PCA9306 Dual Bidirectional I2C-bus and SMBus Voltage-Level Translator The PCA9306 is a dual bidirectional I2C−bus and SMBus voltage−level translator with an enable (EN) input. http://onsemi.com Features MARKING DIAGRAMS • 2−bit Bidirectional Translator for SDA and SCL Lines in • • • • • • • • • • • • • • Mixed−Mode I2C−Bus Applications Standard−Mode, Fast−Mode, and Fast−Mode Plus I2C−Bus and SMBus Compatible Less Than 1.5 ns Maximum Propagation Delay to Accommodate Standard−Mode and Fast−Mode I2C−Bus Devices and Multiple Masters Allows Voltage Level Translation Between: ♦ 1.0 V Vref(1) and 1.8 V, 2.5 V, 3.3 V or 5 V Vbias(ref)(2) ♦ 1.2 V Vref(1) and 1.8 V, 2.5 V, 3.3 V or 5 V Vbias(ref)(2) ♦ 1.8 V Vref(1) and 3.3 V or 5 V Vbias(ref)(2) ♦ 2.5 V Vref(1) and 5 V Vbias(ref)(2) ♦ 3.3 V Vref(1) and 5 V Vbias(ref)(2) Provides Bidirectional Voltage Translation With No Direction Pin Low 3.5 W ON−State Connection Between Input and Output Ports Provides Less Signal Distortion Open−Drain I2C−Bus I/O Ports (SCL1, SDA1, SCL2 and SDA2) 5 V Tolerant I2C−Bus I/O Ports to Support Mixed−Mode Signal Operation High−Impedance SCL1, SDA1, SCL2 and SDA2 Pins for EN = LOW Lock−Up Free Operation Flow Through Pinout for Ease of Printed−Circuit Board Trace Routing Packages Offered: ♦ TSSOP−8, US8, UQFN8, UDFN8 ESD Performance: 4000 V Human Body Model, 400 V Machine Model NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices © Semiconductor Components Industries, LLC, 2013 August, 2013 − Rev. 5 1 8 AAF YWW AG TSSOP−8 DT SUFFIX CASE 948AL 1 8 US8 US SUFFIX CASE 493 AK MG G 1 1 8 UQFN8 MU SUFFIX CASE 523AN UDFN8 1.45 x 1.0 CASE 517BZ AAF, AK, AQ, P A Y WW M G 1 AQ MG PM 1 = Specific Device Code = Assembly Location = Year = Work Week = Date Code = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: PCA9306/D PCA9306 Function Description bus. The PCA9306 has a standard open−collector configuration of the I2C−bus. The size of these pull−up resistors depends on the system, but each side of the translator must have a pull−up resistor. The device is designed to work with Standard−mode, Fast−mode and Fast mode Plus I2C−bus devices in addition to SMBus devices. The maximum frequency is dependent on the RC time constant, but generally supports > 2 MHz. When the SDA1 or SDA2 port is LOW, the clamp is in the ON−state and a low resistance connection exists between the SDA1 and SDA2 ports. Assuming the higher voltage is on the SDA2 port, when the SDA2 port is HIGH, the voltage on the SDA1 port is limited to the voltage set by VREF1. When the SDA1 port is HIGH, the SDA2 port is pulled to the drain pull−up supply voltage (Vpu(D)) by the pull−up resistors. This functionality allows a seamless translation between higher and lower voltages selected by the user without the need for directional control. The SCL1/SCL2 channel also functions as the SDA1/SDA2 channel. All channels have the same electrical characteristics and there is minimal deviation from one output to another in voltage or propagation delay. This is a benefit over discrete transistor voltage translation solutions, since the fabrication of the switch is symmetrical. The translator provides excellent ESD protection to lower voltage devices, and at the same time protects less ESD−resistant devices. The PCA9306 is a dual bidirectional I2C−bus and SMBus voltage−level translator with an enable (EN) input, and is operational from 1.0 V to 3.6 V (Vref(1)) and 1.8 V to 5.5 V (Vbias(ref)(2)). The PCA9306 allows bidirectional voltage translations between 1.0 V and 5 V without the use of a direction pin. The low ON−state resistance (Ron) of the switch allows connections to be made with minimal propagation