Datasheet - Union Semiconductor

UM3212
Dual Bidirectional I2C-Bus and SMBus Voltage-Level Translator
UM3212M8 MSOP8
UM3212DA DFN8 2.1×1.6
General Description
The UM3212 is a dual bidirectional I2C-bus and SMBus voltage-level translator with an
enable(EN) input, and is operational from 1.0 V to 3.6 V (Vref(1)) and 1.8 V to 5.5 V(Vbias(ref)(2)).
The UM3212 allows bidirectional voltage translations between 1.0 V and 5 V without the use of a
direction pin. The low ON-state resistance (Ron) of the switch allows connections to be made with
minimal propagation delay. When EN is HIGH, the translator switch is on, and the SCL1 and
SDA1 I/O are connected to the SCL2 and SDA2 I/O, respectively, allowing bidirectional data
flow between ports. When EN is LOW, the translator switch is off, and a high-impedance state
exists between ports.
The UM3212 is not a bus buffer which provides both level translation and physically isolates the
capacitance to either side of the bus when both sides are connected. The UM3212 only isolates
both sides when the device is disabled and provides voltage level translation when active.
The UM3212 can also be used to run two buses, one at 400 kHz operating frequency and the other
at 100 kHz operating frequency. If the two buses are operating at different frequencies, the 100
kHz bus must be isolated when the 400 kHz operation of the other bus is required. If the master is
running at 400 kHz, the maximum system operating frequency may be less than 400 kHz because
of the delays added by the translator.
As with the standard I2C-bus system, pull-up resistors are required to provide the logic HIGH
levels on the translator’s bus. The UM3212 has a standard open-collector configuration of the
I2C-bus. The size of these pull-up resistors depends on the system, but each side of the translator
must have a pull-up resistor. The device is designed to work with Standard-mode, Fast-mode and
Fast-mode Plus I2C-bus devices in addition to SMBus devices. The maximum frequency is
dependent on the RC time constant, but generally supports > 2 MHz.
When the SDA1 or SDA2 port is LOW, the clamp is in the ON-state and a low resistance
connection exists between the SDA1 and SDA2 ports. Assuming the higher voltage is on the
SDA2 port when the SDA2 port is HIGH, the voltage on the SDA1 port is limited to the voltage
set by VREF1. When the SDA1 port is HIGH, the SDA2 port is pulled to the drain pull-up supply
voltage (Vpu(D)) by the pull-up resistors. This functionality allows a seamless translation between
higher and lower voltages selected by the user without the need for directional control. The
SCL1/SCL2 channel also functions as the SDA1/SDA2 channel.
All channels have the same electrical characteristics and there is minimal deviation from one
output to another in voltage or propagation delay. This is a benefit over discrete transistor voltage
translation solutions, since the fabrication of the switch is symmetrical.
The translator provides excellent ESD protection to lower voltage devices, and at the same time
protects less ESD-resistant devices.
Applications






I2C, SMBus and SPI Level Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Cell-Phone Cradles
Portable POS Systems
Portable Communication Devices




Low-Cost Serial Interfaces
Cell-Phones
GPS
Telecommunications Equipment
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UM3212
Features




2-Bit Bidirectional Translator for SDA
and SCL Lines in Mixed-Mode I2C-Bus
Applications
Standard-Mode, Fast-Mode, Fast-Mode
Plus and HS-Mode I2C-Bus and SMBus
Compatible
Less than 3.5ns Maximum Propagation
Delay to Accommodate Standard-Mode
and Fast-Mode I2C-Bus Devices and
Multiple Masters
Allows Voltage Level Translation
between:
1.) 1.0V VREF1 and 1.8V, 2.5V, 3.3V
or 5V VREF2
2.) 1.2V VREF1 and 1.8V, 2.5V, 3.3V
or 5V VREF2
3.) 1.8V VREF1 and 3.3V or 5V
VREF2
4.) 2.5V VREF1 and 5V VREF2
5.) 3.3V VREF1 and 5V VREF2
Pin Configurations









Open-Drain I2C-Bus I/O Ports (SCL1,
SDA1, SCL2 and SDA2)
Provides Bidirectional Voltage Translation
with no Direction Pin
Low 3.0Ω ON-State Connection between
Input and Output Ports Provides Less
Signal Distortion
5V Tolerant I2C-Bus I/O Ports to Support
Mixed-Mode Signal Operation
High-Impedance SCL1, SDA1, SCL2 and
SDA2 Pins for EN = LOW
Lock-up Free Operation
Flow through Pinout for Ease of
Printed-Circuit Board Trace Routing
ESD Protection Exceeds 2000V HBM per
JESD22-A114,
200V
MM
per
JESD22-A115, and 1000V CDM per
JESD22-C101
Packages Offered: MSOP8, DFN8
Top View
8
1
8
EN
VREF1 2
7
VREF2
3
6
SCL2
SDA1 4
5
SDA2
GND
SCL1
7
6
5
3212
XX
1
2
3
4
XX: Week Code
UM3212M8
MSOP8
1
8
VREF1
2
7 VREF2
SCL1
3
6
SCL2
SDA1
4
5
SDA2
3212
M
EN
GND
M: Month Code
UM3212DA
DFN8 2.1×1.6
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UM3212
Pin Description
Pin
Number
1
2
Symbol
Function
GND
VREF1
Ground (0V).
