BLM2302 V2.0

Pb Free Product
BLM2302
N-Channel Enhancement Mode Power MOSFET
DESCRIPTION
D
The BLM2302 uses advanced trench technology to provide
excellent RDS(ON), low gate charge and operation with gate
G
voltages as low as 2.5V. This device is suitable for use as a
Battery protection or in other Switching application.
S
GENERAL FEATURES
Schematic diagram
● VDS = 20V,ID = 2.9A
3
RDS(ON) < 59mΩ @ VGS=2.5V
D
2302
RDS(ON) < 45mΩ @ VGS=4.5V
● High Power and current handing capability
G 1
● Lead free product is acquired
● Surface Mount Package
2 S
Marking and pin Assignment
Application
●Battery protection
●Load switch
●Power management
SOT-23 top view
Package Marking And Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
2302
BLM2302
SOT-23
Ø180mm
8 mm
3000 units
Absolute Maximum Ratings (TA=25℃
℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Drain Current-Continuous
ID
Drain Current-Pulsed (Note 1)
IDM
Maximum Power Dissipation
PD
Operating Junction and Storage Temperature Range
TJ,TSTG
Limit
Unit
20
V
±10
V
2.9
A
10
A
1
W
-55 To 150
℃
125
℃/W
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Off Characteristics
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250µA
20
22
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=20V,VGS=0V
-
-
1
µA
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BLM2302
Gate-Body Leakage Current
IGSS
VGS=±10V,VDS=0V
-
-
±100
nA
Gate Threshold Voltage
VGS(th)
VDS=VGS,ID=250µA
0.5
0.75
1.2
V
Drain-Source On-State Resistance
RDS(ON)
VGS=2.5V, ID=2.5A
-
37
59
mΩ
VGS=4.5V, ID=2.9A
-
30
45
mΩ
VDS=5V,ID=2.9A
-
8
-
S
-
300
-
PF
-
120
-
PF
On Characteristics (Note 3)
Forward Transconductance
gFS
Dynamic Characteristics (Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
-
80
-
PF
Turn-on Delay Time
td(on)
-
10
15
nS
Turn-on Rise Time
tr
VDD=10V,ID=2.9A
-
50
85
nS
td(off)
VGS=4.5V,RGEN=6Ω
-
17
45
nS
-
10
20
nS
-
4.0
10
nC
-
0.65
-
nC
-
1.2
-
nC
-
0.75
1.2
V
-
-
2.9
A
VDS=10V,VGS=0V,
F=1.0MHz
Switching Characteristics (Note 4)
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=10V,ID=2.9A,
VGS=4.5V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
Diode Forward Current (Note 2)
IS
VGS=0V,IS=2.9A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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Pb Free Product
BLM2302
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
Vdd
Vgs
Rgen
td(on)
Rl
Vin
D
ton
tr
td(off)
90%
Vout
VOUT
G
toff
tf
90%
INVERTED
10%
10%
90%
S
VIN
50%
50%
10%
PULSE WIDTH
Figure 2:Switching Waveforms
PD Power(W)
ID- Drain Current (A)
Figure 1:Switching Test Circuit
TJ-Junction Temperature(℃)
TJ-Junction Temperature(℃)
Figure 4 Drain Current
ID- Drain Current (A)
Rdson On-Resistance(mΩ)
Figure 3 Power Dissipation
Vds Drain-Source Voltage (V)
ID- Drain Current (A)
Figure 5 Output CHARACTERISTICS
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Figure 6 Drain-Source On-Resistance
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ID- Drain Current (A)
Normalized On-Resistance
BLM2302
Vgs Gate-Source Voltage (V)
TJ-Junction Temperature(℃)
Figure 8 Drain-Source On-Resistance
C Capacitance (pF)
Rdson On-Resistance(mΩ)
Figure 7 Transfer Characteristics
Vgs Gate-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 10 Capacitance vs Vds
Vgs Gate-Source Voltage (V)
Is- Reverse Drain Current (A)
Figure 9 Rdson vs Vgs
Qg Gate Charge (nC)
Figure 11 Gate Charge
Page4
Vsd Source-Drain Voltage (V)
Figure 12 Source- Drain Diode Forward
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ID- Drain Current (A)
BLM2302
Vds Drain-Source Voltage (V)
Safe Operation Area
r(t),Normalized Effective
Transient Thermal Impedance
Figure 13
Square Wave Pluse Duration(sec)
Figure 14 Normalized Maximum Transient Thermal Impedance
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V2.0
Pb Free Product
BLM2302
SOT-23 PACKAGE INFORMATION
Dimensions in Millimeters (UNIT:mm)
Symbol
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
Dimensions in Millimeters
MIN.
MAX.
0.900
1.150
0.000
0.100
0.900
1.050
0.300
0.500
0.080
0.150
2.800
3.000
1.200
1.400
2.250
2.550
0.950TYP
1.800
2.000
0.550REF
0.300
0.500
0°
8°
NOTES
1. All dimensions are in millimeters.
2. Tolerance ±0.10mm (4 mil) unless otherwise specified
3. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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