delay. When EN is HIGH, the translator switch is on, and the SCL1 and SDA1 I/O are connected to the SCL2 and SDA2 I/O, respectively, allowing bidirectional data flow between ports. When EN is LOW, the translator switch is off, and a high−impedance state exists between ports. The PCA9306 is not a bus buffer that provides both level translation and physical capacitance isolation to either side of the bus when both sides are connected. The PCA9306 only isolates both sides when the device is disabled and provides voltage level translation when active. The PCA9306 can be used to run two buses, one at 400 kHz operating frequency and the other at 100 kHz operating frequency. If the two buses are operating at different frequencies, the 100 kHz bus must be isolated when the 400 kHz operation of the other bus is required. If the master is running at 400 kHz, the maximum system operating frequency may be less than 400 kHz because of the delays added by the translator. As with the standard I2C−bus system, pull−up resistors are required to provide the logic HIGH levels on the translator’s FUNCTIONAL DIAGRAM Figure 1. Logic Diagram http://onsemi.com 2 PCA9306 PIN ASSIGNMENTS Figure 2. TSSOP−8 / US8 Pinouts Figure 3. UQFN8 Pinout (Top Thru View) Figure 4. UDFN8 Pinout (Top Thru View) Table 1. PIN DESCRIPTION Pin GND VREF1 Description Ground Low−voltage side reference supply voltage for SCL1 and SDA1 SCL1 Serial clock, low−voltage side; connect to VREF1 through a pull−up resistor SDA1 Serial data, low−voltage side; connect to VREF1 through a pull−up resistor SDA2 Serial data, high−voltage side; connect to VREF2 through a pull−up resistor SCL2 Serial clock, high−voltage side; connect to VREF2 through a pull−up resistor VREF2 EN High−voltage side reference supply voltage for SCL2 and SDA2 Switch enable input; connect to VREF2 and pull−up through a high resistor Table 2. FUNCTION TABLE Input EN (Note 1) Function Low Disconnect High SCL1 = SCL2; SDA1 = SDA2 1. EN is controlled by the Vbias(ref)(2) logic levels and should be at least 1 V higher than Vref(1) for best translator operation. http://onsemi.com 3 PCA9306 Table 3. MAXIMUM RATINGS Symbol Value Unit Reference Voltage (Note 2) −0.5 to +7.0 V Reference Bias Voltage (Note 3) −0.5 to +7.0 V VIN Input Voltage −0.5 to +7.0 V VI/O Input / Output Pin Voltage −0.5 to +7.0 V ICH DC Channel Current 128 mA IIK DC Input Diode Current VIN < GND Vref(1) Vbias(ref)(2) TSTG Parameter Storage Temperature Range −50 mA −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TL = 260 °C TJ Junction Temperature Under Bias TJ = 150 °C qJA Thermal Resistance (Note 2) qJA = 150 °C/W PD Power Dissipation in Still Air at 85°C PD = 833 mW MSL FR VESD ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD Withstand Voltage Human Body Mode (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Latchup Performance Above VCC and Below GND at 125 °C (Note 6) > 4000 > 400 N/A V ±100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 3. Tested to EIA / JESD22−A114−A. 4. Tested to EIA / JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA / JESD78. Table 4. RECOMMENDED OPERATING CONDITIONS Symbol Vref(1) Vbias(ref)(2) VI/O VI(EN) Isw(pass) TA Parameter Min Max Unit Reference Voltage (1) (Note 7) VREF1 0 5.5 V Reference Bias Voltage (2) (Note 7) VREF2 0 5.5 V Input / Output Pin Voltage SCL1, SDA1, SCL2, SDA2 0 5.5 V Control Pin Input Voltage EN 0 5.5 V 0 64 mA −55 +125 °C Pass Switch Current Operating Free−Air Temperature 7. V(ref)(1) ≤ Vbias(ref)(2) −1 V for best results in level shifting applications. http://onsemi.com 4 PCA9306 Table 5. DC ELECTRICAL CHARACTERISTICS TA = −555C to +1255C Symbol Parameter