Low-voltage side reference supply voltage for SCL1 and SDA1.
Serial clock, low-voltage side; connect to VREF1 through a pull-up
resistor.
Serial data, low-voltage side; connect to VREF1 through a pull-up
resistor.
Serial data, high-voltage side; connect to VREF2 through a pull-up
resistor.
Serial clock, high-voltage side; connect to VREF2 through a pull-up
resistor.
High-voltage side reference supply voltage for SCL2 and SDA2.
Switch enable input; connect to VREF2 and pull-up through a high
resistor.
3
SCL1
4
SDA1
5
SDA2
6
SCL2
7
VREF2
8
EN
Ordering Information
Part Number
Packaging Type
Marking Code
UM3212M8
MSOP8
3212
UM3212DA
DFN8 2.1×1.6
3212
Shipping Qty
3000pcs/13Inch
Tape & Reel
3000pcs/7Inch
Tape & Reel
Absolute Maximum Ratings (Note 1)
Over operating free-air temperature range (unless otherwise noted)
Symbol
Parameter
Vref(1)
Reference Voltage (1)
Vbias(ref)(2)
Reference Bias Voltage (2)
VI
VI/O
Ich
Value
-0.5 to +6
-0.5 to +6
Unit
V
V
Input Voltage
-0.5(Note 2) to +6
V
Voltage on an input/output pin
-0.5(Note 2) to +6
V
+128
mA
Channel Current (DC)
IIK
Input Clamp Current
-50
mA
VI<0V
Tstg
Storage Temperature Range
-65 to +150
°C
Note 1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent
damage to the device. These are stress ratings only and functional operation of the device at these
or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
Note 2: The input and input/output negative voltage ratings may be exceeded if the input and
input/output clamp current ratings are observed.
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UM3212
Recommended Operating Conditions
Symbol
Parameter
Voltage on an input/
output pin
Conditions
SCL1, SDA1,
SCL2, SDA2
Min
Max
Unit
0
5
V
Vref(1)(Note 3)
Reference Voltage (1)
VREF1
0
5
V
Vbias(ref)(2)
(Note 3)
Reference Bias Voltage (2)
VREF2
0
5
V
VI(EN)
Input Voltage on pin EN
0
5
V
Isw(pass)
Pass Switch Current
64
mA
+85
°C
VI/O
Operating in
-40
free-air
Note 3:Vref(1) ≤ Vbias(ref)(2) −1 V for best results in level shifting applications.
Tamb
Ambient Temperature
Electrical Characteristics
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol
Parameter
Conditions
VIK
Input Clamping Voltage
HIGH-level
Input Current
Input Capacitance on
pin EN
Off-state input/output
capacitance
On-state input/output
capacitance
II = −18 mA; VI(EN) = 0 V
VI= 5 V;
VI(EN) = 0 V
IIH
Ci(EN)
Cio(off)
Cio(on)
Ron
ON-state
resistance(Note 5)
VI= 0 V or 3 V
SCLn, SDAn;
VO= 0 V or 3 V ; VI(EN) = 0V
SCLn, SDAn;
VO= 0 V or 3 V ; VI(EN) = 3V
SCLn, SDAn; EN = 4.5V
EN = 3V
(Note 6)
VI = 0;
EN = 2.3V
IO = 64mA
EN = 1.5V
SCLn, SDAn; EN = 4.5V
VI = 2.4V;
EN = 3V
IO = 15mA
SCLn, SDAn;
VI = 1.7V;
EN = 2.3V
IO = 15mA
Min
Typ(Note 4)
Max
Unit
-1.2
V
5
μA
13
pF
10
12.2
pF
8
12
pF
2.0
2.4
3.1
11
4.6
5.0
6.0
8.0
32
7.5
Ω
50
80
50
80
Note 4:All typical values are at Tamb = 25°C.
Note 5:Measured by the voltage drop between the SCL1 and SCL2, or SDA1 and SDA2
terminals at the indicated current through the switch.
ON-state resistance is determined by the lowest voltage of the two terminals.
Note 6:Guaranteed by design.
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UM3212
Switching Characteristics (translating down)
Over recommended operating free-air temperature range (unless otherwise noted). Values
guaranteed by design.
