BLM7002K

Pb Free Product
BLM7002K
N-Channel Enhancement Mode Power MOSFET
General Features
● VDS = 60V,ID = 0.3A
RDS(ON) < 3Ω @ VGS=5V
RDS(ON) < 2Ω @ VGS=10V
ESD Rating：HBM 2300V
● High power and current handing capability
Schematic diagram
● Lead free product is acquired
● Surface mount package
Application
●Direct logic-level interface: TTL/CMOS
●Drivers: relays, solenoids, lamps, hammers,display,
memories, transistors, etc.
Marking and pin assignment
●Battery operated systems
●Solid-state relays
SOT-23 top view
Package Marking And Ordering Information
Device Marking
7002K
Device
BLM7002K
Device Package
Reel Size
Tape width
Quantity
SOT-23
Ø180mm
8 mm
3000 units
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current (TJ =150℃)
Drain
TA =25℃
TA =100℃
Current-Pulsed (Note 1)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
ID
0.3
0.19
A
IDM
0.8
A
PD
0.35
W
TJ,TSTG
-55 To 150
℃
RθJA
350
℃/W
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient (Note 2)
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Pb Free Product
BLM7002K
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
60
68
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=60V,VGS=0V
-
-
1
μA
Gate-Body Leakage Current
IGSS
VGS=±10V,VDS=0V
-
±100
±500
nA
VGS=±20V,VDS=0V
-
±4
±10
uA
VDS=VGS,ID=250μA
1
1.7
2.5
V
VGS=5V, ID=0.4A
-
1.3
3
Ω
VGS=10V, ID=0.5A
-
1
2
Ω
VDS=10V,ID=0.2A
0.1
-
-
S
-
21
50
PF
-
11
25
PF
-
4.2
5
PF
-
10
-
nS
Off Characteristics
On Characteristics (Note 3)
Gate Threshold Voltage
VGS(th)
Drain-Source On-State Resistance
RDS(ON)
Forward Transconductance
gFS
Dynamic Characteristics (Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS=25V,VGS=0V,
F=1.0MHz
Switching Characteristics (Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=30V,ID=0.2A
-
50
-
nS
td(off)
VGS=10V,RGEN=10Ω
-
17
-
nS
-
10
-
nS
-
1.7
3
nC
-
-
1.3
V
-
-
0.2
A
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
VDS=10V,ID=0.3A,
VGS=4.5V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
Diode Forward Current (Note 2)
IS
VGS=0V,IS=0.2A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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BLM7002K
Typical Electrical And Thermal Characteristics
Vdd
Vgs
Rgen
td(on)
Rl
Vin
D
ton
tr
td(off)
Vout
90%
VOUT
G
toff
tf
90%
INVERTED
10%
10%
90%
S
VIN
50%
50%
10%
PULSE WIDTH
Figure 2:Switching Waveforms
ID- Drain Current (A)
ID- Drain Current (A)
Figure 1:Switching Test Circuit
Vds Drain-Source Voltage (V)
Vgs Gate-Source Voltage (V)
Figure 4 Transfer Characteristics
Rdson On-Resistance(Ω)
Rdson On-Resistance(Ω)
Figure 3 Output Characteristics
Vgs Gate-Source Voltage (V)
ID- Drain Current (A)
Figure 5 Drain-Source On-Resistance
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Figure 6 Rdson vs Vgs
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Pb Free Product
Vgs Gate-Source Voltage (V)
Is- Reverse Drain Current (mA)
BLM7002K
Vsd Source-Drain Voltage (V)
Qg Gate Charge (nC)
Figure 8 Source-DrainDiode Forward
ID- Drain Current (A)
Normalized On-Resistance
Figure 7 Gate Charge
TJ-Junction Temperature(℃)
Figure 10
Safe Operation Area
C Capacitance (pF)
Figure 9 Drain-Source On-Resistance
Vds Drain-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 11 Capacitance vs Vds
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Pb Free Product
r(t),Normalized Effective
Transient Thermal Impedance
BLM7002K
Square Wave Pluse Duration(sec)
Figure 12 Normalized Maximum Transient Thermal Impedance
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Pb Free Product
BLM7002K
SOT-23-3L Package Information
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions in Millimeters
MIN.
MAX.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950TYP
1.800
2.000
0.550REF
0.300
0.500
0°
8°
Notes
1. All dimensions are in millimeters.
2. Tolerance ±0.10mm (4 mil) unless otherwise specified
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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