Conditions VIK Input Clamping Voltage II = −18 mA; VI(EN) = 0 V IIH High−Level Input Current VI = 5 V; VI(EN) = 0 V Ci(EN) EN Pin Input Capacitance VI = 3 V or 0 V Ci/O(off) OFF−State I/O Pin Capacitance SCLn, SDAn VO = 3 V or 0 V; VI(EN) = 0 V Ci/O(on) ON−State I/O Pin Capacitance SCLn, SDAn ON−State Resistance(2)(3) SCLn, SDAn RON Typ (Note 8) Min Max Unit −1.2 V 5 mA 7.1 pF 4 6 VO = 3 V or 0 V; VI(EN) = 3 V 9.3 12.5 VI = 0 V; IO = 64 mA VI(EN) = 4.5 V VI(EN) = 3 V VI(EN) = 2.3 V VI(EN) = 1.5 V 2.4 3.0 3.8 9.0 5.0 6.0 8.0 20 VI = 2.4 V; IO = 15 mA VI(EN) = 4.5 V VI(EN) = 3 V 4.8 46 7.5 80 VI = 1.7 V; IO = 15 mA VI(EN) = 2.3 V 40 80 pF pF W 8. All typical values are at TA = 25°C. 9. Measured by the voltage drop between the SCL1 and SCL2, or SDA1 and SDA2 terminals at the indicated current through the switch. ON−state resistance is determined by the lowest voltage of the two terminals. 10. Guaranteed by design. Table 6. AC ELECTRICAL CHARACTERISTICS (Translating Down) − Values Guaranteed by Design Symbol Parameter Test Condition Load Condition TA = −555C to +1255C Min Max Unit CL = 15 pF 0 0.6 ns CL = 30 pF 0 1.2 CL = 50 pF 0 2.0 CL = 15 pF 0 0.75 CL = 30 pF 0 1.5 CL = 50 pF 0 2.0 CL = 15 pF 0 0.6 CL = 30 pF 0 1.2 CL = 50 pF 0 2.0 CL = 15 pF 0 0.75 CL = 30 pF 0 1.5 CL = 50 pF 0 2.5 SEE FIGURE 4 LOAD SWITCH AT S2 POSITION tPLH tPHL tPLH tPHL Low−to−High Propagation Delay, from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 VI(EN) = 3.3 V; VIH = 3.3 V; VIL = 0 V; VM = 1.15 V High−to−Low Propagation Delay, from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 Low−to−High Propagation Delay, from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 VI(EN) = 2.5 V; VIH = 2.5 V; VIL = 0 V; VM = 0.75 V High−to−Low Propagation Delay, from (input) SCL2 or SDA2 to (output) SCL1 or SDA1 http://onsemi.com 5 ns PCA9306 Table 7. AC ELECTRICAL CHARACTERISTICS (Translating Up) − Values Guaranteed by Design TA = −555C to +1255C Symbol Test Condition Load Condition Min Max Unit VI(EN) = 3.3 V; VIH = 2.3 V; VIL = 0 V; VTT = 3.3 V; VM = 1.15 V RL = 300 W, CL = 15 pF 0 0.5 ns RL = 300 W, CL = 30 pF 0 1.0 RL = 300 W, CL = 50 pF 0 1.75 RL = 300 W, CL = 15 pF 0 0.8 RL = 300 W, CL = 30 pF 0 1.65 RL = 300 W, CL = 50 pF 0 2.75 RL = 300 W, CL = 15 pF 0 0.5 RL = 300 W, CL = 30 pF 0 1.0 RL = 300 W, CL = 50 pF 0 1.75 RL = 300 W, CL = 15 pF 0 1.0 RL = 300 W, CL = 30 pF 0 2.0 RL = 300 W, CL = 50 pF 0 3.3 Parameter SEE FIGURE 4 LOAD SWITCH AT S1 POSITION tPLH Low−to−High Propagation Delay, from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 tPHL High−to−Low Propagation Delay, from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 tPLH Low−to−High Propagation Delay, from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 tPHL VI(EN) = 2.5 V; VIH = 1.5 V; VIL = 0 V; VTT = 2.5 V; VM = 0.75 V High−to−Low Propagation Delay, from (input) SCL1 or SDA1 to (output) SCL2 or SDA2 VIH VTT input VM VM VIL RL from output under test ns VOH S1 S2 (open) output VM VM VOL CL A. Load Circuit B. Timing Diagram S1 = translating up; S2 = translating down. CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Zo = 50 W; tr ≤ 2 ns; tf ≤ 2 ns. The outputs are measured one at a time, with one transition per measurement. Figure 5. Load Circuit for Outputs ORDERING INFORMATION Package Shipping† PCA9306DTR2G TSSOP−8 (Pb−Free) 4000 / Tape & Reel PCA9306AMUTCG UQFN−8 (Pb−Free) 3000 / Tape & Reel PCA9306FMUTCG UDFN8 (Pb−Free) 3000 / Tape & Reel PCA9306USG US8 (Pb−Free) Device NLV9306USG* 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 6 PCA9306 APPLICATION INFORMATION VPU(D) = 3.3 V (Note 1) 200 kW VREF(1) = 1.8 V (Note 1) PCA9306 VREF1 RPU 2 8 EN RPU RPU