CL=50pF
CL=30pF
CL=15pF
Test
Symbol
Parameter
Unit
Conditions Min Max Min Max Min Max
VI(EN) = 3.3 V; VIH = 3.3 V; VIL = 0 V; VM =1.15V(see Figure 1).
LOW to HIGH from (input)
tPLH
propagation
0
2.5
0
1.7
0
1.2
ns
SCL2 or
delay
SDA2
HIGH to LOW to (output)
SCL1 or
tPHL
propagation
0
2.5
0
2.0
0
1.3
ns
SDA1.
delay
VI(EN) =2.5V; VIH = 2.5 V; VIL = 0 V; VM = 0.75 V (see Figure 1).
LOW to HIGH from (input)
tPLH
propagation
0
2.5
0
1.7
0
1.2
ns
SCL2 or
delay
SDA2
HIGH to LOW to (output)
SCL1 or
tPHL
propagation
0
3.0
0
2.0
0
1.3
ns
SDA1.
delay
Switching Characteristics (translating up)
Over recommended operating free-air temperature range (unless otherwise noted). Values
guaranteed by design.
CL=50pF
CL=30pF
CL=15pF
Test
Symbol
Parameter
Unit
Conditions Min Max Min Max Min Max
VI(EN) = 3.3 V; VIH = 2.3 V; VIL = 0 V; VTT = 3.3 V; VM = 1.15 V; RL = 300 Ω(see Figure 1).
LOW to HIGH from (input)
tPLH
propagation
0
2.35
0
1.5
0
1.0
ns
SCL1 or
delay
SDA1
HIGH to LOW to (output)
SCL2 or
tPHL
propagation
0
3.35
0
2.25
0
1.4
ns
SDA2.
delay
VI(EN) =2.5V; VIH = 1.5 V; VIL = 0 V; VTT = 2.5 V; VM = 0.75 V; RL = 300 Ω (see Figure 1).
LOW to HIGH from (input)
tPLH
propagation
0
2.35
0
1.5
0
1.0
ns
SCL1 or
delay
SDA1
HIGH to LOW to (output)
SCL2 or
tPHL
propagation
0
3.5
0
2.5
0
1.5
ns
SDA2.
delay
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UM3212
VIH
VTT
VM
VM
input
VIL
RL
S1
from output under test
S2(OPEN)
VOH
CL
VM
VM
output
VOL
a. Load circuit
B. Timing diagram; high-impedance scope probe used
S1 = translating up; S2 = translating down.
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Zo = 50 Ω; tr ≤ 5 ns; tf ≤ 5 ns.
The outputs are measured one at a time, with one transition per measurement.
Fig 1. Load circuit for outputs
Typical Application Circuit
Vpu(D)=3.3V(1)
200kΩ
Vref(1)=1.8V
(1)
UM3212
8 EN
VREF1
2
RPU
Vcc
SCL
I2C-BUS
MASTER
SDA
GND
7
RPU
RPU
VREF2
RPU
SCL1
SDA1
3
4
SW
SW
1
6
5
SCL2
SDA2
Vcc
SCL
I2C-BUS
DEVICE
SDA
GND
GND
(1) The applied voltages at Vref(1) and Vpu(D) should be such that Vbias(ref)(2) is at least 1 V higher than
Vref(1) for best translator operation.
Fig 2. Typical application circuit (switch always enabled)
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UM3212
Vpu(D)=3.3V(1)
3.3V enable signal(1)
on
off
200kΩ
Vref(1)=1.8V
(1)
UM3212
8 EN
VREF1
2
RPU
Vcc
SCL1
SDA
GND
RPU
RPU
SCL
I2C-BUS
MASTER
7
RPU
VREF2
SDA1
3
4
SW
SW
1
6
5
SCL2
SDA2
Vcc
SCL
I2C-BUS
DEVICE
SDA
GND
GND
(1) In the Enabled mode, the applied enable voltage VI(EN) and the applied voltage at Vref(1) should be
such that Vbias(ref)(2) is at least 1 V higher than Vref(1) for best translator operation.
Fig 3. Typical application circuit (switch enable control)
Applications Information
Bidirectional translation
For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to
higher voltage), the EN input must be connected to VREF2 and both pins pulled to HIGH side
Vpu(D) through a pull-up resistor (typically 200 kΩ). This allows VREF2 to regulate the EN input.
A filter capacitor on VREF2 is recommended. The I2C-bus master output can be totem pole or
open-drain (pull-up resistors may be required) and the I2C-bus device output can be totem pole or
open-drain (pull-up resistors are required to pull the SCL2 and SDA2 outputs to Vpu(D)). However,
if either output is totem pole, data must be unidirectional or the outputs must be 3-stateable and be
controlled by some direction-control mechanism to prevent HIGH-to-LOW contentions in either
direction. If both outputs are open-drain, no direction control is needed.
