SEMTECH UCLAMP0511P.TCT

uClamp0511P
μClampTM
1-Line ESD protection
PROTECTION PRODUCTS - MicroClamp
Description
Features
The μClamp series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to ESD.
It is designed to replace multilayer varistors (MLVs) in portable applications. It features large cross-sectional area
junctions for conducting high transient currents. It offers superior electrical characteristics such as lower
clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for
board level protection including fast response time, low
operating and clamping voltage, and no device degradation.
The μClampTM0511P is in a 2-pin, RoHS/WEEE
compliant, SLP1006P2 package. It measures
1.0 x 0.6 x 0.5mm. The leads are spaced at a pitch of
0.65mm and are finished with lead-free NiPdAu. Each
device will protect one bidirectional line operating at
±5 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practical. They may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (±15kV air,
±8kV contact discharge). The combination of small
size and high ESD surge capability makes them ideal
for use in portable applications such as cellular
phones, digital cameras, and MP3 players.
TM
‹ Transient protection for data lines to
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.5mm)
Protects one I/O or power line
Low clamping voltage
Working voltage: 5V
Low leakage current
Solid-state silicon-avalanche technology
Mechanical Characteristics
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SLP1006P2 package
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel
Lead Finish: NiPdAu
RoHS/WEEE Compliant
Applications
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Dimensions
Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDAs)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Schematic & PIN Configuration
1.0
2
0.60
0.65
1
0.50
Maximum Dimensions (mm)
Revision 8/15/2008
SLP1006P2 (Bottom View)
1
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uClamp0511P
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
170
Watts
Maximum Peak Pulse Current (tp = 8/20μs)
Ip p
12
A mp s
VESD
+/- 15
+/- 8
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
Op erating Temp erature
Storage Temp erature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 to 2 or 2 to 1
Reverse Breakdown Voltage
V BR
It = 1mA
Pin 1 to 2 or 2 to 1
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Pin 1 to 2 or 2 to 1
Clamping Voltage
VC
Clamping Voltage
Junction Capacitance
© 2008 Semtech Corp.
Maximum
Units
5
V
8
10
V
0.025
1
μA
IPP = 1A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
11
V
VC
IPP = 12A, tp = 8/20μs
Pin 1 to 2 or 2 to 1
14
V
Cj
VR = 0V, f = 1MHz
Pin 1 to 2 or 2 to 1
75
pF
2
Minimum
6
Typical
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uClamp0511P
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
100
% of Rated Power or I PP
Peak Pulse Power - P PP (kW)
90
1
0.1
80
70
60
50
40
30
20
10
0
0
0.01
0.1
1
10
100
25
50
75
100
125
150
Ambient Temperature - TA (oC)
1000
Pulse Duration - tp (us)
ESD Clamping
(8kV Contact per IEC 61000-4-2)
Clamping Voltage vs. Peak Pulse Current
Peak Pulse Current vs. Clamping Voltage
14
Clamping Voltage - VC (V)
12
10
8
6
4
Waveform
Parameters:
tr = 8μs
td = 20μs
2
0
0
2
4
6
8
10
Peak Pulse Current - IPP (A)
12
14
16
Note: Data is taken with a 10x attenuator
Junction Capacitance vs. Reverse Voltage
1.1
f = 1 MHz
1
0.9
CJ(VR) / CJ(VR=0)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
1
© 2008 Semtech Corp.
2
3
Reverse Voltage - VR (V)
4
5
3
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uClamp0511P
PROTECTION PRODUCTS
Applications Information
Device Connection Options
Circuit Diagram
These TVS diodes are designed to protect one data,
I/O, or power supply line. The device is bidirectional and
may be used on lines where the signal polarity can go
above abd below ground.
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
© 2008 Semtech Corp.
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uClamp0511P
PROTECTION PRODUCTS
Applications Information - Spice Model
Figure 1 - uClamp0511P Spice Model
Table 1 - μClamp0511P Spice Parameters
© 2008 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
1.48E-14
1.48E-14
BV
Volt
7.3
7.3
VJ
Volt
0 .7
0.7
RS
O hm
0.157
0.157
IBV
Amp
1 E -3
1E-3
CJO
Farad
85E-12
8 5 E -1 2
TT
sec
2.541E-9
2.541E-9
M
--
0.126
0.126
N
--
1.1
1.1
EG
eV
1.11
1.11
5
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uClamp0511P
PROTECTION PRODUCTS
Outline Drawing - SLP1006P2
A
B
D
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
E
A
A1
b
D
E
e
L
R
N
aaa
bbb
TOP VIEW
A
SEATING
PLANE
aaa C
C
A1
.016 .020 .022
.000 .001 .002
.018 .020 .022
.035 .039 .043
.020 .024 .028
.026 BSC
.008 .010 .012
.002 .004 .006
2
.003
.004
0.40 0.50 0.55
0.00 0.03 0.05
0.45 0.50 0.55
0.90 1.00 1.10
0.50 0.60 0.70
0.65 BSC
0.20 0.25 0.30
0.05 0.10 0.15
2
0.08
0.10
PIN 1 ID
R
bxN
bbb
C A B
2x L
e
BOTTOM VIEW
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006P2
DIMENSIONS
Y
(C)
DIM
C
G
X
Y
Z
Z
G
X
INCHES
(.033)
.012
.024
.022
.055
MILLIMETERS
(0.85)
0.30
0.60
0.55
1.40
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2008 Semtech Corp.
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uClamp0511P
PROTECTION PRODUCTS
Marking Code
Ordering Information
O
Part Number
Qty per Reel
Reel Size
uClamp0511P.TCT
3,000
7 Inch
MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
PIN 1 ID
Tape and Reel Specification
A0
0.69 +/-0.10 mm
B0
K0
1.19 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.4 mm
±0.25
(.031)
E
1.750±.10
mm
(.069±.004)
F
P
P0
P2
T
W
3.5±0.05
mm
(.138±.002)
4.0±0.10
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05
mm
(.079±.002)
0.254±0.02
mm (.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2008 Semtech Corp.
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