VREF2 7 RPU VCC SCL I2C−Bus MASTER SDA SCL1 3 SDA1 4 SW SW GND 6 SCL2 5 SDA2 VCC SCL I2C−Bus DEVICE SDA 1 GND GND 1. The applied voltages at Vref(1) and Vpu(D) should be such that Vbias(ref)(2) is at least 1 V higher than Vref(1) for best translator operation. Figure 6. Typical Application (Switch Always Enabled) VPU(D) = 3.3 V 3.3 V Enable Signal (Note 2) OFF ON 200 kW VREF(1) = 1.8 V (Note 2) PCA9306 VREF1 RPU VCC SCL 2 8 7 EN RPU RPU VREF2 RPU SCL1 3 6 SCL2 SW I2C−Bus MASTER SDA SDA1 4 GND 5 SDA2 SW 1 SCL VCC I2C−Bus DEVICE SDA GND GND 2. In the Enabled mode, the applied enable voltage and the applied voltage at Vref(1) should be such that Vbias(ref)(2) is at least 1 V higher than Vref(1) for best translator operation. Figure 7. Typical Application (Switch Enable Control) Bidirectional Translation unidirectional or the outputs must be 3−stateable and be controlled by some direction−control mechanism to prevent HIGH−to−LOW contentions in either direction. If both outputs are open−drain, no direction control is needed. The reference supply voltage (Vref(1)) is connected to the processor core power supply voltage. When VREF2 is connected through a 200 kW resistor to a 3.3 V to 5.5 V Vpu(D) power supply, and Vref(1) is set between 1.0 V and (Vpu(D) − 1 V), the output of each SCL1 and SDA1 has a maximum output voltage equal to VREF1, and the output of each SCL2 and SDA2 has a maximum output voltage equal to Vpu(D). For the bidirectional clamping configuration (higher voltage to lower voltage or lower voltage to higher voltage), the EN input must be connected to VREF2 and both pins pulled to HIGH side Vpu(D) through a pull−up resistor (typically 200 kW). This allows VREF2 to regulate the EN input. A filter capacitor on VREF2 is recommended. The I2C−bus master output can be totem−pole or open−drain (pull−up resistors may be required) and the I2C−bus device output can be totem−pole or open−drain (pull−up resistors are required to pull the SCL2 and SDA2 outputs to Vpu(D)). However, if either output is totem−pole, data must be http://onsemi.com 7 PCA9306 Table 8. APPLICATION OPERATING CONDITIONS Refer to Figure 6. Min Typ(1) Max Unit Reference Bias Voltage (2) Vref(1) + 0.6 2.1 5 V VI(EN) EN Pin Input Voltage Vref(1) + 0.6 2.1 5 V Vref(1) Reference Voltage (1) 0 1.5 4.4 V Symbol Parameter Vbias(ref)(2) Isw(pass) Iref Tamb Conditions Pass Switch Current Reference Current Transistor Ambient Temperature Operating in free−air 14 mA 5 mA −55 +125 °C 11. All typical values are at Tamb = 25 °C. Sizing Pull−up Resistor The following table summarizes resistor reference voltages and currents at 15 mA, 10 mA, and 3 mA. The resistor values shown in the +10% column or a larger value should be used to ensure that the pass voltage of the transistor would be 350 mV or less. The external driver must be able to sink the total current from the resistors on both sides of the PCA9306 device at 0.175 V, although the 15 mA only applies to current flowing through the PCA9306 device. The pull−up resistor value needs to limit the current through the pass transistor when it is in the ON state to about 15 mA. This ensures a pass voltage of 260 mV to 350 mV. If the current through the pass transistor is higher than 15 mA, the pass voltage also is higher in the ON state. To set the current through each pass transistor at 15 mA, the pull−up resistor value is calculated as: R PU + V PU(D) * 0.35 V 0.015 A (eq. 1) Table 9. PULLUP RESISTOR VALUES Calculated for VOL = 0.35 V; assumes output driver VOL = 0.175 V at stated current. Pullup Resistor Value (W) 15 mA 10 mA 3 mA Vpu(D) Nominal +10% (Note 12) Nominal +10%(1) Nominal +10% (Note 12) 5V 310 341 465 