The reference supply voltage (Vref(1)) is connected to the processor core power supply voltage.
When VREF2 is connected through a 200 kΩ resistor to a 3.3 V to 5.5 V Vpu(D) power supply, and
Vref(1) is set between 1.0 V and (Vpu(D) −1 V), the output of each SCL1 and SDA1 has a maximum
output voltage equal to VREF1, and the output of each SCL2 and SDA2 has a maximum output
voltage equal to Vpu(D).
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UM3212
Application operating conditions
Refer to Figure 2
Symbol
Parameter
Vbias(ref)(2)
VI(EN)
Vref(1)
Isw(pass)
Iref
Reference Bias Voltage (2)
Input Voltage on pin EN
Reference Voltage (1)
Pass Switch Current
Reference Current
Conditions
Transistor
Operating
Tamb
Ambient Temperature
in free-air
Note 7: All typical values are at Tamb = 25 °C.
Vref(1) + 0.6
Vref(1) + 0.6
0
-
Typ
(Note 7)
2.1
2.1
1.5
14
5
-40
-
Min
Max
Unit
5
5
4.4
-
V
V
V
mA
μA
+85
°C
Sizing pull-up resistor
The pull-up resistor value needs to limit the current through the pass transistor when it is in the
ON state to about 15mA. This ensures a pass voltage of 260 mV to 350 mV. If the current through
the pass transistor is higher than 15mA, the pass voltage also is higher in the ON state. To set the
current through each pass transistor at 15mA, the pull-up resistor value is calculated as:
RPU 
V pu( D )  0.35V
0.015 A
The table below summarizes resistor reference voltages and currents at 15mA, 10mA, and 3mA.
The resistor values shown in the +10 % column or a larger value should be used to ensure that the
pass voltage of the transistor would be 350 mV or less. The external driver must be able to sink
the total current from the resistors on both sides of the UM3212 device at 0.175 V, although the
15mA only applies to current flowing through the UM3212 device
Pull-up resistor values
Calculated for VOL = 0.35 V; assumes output driver VOL = 0.175 V at stated current.
Pull-up resistor value (Ω)
15mA
10mA
3mA
Vpu(D)
+10 %
+10 %
+10 %
Nominal
Nominal
Nominal
(Note 8)
(Note 8)
(Note 8)
5V
310
341
465
512
1550
1705
3.3V
197
217
295
325
983
1082
2.5V
143
158
215
237
717
788
1.8V
97
106
145
160
483
532
1.5V
77
85
115
127
383
422
1.2V
57
63
85
94
283
312
Note 8: +10 % to compensate for VCC range and resistor tolerance.
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UM3212
Package Information
UM3212M8: MSOP8
Outline Drawing
D
E3
L
0.750
0.750
Symbol
E1
E
E1
c
e
Ø0.60mm×0.038DP
θ
Top View
A3
A
A2
End View
A1
b
Side View
A
A1
A2
A3
b
c
D
E
E1
E3
e
L
θ
DIMENSIONS
MILLIMETERS
Min
Max
1.10
0.05
0.15
0.75
0.95
0.29
0.49
0.22
0.38
0.08
0.23
2.90
3.10
4.70
5.10
2.90
3.10
2.85
3.05
0.65(BSC)
0.40
0.80
0°
8°
INCHES
Min
Max
0.044
0.002 0.006
0.030 0.038
0.012 0.020
0.009 0.015
0.003 0.009
0.116 0.124
0.188 0.204
0.116 0.124
0.114 0.122
0.026(BSC)
0.016 0.032
0°
8°
4.8
1.02
Land Pattern
0.65
0.41
NOTES:
1. Compound dimension: 3.00×3.00;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
3212
XX
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UM3212
UM3212DA: DFN8 2.1×1.6
A
Outline Drawing
Side View
A3
A1
Symbol
D
D2
L
E
E2
Pin1 ID
C0.2*45
e
b
Bottom View
D
E
D2
E2
A
A1
A3
b
L
e
DIMENSIONS
MILLIMETERS
Min
Typ
2.05
2.10
1.55
1.60
1.60
1.70
0.30
0.40
0.545
0.575
0.02
0.13TYP
0.20
0.25
0.275
0.325
0.50TYP
Max
2.175
1.675
1.80
0.50
0.605
0.05
0.30
0.375
Land Pattern
NOTES:
1. Compound dimension: 2.10×1.60;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
3212
M
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UM3212
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be
accurate. Nonetheless, this document is subject to change without notice. Union assumes
no responsibility for any inaccuracies that may be contained in this document, and makes
no commitment to update or to keep current the contained information, or to notify a
person or organization of any update. Union reserves the right to make changes, at any
time, in order to improve reliability, function or design and to attempt to supply the best
product possible.
Union Semiconductor, Inc
Add: Unit 606, No.570 Shengxia Road, Shanghai 201210
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
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