage - Vc(V) 12 0.1 11 10 9 8 Waveform parameters: tr=8uS td=20uS 7 0.02 0.04 0.1 1 10 100 6 1000 0 2 Pulse Duration - tp(uS) Forward Voltage vs. Forward Current 6 8 10 Junction Capacitance vs. Reverse Voltage 50 5 4 3 Waveform parameters: tr=8uS td=20uS 2 Junction Capacitance(pF) 6 Forward Voltage - Vf(V) 4 Peak Pulse Current - Ipp(A) 45 40 35 30 1 2 4 6 8 Forward Current - If(A) 10 0 1 2 3 4 5 Reverse Voltage (V) ___________________________________________________________________________ http://www.union-ic.com Rev.02 Nov.2014 3/6 UESD6V8S2B Application Information UESD6V8S2B ESD protection diode is designed to protect dual data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode should be placed towards the line that is to be protected. Device Connection for Protection of Dual Data Lines The Dual TVS Diode Array is designed to protect up to two unidirectional data lines. The device is connected as follows: Unidirectional protection of two I/O lines is achieved by connecting pins 1 and 2 to the data lines. Pin 3 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground vias. Keep parallel signal paths to a minimum. Avoid running protection conductors in parallel with unprotected conductor. Minimize all printed-circuit board conductive loops including power and ground loops. Avoid using shared transient return paths to a common ground point. ___________________________________________________________________________ http://www.union-ic.com Rev.02 Nov.2014 4/6 UESD6V8S2B Package Information UESD6V8S2B SOT523 Outline Drawing DIMENSIONS MILLIMETERS INCHES Symbol Min Max Min Max A 0.15 0.30 0.006 0.012 B 0.75 0.85 0.030 0.034 C 1.45 1.75 0.058 0.070 D 0.50TYP 0.020TYP G 0.90 1.10 0.036 0.044 H 1.50 1.70 0.060 0.068 J 0.00 0.10 0.000 0.004 K 0.60 0.80 0.024 0.032 L 0.10 0.30 0.004 0.012 M 0.10 0.20 0.004 0.008 N 0.45 0.65 0.018 0.026 α 0° 8° 0° 8° Land Pattern 1.29 0.75 1.00 0.30 NOTES: 1. Compound dimension: 1.60×0.80 ; 2. Unit: mm; 3. General tolerance ±0.05mm unless otherwise specified; 4. The layout is just for reference. 5ZA M Tape and Reel Orientation ___________________________________________________________________________ http://www.union-ic.com Rev.02 Nov.2014 5/6 UESD6V8S2B IMPORTANT NOTICE The information in this document has been carefully reviewed and is believed to be accurate. Nonetheless, this document is subject to change without notice. Union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained information, or to notify a person or organization of any update. Union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. Union Semiconductor, Inc Add: Unit 606, No.570 Shengxia Road, Shanghai 201210 Tel: 021-51093966 Fax: 021-51026018 Website: www.union-ic.com ___________________________________________________________________________ http://www.union-ic.com Rev.02 Nov.2014 6/6