512 1550 1705 3.3 V 197 217 295 325 983 1082 2.5 V 143 158 215 237 717 788 1.8 V 97 106 145 160 483 532 1.5 V 77 85 115 127 383 422 1.2 V 57 63 85 94 283 312 12. +10% to compensate for VCC range and resistor tolerance. Maximum Frequency Calculation resistor is needed on the 3.3 V side. The capacitance and line length of concern is on the 1.8 V side since it is driven through the ON resistance of the PCA9306. If the line length on the 1.8 V side is long enough there can be a reflection at the chip/terminating end of the wire when the transition time is shorter than the time of flight of the wire because the PCA9306 looks like a high−impedance compared to the wire. If the wire is not too long and the lumped capacitance is not excessive the signal will only be slightly degraded by the series resistance added by passing through the PCA9306. If the lumped capacitance is large the rise time will deteriorate, the fall time is much less affected and if the rise time is slowed down too much the duty cycle of the clock will be degraded and at some point the clock will no longer be useful. So the principle design consideration is to minimize the wire length and the capacitance on the 1.8 V side for the clock path. A pull−up resistor on the 1.8 V side can also be used to trade a slower fall time for a faster rise time and can also reduce the overshoot in some cases. The maximum frequency is totally dependent upon the specifics of the application and the device can operate > 33 MHz. Basically, the PCA9306 behaves like a wire with the additional characteristics of transistor device physics and should be capable of performing at higher frequencies if used correctly. Here are some guidelines to follow that will help maximize the performance of the device: • Keep trace length to a minimum by placing the PCA9306 close to the processor. • The trace length should be less than half the time of flight to reduce ringing and reflections. • The faster the edge of the signal, the higher the chance for ringing. • The higher the drive strength (up to 15 mA), the higher the frequency the device can use. In a 3.3 V to 1.8 V direction level shift, if the 3.3 V side is being driven by a totem pole type driver no pull−up http://onsemi.com 8 PCA9306 PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL ISSUE O b SYMBOL MIN NOM A E1 E MAX 1.20 A1 0.05 0.15 A2 0.80 b 0.19 0.30 c 0.09 0.20 D 2.90 3.00 3.10 E 6.30 6.40 6.50 E1 4.30 4.40 4.50 0.90 e 0.65 BSC L 1.00 REF L1 0.50 θ 0º 0.60 1.05 0.75 8º e TOP VIEW D A2 c q1 A A1 L1 SIDE VIEW L END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. http://onsemi.com 9 PCA9306 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M DIM A B C D F G H J K L M N P R S U V F DETAIL E SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC PCA9306 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN ISSUE O A B D ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C EXPOSED Cu E A1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. MOLD CMPD ÇÇ ÉÉ A3 DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE (0.15) DETAIL A OPTIONAL CONSTRUCTION SOLDERING FOOTPRINT* 1.70 8X 8X L3 L 0.50 PITCH 1 e 5 3 1 DETAIL A MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 0.35 7 8 8X b 0.10 C A B BOTTOM VIEW 1.70 0.05 C 7X NOTE 3 0.25 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 PCA9306 PACKAGE DIMENSIONS UDFN8, 1.45x1, 0.35P CASE 517BZ ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* e/2 e 1 7X 7X L 0.48 4 8X 0.22 L1 1.18 8 5 8X BOTTOM VIEW b 0.10 M C A B 0.05 M C 0.53 NOTE 3 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 12 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative PCA9306/D